Laser cutting method, device, computer device and storage medium

Abstract

The application relates to a laser cutting method and device, computer equipment, a storage medium and a computer program product, and relates to the technical field of laser cutting. The method comprises the following steps: acquiring a current cutting position of a laser cutter for cutting material; determining a target segment cutting track corresponding to the current cutting position from a plurality of pre-determined segment cutting tracks; the plurality of segment cutting tracks are obtained by dividing a complete cutting track of the cutting material; acquiring a cutting speed of the cutting material at the target segment cutting track, and a laser power curve and a laser frequency curve corresponding to the cutting material of the target segment cutting track; determining a cutting parameter of the laser cutter for the cutting position according to the cutting speed, the laser power curve and the laser frequency curve; and cutting the current cutting position of the cutting material based on the cutting parameter. The method can achieve the purpose of meeting the cutting effect requirements of the cutting material at different speeds.

Description

Technical Field

[0001] This application relates to the field of laser cutting technology, and in particular to a laser cutting method, apparatus, computer equipment, storage medium, and computer program product. Background Technology

[0002] The principle behind laser cutting is that the laser head irradiates the raw material being cut, and the high temperature of the laser melts or vaporizes the material, thus achieving cutting. The cutting efficiency of a laser cutter is often affected by its power; the higher the power, the higher the cutting efficiency. As the requirements for laser cutting efficiency gradually increase, higher-power laser cutters are needed.

[0003] However, while high-power laser cutters can meet the power requirements for high-speed cutting, changes in cutting speed have a greater impact on cutting in low-speed scenarios. That is, when high-power laser cutters are cutting, the laser energy density per unit time is too high, resulting in an excessively large heat-affected zone on the material being cut, leading to problems such as a wide kerf and molten beads splashing, resulting in poor cutting results. Summary of the Invention

[0004] Therefore, it is necessary to provide a laser cutting method, apparatus, computer equipment, computer-readable storage medium, and computer program product to address the technical problems of cutting control in low-speed laser cutting mentioned above.

[0005] In a first aspect, this application provides a laser cutting method. The method includes:

[0006] Obtain the current cutting position of the laser cutter on the material being cut;

[0007] The target segment cutting trajectory corresponding to the current cutting position is determined from a pre-determined multi-segment cutting trajectory; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the material being cut;

[0008] The cutting speed of the cutting material at the cutting trajectory of the target segment is obtained, as well as the laser power curve and laser frequency curve of the cutting material at the cutting trajectory of the target segment;

[0009] Based on the cutting speed, the laser power curve, and the laser frequency curve, the cutting parameters of the laser cutter for the cutting position are determined;

[0010] Based on the cutting parameters, the current cutting position of the material is cut.

[0011] In one embodiment, the cutting speed of the laser cutter on the cutting trajectory of the target segment is determined in the following manner:

[0012] The graphic parameters corresponding to the cutting trajectory of the laser cutter for the material to be cut are obtained, the galvanometer travel range of the galvanometer in the laser cutter, and the conveying speed of the conveyor belt that carries the material to be cut are obtained.

[0013] Under the condition that the travel of the galvanometer does not exceed the travel range of the galvanometer, the cutting speed of the laser cutter on the cutting trajectory of the target segment is determined according to the transmission speed and the graphic parameters.

[0014] In one embodiment, determining the cutting speed of the laser cutter on the target segment cutting trajectory based on the transmission speed and the graphic parameters includes:

[0015] Based on the aforementioned graphic parameters, the lag distance of the laser cutter relative to the conveyor belt's transport distance during the complete cutting process is determined; the cutting distance represents the actual distance the laser spot output by the laser cutter moves along the conveyor belt's transport direction during the complete cutting process; the complete cutting process represents the process from the start of cutting the material to the end of cutting the material.

[0016] Under the condition that the total transmission distance after moving the target time at the conveyor belt speed does not exceed the lag distance, the cutting speed corresponding to each cutting trajectory is adjusted to obtain the cutting speed of the laser cutter on the target cutting trajectory; the target time is the sum of the cutting times of each cutting trajectory, and the cutting time of each cutting trajectory is obtained based on the length of each cutting trajectory and the cutting speed of that cutting trajectory.

[0017] In one embodiment, determining the cutting parameters of the laser cutter for the cutting position based on the cutting speed, the laser power curve, and the laser frequency curve includes:

[0018] The laser output power is determined based on the cutting speed and the laser power curve, and the laser output frequency is determined based on the cutting speed and the laser frequency curve.

[0019] The laser output pulse width of the laser cutter is obtained based on the laser output frequency and the predetermined laser output duty cycle.

[0020] The cutting parameters of the laser cutter are obtained based on the laser output power and laser output pulse width.

[0021] In one embodiment, the laser power curve includes multiple power curves, each power curve having a corresponding velocity range;

[0022] The step of determining the laser output power based on the cutting speed and the laser power curve includes:

[0023] Determine the target speed range corresponding to the cutting speed in multiple speed ranges;

[0024] From the laser power curve, the target segment power curve corresponding to the target speed range is determined, and the laser output power corresponding to the cutting speed is determined based on the target segment power curve.

[0025] In one embodiment, the laser frequency curve includes multiple frequency curves, each frequency curve having a corresponding velocity range;

[0026] The step of determining the laser output frequency based on the cutting speed and the laser frequency curve includes:

[0027] Determine the target speed range corresponding to the cutting speed in multiple speed ranges;

[0028] From the laser frequency curve, the target segment frequency curve corresponding to the target speed range is determined, and the laser output frequency corresponding to the cutting speed is determined based on the target segment frequency curve.

[0029] In one embodiment, cutting the material at its current cutting position based on the cutting parameters includes:

[0030] Determine the reference galvanometer position corresponding to the galvanometer in the laser cutter at the current cutting position;

[0031] The position of the galvanometer is adjusted to the position of the reference galvanometer, and the cutting material is cut at the current cutting position based on the galvanometer at the position of the reference galvanometer and the cutting parameters.

[0032] In one embodiment, determining the reference galvanometer position corresponding to the galvanometer in the laser cutter at the current cutting position includes:

[0033] From multiple galvanometer synchronization time periods, the target galvanometer synchronization time period corresponding to the current cutting position is determined; the duration of each galvanometer synchronization time period corresponds to the synchronization cycle in which the galvanometer completes one synchronization; each galvanometer synchronization time period has a corresponding reference galvanometer position;

[0034] Obtain the reference galvanometer position corresponding to the target galvanometer synchronization time period, and use it as the reference galvanometer position of the galvanometer in the laser cutter at the current cutting position.

[0035] Secondly, this application also provides a laser cutting apparatus. The apparatus includes:

[0036] The position acquisition module is used to acquire the current cutting position of the laser cutter on the material being cut;

[0037] The trajectory determination module is used to determine the target segment cutting trajectory corresponding to the current cutting position from a pre-determined multi-segment cutting trajectory; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the cutting material;

[0038] The information acquisition module is used to acquire the cutting speed of the cutting material at the cutting trajectory of the target segment, as well as the laser power curve and laser frequency curve of the cutting material corresponding to the cutting trajectory of the target segment;

[0039] The cutting parameter determination module is used to determine the cutting parameters of the laser cutter for the cutting position based on the cutting speed, the laser power curve, and the laser frequency curve.

[0040] The cutting execution module is used to cut the material at the current cutting position based on the cutting parameters.

[0041] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to perform the following steps:

[0042] Obtain the current cutting position of the laser cutter on the material being cut;

[0043] The target segment cutting trajectory corresponding to the current cutting position is determined from a pre-determined multi-segment cutting trajectory; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the material being cut;

[0044] The cutting speed of the cutting material at the cutting trajectory of the target segment is obtained, as well as the laser power curve and laser frequency curve of the cutting material at the cutting trajectory of the target segment;

[0045] Based on the cutting speed, the laser power curve, and the laser frequency curve, the cutting parameters of the laser cutter for the cutting position are determined;

[0046] Based on the cutting parameters, the current cutting position of the material is cut.

[0047] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, performs the following steps:

[0048] Obtain the current cutting position of the laser cutter on the material being cut;

[0049] The target segment cutting trajectory corresponding to the current cutting position is determined from a pre-determined multi-segment cutting trajectory; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the material being cut;

[0050] The cutting speed of the cutting material at the cutting trajectory of the target segment is obtained, as well as the laser power curve and laser frequency curve of the cutting material at the cutting trajectory of the target segment;

[0051] Based on the cutting speed, the laser power curve, and the laser frequency curve, the cutting parameters of the laser cutter for the cutting position are determined;

[0052] Based on the cutting parameters, the current cutting position of the material is cut.

[0053] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0054] Obtain the current cutting position of the laser cutter on the material being cut;

[0055] The target segment cutting trajectory corresponding to the current cutting position is determined from a pre-determined multi-segment cutting trajectory; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the material being cut;

[0056] The cutting speed of the cutting material at the cutting trajectory of the target segment is obtained, as well as the laser power curve and laser frequency curve of the cutting material at the cutting trajectory of the target segment;

[0057] Based on the cutting speed, the laser power curve, and the laser frequency curve, the cutting parameters of the laser cutter for the cutting position are determined;

[0058] Based on the cutting parameters, the current cutting position of the material is cut.

[0059] The aforementioned laser cutting method, apparatus, computer equipment, storage medium, and computer program products acquire the current cutting position of the laser cutter on the material to be cut, then determine the corresponding cutting speed from the cutting position. Based on the cutting speed and the parameter information corresponding to the material to be cut at the current cutting position, the cutting parameters for the current cutting position are determined, thereby controlling the laser output to complete the cutting work at the current cutting position. By determining the cutting speed at the current cutting position in real time, the cutting parameters are adjusted based on different cutting speeds to achieve the goal of meeting the cutting effect requirements of the material to be cut at different speeds. Attached Figure Description

[0060] Figure 1This is a diagram illustrating the application environment of the laser cutting method in one embodiment;

[0061] Figure 2 This is a flowchart illustrating a laser cutting method in one embodiment;

[0062] Figure 3 This is a schematic diagram of the complete cutting trajectory in one embodiment;

[0063] Figure 4 This is a schematic diagram of the location acquisition time period and the galvanometer synchronization time period in one embodiment;

[0064] Figure 5 This is a schematic diagram of the complete process of the laser cutting method in another embodiment;

[0065] Figure 6 This is a structural block diagram of a laser cutting device in one embodiment;

[0066] Figure 7 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0068] The laser cutting method provided in this application embodiment can be applied to, for example... Figure 1 In the application environment shown, the laser cutting controller 102 communicates with the conveyor belt detector 104 and the laser cutter 106. A data storage system can store the data that the laser cutting controller 102 needs to process. The data storage system can be integrated into the laser cutting controller 102 or placed in the cloud or on another network server. The laser cutting controller 102 obtains the current cutting position through the conveyor belt detector 104 and queries the data storage system for pre-set multiple cutting trajectories to determine the current target segment cutting trajectory. Based on the target segment cutting trajectory, the laser cutting controller 102 calculates the cutting speed and, according to the current cutting material, queries the data storage system for the corresponding laser power curve and laser frequency curve to calculate the cutting parameters. Finally, the cutting parameters are sent to the laser cutter 106 to cut at the current cutting position. The laser cutting controller 102 can be, but is not limited to, various personal computers and laptops, or it can be the central controller in the laser cutter 106. The conveyor belt detector 104 can be an encoder on the conveyor belt or other devices capable of detecting the position of the conveyor belt.

[0069] In one embodiment, such as Figure 2As shown, a laser cutting method is provided, which is applied to... Figure 1 Taking the laser cutting controller 102 as an example, the following steps are included:

[0070] Step 201: Obtain the current cutting position of the laser cutter on the material being cut.

[0071] For example, the laser cutting controller 102 obtains the current cutting position of the material to be cut on the conveyor belt through the conveyor belt detector 104. The conveyor belt detector 104 may be an encoder on the conveyor belt for real-time detection of the rotation angle and rotation speed of the conveyor wheels in the conveyor belt; or it may be other devices above the conveyor belt that detect the position based on computer vision.

[0072] Step 202: Determine the target segment cutting trajectory corresponding to the current cutting position from the predetermined multi-segment cutting trajectories; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the cutting material.

[0073] Multiple cutting trajectories can be obtained by dividing the complete cutting trajectory into straight and curved segments. That is, the same straight segment or the same curved segment constitutes one cutting trajectory; alternatively, the division can be defined by the user.

[0074] For example, the laser cutting controller 102 acquires the complete cutting trajectory predetermined by the user, and determines the target segment cutting trajectory corresponding to the current cutting position from the complete cutting trajectory. It should be noted that the cutting speed, cutting material, and cutting laser parameters can be the same in the same cutting trajectory. Therefore, by determining the target segment cutting trajectory corresponding to the current cutting position, the cutting situation corresponding to the current cutting position can be determined, and the laser cutting can be adjusted based on the cutting situation.

[0075] Step 203: Obtain the cutting speed of the cutting material at the cutting trajectory of the target segment, as well as the laser power curve and laser frequency curve corresponding to the cutting material at the cutting trajectory of the target segment.

[0076] Among them, the laser power curve and the laser frequency curve are process parameters obtained by users through prior testing of the material to be cut, respectively reflecting the relationship between cutting speed and laser output power and cutting speed and laser output frequency.

[0077] For example, the laser cutting controller 102 adjusts the cutting speed of the current target segment cutting trajectory based on the real-time speed of the conveyor belt during cutting. Simultaneously, based on user settings, the cutting material corresponding to the current target segment cutting trajectory is determined. Different cutting materials have different physical properties and different requirements for laser energy density during laser cutting. Therefore, the laser cutting controller 102, based on the cutting material corresponding to the target segment cutting trajectory, obtains the laser power curve and laser frequency curve corresponding to different cutting materials from the laser power curves and laser frequency curves corresponding to different cutting materials pre-stored in the data storage system.

[0078] Step 204: Determine the cutting parameters of the laser cutter for the cutting position based on the cutting speed, laser power curve, and laser frequency curve.

[0079] Among them, the cutting parameters reflect the intensity and frequency of the laser output by the laser cutter.

[0080] For example, the laser cutting controller 102 determines the laser output power corresponding to the material being cut at the current cutting position at the current cutting speed based on the cutting speed and laser power curve corresponding to the current cutting position; and determines the laser output frequency corresponding to the material being cut at the current cutting position at the current cutting speed based on the cutting speed and laser frequency curve corresponding to the current cutting position. The cutting parameters of the laser cutter for the cutting position are determined based on the laser output frequency and laser output power. It should be noted that the relationship between the cutting speed and laser output power reflected by the laser power curve can be linear or non-linear. Similarly, the relationship between the cutting speed and laser output frequency reflected by the laser frequency curve is also linear. Furthermore, different cutting speeds in different speed ranges can have different mapping relationships with laser output power; similarly, different cutting speeds in different speed ranges can have different mapping relationships with laser output frequency.

[0081] Step 205: Based on the cutting parameters, cut the material at the current cutting position.

[0082] For example, the laser cutting controller 102 adjusts the laser energy output by the laser cutter to the current cutting position based on the obtained cutting parameters. The laser cutter itself has hardware limitations, and the adjustment of cutting parameters is frequency-dependent; that is, adjusting the cutting parameters is a periodic action. Once the laser cutting controller 102 adjusts the cutting parameters of the laser cutter, the laser cutter outputs laser energy according to the current cutting parameters until the next adjustment is completed.

[0083] In the aforementioned laser cutting method, the current cutting position of the laser cutter on the material is obtained, and the corresponding cutting speed is determined from the cutting position. Based on the cutting speed and the parameter information corresponding to the material at the current cutting position, the cutting parameters for the current cutting position are determined, thereby controlling the laser output to complete the cutting work at the current cutting position. By determining the cutting speed at the current cutting position in real time, the cutting parameters are adjusted based on different cutting speeds to achieve the goal of meeting the cutting effect requirements of the material at different speeds.

[0084] In one embodiment, the cutting speed of the laser cutter on the target segment cutting trajectory can be determined by the following steps:

[0085] Step 1: Obtain the graphic parameters corresponding to the cutting trajectory of the laser cutter for the material being cut, the galvanometer travel range of the galvanometer in the laser cutter, and the conveying speed of the conveyor belt that transports the material being cut.

[0086] Step two: Under the condition that the travel of the galvanometer does not exceed the travel range of the galvanometer, determine the cutting speed of the laser cutter on the cutting trajectory of the target segment based on the transmission speed and graphic parameters.

[0087] The graphic parameters include graphic shape and graphic size.

[0088] In a laser cutter, the galvanometer, also known as a laser scanner, deflects the laser beam through reflection from a mirror. Furthermore, the mirror has a certain rotation angle, and correspondingly, its deflection range for the laser beam is also limited.

[0089] The galvanometer travel range refers to the range within which the galvanometer can move.

[0090] Furthermore, the laser deflection range and the galvanometer travel range together determine the range of the laser impact point.

[0091] For example, the laser cutting controller acquires the graphic parameters corresponding to the cutting trajectory, the galvanometer travel range of the galvanometer in the laser cutter, and the conveyor speed detected in real time by the conveyor belt detector; wherein the galvanometer travel range is determined based on user input. Then, under the condition that the movement position of the galvanometer does not exceed the galvanometer travel range, the laser cutting controller determines the cutting speed of the laser cutter on different segments of the cutting trajectory based on the real-time conveyor speed and graphic parameters, through a user-predetermined calculation model, including the cutting speed of the target segment cutting trajectory corresponding to the current cutting position.

[0092] In the same embodiment, step two above, which determines the cutting speed of the laser cutter on the cutting trajectory of the target segment based on the transmission speed and graphic parameters, can also be achieved through the following steps:

[0093] Step 1: Based on the graphic parameters, determine the lag distance of the laser cutter relative to the conveyor belt's transport distance during the complete cutting process; the cutting distance represents the actual distance the laser spot output by the laser cutter moves in the conveyor belt's transport direction during the complete cutting process; the complete cutting process represents the process from the start of cutting the material to the end of cutting the material.

[0094] Step 2: Under the condition that the total conveying distance after moving the target time at the conveyor belt speed does not exceed the lag distance, adjust the cutting speed corresponding to each cutting trajectory to obtain the cutting speed of the laser cutter on the target cutting trajectory; the target time is the sum of the cutting times of each cutting trajectory, and the cutting time of each cutting trajectory is obtained based on the length of each cutting trajectory and the cutting speed of that cutting trajectory.

[0095] For example, on the conveyor belt plane, the conveyor belt's transport direction is taken as the x-axis, and the direction perpendicular to the conveyor belt's transport direction is taken as the y-axis. During the complete cutting process, relative motion occurs between the laser's spot and the conveyor belt; this relative motion occurs not only in the y-axis direction but also in the x-axis direction; further, the distance of this relative motion is determined by graphic parameters. When the conveyor belt's transport speed fluctuates during the cutting process, the current cutting speed needs to be adjusted according to the real-time transport speed to ensure that the conveyor belt's transport distance does not exceed the corresponding relative motion distance. For example, as... Figure 3 As shown, the figure represents the complete cutting trajectory. The length of the complete cutting trajectory on the x-axis is 20 (the specific unit of length is determined according to the actual scenario), and the cutting trajectory is divided into 7 segments. The trajectory lengths are as follows: arc segment AB is L1, straight segment BC is L2, arc segment CD is L3, straight segment ED is L4, arc segment EF is L5, straight segment FG is L6, and arc segment GH is L7. Each of the four arc segments is a quarter-circle arc. The radius of the circle corresponding to L1 is R1, L3 is R3, L5 is R5, and L7 is R7. Furthermore, the trajectory is symmetrical; therefore, R1 = R7, R3 = R5, L1 = L7, L3 = L5, and L2 = L6. The cutting speed varies for different segments, while the cutting speed for the same segment is considered constant. Adjust the cutting speed according to the following formula:

[0096]

[0097] Where V0 is the conveyor belt speed, V1 is the cutting speed corresponding to segment L1 (which is also the cutting speed corresponding to segment L7), V3 is the cutting speed corresponding to segment L3 (which is also the cutting speed corresponding to segment L5), V2 is the cutting speed corresponding to segment L2, V6 is the cutting speed corresponding to segment L6, and V4 is the cutting speed corresponding to segment L4.

[0098] After obtaining the cutting speed of all segment cutting trajectories, the cutting speed of the target segment cutting trajectory corresponding to the current cutting position is obtained from them.

[0099] Furthermore, the galvanometer's travel range is smaller than the range corresponding to the complete cutting trajectory, meaning the laser's landing point will be smaller than the range corresponding to the complete cutting trajectory. Further, if the angle between the laser and the cutting material plane is too large, it will cause excessive distortion in the laser spot shape, affecting the laser cutting effect; that is, the effective landing point range of the laser will be even smaller than the range corresponding to the complete cutting trajectory. Therefore, the galvanometer in a laser cutter will move during the complete cutting process. The cutting speed setting must also conform to the galvanometer's travel range; the specific correlation needs to be set by the user according to the actual application scenario.

[0100] In this embodiment, the real-time conveyor speed is acquired, and the cutting speed is adjusted in real time based on the cutting trajectory and the galvanometer travel position. Dynamically adjusting the cutting speed to account for fluctuations in the conveyor speed not only meets the working conditions of various devices in practical applications but also provides an accurate reference for subsequent adjustments to cutting parameters, effectively improving the cutting effect.

[0101] In one embodiment, step 204 above, which determines the cutting parameters of the laser cutter for the cutting position based on the cutting speed, laser power curve, and laser frequency curve, can also be achieved through the following steps:

[0102] Step 1: Determine the laser output power based on the cutting speed and laser power curves, and determine the laser output frequency based on the cutting speed and laser frequency curves.

[0103] Step 2: Based on the laser output frequency and the predetermined laser output duty cycle, obtain the laser output pulse width of the laser cutter;

[0104] Step 3: Based on the laser output power and laser output pulse width, obtain the cutting parameters of the laser cutter.

[0105] For example, the laser power curve and laser frequency curve are process parameters in practical applications, which need to be pre-calibrated by the user. The calibration is based on the physical properties of the material being cut, ensuring that the laser energy density received by the material meets the cutting requirements. The laser cutting controller retrieves the laser power curve and laser frequency curve corresponding to the material at the current cutting position from the data storage system, and then calculates the corresponding laser output power and laser output frequency based on the current cutting speed. The laser cutting controller directly calculates the laser output pulse width based on the laser output frequency and the user-preset laser output duty cycle. The laser output duty cycle affects the flatness of the cut surface, and therefore is preset by the user according to actual conditions. The laser output power and laser output pulse width serve as the cutting parameters of the laser output from the laser cutter.

[0106] In the same embodiment, the laser power curve includes multiple power curve segments, each with a corresponding speed range; the above step one, determining the laser output power based on the cutting speed and the laser power curve, can also be achieved through the following steps:

[0107] Step 1: Determine the target speed range corresponding to the cutting speed among multiple speed ranges;

[0108] Step 2: From the laser power curve, determine the target segment power curve corresponding to the target speed range, and based on the target segment power curve, determine the laser output power corresponding to the cutting speed.

[0109] Similarly, in one embodiment, the laser frequency curve includes multiple frequency segments, each with a corresponding speed range; the step one above, determining the laser output frequency based on the cutting speed and the laser frequency curve, can also be achieved through the following steps:

[0110] Step 1: Determine the target speed range corresponding to the cutting speed among multiple speed ranges;

[0111] Step 2: From the laser frequency curve, determine the target segment frequency curve corresponding to the target speed range, and based on the target segment frequency curve, determine the laser output frequency corresponding to the cutting speed.

[0112] For example, the laser power curve (laser frequency curve) contains multiple power curves (frequency curves) corresponding to different cutting speed ranges. Each power curve (frequency curve) has different curve parameters and may also have different curve types; it can be a straight line corresponding to a linear relationship or a curve corresponding to a non-linear relationship. The laser cutting controller determines the target speed range to which the cutting speed belongs, obtains the corresponding target segment power curve (frequency curve) based on the target speed range, and determines the laser output power (laser output frequency) corresponding to the cutting speed based on the curve parameters of the target segment power curve (frequency curve).

[0113] In this embodiment, by using the laser power curves and laser frequency curves corresponding to different speed ranges within the cutting speed range, the laser output power and laser output frequency are determined, thereby obtaining the cutting parameters of the laser output from the laser cutter and controlling the energy of the laser output and the uniformity of the laser spot. This allows for dynamic adjustment of the cutting parameters according to different cutting speeds, resulting in dynamic adjustment of the output laser to improve the cutting effect.

[0114] In one embodiment, step 205 above, which cuts the material at the current cutting position based on cutting parameters, can also be achieved through the following steps:

[0115] Step 1: Determine the reference galvanometer position of the galvanometer in the laser cutter at the current cutting position;

[0116] Step two: Adjust the position of the galvanometer to the reference galvanometer position, and cut the material at the current cutting position based on the galvanometer at the reference galvanometer position and the cutting parameters.

[0117] For example, the galvanometer travel range is smaller than the range corresponding to the complete cutting trajectory, meaning the laser landing point range is smaller than the range corresponding to the complete cutting trajectory. Furthermore, if the angle between the laser and the cutting material plane is too large, it will cause excessive distortion of the laser spot shape, affecting the laser cutting effect; that is, the effective landing point range of the laser will be even smaller than the range corresponding to the complete cutting trajectory. Therefore, the galvanometer in the laser cutter will move during the complete cutting process. Therefore, the position of the galvanometer needs to be adjusted in real time so that the laser spot can fall on the current cutting position and complete the cutting of the material. In this example, the execution of the method steps can be completed by an FPGA (Field Programmable Gate Array) chip, where the laser output pulse width in the cutting parameters can be controlled based on pulse width modulation (PWM), and the galvanometer position can be adjusted based on the XY2-100 digital protocol.

[0118] In the same embodiment, step one above, which determines the reference galvanometer position of the galvanometer in the laser cutter at the current cutting position, can also be achieved through the following steps:

[0119] Step 1: Determine the target galvanometer synchronization time period corresponding to the current cutting position from multiple galvanometer synchronization time periods; the duration of each galvanometer synchronization time period corresponds to the synchronization cycle of the galvanometer completing one synchronization; each galvanometer synchronization time period has a corresponding reference galvanometer position;

[0120] Step 2: Obtain the reference galvanometer position corresponding to the target galvanometer synchronization time period, which will serve as the reference galvanometer position of the laser cutter at the current cutting position.

[0121] For example, ideally, the acquisition of the current cutting position and the adjustment of the galvanometer position should be real-time. However, due to objective limitations of the device hardware, both the acquisition of the current cutting position and the adjustment of the galvanometer position are periodic (though appearing real-time from the user's perspective due to the high frequency of the actions). Therefore, a galvanometer synchronization time period can include multiple cutting positions. A target galvanometer synchronization time period corresponding to the current cutting position is determined, and the galvanometer position for the current cutting position is adjusted based on the reference galvanometer position corresponding to the target galvanometer synchronization time period. The reference galvanometer position for a galvanometer synchronization time period is predetermined, specifically calculated based on the actual cutting position acquired during the position acquisition time period corresponding to the current galvanometer synchronization time period. For example, ... Figure 4 The diagram illustrates the relationship between the position acquisition time period and the galvanometer synchronization time period. At time t0, the current actual cutting position is acquired, and other cutting positions between t0 and t1 can be calculated and determined based on the current actual cutting position and the current cutting speed (uniform speed). Simultaneously, within one position acquisition time period, five galvanometer synchronizations are performed. The reference galvanometer position for the first synchronization is determined based on the acquired current actual cutting position, while the reference positions for the remaining four synchronizations are determined based on the calculated cutting position at the start of each synchronization. Therefore, the reference position of the galvanometer within a single synchronization time period is determined by the cutting position at the start of each synchronization. The execution of these steps in this example can be performed by an ARM chip.

[0122] In this embodiment, the galvanometer position is adjusted based on the current cutting position, ensuring that the output laser can effectively cut the material under the adjusted galvanometer position, thus improving cutting quality. Simultaneously, considering the limitations of the equipment hardware, the reference galvanometer position is calculated using the galvanometer synchronization time period. This efficiently determines the reference galvanometer position corresponding to different cutting positions, improving the overall efficiency of laser cutting.

[0123] In another embodiment, such as Figure 5 As shown, a laser cutting method is provided, which can be applied to the flying cutting scenario of a laser cutter, including the following steps:

[0124] Step 501: Obtain the current cutting position of the laser cutter on the material being cut.

[0125] Step 502: Determine the target segment cutting trajectory corresponding to the current cutting position from the pre-determined multi-segment cutting trajectories; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the cutting material.

[0126] Step 503: Obtain the graphic parameters corresponding to the cutting trajectory of the laser cutter for the cutting material, the galvanometer travel range of the galvanometer in the laser cutter, and the conveying speed of the conveyor belt for transporting the cutting material.

[0127] Step 504: Based on the graphic parameters, determine the lag distance of the laser cutter relative to the conveyor belt's conveying distance during the complete cutting process; where the cutting distance represents the actual distance the laser spot output by the laser cutter moves in the conveyor belt's conveying direction during the complete cutting process; the complete cutting process represents the process from the start of cutting the material to the end of cutting the material.

[0128] Step 505: Under the conditions that the travel of the galvanometer does not exceed the travel range of the galvanometer and the total conveying distance after the conveyor belt moves the target time does not exceed the lag distance, adjust the cutting speed corresponding to each segment of the cutting trajectory to obtain the cutting speed of the laser cutter on the target segment of the cutting trajectory; wherein, the target time is the sum of the cutting times of each segment of the cutting trajectory, and the cutting time of each segment of the cutting trajectory is obtained based on the length of each segment of the cutting trajectory and the cutting speed of that segment of the cutting trajectory.

[0129] Step 506: Obtain the laser power curve and laser frequency curve corresponding to the cutting material of the target segment cutting trajectory.

[0130] Step 507: Determine the target speed range corresponding to the cutting speed in multiple speed ranges; determine the target segment power curve corresponding to the target speed range from the laser power curve; and determine the laser output power corresponding to the cutting speed based on the target segment power curve.

[0131] Step 508: Determine the target speed range corresponding to the cutting speed in multiple speed ranges; determine the target segment frequency curve corresponding to the target speed range from the laser frequency curve; and determine the laser output frequency corresponding to the cutting speed based on the target segment frequency curve.

[0132] Step 509: Based on the laser output frequency and the predetermined laser output duty cycle, obtain the laser output pulse width of the laser cutter; based on the laser output power and the laser output pulse width, obtain the cutting parameters of the laser cutter.

[0133] Step 510: Determine the target galvanometer synchronization time period corresponding to the current cutting position from multiple galvanometer synchronization time periods; wherein, the duration of each galvanometer synchronization time period corresponds to the synchronization cycle of the galvanometer completing one synchronization, and each galvanometer synchronization time period has a corresponding reference galvanometer position.

[0134] Step 511: Obtain the reference galvanometer position corresponding to the target galvanometer synchronization time period, which serves as the reference galvanometer position of the laser cutter at the current cutting position.

[0135] Step 512: Adjust the position of the galvanometer to the reference galvanometer position, and cut the material at the current cutting position based on the galvanometer at the reference galvanometer position and the cutting parameters.

[0136] In this embodiment, the current cutting position of the laser cutter on the material is obtained, and the corresponding cutting speed is determined from the cutting position. Based on the cutting speed and the parameter information corresponding to the material at the current cutting position, the cutting parameters for the current cutting position are determined, thereby controlling the laser output to complete the cutting work at the current cutting position. By determining the cutting speed at the current cutting position in real time, the cutting parameters are adjusted based on different cutting speeds, achieving segmented cutting parameter matching according to the cutting speed, so that the cutting effect throughout the entire cutting process meets the process requirements. At the same time, considering the limitations of the equipment hardware under objective conditions, the reference galvanometer position is calculated using the galvanometer synchronization time period, which can efficiently determine the reference galvanometer position corresponding to different cutting positions and improve the overall efficiency of laser cutting.

[0137] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0138] Based on the same inventive concept, this application also provides a laser cutting apparatus for implementing the laser cutting method described above. The solution provided by this apparatus is similar to the solution described in the above method; therefore, the specific limitations in one or more laser cutting apparatus embodiments provided below can be found in the limitations of the laser cutting method described above, and will not be repeated here.

[0139] In one embodiment, such as Figure 6 As shown, a laser cutting device is provided, including: a position acquisition module 601, a trajectory determination module 602, an information acquisition module 603, a cutting parameter determination module 604, and a cutting execution module 605, wherein:

[0140] The position acquisition module 601 is used to acquire the current cutting position of the laser cutter on the material being cut.

[0141] The trajectory determination module 602 is used to determine the target segment cutting trajectory corresponding to the current cutting position from a pre-determined multi-segment cutting trajectory; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the cutting material.

[0142] The information acquisition module 603 is used to acquire the cutting speed of the cutting material at the cutting trajectory of the target segment, as well as the laser power curve and laser frequency curve of the cutting material at the cutting trajectory of the target segment.

[0143] The cutting parameter determination module 604 is used to determine the cutting parameters of the laser cutter for the cutting position based on the cutting speed, laser power curve and laser frequency curve.

[0144] The cutting execution module 605 is used to cut the material at the current cutting position based on the cutting parameters.

[0145] In one embodiment, the information acquisition module 603 is further configured to acquire the graphic parameters corresponding to the cutting trajectory of the laser cutter for the cutting material, the galvanometer travel range of the galvanometer in the laser cutter, and the conveying speed of the conveyor belt for transporting the cutting material; and, under the condition that the galvanometer travel does not exceed the galvanometer travel range, determine the cutting speed of the laser cutter on the cutting trajectory of the target segment based on the conveying speed and graphic parameters.

[0146] In one embodiment, the information acquisition module 603 is further configured to determine, based on the graphic parameters, the lag distance of the laser cutter relative to the conveyor belt's transmission distance during the complete cutting process; the cutting distance represents the actual distance the laser spot output by the laser cutter moves in the conveyor belt's transmission direction during the complete cutting process; the complete cutting process represents the process from the start of cutting the material to the end of cutting the material; under the condition that the total transmission distance after moving the target time at the conveyor belt's transmission speed does not exceed the lag distance, the cutting speed corresponding to each segment of the cutting trajectory is adjusted to obtain the laser cutter's cutting speed in the target segment of the cutting trajectory; the target time is the sum of the cutting times of each segment of the cutting trajectory, and the cutting time of each segment of the cutting trajectory is obtained based on the length of each segment of the cutting trajectory and the cutting speed of that segment of the cutting trajectory.

[0147] In one embodiment, the cutting parameter determination module 604 is further configured to determine the laser output power based on the cutting speed and laser power curve, and to determine the laser output frequency based on the cutting speed and laser frequency curve; to obtain the laser output pulse width of the laser cutter based on the laser output frequency and a predetermined laser output duty cycle; and to obtain the cutting parameters of the laser cutter based on the laser output power and the laser output pulse width.

[0148] In one embodiment, the laser power curve includes multiple power curves, each with a corresponding speed range. The cutting parameter determination module 604 is further used to determine the target speed range corresponding to the cutting speed in the multiple speed ranges; determine the target segment power curve corresponding to the target speed range from the laser power curve; and determine the laser output power corresponding to the cutting speed based on the target segment power curve.

[0149] In one embodiment, the laser frequency curve includes multiple frequency curves, each with a corresponding speed range. The cutting parameter determination module 604 is further used to determine the target speed range corresponding to the cutting speed in the multiple speed ranges; determine the target segment frequency curve corresponding to the target speed range from the laser frequency curve; and determine the laser output frequency corresponding to the cutting speed based on the target segment frequency curve.

[0150] In one embodiment, the cutting execution module 605 is further configured to determine the reference galvanometer position corresponding to the galvanometer in the laser cutter at the current cutting position; adjust the position of the galvanometer to the reference galvanometer position; and cut the material at the current cutting position based on the galvanometer at the reference galvanometer position and the cutting parameters.

[0151] In one embodiment, the cutting execution module 605 is further configured to determine the target galvanometer synchronization time period corresponding to the current cutting position from multiple galvanometer synchronization time periods; the duration of each galvanometer synchronization time period corresponds to the synchronization cycle of the galvanometer completing one synchronization; each galvanometer synchronization time period has a corresponding reference galvanometer position; and obtain the reference galvanometer position corresponding to the target galvanometer synchronization time period as the reference galvanometer position of the galvanometer in the laser cutter at the current cutting position.

[0152] Each module in the aforementioned laser cutting device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0153] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 7As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a laser cutting method. The display unit is used to form a visually visible image and can be a display screen, projection device, or virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0154] Those skilled in the art will understand that Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0155] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0156] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0157] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0158] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data shall comply with the relevant laws, regulations and standards of the relevant countries and regions.

[0159] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0160] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0161] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A laser cutting method, characterized in that, The method includes: Obtain the current cutting position of the laser cutter on the material being cut; The target segment cutting trajectory corresponding to the current cutting position is determined from a pre-determined multi-segment cutting trajectory; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the material being cut; The cutting speed of the cutting material at the cutting trajectory of the target segment is obtained, as well as the laser power curve and laser frequency curve of the cutting material at the cutting trajectory of the target segment; Based on the cutting speed, the laser power curve, and the laser frequency curve, the cutting parameters of the laser cutter for the cutting position are determined; Based on the cutting parameters, the material is cut at its current cutting position; The cutting speed of the laser cutter on the target segment cutting trajectory is determined in the following manner: The graphic parameters corresponding to the cutting trajectory of the laser cutter for the material to be cut are obtained, the galvanometer travel range of the galvanometer in the laser cutter, and the conveying speed of the conveyor belt that carries the material to be cut are obtained. Under the condition that the travel of the galvanometer does not exceed the travel range of the galvanometer, the cutting speed of the laser cutter on the cutting trajectory of the target segment is determined according to the transmission speed and the graphic parameters.

2. The method according to claim 1, characterized in that, Determining the cutting speed of the laser cutter on the target segment cutting trajectory based on the transmission speed and the graphic parameters includes: Based on the aforementioned graphic parameters, the lag distance of the laser cutter relative to the conveyor belt's transport distance during the complete cutting process is determined; the cutting distance represents the actual distance the laser spot output by the laser cutter moves along the conveyor belt's transport direction during the complete cutting process; the complete cutting process represents the process from the start of cutting the material to the end of cutting the material. Under the condition that the total transmission distance after moving the target time at the conveyor belt speed does not exceed the lag distance, the cutting speed corresponding to each cutting trajectory is adjusted to obtain the cutting speed of the laser cutter on the target cutting trajectory; the target time is the sum of the cutting times of each cutting trajectory, and the cutting time of each cutting trajectory is obtained based on the length of each cutting trajectory and the cutting speed of that cutting trajectory.

3. The method according to claim 1, characterized in that, Determining the cutting parameters of the laser cutter for the cutting position based on the cutting speed, the laser power curve, and the laser frequency curve includes: The laser output power is determined based on the cutting speed and the laser power curve, and the laser output frequency is determined based on the cutting speed and the laser frequency curve. The laser output pulse width of the laser cutter is obtained based on the laser output frequency and the predetermined laser output duty cycle. The cutting parameters of the laser cutter are obtained based on the laser output power and laser output pulse width.

4. The method according to claim 3, characterized in that, The laser power curve includes multiple power curves, and each power curve has a corresponding velocity range. The step of determining the laser output power based on the cutting speed and the laser power curve includes: Determine the target speed range corresponding to the cutting speed in multiple speed ranges; From the laser power curve, the target segment power curve corresponding to the target speed range is determined, and the laser output power corresponding to the cutting speed is determined based on the target segment power curve.

5. The method according to claim 3, characterized in that, The laser frequency curve includes multiple frequency curves, and each frequency curve has a corresponding velocity range. The step of determining the laser output frequency based on the cutting speed and the laser frequency curve includes: Determine the target speed range corresponding to the cutting speed in multiple speed ranges; From the laser frequency curve, the target segment frequency curve corresponding to the target speed range is determined, and the laser output frequency corresponding to the cutting speed is determined based on the target segment frequency curve.

6. A laser cutting device, characterized in that, The device includes: The position acquisition module is used to acquire the current cutting position of the laser cutter on the material being cut; The trajectory determination module is used to determine the target segment cutting trajectory corresponding to the current cutting position from a pre-determined multi-segment cutting trajectory; the multi-segment cutting trajectory is obtained by dividing the complete cutting trajectory of the cutting material; The information acquisition module is used to acquire the cutting speed of the cutting material at the cutting trajectory of the target segment, as well as the laser power curve and laser frequency curve of the cutting material corresponding to the cutting trajectory of the target segment; The cutting parameter determination module is used to determine the cutting parameters of the laser cutter for the cutting position based on the cutting speed, the laser power curve, and the laser frequency curve. The cutting execution module is used to cut the material at the current cutting position based on the cutting parameters. The information acquisition module is also used to acquire graphic parameters corresponding to the cutting trajectory of the laser cutter for the cutting material, the galvanometer travel range of the galvanometer in the laser cutter, and the conveying speed of the conveyor belt that transports the cutting material; under the condition that the travel of the galvanometer does not exceed the galvanometer travel range, the laser cutter determines the cutting speed of the laser cutter on the cutting trajectory of the target segment according to the conveying speed and the graphic parameters.

7. The apparatus according to claim 6, characterized in that, The information acquisition module is further configured to determine, based on the graphic parameters, the lag distance of the laser cutter relative to the conveyor belt's transmission distance during the complete cutting process; the cutting distance represents the actual distance the laser spot output by the laser cutter moves along the conveyor belt's transmission direction during the complete cutting process; the complete cutting process represents the process from the start of cutting the material to the end of cutting the material; under the condition that the total transmission distance after moving the target time at the conveyor belt's transmission speed does not exceed the lag distance, the cutting speed corresponding to each segment of the cutting trajectory is adjusted to obtain the cutting speed of the laser cutter on the target segment of the cutting trajectory; The target time is the sum of the cutting times of each cutting trajectory segment, and the cutting time of each cutting trajectory segment is obtained based on the length of each cutting trajectory segment and the cutting speed of that segment.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 5.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 5.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 5.

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