A swing cutting-measuring integrated method based on a rotating optical system

By combining the circular spot of the optical rotation system with the variable speed swing of the moving platform and ultrasonic vibration, high-quality and high-efficiency cutting with ultrashort pulse laser cutting is achieved, solving the problems of small cutting depth and large kerf taper, and improving cutting efficiency and cutting surface quality.

CN116475589BActive Publication Date: 2026-06-19DALIAN UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DALIAN UNIV OF TECH
Filing Date
2023-05-08
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing technologies suffer from problems such as shallow cutting depth, large kerf taper, and low cutting surface quality and efficiency when cutting difficult-to-machine materials, especially in ultra-short pulse laser cutting, where it is difficult to achieve high-quality and efficient cutting.

Method used

An integrated cutting-measurement method based on an optical rotation system is adopted. The optical rotation system forms a circular light spot, and combined with the variable speed swing of the moving platform and ultrasonic vibration, layer-by-layer scanning cutting is performed. The image sensing module is used to measure the morphology in real time and adjust the laser energy density, thereby achieving uniformity of cutting depth and improvement of cutting quality.

Benefits of technology

It achieves high-quality and efficient cutting on difficult-to-machine materials, solves the problems of shallow cutting depth and large kerf taper, and improves cutting efficiency and cutting surface quality.

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Abstract

This invention addresses the problems of shallow cutting depth, large kerf taper, excessive deposition and recasting at the cut, poor surface quality, and low cutting efficiency in the cutting of difficult-to-machine materials. It discloses an integrated oscillating cutting-measurement method based on an optical rotation system. This method controls the translation and deflection modules of the optical rotation system to achieve the translation and deflection of the incident beam, controlling the shape and size of the annular laser spot. Combined with the variable-speed reciprocating motion of the moving platform, it achieves real-time dynamic uniform distribution of energy in the cutting trajectory and effective removal of laser products. After layer-by-layer removal, a low-energy linear scan refines the cut surface. The oscillating mode, combined with the annular laser spot generated by the multi-wedge system, can achieve zero-taper, positive-taper, and inverted-taper cut surface shapes to meet different processing requirements. Based on a multi-wedge system and combined with the variable-speed oscillation of the moving platform, this invention can achieve high aspect ratio, zero-taper, high-quality, and high-efficiency cutting of difficult-to-machine materials.
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