Shielded gate mosfet and method of manufacturing the same
Patent Information
- Application Number
- CN202310917514.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-25
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2043-07-25
AI Technical Summary
[0006]本申请提供了一种屏蔽栅MOSFET及其制备方法,可以解决源端引出区域中源极和栅极短接造成IGSS漏电超出芯片漏电量设计规格的问题
[0045] This application avoids the influence of wet etching of the first gate oxide layer/second gate oxide layer on the main trench and auxiliary trench covering the source lead-out region by forming a patterned first photoresist layer. Furthermore, by forming a patterned second photoresist layer covering the main trench and auxiliary trench covering the source lead-out region, it avoids the influence of wet etching of the first gate oxide layer/second gate oxide layer on the main trench used for source lead-out. This also avoids side-cutting defects on both sides of the top of the first polysilicon layer in the main trench of the source lead-out region, thereby preventing short circuits between the source and gate in the source lead-out region, reducing IGSS leakage current, and improving the electrical performance of the device.