Exhaust jig device and method for suppressing warpage of a carrier plate using gas pressurization

Abstract

This invention discloses an exhaust fixture device and method for suppressing carrier plate warping by using gas pressurization, comprising: placing an exhaust fixture containing a carrier plate in a gas pressurization chamber; the upper contact surface of the exhaust fixture having a plurality of holes providing a first surface for placing the carrier plate; and fixing the carrier plate by vacuum exhaust of the exhaust fixture. The exhaust fixture can be composed of a detachable upper contact portion and a lower base portion assembled by a fitting structure. Gas is pressurized in the gas pressurization chamber to form a pressure difference between the first and second surfaces of the carrier plate, thereby pressing the carrier plate onto the exhaust fixture. The gas pressurization chamber is pressurized to a predetermined pressure greater than standard atmospheric pressure for heat processing. The first surface of the carrier plate can be obtained by simulating or actually measuring a geometric curved surface, and the upper contact surface is processed into an inverse geometric curved surface to offset thermal stress, thereby shaping the carrier plate into a carrier plate that tends to be flat.

Description

Technical Field

[0001] This invention relates to the field of exhaust fixture technology, and in particular to an exhaust fixture device and method that uses gas pressurization to suppress the warping of a carrier plate. The contact surface of the exhaust fixture is processed into a carrier plate, and the reverse curvature or reverse wave surface of the curved or wavy surface is simulated or actually measured to offset the thermal stress of the carrier plate and make it tend to be flat. Background Technology

[0002] Investigations revealed that the warping of the package originates from the different coefficients of thermal expansion of the materials within the package. To address this warping problem, prior art patent application TW100146868, entitled "A Method for Fixing a Carrier Plate to Suppress Carrier Warping Using Gas Pressurization," provides a solution. (See also...) Figure 1 , Figure 2 As shown, the aforementioned prior art invention includes: a carrier plate 1 having upper and lower surfaces 1b and 1c, which are opposite to each other; a ventable fixture 3 having a perforated surface 3a containing a plurality of holes 5; placing one of the upper or lower surfaces 1b and 1c of the carrier plate 1 onto the perforated surface 3a; venting the ventable fixture 3 under vacuum to fix the carrier plate 1 to the ventable fixture 3; fixing the carrier plate 1 to the perforated surface 3a by means of a pressure plate that avoids an effective area on the carrier plate 1; placing the ventable fixture 3 containing the carrier plate 1 into a gas pressurization chamber 20; pressurizing the gas pressurization chamber 20 with gas to create a pressure difference between the first and second surfaces of the carrier plate 1, generating a pressure 22 to press the carrier plate 1 onto the ventable fixture 3, wherein the gas pressurization chamber 20 is pressurized to a predetermined pressure greater than standard atmospheric pressure. This predetermined pressure is between 1 atm (kg / cm²). 2 ) and approximately 30 atm (kg / cm 2The pressure within the gas pressurization chamber 20 can reach a predetermined pressure, after which the exhaust of the ventable fixture 3 can be shut off, and the carrier plate 1 can be pressed onto the ventable fixture 3 by the resulting high pressure difference. At least one heat-resistant sealing layer 11 can be provided between the first surface of the carrier plate 1 and the perforated surface 3a of the ventable fixture 3, wherein this heat-resistant sealing layer 11 does not cover the perforations 5 of the perforated surface 3a. This heat-resistant sealing layer 11 can, for example, withstand processing temperatures from above 40°C to below 300°C. The carrier plate 1 with the warped portion 1a is placed on the ventable fixture 3. The upper surface 1b or the lower surface 1c of the carrier plate 1 can be the first surface or the second surface. The ventable fixture 3 can have a perforated surface 3a and a gas channel 7 to generate an airflow path 21. The perforated surface 3a can contain a plurality of perforations 5. The gas channel 7 is coupled to an exhaust device 9, which can be a general exhaust pump, a vacuum pump, or an exhaust channel switch. The downward pressure 22 generated by the air pressure difference along the airflow path 21 from the gas pressurization chamber 20 to the perforation surface 3A and the perforation 5 can tightly press the carrier plate 1 onto the exhaust-capable fixture 3, thereby counteracting the warping of the carrier plate 1 caused by uneven thermal expansion at high temperatures. Although the aforementioned prior art inventions maintain the carrier plate 1 flat under pressure, thermal stress still exists within the carrier plate 1 and is not completely eliminated. Therefore, when the pressure is removed, the thermal stress will still cause the carrier plate 1 to deform.

[0003] Therefore, in response to the problems existing in the above-mentioned known structures, how to develop a more ideal and practical innovative structure is what consumers eagerly expect, and it is also the goal and direction that relevant businesses must strive to achieve through research and development. Summary of the Invention

[0004] The main objective of this invention is to provide an exhaust fixture device and method for suppressing carrier plate warping by using gas pressurization. The upper contact surface of the exhaust fixture can be processed into a reverse curvature surface or reverse wave surface corresponding to the simulated or actually measured curvature or wave surface of the carrier plate, so as to offset the thermal stress of the carrier plate and make the carrier plate tend to be flat.

[0005] To achieve the above objectives, the present invention provides an exhaust fixture device for suppressing carrier plate warping by using gas pressurization, comprising: a carrier plate having a top surface and a bottom surface opposite to each other; an exhaust fixture having an upper contact surface including a plurality of holes; placing and fixing the carrier plate with one of its top surface or bottom surface facing the upper contact surface, wherein the top or bottom surface of the carrier plate facing the upper contact surface is defined as a first surface, and the other surface opposite to the first surface is defined as a second surface; pressurizing a gas pressurization chamber with gas, and venting the exhaust fixture located in the gas pressurization chamber to create a pressure difference between the first surface and the second surface of the carrier plate, thereby pressing the carrier plate against the exhaust fixture. The fixture is characterized in that the gas pressurization chamber is pressurized to a predetermined pressure greater than the standard atmospheric pressure; the fixture is characterized in that: the exhaust fixture includes an assembly composed of an upper contact part and a lower base part, wherein the surface of the upper contact part is the upper contact surface, a fitting part with a fitting structure is provided downward around the periphery of the upper contact part, the lower base part is provided with a fitting groove of the fitting structure corresponding to the fitting part, and an O-ring is first assembled in the fitting groove and then assembled to the fitting part, the upper contact part is a detachable design, the first surface of the carrier plate can be simulated or actually measured as a plane or a concave curved surface, a convex curved surface or a wavy surface, the upper contact surface can be processed into the corresponding plane or convex curved surface, concave curved surface, or anti-wavy surface, thereby offsetting thermal stress and making the carrier plate after heat processing a carrier plate that tends to be flat.

[0006] The present invention also provides a method for suppressing carrier plate warping by gas pressurization, comprising the following steps:

[0007] After a carrier plate is deformed by hot working, the surface data of the first surface of the carrier plate after deformation is actually measured, or the surface data of the first surface of the carrier plate after deformation is calculated after the carrier plate is deformed by simulated hot working.

[0008] Prepare a set of exhaust fixtures with a detachable upper contact part;

[0009] The processing machine can process the relevant data corresponding to flat, concave and concave on the upper contact surface of the upper contact part according to the surface data;

[0010] The exhaust fixture containing the carrier plate is placed in a gas pressurization chamber, with the first surface of the carrier plate facing the upper contact surface having a plurality of holes.

[0011] The gas filling chamber is pressurized with gas, and the exhaust fixture is vented to create a pressure difference between the first and second surfaces of the carrier plate, thereby pressing the carrier plate onto the exhaust fixture and pressurizing the gas filling chamber to a predetermined pressure greater than standard atmospheric pressure; and

[0012] After heat treatment, the thermal stress of the carrier plate is offset, making the carrier plate tend to be flat.

[0013] The techniques, methods, and effects of this invention are described in detail below with reference to a preferred embodiment and accompanying drawings. It is believed that the above-mentioned objectives, structure, and features of this invention can be deeply and specifically understood through this embodiment. Attached Figure Description

[0014] Figure 1 It is a rough cross-sectional view of the principle of the known precedent.

[0015] Figure 2 It is a schematic cross-sectional view of a known prior art where at least one heat-resistant sealing layer is provided between the first surface of the carrier plate and the hole surface of the fixture.

[0016] Figure 3 This is a schematic cross-sectional view of a preferred embodiment of the present invention.

[0017] Figure 4 This is a schematic cross-sectional view of a preferred embodiment of the present invention.

[0018] Figure 5 This is a schematic diagram of one embodiment of a portion of the first surface of the carrier plate of the present invention in contact with the surface of the exhaust fixture.

[0019] Figure 6 This is a schematic diagram of another embodiment of a portion of the first surface of the carrier plate of the present invention in contact with the surface of the exhaust fixture.

[0020] Figure 7 This is a schematic diagram of another embodiment of a portion of the first surface of the carrier plate of the present invention in contact with the surface of the exhaust fixture.

[0021] Figure 8 This is a schematic diagram of another embodiment of a portion of the first surface of the carrier plate of the present invention in contact with the surface of the exhaust fixture.

[0022] Figure 9 This is a flowchart of a method according to an embodiment of the present invention.

[0023] Explanation of icon numbers

[0024] 1-Carrier plate; 1a-Warped portion; 1b-Top; c-Bottom; Exhaust fixture; 3a-Perforated surface; 5-Perforation; 7-Gas passage; 9-Exhaust device; 11-Heat-resistant sealing layer; 20-Gas pressurization chamber; 21-Airflow path; 22-Downward pressure; 30-Exhaust fixture; 40-Upper contact part; 41-Upper contact surface; 42-Matching part; 50-Lower base part; 51-Matching groove; 60-O-ring;

[0025] 71. After a carrier plate undergoes heat treatment deformation, the surface data of the first surface of the carrier plate after deformation are actually measured.

[0026] 72. After a carrier plate undergoes simulated hot working deformation, the surface data of the first surface of the carrier plate after deformation are calculated.

[0027] 73. Prepare an exhaust fixture with a detachable upper contact part.

[0028] 74 The machining machine can process the corresponding data of flat to flat, concave to convex, and convex to concave on the upper contact surface of the upper contact part according to the surface data.

[0029] 75. The venting fixture containing the carrier plate is placed in a gas pressurization chamber, with the first surface of the carrier plate facing the upper contact surface having a plurality of holes.

[0030] 76. The gas filling chamber is pressurized with gas, and the exhaust fixture is vented, so as to create a pressure difference between the first surface and the second surface of the carrier plate, thereby pressing the carrier plate onto the exhaust fixture, and pressurizing the gas filling chamber to a predetermined pressure greater than the standard atmospheric pressure.

[0031] 77. After heat treatment, the thermal stress of the carrier plate is offset, making the carrier plate more flat. Detailed Implementation

[0032] This invention provides an exhaust fixture device and method for suppressing carrier plate warping by using gas pressurization.

[0033] To enable a better understanding of the purpose, features, and effects of this invention, the following detailed description is provided in conjunction with embodiments and illustrations:

[0034] See Figures 3 to 4 As shown, the present invention provides an exhaust fixture device for suppressing carrier plate warping by using gas pressurization, comprising:

[0035] A carrier plate 1 having a top surface 1b and a bottom surface 1c, the top surface 1b and the bottom surface 1c being opposite each other; an exhaust fixture 30 having an upper contact surface 41 including a plurality of holes 5; the carrier plate 1 having one of its top surface 1b or bottom surface 1c facing the upper contact surface 41 and being placed and fixed on the upper contact surface 41, wherein the top surface 1b or bottom surface 1c of the carrier plate 1 facing the upper contact surface 41 is defined as a first surface, and the other surface opposite to the first surface is defined as a second surface; a gas pressurization chamber 20 is pressurized with gas, and the exhaust fixture 30 located in the gas pressurization chamber 20 is vented to form a pressure difference between the first surface and the second surface of the carrier plate 1, thereby pressing the carrier plate 1 onto the exhaust fixture 30, wherein the gas pressurization chamber 20 is pressurized to a predetermined pressure greater than standard atmospheric pressure; characterized in that:

[0036] The exhaust fixture 30 includes an assembly consisting of an upper contact portion 40 and a lower base portion 50. The surface of the upper contact portion 40 is the upper contact surface 41. The upper contact portion 40 is designed to be detachable. A surface data can be obtained by simulating or actually measuring the first surface of the previously heat-processed carrier plate 1. The surface data can be processed onto the upper contact surface 41 with corresponding data of flat to flat, concave to convex, and convex to concave. This can offset the thermal stress of the carrier plate 1 during subsequent heat processing, making the carrier plate 1 after heat processing tend to be a flat carrier plate.

[0037] The exhaust fixture device that uses gas pressurization to suppress the warping of the carrier plate includes an engagement part 42 with an engagement structure located downward around the periphery of the upper contact part 40. The lower base part 50 has an engagement groove 51 corresponding to the engagement part 42. The engagement part 42 is fitted tightly into the engagement groove 51. An O-ring 60 is provided between the engagement part 42 and the engagement groove 51.

[0038] See Figure 5 As shown, in the exhaust fixture device that uses gas pressurization to suppress warping of the carrier plate, the first surface of the carrier plate 1 is a concave curved surface, and the upper contact surface 41 of the upper contact portion 40 is a convex curved surface.

[0039] See Figure 6 As shown, in the exhaust fixture device that uses gas pressurization to suppress warping of the carrier plate, the first surface of the carrier plate 1 is a convex curved surface, and the upper contact surface 41 of the upper contact portion 40 is a concave curved surface.

[0040] See Figure 7 As shown, in the exhaust fixture device that uses gas pressurization to suppress warping of the carrier plate, the first surface of the carrier plate 1 is a wavy surface, and the upper contact surface 41 of the upper contact portion 40 is an anti-wavy surface.

[0041] See Figure 8 As shown, in the exhaust fixture device that uses gas pressurization to suppress warping of the carrier plate, the first surface of the carrier plate 1 is an irregular curved surface, and the upper contact surface 41 of the upper contact portion 40 is an inverse irregular curved surface.

[0042] The exhaust fixture device that uses gas pressurization to suppress warping of the carrier plate includes at least one heat-resistant sealing layer 11 between the first surface of the carrier plate 1 and the upper contact surface 41 of the exhaust fixture 30, wherein the heat-resistant sealing layer 11 may partially cover or not cover the hole 5.

[0043] The exhaust fixture device that uses gas pressurization to suppress carrier plate warping, wherein the heat-resistant sealing layer 11 can withstand processing temperatures from above 40°C to below 1200°C.

[0044] The aforementioned exhaust fixture device for suppressing carrier board warping by using gas pressurization, wherein the carrier board 1 may be at least one of a printed circuit board, a substrate, a lead frame, a wafer, a silicon interposer, a package, or a flat plate with circuit wiring.

[0045] See Figure 9 As shown, a method for suppressing carrier plate warping using gas pressurization includes:

[0046] Step 1A: After a carrier plate is deformed by hot working, the surface data of the first surface of the carrier plate after deformation is actually measured (71); or

[0047] Step 1B: After a carrier plate undergoes simulated thermal deformation, the surface data of the first surface of the carrier plate after deformation is calculated (72);

[0048] Step 2: Prepare an exhaust fixture (73) with a detachable upper contact part;

[0049] Step 3: The machining machine can process the relevant data corresponding to flat, concave and concave on the upper contact surface of the upper contact part according to the surface data (74);

[0050] Step 4: Place the exhaust fixture containing the carrier plate in a gas pressurization chamber, with the first surface of the carrier plate facing the upper contact surface having a plurality of holes (75);

[0051] Step 5: Pressurize the gas filling chamber with gas and vent the exhaust fixture to create a pressure difference between the first surface and the second surface of the carrier plate, thereby pressing the carrier plate onto the exhaust fixture and pressurizing the gas filling chamber to a predetermined pressure greater than the standard atmospheric pressure (76).

[0052] Step 6: After heat treatment, the thermal stress of the carrier plate is offset, making the carrier plate more flat (77). The upper or lower surface of the carrier plate facing the upper contact surface is defined as the first surface, and the other surface opposite the first surface is defined as the second surface.

[0053] The foregoing description uses preferred embodiments of the present invention to illustrate its technical features; however, those skilled in the art may make changes and modifications to the present invention without departing from its spirit and principles, and all such changes and modifications should be covered within the scope defined by the claims of this application.

Claims

1. A venting fixture device that utilizes gas pressurization to suppress carrier plate warping, characterized in that, include: A carrier plate having a top surface and a bottom surface opposite each other; an exhaust fixture having an upper contact surface including a plurality of holes; the carrier plate having one of its top surface and bottom surface facing the upper contact surface and being placed and fixed on the upper contact surface, wherein the top surface or bottom surface of the carrier plate facing the upper contact surface is defined as a first surface, and the other surface opposite the first surface is defined as a second surface; a gas pressurization chamber is pressurized with gas, and the exhaust fixture located in the gas pressurization chamber is vented to create a pressure difference between the first surface and the second surface of the carrier plate, thereby pressing the carrier plate onto the exhaust fixture, wherein the gas pressurization chamber is pressurized to a predetermined pressure greater than standard atmospheric pressure; characterized in that: The exhaust fixture includes an assembly consisting of an upper contact portion and a lower base portion. The surface of the upper contact portion is the upper contact surface. The upper contact portion is designed to be detachable. A surface data can be obtained by simulating or actually measuring the first surface of the previously heat-processed carrier plate. Based on the surface data, relevant data corresponding to flatness, concavity, and concavity are processed on the upper contact surface. This can offset the thermal stress of the carrier plate during subsequent heat processing, making the carrier plate after heat processing tend to be a flat carrier plate.

2. The exhaust fixture device for suppressing carrier plate warping by utilizing gas pressurization as described in claim 1, characterized in that, The upper contact portion has a fitting part with a fitting structure extending downwards from its periphery. The lower base portion has a fitting groove of the fitting structure corresponding to the fitting part. The fitting part can fit tightly into the fitting groove. An O-ring is provided between the fitting part and the fitting groove.

3. The exhaust fixture device for suppressing carrier plate warping by utilizing gas pressurization as described in claim 1, characterized in that, If the first surface of the carrier plate is a concave surface, then the upper contact surface of the upper contact portion is a convex surface.

4. The exhaust fixture device for suppressing carrier plate warping by utilizing gas pressurization as described in claim 1, characterized in that, If the first surface of the carrier plate is a convex curved surface, then the upper contact surface of the upper contact portion is a concave curved surface.

5. The exhaust fixture device for suppressing carrier plate warping by utilizing gas pressurization as described in claim 1, characterized in that, If the first surface of the carrier plate is a wavy surface, then the upper contact surface of the upper contact portion is an inverted wavy surface.

6. The exhaust fixture device for suppressing carrier plate warping by utilizing gas pressurization as described in claim 1, characterized in that, If the first surface of the carrier plate is an irregular curved surface, then the upper contact surface of the upper contact portion is an inverse irregular curved surface.

7. The exhaust fixture device for suppressing carrier plate warping by utilizing gas pressurization as described in claim 1, characterized in that, At least one heat-resistant sealing layer is provided between the first surface of the carrier plate and the upper contact surface of the exhaust fixture, wherein the heat-resistant sealing layer partially covers or does not cover the hole.

8. The exhaust fixture device for suppressing carrier plate warping by utilizing gas pressurization as described in claim 7, characterized in that, This heat-resistant sealing layer can withstand processing temperatures ranging from above 40°C to below 1200°C.

9. The exhaust fixture device for suppressing carrier plate warping by utilizing gas pressurization as described in claim 1, characterized in that, The carrier is at least one of a printed circuit board, a substrate, a conductive support, a wafer, a silicon interposer, a package, and a flat plate with circuit wiring.

10. A method for suppressing carrier plate warping using gas pressurization, comprising the following steps: after a carrier plate is deformed by heat treatment, actually measuring the surface data of the first surface of the carrier plate after deformation, or after a carrier plate is deformed by simulated heat treatment, calculating the surface data of the first surface of the carrier plate after deformation; preparing a venting fixture with a detachable upper contact portion; processing machinery processing, according to the surface data, onto an upper contact surface of the upper contact portion, relevant data corresponding to flatness, concavity, and concavity on the upper contact surface; and further processing the gas pressurization fixture containing... The venting fixture with the carrier plate is placed in a gas pressurization chamber, with the first surface of the carrier plate facing the upper contact surface having a plurality of holes; the gas pressurization chamber is pressurized with gas, and the venting fixture is vented, so as to form a pressure difference between the first surface and the second surface of the carrier plate, thereby pressing the carrier plate onto the venting fixture, and pressurizing the gas pressurization chamber to a predetermined pressure greater than the standard atmospheric pressure; and the carrier plate is heat-treated to offset the thermal stress of the carrier plate, making the carrier plate tend to be flat.

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