A profile processing method and device, electronic equipment and storage medium

Abstract

The application discloses a profile processing method and device, electronic equipment and a storage medium. The method comprises the following steps: controlling a temperature control module to align to the surface of a to-be-processed profile, the temperature control module comprising a high-temperature module and a low-temperature module, the high-temperature module and the low-temperature module being distributed on different sides of the to-be-processed profile; adjusting the relative position between the temperature control module and the to-be-processed profile and the temperature difference of the temperature control module, so that the to-be-processed profile is deformed to obtain a standard profile. The application improves the efficiency and accuracy of profile processing, thereby guaranteeing the quality of profile processing.

Description

Technical Field

[0001] This invention relates to the field of materials processing technology, and in particular to a profile processing method, apparatus, electronic device, and storage medium. Background Technology

[0002] Profile processing is particularly important in the product manufacturing and processing process.

[0003] Traditional profile processing methods mainly rely on molds. Before profile processing, molds are produced and processed first, and then the profiles are mass-produced based on the processed molds.

[0004] However, in the process of profile processing for aerospace products, the production cycle of molds extends the production cycle of the products, and the product quality is highly dependent on the molds, resulting in low efficiency in profile processing and difficulty in guaranteeing profile quality, which urgently needs to be addressed. Summary of the Invention

[0005] This invention provides a profile processing method, apparatus, electronic device, and storage medium, which improves the efficiency and accuracy of profile processing, thereby ensuring the quality of profile processing.

[0006] According to one aspect of the present invention, a profile processing method is provided, comprising:

[0007] The temperature control module is aligned with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed.

[0008] Adjust the relative position between the temperature control module and the profile to be processed, and adjust the temperature difference between the temperature control module and the profile to be processed so that the profile to be processed is deformed to obtain a standard profile.

[0009] According to another aspect of the present invention, a profile processing apparatus is provided, comprising:

[0010] The temperature control module is used to align the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed.

[0011] The standard profile acquisition module is used to adjust the relative position between the temperature control module and the profile to be processed, as well as the temperature difference between the temperature control module and the profile to be processed, so that the profile to be processed is deformed to obtain a standard profile.

[0012] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0013] At least one processor; and

[0014] A memory that is communicatively connected to at least one processor; wherein,

[0015] The memory stores a computer program that can be executed by at least one processor, such that the at least one processor is able to perform the profile processing method of any embodiment of the present invention.

[0016] According to another aspect of the present invention, a computer-readable storage medium is provided, which stores computer instructions for causing a processor to execute and implement the profile processing method of any embodiment of the present invention.

[0017] The technical solution of this invention controls the temperature control module to align with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed. The relative position between the temperature control module and the profile to be processed and the temperature difference between the temperature control module are adjusted to deform the profile to be processed, thereby obtaining a standard profile. This improves the efficiency and accuracy of profile processing, thereby ensuring the quality of profile processing.

[0018] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1a This is a flowchart of a profile processing method provided in Embodiment 1 of the present invention;

[0021] Figure 1b This is a schematic diagram of the structure of a profile to be processed according to Embodiment 1 of the present invention;

[0022] Figure 1c This is a structural schematic diagram of a standard profile provided in Embodiment 1 of the present invention;

[0023] Figure 2 This is a flowchart of a profile processing method provided in Embodiment 2 of the present invention;

[0024] Figure 3 This is a flowchart of a profile processing method provided in Embodiment 3 of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of a profile processing device provided in Embodiment 4 of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of an electronic device that implements the profile processing method of the present invention. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0028] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0029] Example 1

[0030] Figure 1a This is a flowchart illustrating a profile processing method according to Embodiment 1 of the present invention. This embodiment is applicable to the processing of profiles, particularly those used in aerospace equipment. The method can be executed by a profile processing device, which can be implemented in hardware and / or software and can be configured within an electronic device. Figure 1a As shown, the method includes:

[0031] S110, the temperature control module is aligned with the surface of the profile to be processed.

[0032] The temperature control module is used to control the temperature during profile processing, specifically the surface temperature of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are located on different sides of the profile. The high-temperature module is used to heat the profile surface. The low-temperature module is used to cool the profile surface. Optionally, the heating method of the high-temperature module may include, but is not limited to, methods with high calorific value such as self-resistive electric heating and laser heating. The cooling method of the low-temperature module may include, but is not limited to, methods that rapidly remove large amounts of heat such as liquid nitrogen cooling and dry ice cooling.

[0033] The profile to be processed can be the profile prepared for processing during the profile processing procedure. Optionally, the material of the profile to be processed can include materials such as aluminum alloy, magnesium alloy, and titanium alloy. For example, Figure 1b As shown in the figure, Embodiment 1 of the present invention provides a structural schematic diagram of the profile to be processed.

[0034] In the technical solution of this invention embodiment, the profile to be processed further includes aerospace parts.

[0035] Aerospace parts can be profiles that are to be processed and then applied to aerospace equipment. In practice, traditional processing methods mostly employ mold making, which is suitable for mass production. The quality of the mold directly affects the quality of the product, and the speed of mold design also affects the development cycle of new products. The raw materials and processing costs of molds are high, and the types of products that can be formed limit the applicability of each mold set. Once a product needs to be updated, the entire mold set must be replaced. Aerospace equipment profiles are used to manufacture structural components such as aircraft beams, stringers, frame ribs, or reinforcing struts. Aerospace parts are characterized by a wide variety of products and small batches; using mold forming increases production costs and extends the production cycle.

[0036] The technical solution of this invention specifically exemplifies aerospace parts as the profile to be processed. The profile processing method provided by this invention can process aerospace parts, ensuring the application of the profile to be processed in the aerospace field. Furthermore, this invention is applicable to profiles of aerospace equipment with multiple varieties and small batches, reducing the realization cost of profile processing, shortening the profile processing cycle, improving the accuracy of profile processing, and improving the processing quality of aerospace equipment profiles.

[0037] Specifically, the high-temperature module can be fixed to one side of the profile to be processed, and the low-temperature module can be fixed to the other side of the profile to be processed, with the temperature control direction of the high-temperature module and the low-temperature module perpendicular to the surface of the profile to be processed. For example, ... Figure 1bAs shown, the high-temperature module is fixed to the upper side of the profile to be processed, and the low-temperature module is fixed to the lower side of the profile to be processed. The temperature control directions of both the high-temperature and low-temperature modules are perpendicular to the surface of the profile to be processed. The temperature control direction can be the direction in which the temperature control module is aligned with the profile to be processed. For example, if the temperature control module is a laser, the temperature control direction can be the direction in which the laser beam is perpendicularly aligned with the central axis of the surface of the profile to be processed.

[0038] For example, if the front and rear surfaces of the profile to be processed are to be processed, the temperature control direction of the high-temperature module can be kept horizontal and vertically aligned with the front surface of the profile to be processed, and the temperature control direction of the low-temperature module can be kept horizontal and vertically aligned with the rear surface of the module to be processed.

[0039] S120. Adjust the relative position between the temperature control module and the profile to be processed, and the temperature difference between the temperature control module and the profile to be processed, so that the profile to be processed is deformed to obtain a standard profile.

[0040] The relative position can be the position of the temperature control module aligned with the surface of the profile to be processed, and the relative position between this position and the actual location on the surface of the profile to be processed. The relative position can be used to determine whether the temperature control module is aligned with the required processing location on the surface of the profile.

[0041] Temperature difference can be the temperature difference between the temperature control module and the surface of the profile to be processed. Temperature difference can be determined by the type of temperature control module, the contact area of ​​the temperature control part of the temperature control module, the energy of the temperature control module, the distance between temperature control modules, and the distance between the temperature control module and the two sides of the profile to be processed.

[0042] Standard profiles can be processed profiles that conform to profile processing standards. These processing standards can be set by technicians based on experience. For example, ... Figure 1c As shown in the figure, Embodiment 1 of the present invention provides a structural schematic diagram of a standard profile.

[0043] Specifically, the type of temperature control module and the distance between two temperature control modules can be determined. Based on the determined type and distance, the temperature difference between the high-temperature and low-temperature modules is determined. Based on this temperature difference, the axial relative position between the temperature control modules and the profile to be processed is adjusted, thereby adjusting the temperature difference between them. Finally, the radial relative position is adjusted to cause deformation in various areas of the profile's surface, resulting in a standard profile. The axial direction can be parallel to the temperature control direction of the temperature control module, while the radial direction can be perpendicular to it.

[0044] The technical solution of this invention controls the temperature control module to align with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed. By adjusting the relative position between the temperature control module and the profile to be processed and the temperature difference between the temperature control module and the profile to be processed, the profile to be processed is deformed to obtain a standard profile, thereby improving the efficiency and accuracy of profile processing and ensuring the quality of profile processing.

[0045] Example 2

[0046] Figure 2 This is a flowchart illustrating a profile processing method according to Embodiment 2 of the present invention. Based on the above technical solution, this embodiment further optimizes the alignment of the temperature control module with the surface of the profile to be processed. For example... Figure 2 As shown, the method includes:

[0047] S210, control the high temperature module to align with the first surface of the profile to be processed.

[0048] The first surface can be any side surface of the profile to be processed. For example, if the profile to be processed requires processing of both the upper and lower surfaces, the first surface can be either the upper or lower surface of the profile to be processed.

[0049] Specifically, the temperature control direction of the heating part of the high-temperature module can be vertically aligned with the first surface of the profile to be processed.

[0050] S220, the low-temperature module is aligned with the second surface of the profile to be processed, and the temperature control direction of the low-temperature module is aligned with the temperature control direction of the high-temperature module.

[0051] The second surface can be the surface of the profile to be processed that is opposite to the first surface. Optionally, the first surface and the second surface are the two side surfaces of the profile to be processed, respectively. For example, if the profile to be processed needs to have its upper and lower surfaces processed, the first surface can be the upper surface of the profile to be processed, and the second surface can be the lower surface of the profile to be processed.

[0052] The temperature control direction of the low-temperature module is aligned with the temperature control direction of the high-temperature module. Specifically, the temperature control direction of the cooling section of the low-temperature module can be vertically aligned with the second surface of the profile to be processed, and the temperature control directions of the low-temperature module and the high-temperature module can be kept aligned on the same axis. For example, if the low-temperature module includes dry ice and the high-temperature module includes a laser, the axial direction of the dry ice and the axial direction of the laser beam can be aligned on the same axis.

[0053] S230. Adjust the relative position between the temperature control module and the profile to be processed, and the temperature difference between the temperature control module and the profile to be processed, so that the profile to be processed is deformed to obtain a standard profile.

[0054] The technical solution of this invention controls a high-temperature module to align with the first surface of the profile to be processed; controls a low-temperature module to align with the second surface of the profile to be processed, with the temperature control direction of the low-temperature module aligned with the temperature control direction of the high-temperature module; adjusts the relative position between the temperature control module and the profile to be processed and the temperature difference between the temperature control modules to deform the profile to be processed, thus obtaining a standard profile; by aligning the high-temperature module with the first surface and the low-temperature module with the second surface, processing of both surfaces of the profile to be processed is achieved; simultaneously maintaining the alignment of the temperature control directions of the high-temperature module and the low-temperature module ensures that the temperature control module can be aligned with the accurate position of the profile to be processed, improving the precision of temperature processing, and thus improving the efficiency and accuracy of profile processing.

[0055] This invention provides an optional technical solution. Further, the above technical solution is specifically exemplified as follows: the high-temperature module includes a laser, the low-temperature module includes liquid nitrogen, the laser spot diameter and the liquid nitrogen nozzle diameter are the same, and the laser beam and the liquid nitrogen injection direction are on the same axis.

[0056] Specifically, a laser is used as the high-temperature module, and liquid nitrogen as the low-temperature module. The laser spot diameter is set to be the same as the liquid nitrogen nozzle diameter. The laser beam and liquid nitrogen nozzle are respectively aligned with the two sides of the profile to be processed, with the liquid nitrogen nozzle in close proximity to the surface of the profile. During the processing of the profile, the laser beam and liquid nitrogen jet directions are always kept on the same axis. By moving the temperature control module (i.e., the laser and liquid nitrogen) or the profile to be processed, the laser and liquid nitrogen move across the surface of the profile to process it, resulting in a standard profile.

[0057] This solution specifically defines the high-temperature module as a laser and the low-temperature module as liquid nitrogen. The diameter of the laser spot and the diameter of the liquid nitrogen nozzle are the same, and the laser beam and the liquid nitrogen spray direction are on the same axis. By specifically defining the high-temperature module and the low-temperature module as a laser and liquid nitrogen, it is easy to control the temperature control direction of the high-temperature module and the low-temperature module, ensuring the accuracy of the area of ​​the profile to be processed aligned by the laser and liquid nitrogen, thereby ensuring the accuracy of profile processing.

[0058] Example 3

[0059] Figure 3 This is a flowchart illustrating a profile processing method according to Embodiment 3 of the present invention. Based on the above technical solution, this embodiment further optimizes the method by adjusting the relative position between the temperature control module and the profile to be processed, and the temperature difference between the temperature control module and the profile. Figure 3 As shown, the method includes:

[0060] S310, the temperature control module is aligned with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed.

[0061] S320. Obtain standard deformation information of standard profiles and determine the relationship between temperature difference area and temperature difference of the profile to be processed.

[0062] The standard deformation information can be the deformation information of each region of a standard profile. Optionally, it can be the curvature information of each region.

[0063] The temperature difference region can be the area on both sides of the profile to be processed, mapped by the heating part of the high-temperature module and the cooling part of the low-temperature module. For example, if the high-temperature module is a laser and the low-temperature module is liquid nitrogen, and the laser and liquid nitrogen are located on different sides of the profile to be processed, with the same diameter of the laser spot and the same diameter of the liquid nitrogen nozzle, the temperature difference region can be the surface area of ​​the profile to be processed mapped by the laser spot and the surface area of ​​the profile to be processed adjacent to the liquid nitrogen nozzle.

[0064] Specifically, standard deformation information (e.g., curvature information) of various regions of a standard profile can be obtained. Based on this information, the standard deformation information corresponding to the temperature control zone of the profile to be processed can be determined. Based on the relationship between the standard deformation information and the temperature difference, the temperature difference of the temperature difference zone of the profile to be processed can be determined. The relationship between the standard deformation information and the temperature difference can be determined by the material of the profile to be processed. This relationship can be set and adjusted by technicians based on empirical values ​​obtained from experimental data. For example, experimental data can be obtained by detecting which temperature difference is needed to adjust the temperature of which regions of the profile to be processed, and for how long, to make the profile reach the deformation requirements of the standard profile. The adjusted regions, corresponding temperature differences, and adjustment durations are recorded, and this recorded data is considered experimental data.

[0065] S330. Adjust the relative position between the profile to be processed and the temperature control module according to the temperature difference zone.

[0066] Specifically, based on the temperature difference region, the temperature control module can be kept stationary while adjusting the position of the profile to be processed. This adjustment achieves a relative position adjustment so that the area mapped by the temperature control module onto the surface of the profile to be processed coincides with the temperature difference region. Alternatively, the profile to be processed can be kept stationary while adjusting the position of the temperature control module. This adjustment achieves a relative position adjustment so that the area mapped by the temperature control module onto the surface of the profile to be processed coincides with the temperature difference region.

[0067] Based on the above technical solution, the preferred implementation method for adjusting the relative position between the profile to be processed and the temperature control module according to the temperature difference region may include the following:

[0068] S3301. Maintain the relative position between the high-temperature module and the low-temperature module.

[0069] Specifically, the relative distance between the high-temperature module and the low-temperature module can be kept constant, and the high-temperature module and the low-temperature module can be moved or stationary at the same time to ensure that the high-temperature module and the low-temperature module are aligned with the two sides of the profile to be processed.

[0070] S3302. Determine the relative position of the temperature difference between the profile to be processed and the temperature control module based on the temperature difference region.

[0071] The relative position of temperature difference refers to the relative position between the profile to be processed and the temperature control module when processing the profile in the temperature difference zone. When the profile to be processed and the temperature control module are in the relative position of temperature difference, the temperature control direction of the temperature control module is aligned with the temperature difference zone on the surface of the profile to be processed.

[0072] Specifically, based on the temperature difference region of the profile to be processed, the position of the central axis of the temperature difference region can be used as the radial relative position of the temperature difference between the profile to be processed and the temperature control module. Based on the temperature difference corresponding to the temperature difference region, the axial relative position of the temperature difference between the profile to be processed and the temperature control module can be determined when the required temperature difference for processing the profile in the temperature difference region is reached. The obtained radial and axial relative positions of the temperature difference are used as the relative position of the temperature difference between the profile to be processed and the temperature control module.

[0073] For example, if the temperature control modules are laser and liquid nitrogen, and the temperature difference region is two circular areas on both sides of the profile to be processed where the laser beam and the liquid nitrogen nozzle are aligned, the position of the central axis of the temperature difference region is taken as the radial relative position of the temperature difference between the profile to be processed and the temperature control module; then, based on the temperature difference required when processing the profile in the temperature difference region, the axial relative position of the temperature difference between the laser and the liquid nitrogen and the surface of the profile to be processed is determined to achieve the required temperature difference when processing the profile in the temperature difference region. The obtained radial and axial relative positions of the temperature difference are taken as the relative position of the temperature difference between the profile to be processed and the temperature control module.

[0074] S3303: Obtain the current relative position between the profile to be processed and the temperature control module.

[0075] The current relative position can be the relative position between the profile to be processed and the temperature control module at the current moment before the temperature difference relative position was adjusted.

[0076] Specifically, the current radial relative position can be defined as the position of the temperature control module's current temperature control direction aligned with the surface of the profile to be processed. The current axial relative position can be defined as the distance between the surface of the profile to be processed and the temperature control module. The current radial and axial relative positions are then used as the current relative positions.

[0077] For example, if the temperature control module at the current moment is a laser and liquid nitrogen, the position of the surface of the profile to be processed, which is aligned with the temperature control direction of the laser and liquid nitrogen, is taken as the current radial relative position, and the distance between the surface of the profile to be processed and the laser and liquid nitrogen nozzles are taken as the current axial relative positions, respectively. The current radial and axial relative positions are used as the current relative positions.

[0078] S3304. Based on the difference between the relative position of the temperature difference and the current relative position, adjust the moving module according to the specified moving speed and moving direction so that the overlapping area between the profile to be processed and the temperature control module includes the temperature difference area.

[0079] The moving module includes either the profile to be processed or a temperature control module. The moving module is used to adjust the relative position between the profile to be processed and the temperature control module.

[0080] The overlapping area can be the area mapped by the temperature control module onto the surface of the profile to be processed.

[0081] Specifically, the moving direction and speed of the moving module can be set based on the radial and axial relative distances between the relative position of the temperature difference and the current relative position. The position of the moving module is then adjusted according to the set moving direction and speed until the temperature control module is mapped onto the overlapping area of ​​the profile surface to be processed, including the temperature difference area. The moving speed can be set and adjusted according to the parameters of the corresponding profile processing equipment.

[0082] This solution maintains the relative positions of the high-temperature module and the low-temperature module, compares the relative position of the temperature difference with the current relative position, and adjusts the moving module based on the difference between the relative position of the temperature difference and the current relative position. This ensures that the overlapping area between the profile to be processed and the temperature control module includes the temperature control area, thereby achieving precise control of the temperature control area and improving the accuracy of profile processing.

[0083] S340. Adjust the temperature difference between the high-temperature module and the low-temperature module according to the relationship between the temperature difference region and the temperature difference.

[0084] Specifically, the standard deformation information of the temperature difference region of the profile to be processed can be determined based on the standard deformation information (such as curvature information) of the standard profile. Based on the standard deformation information of the temperature difference region, the temperature difference required for the deformation of the temperature difference region can be determined. Then, the temperature difference between the temperature control region corresponding to the high temperature module and the temperature control region corresponding to the low temperature module of the profile to be processed can be determined. Based on the determined temperature difference between the high temperature module and the low temperature module, the temperature of the high temperature module and the temperature of the low temperature module can be adjusted to achieve the determined temperature difference between the high temperature module and the low temperature module.

[0085] Based on the above technical solution, according to the relationship between the temperature difference region and the temperature difference, the preferred implementation method for adjusting the temperature difference between the high-temperature module and the low-temperature module may include the following:

[0086] S3401. Obtain the current temperature difference region to be adjusted, and determine the temperature difference corresponding to the current temperature difference region to be adjusted based on the correspondence between the temperature difference region and the temperature difference.

[0087] Among them, the temperature difference area to be adjusted can be the area on the surface of the profile to be processed at the current moment.

[0088] Specifically, the temperature difference region to be adjusted can be obtained, the standard deformation information (such as curvature information) corresponding to the temperature difference region to be adjusted can be determined, and the temperature difference of the current region to be adjusted can be determined based on the correspondence between the standard deformation information corresponding to the temperature difference region and the temperature difference.

[0089] For example, the correspondence between standard deformation information and temperature difference can be determined in advance based on experiments.

[0090] S3402. Adjust the energy and contact area of ​​the temperature control module so that the temperature difference between the high-temperature module and the low-temperature module is the same as the temperature difference corresponding to the current temperature difference area to be adjusted.

[0091] The contact area can be defined as the area on the surface of the profile to be processed by the temperature control module. The contact area determines the processing temperature of the profile to be processed by the high-temperature module and the low-temperature module, thus affecting the temperature difference between the high-temperature module and the low-temperature module.

[0092] The energy can be the energy value of the temperature control module during profile processing. This energy can be used to adjust the temperatures of the high-temperature and low-temperature modules, thereby affecting the temperature difference between them.

[0093] Specifically, the energy of the high-temperature module and the low-temperature module, as well as the contact area between the high-temperature module and the low-temperature module and the surface of the profile to be processed, can be adjusted, and the temperature of the high-temperature module and the low-temperature module can be adjusted so that the temperature difference between the high-temperature module and the low-temperature module is the same as the temperature difference value corresponding to the temperature difference area to be adjusted.

[0094] It should be noted that when adjusting the energy and contact area of ​​the high-temperature module, it is necessary to ensure that defects such as melting modification do not occur on the surface of the material to be processed.

[0095] It should be noted that if, when adjusting to the temperature difference corresponding to the current temperature difference zone to be adjusted, the energy value of the high-temperature module exceeds the melting point of the profile to be processed (i.e., it will cause melt modification on the surface of the profile to be processed), energy compensation can be used to process the profile. Specifically, the energy value required for the temperature-controlled zone of the profile to be processed to transform into a standard profile can be the sum of the energy value of the temperature-controlled zone and the energy compensation value of adjacent temperature-controlled zones. The energy compensation value of adjacent zones can be set and adjusted by technicians based on experience.

[0096] It should be noted that when adjusting the temperatures of the high-temperature and low-temperature modules, a temperature sensor can be set to monitor the temperature changes in real time to ensure that the temperature matches the expected value. For example, an infrared thermometer can be set to monitor the temperature changes in real time, and a displacement sensor can be used to record the bending degree of the profile to ensure forming accuracy.

[0097] This solution introduces the temperature difference region to be adjusted, and by adjusting the energy and contact area of ​​the temperature control module, adjusts the temperature difference between the high-temperature module and the low-temperature module to the temperature difference corresponding to the temperature difference region to be adjusted. This achieves precise control of the temperature difference region and temperature difference during profile processing, thereby improving the accuracy of profile processing and ensuring the quality of profile processing.

[0098] The technical solution of this invention controls a temperature control module to align with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed. It acquires standard deformation information of a standard profile and determines the relationship between the temperature difference region and the temperature difference of the profile to be processed. Based on the temperature difference region, it adjusts the relative position between the profile to be processed and the temperature control module. Based on the relationship between the temperature difference region and the temperature difference, it adjusts the temperature difference between the high-temperature module and the low-temperature module. This improves the accuracy of processing the temperature difference region of the profile to be processed and enhances the precision of determining the temperature difference between the high-temperature module and the low-temperature module, ensuring the accuracy of profile processing and thus guaranteeing the quality of profile processing.

[0099] Example 4

[0100] Figure 4 This is a schematic diagram of a profile processing apparatus according to Embodiment 4 of the present invention. This embodiment is applicable to the processing of profiles, especially profiles for aerospace equipment. The apparatus can perform profile processing methods and can be implemented in hardware and / or software. This profile processing apparatus can be configured in an electronic device. Figure 4 As shown, the device includes:

[0101] The temperature control module 410 is used to align with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed.

[0102] The standard profile acquisition module 420 is used to adjust the relative position between the temperature control module and the profile to be processed and the temperature difference between the temperature control module, so that the profile to be processed is deformed to obtain a standard profile.

[0103] Among them, the processed profiles include aerospace parts.

[0104] The technical solution of this invention controls the temperature control module to align with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed. By adjusting the relative position between the temperature control module and the profile to be processed and the temperature difference between the temperature control module and the profile to be processed, the profile to be processed is deformed to obtain a standard profile, thereby improving the efficiency and accuracy of profile processing and ensuring the quality of profile processing.

[0105] Optionally, the temperature control module 410 may include:

[0106] The first surface control unit is used to control the high-temperature module to align with the first surface of the profile to be processed.

[0107] The second surface control unit is used to control the low-temperature module to align with the second surface of the profile to be processed, and the temperature control direction of the low-temperature module is aligned with the temperature control direction of the high-temperature module.

[0108] In a preferred embodiment of the present invention, the high-temperature module includes a laser, the low-temperature module includes liquid nitrogen, the laser spot diameter and the liquid nitrogen nozzle diameter are the same, and the laser beam and the liquid nitrogen injection direction are on the same axis.

[0109] Optionally, the standard profile acquisition module 420 may include:

[0110] The temperature relationship determination unit is used to acquire standard deformation information of standard profiles and determine the relationship between the temperature difference region and the temperature difference of the profile to be processed.

[0111] The relative position adjustment unit is used to adjust the relative position between the profile to be processed and the temperature control module according to the temperature difference zone.

[0112] The temperature difference adjustment unit is used to adjust the temperature difference between the high-temperature module and the low-temperature module according to the relationship between the temperature difference region and the temperature difference.

[0113] Optionally, the relative position adjustment unit can be used for:

[0114] Keep the relative positions of the high-temperature module and the low-temperature module unchanged.

[0115] Based on the temperature difference region, determine the relative position of the temperature difference between the profile to be processed and the temperature control module.

[0116] Obtain the current relative position between the profile to be processed and the temperature control module.

[0117] Based on the difference between the relative position of the temperature difference and the current relative position, the moving module is adjusted according to the specified moving speed and moving direction so that the overlapping area between the profile to be processed and the temperature control module includes the temperature difference area. The moving module includes either the profile to be processed or the temperature control module.

[0118] Optionally, the temperature difference adjustment unit can be used for:

[0119] Obtain the current temperature difference region to be adjusted, and determine the temperature difference corresponding to the current temperature difference region to be adjusted based on the correspondence between the temperature difference region and the temperature difference.

[0120] Adjust the energy and contact area of ​​the temperature control module so that the temperature difference between the high-temperature module and the low-temperature module is the same as the temperature difference corresponding to the current temperature difference area to be adjusted.

[0121] The profile processing apparatus provided in the embodiments of the present invention can execute the profile processing method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of executing the method.

[0122] Example 5

[0123] Figure 5 A schematic diagram of an electronic device 500 that can be used to implement embodiments of the present invention is provided. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0124] like Figure 5As shown, the electronic device 500 includes at least one processor 501 and a memory, such as a read-only memory (ROM) 502 or a random access memory (RAM) 503, communicatively connected to the at least one processor 501. The memory stores computer programs executable by the at least one processor. The processor 501 can perform various appropriate actions and processes based on the computer program stored in the ROM 502 or loaded into the RAM 503 from storage unit 508. The RAM 503 can also store various programs and data required for the operation of the electronic device 500. The processor 501, ROM 502, and RAM 503 are interconnected via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0125] Multiple components in electronic device 500 are connected to I / O interface 505, including: input unit 506, such as keyboard, mouse, etc.; output unit 507, such as various types of monitors, speakers, etc.; storage unit 508, such as disk, optical disk, etc.; and communication unit 509, such as network card, modem, wireless transceiver, etc. Communication unit 509 allows electronic device 500 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0126] Processor 501 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 501 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 501 performs the various methods and processes described above, such as profile processing methods.

[0127] In some embodiments, the profile processing method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 508. In some embodiments, part or all of the computer program may be loaded and / or installed on electronic device 500 via ROM 502 and / or communication unit 509. When the computer program is loaded into RAM 503 and executed by processor 501, one or more steps of the profile processing method described above may be performed. Alternatively, in other embodiments, processor 501 may be configured to perform the profile processing method by any other suitable means (e.g., by means of firmware).

[0128] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0129] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0130] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0131] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0132] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0133] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0134] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0135] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A profile processing method, characterized by, include: The temperature control module is aligned with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed. Adjust the relative position between the temperature control module and the profile to be processed, and the temperature difference between the temperature control module and the profile to be processed, so that the profile to be processed is deformed to obtain a standard profile; Adjusting the relative position between the temperature control module and the profile to be processed and the temperature difference between the temperature control module includes: Obtain the standard deformation information of the standard profile and determine the relationship between the temperature difference region and the temperature difference of the profile to be processed; Adjust the relative position between the profile to be processed and the temperature control module according to the temperature difference range; Based on the relationship between the temperature difference region and the temperature difference, the temperature difference between the high-temperature module and the low-temperature module is adjusted. Adjusting the relative position between the profile to be processed and the temperature control module according to the temperature difference range includes: The relative positions between the high-temperature module and the low-temperature module remain unchanged. Based on the temperature difference region, determine the relative position of the temperature difference between the profile to be processed and the temperature control module; Obtain the current relative position between the profile to be processed and the temperature control module; Based on the difference between the relative position of the temperature difference and the current relative position, the moving module is adjusted according to a specified moving speed and moving direction, so that the overlapping area between the profile to be processed and the temperature control module includes the temperature difference area, wherein the moving module includes the profile to be processed or the temperature control module.

2. The method of claim 1, wherein, The temperature control module is aligned with the surface of the profile to be processed, including: Control the high-temperature module to align with the first surface of the profile to be processed; The low-temperature module is controlled to align with the second surface of the profile to be processed, and the temperature control direction of the low-temperature module is aligned with the temperature control direction of the high-temperature module.

3. The method of claim 2, wherein, The high-temperature module includes a laser, and the low-temperature module includes liquid nitrogen. The laser spot diameter and the liquid nitrogen nozzle diameter are the same, and the laser beam and the liquid nitrogen injection direction are on the same axis.

4. The method of claim 1, wherein, The step of adjusting the temperature difference between the high-temperature module and the low-temperature module based on the correspondence between the temperature difference region and the temperature difference includes: Obtain the current temperature difference region to be adjusted, and determine the temperature difference corresponding to the current temperature difference region to be adjusted based on the correspondence between the temperature difference region and the temperature difference. Adjust the energy and contact area of ​​the temperature control module so that the temperature difference between the high-temperature module and the low-temperature module is the same as the temperature difference corresponding to the current temperature difference region to be adjusted.

5. The method of claim 1, wherein, The profiles to be processed include aerospace parts.

6. A profile processing device, characterized by include: A temperature control module is used to align with the surface of the profile to be processed. The temperature control module includes a high-temperature module and a low-temperature module, which are distributed on different sides of the profile to be processed. The standard profile acquisition module is used to adjust the relative position between the temperature control module and the profile to be processed and the temperature difference between the temperature control module, so that the profile to be processed is deformed to obtain a standard profile; The standard profile acquisition module is specifically used for: Obtain the standard deformation information of the standard profile and determine the relationship between the temperature difference region and the temperature difference of the profile to be processed; Adjust the relative position between the profile to be processed and the temperature control module according to the temperature difference range; Based on the relationship between the temperature difference region and the temperature difference, the temperature difference between the high-temperature module and the low-temperature module is adjusted. The standard profile acquisition module is also used for: The relative positions between the high-temperature module and the low-temperature module remain unchanged. Based on the temperature difference region, determine the relative position of the temperature difference between the profile to be processed and the temperature control module; Obtain the current relative position between the profile to be processed and the temperature control module; Based on the difference between the relative position of the temperature difference and the current relative position, the moving module is adjusted according to a specified moving speed and moving direction, so that the overlapping area between the profile to be processed and the temperature control module includes the temperature difference area, wherein the moving module includes the profile to be processed or the temperature control module.

7. An electronic device, comprising: The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the profile processing method according to any one of claims 1-5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that cause a processor to execute the profile processing method according to any one of claims 1-5.

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