Silicon wafer processing apparatus
By introducing multi-station and transport mechanisms into silicon wafer processing equipment and optimizing the silicon wafer transfer process using a controller, the problem of idle laser equipment was solved, and efficient operation of the equipment was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN HYMSON LASER INTELLIGENT EQUIP CO LTD
- Filing Date
- 2024-02-06
- Publication Date
- 2026-06-16
Smart Images
Figure CN117862685B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of silicon wafer processing technology, and in particular to a silicon wafer processing equipment. Background Technology
[0002] In related technologies, the manufacturing process of silicon wafers for solar cells involves multiple steps, such as texturing and cleaning, diffusion, laser doping, etching, and oxidation. Among these, laser equipment can be used to create grooves on the silicon wafer, marking points or lines to facilitate subsequent electrode formation. Existing silicon wafer processing equipment, when processing silicon wafers with lasers, first uses a robotic arm to transport the wafer to be processed to the laser processing area, then processes the wafer, and then uses another robotic arm to transfer the processed wafer to the next process step, thus completing the processing. Specifically, the silicon wafer processing equipment can process multiple wafers sequentially through these steps. However, during the period when the robotic arm transfers the processed wafer to the next process step, the laser equipment is idle, resulting in low processing efficiency. Summary of the Invention
[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a silicon wafer processing equipment that can achieve high processing efficiency.
[0004] A silicon wafer processing apparatus according to an embodiment of the present invention includes:
[0005] The first processing station is equipped with a first laser, which is used to process the silicon wafer to be processed.
[0006] The first feeding station is used to place the silicon wafer to be processed or the silicon wafer to be processed in the first stage;
[0007] The second feeding station is used to place the silicon wafer to be processed or the silicon wafer processed in the first stage;
[0008] A first conveying mechanism is used to convey the silicon wafer to be processed or the silicon wafer processed in the first stage, so that the silicon wafer to be processed or the silicon wafer processed in the first stage is transferred between the first feeding station and the first processing station; or, to transfer the silicon wafer to be processed or the silicon wafer processed in the first stage is transferred between the second feeding station and the first processing station.
[0009] A controller, communicatively connected to the first conveying mechanism, is configured to: when the silicon wafer to be processed is transferred from the first processing station to the first feeding station, the controller controls the first conveying mechanism to transfer the silicon wafer to be processed from the second feeding station to the first processing station.
[0010] The silicon wafer processing equipment according to embodiments of the present invention has at least the following beneficial effects: In the prior art, after a silicon wafer is transferred from the first processing station to the first feeding station, it needs to be transferred from the first feeding station before the silicon wafer to be processed can be placed on the first feeding station for processing by the first laser. This causes the first laser to be idle for a short period of time. However, in this application, when the silicon wafer is transferred from the first processing station to the first feeding station, the controller controls the first conveying mechanism to transfer the silicon wafer to be processed from the second feeding station to the first processing station. This effectively avoids the first laser being idle and enables the first laser to process the silicon wafer to be processed continuously. Specifically, the silicon wafer processing equipment can have higher processing efficiency.
[0011] According to some embodiments of the present invention, the silicon wafer processing equipment further includes a second processing station and a second transport mechanism. The second processing station is equipped with a second laser, which is used to process the primary silicon wafer. The second transport mechanism is used to transport the primary silicon wafer so that the second laser processes the primary silicon wafer.
[0012] According to some embodiments of the silicon wafer processing equipment of the present invention, the silicon wafer processing equipment further includes a third feeding station, a fourth feeding station, and a third conveying mechanism;
[0013] The third feeding station is used to place the primary or secondary processed silicon wafers.
[0014] The fourth feeding station is used to place the primary processed silicon wafer or the secondary processed silicon wafer;
[0015] The second conveying mechanism is used to convey the primary processed silicon wafer to the third or fourth feeding station:
[0016] The third conveying mechanism is used to convey the primary processed silicon wafer or the secondary processed silicon wafer, so that the primary processed silicon wafer or the secondary processed silicon wafer is transferred between the third feeding station and the second processing station; or, so that the primary processed silicon wafer or the secondary processed silicon wafer is transferred between the fourth feeding station and the second processing station;
[0017] The controller is further configured to: when the primary processed silicon wafer is transferred from the first processing station to the first feeding station, the controller controls the third transport mechanism to transfer the secondary processed silicon wafer from the second processing station to the third feeding station, and the controller controls the third transport mechanism to transfer the primary processed silicon wafer from the fourth feeding station to the second processing station.
[0018] According to some embodiments of the silicon wafer processing equipment of the present invention, the silicon wafer processing equipment further includes a fourth conveying mechanism, the fourth conveying mechanism being used to transfer the secondary processed silicon wafer on the third feeding station or the fourth feeding station;
[0019] The controller is also configured to: when the fourth transport mechanism transfers the secondary processed silicon wafer from the third feeding station, the controller controls the second transport mechanism to transfer the primary processed silicon wafer from the first feeding station to the third feeding station.
[0020] According to some embodiments of the silicon wafer processing equipment of the present invention, the controller is further configured to: when the silicon wafer to be processed is transferred from the first processing station to the first feeding station, the controller synchronously controls the first conveying mechanism to transfer the silicon wafer to be processed from the second feeding station to the first processing station.
[0021] According to some embodiments of the silicon wafer processing equipment of the present invention, the silicon wafer processing equipment further includes a second conveying mechanism, a second processing station, a third feeding station, a fourth feeding station, and a third conveying mechanism:
[0022] The second processing station is equipped with a second laser, which is used to process the silicon wafer in the first processing stage.
[0023] The third feeding station is used to place the primary or secondary processed silicon wafers.
[0024] The fourth feeding station is used to place the primary processed silicon wafer or the secondary processed silicon wafer;
[0025] The second conveying mechanism is used to transfer the primary processed silicon wafer to the third or fourth feeding station;
[0026] The first feeding station, the first processing station, and the second feeding station are arranged along a first horizontal direction;
[0027] The third feeding station, the second processing station, and the fourth feeding station are arranged along the first horizontal direction;
[0028] The first processing station and the second processing station are arranged along the second horizontal direction;
[0029] The first feeding station and the third feeding station are arranged along the second horizontal direction;
[0030] The second feeding station and the fourth feeding station are arranged along the second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction.
[0031] According to some embodiments of the silicon wafer processing equipment of the present invention, the silicon wafer processing equipment further includes a first feeding component and a second feeding component, the first feeding component being used to feed the silicon wafer to be processed to the first feeding station, and the second feeding component being used to feed the silicon wafer to be processed to the second feeding station; the controller is further configured to: when the first feeding component feeds the silicon wafer to be processed to the first feeding station, the controller controls the first conveying mechanism to transfer the silicon wafer to be processed from the second feeding station to the first processing station.
[0032] According to some embodiments of the silicon wafer processing equipment of the present invention, the silicon wafer processing equipment further includes a second processing station and a second conveying mechanism. The second processing station is provided with a second laser, which is used to process the primary silicon wafer. The second conveying mechanism is used to convey the primary silicon wafer so that the second laser processes the primary silicon wafer. The controller is further configured to: when the second conveying mechanism transfers the primary silicon wafer from the first feeding station to the second processing station, the controller controls the first feeding assembly to transfer the silicon wafer to be processed to the first feeding station.
[0033] According to some embodiments of the silicon wafer processing equipment of the present invention, the controller is further configured to: when the second conveying mechanism transfers the silicon wafer to be processed from the first feeding station to the second processing station, the controller synchronously controls the first feeding component to transfer the silicon wafer to be processed to the first feeding station.
[0034] According to some embodiments of the silicon wafer processing equipment of the present invention, the first conveying mechanism includes a linear motor and two platforms. The linear motor is used to drive the two platforms to move respectively. The platforms are used to carry the silicon wafer to be processed or the silicon wafer processed in the first stage. The first feeding station, the first processing station and the second feeding station are arranged along the movement direction of the platforms.
[0035] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0036] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0037] Figure 1 This is a schematic diagram of a silicon wafer processing apparatus according to a first embodiment of the present invention;
[0038] Figure 2 This is a schematic diagram of a silicon wafer processing apparatus according to a second embodiment of the present invention;
[0039] Figure 3 This is a schematic diagram of a first conveying mechanism in a silicon wafer processing apparatus according to some embodiments of the present invention;
[0040] Figure 4 This is a schematic diagram of a second conveying mechanism in a silicon wafer processing apparatus according to some embodiments of the present invention;
[0041] Figure 5 This is a schematic diagram of a silicon wafer processing apparatus according to a third embodiment of the present invention.
[0042] Figure label:
[0043] Silicon wafer processing equipment 10, first processing station 100, first laser 110, second processing station 200, second laser 210, first feeding station 300, second feeding station 400, third feeding station 500, fourth feeding station 600, first conveying mechanism 700, linear motor 710, platform 720, second conveying mechanism 800, third conveying mechanism 900, fourth conveying mechanism 1000, first loading assembly 1100, second loading assembly 1200, first unloading assembly 1300, second unloading assembly 1400. Detailed Implementation
[0044] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0045] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.
[0046] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0047] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.
[0048] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0049] Please refer to Figures 1 to 5In some embodiments, the silicon wafer processing equipment 10 includes: a first processing station 100, a first feeding station 300, a second feeding station 400, a first conveying mechanism 700, and a controller (not shown in the figure). The first processing station 100 is equipped with a first laser 110, which is used to process the silicon wafer to be processed. Specifically, the first laser 110 can emit laser light to create grooves or dots on the silicon wafer. Furthermore, the first laser 110 can also mark dots on the silicon wafer to facilitate subsequent processing of the silicon wafer by a second laser 210 based on the dots. It should also be noted that the first laser 110 and the second laser 210 can be positioned using a vision camera during the processing of the silicon wafer or the silicon wafer being processed, thereby facilitating processing. The first feeding station 300 is used to place the silicon wafer to be processed or the silicon wafer being processed. The second feeding station 400 is also used to place the silicon wafer to be processed or the silicon wafer being processed. Specifically, both the first feeding station 300 and the second feeding station 400 can cooperate with the first processing station 100. Taking the first feeding station 300 as an example, the silicon wafer to be processed can be placed on the first feeding station 300, and then transferred to the first processing station 100 for processing. After the first laser 110 finishes processing the silicon wafer to be processed, the silicon wafer to be processed can be transferred back to the first feeding station 300. Finally, the silicon wafer to be processed is transferred from the first feeding station 300, and a new silicon wafer to be processed is placed on the first feeding station 300. The first conveying mechanism 700 is used to convey the silicon wafer to be processed or the silicon wafer to be processed, so that the silicon wafer to be processed or the silicon wafer to be processed can be transferred between the first feeding station 300 and the first processing station 100. Alternatively, it can be used to transfer the silicon wafer to be processed or the silicon wafer to be processed between the second feeding station 400 and the first processing station 100. The controller is connected to the first conveying mechanism 700. The controller can be a PLC controller, etc., which is existing technology and will not be described in detail here. The controller is configured to: when a silicon wafer is transferred from the first processing station 100 to the first feeding station 300, the controller controls the first conveying mechanism 700 to transfer the silicon wafer to be processed from the second feeding station 400 to the first processing station 100.
[0050] Specifically, in the prior art, after a silicon wafer is transferred from the first processing station 100 to the first feeding station 300, it needs to be transferred from the first feeding station 300 before the silicon wafer to be processed can be placed on the first feeding station 300 for processing by the first laser 110. This causes the first laser 110 to be idle for a short period of time. In this application, when the silicon wafer is transferred from the first processing station 100 to the first feeding station 300, the controller controls the first conveying mechanism 700 to transfer the silicon wafer to be processed from the second feeding station 400 to the first processing station 100. This effectively avoids the first laser 110 being idle and enables the first laser 110 to process the silicon wafer to be processed continuously. Specifically, the silicon wafer processing equipment 10 can have a higher processing efficiency.
[0051] Furthermore, in order to ensure that the first laser 110 operates continuously, thereby enabling the silicon wafer processing equipment 10 to achieve high operating efficiency, please refer to... Figure 5 The processing sequence of the silicon wafer processing equipment 10 can be as follows: when a silicon wafer to be processed is transferred from the first processing station 100 to the first feeding station 300, the controller controls the first conveying mechanism 700 to transfer the silicon wafer to be processed from the second feeding station 400 to the first processing station 100, so that the first laser 110 located at the first processing station 100 processes the silicon wafer to be processed, turning the silicon wafer to be processed into a silicon wafer to be processed; then, when a silicon wafer to be processed is transferred from the first processing station 100 to the second feeding station 400, the controller controls the first conveying mechanism 700 to transfer the silicon wafer to be processed from the first feeding station 300 to the first processing station 100. In this way, through the cooperation of the first processing station 100, the first feeding station 300, the second feeding station 400, the first conveying mechanism 700, and the controller, the first laser 110 can continuously process the silicon wafer to be processed.
[0052] The following explains the meanings of silicon wafers under processing, primary-processed silicon wafers, and secondary-processed silicon wafers mentioned in this article. Solar silicon wafers undergo multiple processes during manufacturing; therefore, primary-processed and secondary-processed silicon wafers do not represent the final form of the silicon wafer, but rather its form at a specific stage of the manufacturing process. Specifically, this article mainly describes the secondary processing of silicon wafers under processing. After processing, the silicon wafer under processing becomes a primary-processed silicon wafer, and after primary-processed silicon wafers are processed, they become secondary-processed silicon wafers.
[0053] The following describes the specific structure of the first conveying mechanism 700, thereby explaining why the first conveying mechanism 700 can transfer the silicon wafer to be processed or the silicon wafer to be processed in the first stage between the first feeding station 300 and the first processing station 100, or transfer the silicon wafer to be processed or the silicon wafer to be processed or the silicon wafer to be processed in the second feeding station 400 and the first processing station 100. Please refer to... Figure 1 , Figure 3 and Figure 5 In some embodiments, the first conveying mechanism 700 includes a linear motor 710 and two platforms 720. The linear motor 710 drives the two platforms 720 to move, and the platforms 720 are used to carry silicon wafers to be processed or silicon wafers processed in the first stage. The first feeding station 300, the first processing station 100, and the second feeding station 400 are arranged along the movement direction of the platforms 720. The linear motor 710 may be a dual-drive motor, with two drives connected to the two platforms 720 respectively, thus enabling the linear motor 710 to drive the two platforms 720 to move. The platforms 720 can be used to place silicon wafers to be processed or silicon wafers processed in the first stage. The linear motor 710 and the stage 720 can be located below the first laser 110. When the linear motor 710 drives the stage 720 to move below the first laser 110, the stage 720 is positioned at the first processing station 100, and the first laser 110 can process the silicon wafer to be processed on the stage 720. Figure 5 In this process, the linear motor 710 can drive the stage 720 to move vertically. Taking a silicon wafer to be processed as an example, after the silicon wafer is placed on the stage 720, the linear motor 710 drives the stage 720 to move from the first feeding station 300 to the first processing station 100, so that the silicon wafer to be processed is processed by the first laser 110. After the first laser 110 completes the processing, the linear motor 710 drives the stage 720 to transfer the silicon wafer to be processed from the first processing station 100 to the first feeding station 300. At the same time, the linear motor 710 can also drive another stage 720 to transport the silicon wafer to be processed from the second feeding station 400 to the first processing station 100 for processing. It should be noted that the first feeding station 300 and the second feeding station 400 are located on opposite sides of the first processing station 100 to prevent the two stages 720 from interfering with each other during movement. Furthermore, the structure of the third transport mechanism 900 described below can be the same as that of the first transport mechanism 700, and will not be repeated here. In addition, the first transport mechanism 700, the second transport mechanism 800, the third transport mechanism 900 and the fourth transport mechanism 1000 in this application are all communicatively connected to the controller.
[0054] In some embodiments, multiple first processing stations 100, second processing stations 200, first feeding stations 300, second feeding stations 400, third feeding stations 500, and fourth feeding stations 600 are provided. For example, there are two first processing stations 100 and two first lasers 110. The silicon wafer processing equipment 10 can process two silicon wafers simultaneously, which can improve the working efficiency of the silicon wafer processing equipment 10. Specifically, the number of the mechanisms and stations mentioned herein is not specifically limited.
[0055] Furthermore, in some cases, secondary processing is required during silicon wafer fabrication, such as processing using a first laser 110 and a second laser 210. For details, please refer to... Figure 2 and Figure 5 In some embodiments, the silicon wafer processing equipment 10 further includes a second processing station 200 and a second transport mechanism 800. The second processing station 200 is equipped with a second laser 210, which is used to process the primary silicon wafer. The second transport mechanism 800 is used to transport the primary silicon wafer so that the second laser 210 can process it. Specifically, the second transport mechanism 800 can transport the primary silicon wafer to the second processing station 200, thereby facilitating the processing of the primary silicon wafer by the second laser 210. When the second transport mechanism 800 transports the primary silicon wafer to the second processing station 200, the process may involve multiple stations. For example, the second transport mechanism 800 may transport the primary silicon wafer to a third feeding station 500, and then the third transport mechanism 900 may transport the primary silicon wafer from the third feeding station 500 to the second processing station 200. It should be noted that in this method, the silicon wafers processed in the first stage are transported by the second transport mechanism 800 and the third transport mechanism 900. In some embodiments, the second transport mechanism 800 can be a multi-axis robot, which can transport the silicon wafers processed in the first stage from the first feeding station 300 to the second processing station 200. The structure of the fourth transport mechanism 1000 can be the same as that of the second transport mechanism 800, and will not be described further here. The second transport mechanism 800 can also be a linear robot connected to the gantry bridge, that is, the robot is located above the platform 720, and the robot can transfer the silicon wafers. Two second transport mechanisms 800 can be provided, with the two second transport mechanisms 800 located on opposite sides of the first processing station 100.
[0056] Furthermore, to improve work efficiency, the silicon wafer processing equipment 10 can also be equipped with a third feeding station 500, a fourth feeding station 600, and a third conveying mechanism 900 to cooperate with the second processing station 200. Please refer to... Figure 1 , Figure 2 and Figure 5In some embodiments, the silicon wafer processing equipment 10 further includes a third feeding station 500, a fourth feeding station 600, and a third conveying mechanism 900. The third feeding station 500 is used to place primary or secondary processed silicon wafers. The fourth feeding station 600 is also used to place primary or secondary processed silicon wafers. The third and fourth feeding stations 500 and 600 may be located on opposite sides of the second processing station 200, respectively. The second conveying mechanism 800 is used to convey the primary processed silicon wafers to the third feeding station 500 or the fourth feeding station 600. The second conveying mechanism 800 may be a robotic arm; specifically, it may be a suction cup robotic arm that picks up the silicon wafers by suction and then transfers them. The third transport mechanism 900 is used to transport primary or secondary processed silicon wafers, so as to transfer the primary or secondary processed silicon wafers between the third feeding station 500 and the second processing station 200; or, to transfer the primary or secondary processed silicon wafers between the fourth feeding station 600 and the second processing station 200. The structure of the third transport mechanism 900 can be the same as that of the first transport mechanism 700. The controller is also configured to: when the primary processed silicon wafer is transferred from the first processing station 100 to the first feeding station 300, the controller controls the third transport mechanism 900 to transfer the secondary processed silicon wafer from the second processing station 200 to the third feeding station 500, and the controller controls the third transport mechanism 900 to transfer the primary processed silicon wafer from the fourth feeding station 600 to the second processing station 200. Specifically, the silicon wafer processing equipment 10 can realize the uninterrupted operation of the first laser 110 and the second laser 210, so that the silicon wafer processing equipment 10 can have high processing efficiency.
[0057] Furthermore, after the second laser 210 processes the primary silicon wafer, the secondary silicon wafer needs to be transferred to the next process. To improve efficiency, the primary silicon wafer can be transferred to the third feeding station 500 while the secondary silicon wafer is being transferred by the fourth transport mechanism 1000. For details, please refer to... Figure 1 , Figure 2 and Figure 5In some embodiments, the silicon wafer processing equipment 10 further includes a fourth transport mechanism 1000, which is used to transfer secondary-processed silicon wafers from the third feeding station 500 or the fourth feeding station 600. The controller is also configured to: when the fourth transport mechanism 1000 transfers the secondary-processed silicon wafer from the third feeding station 500, the controller controls the second transport mechanism 800 to transfer the primary-processed silicon wafer from the first feeding station 300 to the third feeding station 500. Thus, after the secondary-processed silicon wafer is transferred from the third feeding station 500, the third feeding station 500 becomes vacant, and then the primary-processed silicon wafer is transferred to the vacant third feeding station 500. This allows the third feeding station 500 to continuously hold primary-processed silicon wafers, thereby transferring the primary-processed silicon wafers to the second processing station 200 for processing. It should be noted that the controller is also configured such that when the fourth conveying mechanism 1000 transfers secondary-processed silicon wafers from the fourth feeding station 600, the controller controls the second conveying mechanism 800 to transfer primary-processed silicon wafers from the second feeding station 400 to the fourth feeding station 600. Furthermore, the fourth conveying mechanism 1000 can transfer secondary-processed silicon wafers from the third feeding station 500 to the first unloading assembly 1300, and the fourth conveying mechanism 1000 can transfer secondary-processed silicon wafers from the fourth feeding station 600 to the second unloading assembly 1400.
[0058] Furthermore, in some embodiments, the controller is also configured to: when a silicon wafer is transferred from the first processing station 100 to the first feeding station 300, the controller synchronously controls the first transport mechanism 700 to transfer the silicon wafer to be processed from the second feeding station 400 to the first processing station 100. Specifically, synchronous control by the controller means that when the silicon wafer begins to be transferred from the first processing station 100, the first transport mechanism 700 starts working synchronously, thereby transferring the silicon wafer to be processed from the second feeding station 400 to the first processing station 100. This synchronous operation can further enable the silicon wafer to be processed to be transported quickly to the first processing station 100 for processing.
[0059] The layout of the silicon wafer processing equipment 10 is described below. Please refer to [the relevant documentation]. Figure 1 , Figure 2 and Figure 5In some embodiments, the silicon wafer processing equipment 10 further includes a second transport mechanism 800, a second processing station 200, a third feeding station 500, a fourth feeding station 600, and a third transport mechanism 900. The second processing station 200 is equipped with a second laser 210, which is used to process primary silicon wafers. The third feeding station 500 is used to place primary or secondary silicon wafers. The fourth feeding station 600 is used to place primary or secondary silicon wafers. The second transport mechanism 800 is used to transfer primary silicon wafers to the third feeding station 500 or the fourth feeding station 600. The first feeding station 300, the first processing station 100, and the second feeding station 400 are arranged along a first horizontal direction. The third feeding station 500, the second processing station 200, and the fourth feeding station 600 are arranged along a first horizontal direction. The first processing station 100 and the second processing station 200 are arranged along a second horizontal direction. The first feeding station 300 and the third feeding station 500 are arranged along a second horizontal direction. The second feeding station 400 and the fourth feeding station 600 are also arranged along a second horizontal direction, with the first horizontal direction perpendicular to the second horizontal direction. Specifically, the first horizontal direction can be a left-right horizontal direction, and the second horizontal direction can be a front-back horizontal direction. This layout allows the silicon wafer processing equipment 10 to achieve higher working efficiency and saves space, facilitating its layout.
[0060] Further, please refer to Figure 1 , Figure 2 and Figure 5 In some embodiments, the silicon wafer processing equipment 10 further includes a first loading assembly 1100 and a second loading assembly 1200. The first loading assembly 1100 is used to load the silicon wafer to be processed onto a first feeding station 300, and the second loading assembly 1200 is used to load the silicon wafer to be processed onto a second feeding station 400. The controller is also configured to: when the first loading assembly 1100 loads the silicon wafer to be processed onto the first feeding station 300, the controller controls the first conveying mechanism 700 to transfer the silicon wafer to be processed from the second feeding station 400 to the first processing station 100. Thus, the silicon wafer processing equipment 10 can process the silicon wafer to be processed while simultaneously loading it. Furthermore, the first laser 110 can process the silicon wafer to be processed continuously, thereby achieving high working efficiency.
[0061] Further, please refer to Figure 1 , Figure 2 and Figure 5In some embodiments, the silicon wafer processing equipment 10 further includes a second processing station 200 and a second transport mechanism 800. The second processing station 200 is equipped with a second laser 210, which is used to process the primary silicon wafer. The second transport mechanism 800 is used to transport the primary silicon wafer so that the second laser 210 processes the primary silicon wafer. The controller is also configured to: when the second transport mechanism 800 transfers the primary silicon wafer from the first feeding station 300 to the second processing station 200, the controller controls the first loading assembly 1100 to transfer the silicon wafer to be processed to the first feeding station 300. Specifically, during the period when the second transport mechanism 800 transfers the primary silicon wafer from the first feeding station 300 to the second processing station 200, the first feeding station 300 is in an idle state. At this time, by controlling the first loading assembly 1100 to transfer the silicon wafer to be processed to the first feeding station 300, the silicon wafer to be processed can be placed on the first feeding station 300. This allows for a continuous placement of silicon wafers to be processed at the first feeding station 300, ensuring that the wafers are uninterruptedly transported to the first processing station 100 for processing. This improves the processing efficiency of the silicon wafer processing equipment 10.
[0062] Furthermore, in some embodiments, the controller is also configured to: when the second conveying mechanism 800 transfers a silicon wafer to be processed from the first feeding station 300 to the second processing station 200, the controller synchronously controls the first loading assembly 1100 to transfer the silicon wafer to be processed to the first feeding station 300. Specifically, the synchronous control by the controller can be that the first loading assembly 1100 and the second conveying mechanism 800 move synchronously, which can enable the silicon wafer processing equipment 10 to have a smooth processing speed, thereby allowing the silicon wafer to be smoothly transferred between different stations.
[0063] The following example illustrates the processing of 10 pairs of silicon wafers using a silicon wafer processing machine. Please refer to... Figure 5 To distinguish between the silicon wafers to be processed, the silicon wafers to be processed include a first silicon wafer and a second silicon wafer. Primary processing of silicon wafers includes a primary first processing silicon wafer and a primary second processing silicon wafer. Secondary processing of silicon wafers includes a secondary primary processing silicon wafer and a secondary second processing silicon wafer.
[0064] First, the first silicon wafer to be processed is conveyed by the first feeding assembly 1100, and the second silicon wafer to be processed is conveyed by the second feeding assembly 1200. Thus, the first feeding assembly 1100 transfers the first silicon wafer to be processed to the first feeding station 300, and the second feeding assembly 1200 transfers the second silicon wafer to be processed to the second feeding station 400.
[0065] Secondly, the first transport mechanism 700 transfers the first silicon wafer to be processed from the first feeding station 300 to the first processing station 100 so that the first laser 110 can process it. After the first laser 110 finishes processing the first silicon wafer to be processed (the first silicon wafer to be processed becomes a first-processed silicon wafer), the first-processed silicon wafer is transferred from the first processing station 100 to the first feeding station 300. At the same time, the first transport mechanism 700 transfers the second silicon wafer to be processed from the second feeding station 400 to the first processing station 100 for processing.
[0066] Subsequently, the second conveying mechanism 800 transfers the first-processed silicon wafer from the first feeding station 300 to the third feeding station 500, and then transfers the first-processed silicon wafer from the third feeding station 500 to the second processing station 200 for processing. During this period, the first laser 110 can turn the second silicon wafer to be processed into a second-processed silicon wafer, and the second-processed silicon wafer is transferred from the first processing station 100 to the second feeding station 400, and a new first-processed silicon wafer is transferred from the first feeding station 300 to the first processing station 100.
[0067] Subsequently, after the second laser 210 transforms the first-processed silicon wafer into a second-processed silicon wafer, the third transport mechanism 900 transfers the second-processed silicon wafer from the second processing station 200 to the third feeding station 500. At the same time, the third transport mechanism 900 transfers the first-processed silicon wafer from the fourth feeding station 600 to the second processing station 200.
[0068] Subsequently, the fourth conveying mechanism 1000 transfers the secondary first processed silicon wafer to the first unloading assembly 1300, and transfers the secondary second processed silicon wafer to the second unloading assembly 1400.
[0069] By repeating the above steps, the silicon wafer processing equipment 10 can achieve uninterrupted operation of the first laser 110 and the second laser 210, thereby enabling the silicon wafer processing equipment 10 to have high efficiency. In addition, the first laser 110 can mark the silicon wafer being processed in the first stage, which can help the second laser 210 quickly identify and process the silicon wafer being processed in the first stage, turning it into a silicon wafer being processed in the second stage.
[0070] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.
Claims
1. A silicon wafer processing equipment, characterized in that, include: The first processing station is equipped with a first laser, which is used to process the silicon wafer to be processed. The first feeding station is used to place the silicon wafer to be processed or the silicon wafer to be processed in the first stage; The second feeding station is used to place the silicon wafer to be processed or the silicon wafer processed in the first stage; A first conveying mechanism is used to convey the silicon wafer to be processed or the silicon wafer processed in the first stage, so that the silicon wafer to be processed or the silicon wafer processed in the first stage is transferred between the first feeding station and the first processing station; or, to transfer the silicon wafer to be processed or the silicon wafer processed in the first stage is transferred between the second feeding station and the first processing station. A controller, communicatively connected to the first conveying mechanism, is configured to: when the silicon wafer to be processed is transferred from the first processing station to the first feeding station, the controller controls the first conveying mechanism to transfer the silicon wafer to be processed from the second feeding station to the first processing station; The controller is also configured to: when the silicon wafer to be processed is transferred from the first processing station to the first feeding station, the controller synchronously controls the first conveying mechanism to transfer the silicon wafer to be processed from the second feeding station to the first processing station; The silicon wafer processing equipment further includes a first feeding component and a second feeding component. The first feeding component is used to feed the silicon wafer to be processed to the first feeding station, and the second feeding component is used to feed the silicon wafer to be processed to the second feeding station. The controller is further configured to: when the first feeding component feeds the silicon wafer to be processed to the first feeding station, the controller controls the first conveying mechanism to transfer the silicon wafer to be processed from the second feeding station to the first processing station. The first conveying mechanism includes a linear motor and two platforms. The linear motor drives the two platforms to move respectively. The platforms are used to carry the silicon wafer to be processed or the silicon wafer processed in the first stage. The first feeding station, the first processing station and the second feeding station are arranged along the movement direction of the platforms.
2. The silicon wafer processing equipment according to claim 1, characterized in that, The silicon wafer processing equipment further includes a second processing station and a second transport mechanism. The second processing station is equipped with a second laser, which is used to process the primary silicon wafer. The second transport mechanism is used to transport the primary silicon wafer so that the second laser can process the primary silicon wafer.
3. The silicon wafer processing equipment according to claim 2, characterized in that, The silicon wafer processing equipment also includes a third feeding station, a fourth feeding station, and a third conveying mechanism; The third feeding station is used to place the primary or secondary processed silicon wafers. The fourth feeding station is used to place the primary processed silicon wafer or the secondary processed silicon wafer; The second conveying mechanism is used to convey the primary processed silicon wafer to the third or fourth feeding station: The third conveying mechanism is used to convey the primary processed silicon wafer or the secondary processed silicon wafer, so that the primary processed silicon wafer or the secondary processed silicon wafer is transferred between the third feeding station and the second processing station; or, so that the primary processed silicon wafer or the secondary processed silicon wafer is transferred between the fourth feeding station and the second processing station; The controller is further configured to: when the primary processed silicon wafer is transferred from the first processing station to the first feeding station, the controller controls the third transport mechanism to transfer the secondary processed silicon wafer from the second processing station to the third feeding station, and the controller controls the third transport mechanism to transfer the primary processed silicon wafer from the fourth feeding station to the second processing station.
4. The silicon wafer processing equipment according to claim 3, characterized in that, The silicon wafer processing equipment further includes a fourth conveying mechanism, which is used to transfer the secondary processed silicon wafers on the third feeding station or the fourth feeding station. The controller is also configured to: when the fourth transport mechanism transfers the secondary processed silicon wafer from the third feeding station, the controller controls the second transport mechanism to transfer the primary processed silicon wafer from the first feeding station to the third feeding station.
5. The silicon wafer processing equipment according to claim 1, characterized in that, The silicon wafer processing equipment further includes a second conveying mechanism, a second processing station, a third feeding station, a fourth feeding station, and a third conveying mechanism. The second processing station is equipped with a second laser, which is used to process the silicon wafer in the first processing stage. The third feeding station is used to place the primary or secondary processed silicon wafers. The fourth feeding station is used to place the primary processed silicon wafer or the secondary processed silicon wafer; The second conveying mechanism is used to transfer the primary processed silicon wafer to the third or fourth feeding station; The first feeding station, the first processing station, and the second feeding station are arranged along a first horizontal direction; The third feeding station, the second processing station, and the fourth feeding station are arranged along the first horizontal direction; The first processing station and the second processing station are arranged along the second horizontal direction; The first feeding station and the third feeding station are arranged along the second horizontal direction; The second feeding station and the fourth feeding station are arranged along the second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction.
6. The silicon wafer processing equipment according to claim 1, characterized in that, The silicon wafer processing equipment further includes a second processing station and a second transport mechanism. The second processing station is equipped with a second laser, which is used to process the primary silicon wafer. The second transport mechanism is used to transport the primary silicon wafer so that the second laser can process the primary silicon wafer. The controller is also configured to: when the second transport mechanism transfers the primary silicon wafer from the first feeding station to the second processing station, the controller controls the first feeding component to transfer the silicon wafer to be processed to the first feeding station.
7. The silicon wafer processing equipment according to claim 6, characterized in that, The controller is also configured to: when the second conveying mechanism transfers the primary processed silicon wafer from the first feeding station to the second processing station, the controller synchronously controls the first feeding component to transfer the silicon wafer to be processed to the first feeding station.