A transparent polyimide flexible copper clad plate and a preparation method thereof

By preparing transparent polyimide flexible copper-clad laminates and using a copolymerization method with specific monomers and fillers, the shortcomings of existing transparent copper-clad laminates in terms of transparency, heat resistance and bending resistance have been solved, achieving high light transmittance and high peel strength, making it suitable for the processing of colorless and transparent electronic products.

CN117903686BActive Publication Date: 2026-07-24华烁电子材料(武汉)有限公司 +1
4 Cites 0 Cited by

Patent Information

Application Number
CN202410075672.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-01-18
Publication Date
2026-07-24
Estimated Expiration
2044-01-18

AI Technical Summary

Technical Problem

Existing transparent copper-clad laminates are difficult to meet the requirements of colorless and transparent electronic products in terms of transparency, heat resistance and bending resistance, and are prone to deformation during processing.

Method used

A polyamic acid solution was prepared by in-situ copolymerization of bisphenol A type diether dianhydride, hexafluorodianhydride, diaminodiphenyl ether, and 1,3-bis(4-aminophenoxy)benzene. The solution was coated onto copper foil and hot-pressed imidized under nitrogen protection. Fillers such as silica were added to adjust the coefficient of thermal expansion and adhesion.

Benefits of technology

The prepared transparent polyimide flexible copper-clad laminate has a light transmittance of over 85%, a peel strength exceeding 1.0 N/mm, and can withstand 5000 bending cycles. It can pass the 310℃ reflow soldering process and meet the processing requirements of electronic products.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The application discloses a kind of transparent polyimide flexible copper-clad plate and preparation method thereof, belong to electronic chemical technology field.The preparation method of the transparent polyimide flexible copper-clad plate, including the following steps: after organic solvent, filler is ground and dispersed uniformly, monomer diamino diphenyl ether and monomer 1, 3- (4-aminophenoxy) benzene are dissolved to obtain mixed solution;Monomer bisphenol A type diether dianhydride and monomer hexafluorodinitrile dianhydride are added to mixed solution and polymerization reaction occurs, until the viscosity of reaction system is 4-5 million mpa.s, and polyamide acid precursor is prepared;Polyamide acid precursor is coated on copper foil, and transparent polyimide flexible copper-clad plate is obtained by drying under protective gas atmosphere.The polyimide flexible copper-clad plate prepared by the application not only has high light transmittance, but also has high peel strength, tin soldering resistance, etc., and can meet the processing technology requirements of electronic products.
Need to check novelty before this filing date? Find Prior Art