Carrying disc and coating device with same

Abstract

The application discloses a carrier disc and a coating device with the same. The carrier disc is applied to the coating device and comprises a supporting assembly, a carrier, and the like. The supporting assembly comprises a lower supporting piece, an upper supporting piece, and an insulating piece. The upper supporting piece is arranged above the lower supporting piece and is arranged in a spaced manner with the lower supporting piece. The bottom of the upper supporting piece is provided with an upper mounting groove. The top of the lower supporting piece is provided with a lower mounting groove which is arranged in a corresponding manner with the upper mounting groove. The first gap between the lower surface of the upper supporting piece and the upper surface of the lower supporting piece is smaller than the second gap between the top wall of the upper mounting groove and the bottom wall of the lower mounting groove. The insulating piece is embedded in the upper mounting groove and the lower mounting groove, and the insulating piece is abutted between the upper supporting piece and the lower supporting piece. The carrier is arranged on the upper supporting piece. The carrier disc can reduce the risk that the coating material is coated on the insulating piece through the first gap during the coating process, reduce the risk that the insulating piece loses the insulation effect due to being coated with the film, and improve the reliability and service life of the insulating piece.

Description

Technical Field

[0001] This invention relates to the field of solar photovoltaic technology, and in particular to a carrier disk and a coating apparatus having the same. Background Technology

[0002] With the development of the solar photovoltaic industry and the exploration of vacuum coating technology, the requirements for substrate carriers have greatly increased. Traditional carriers are generally made of stainless steel. When the substrate is coated, some target materials are conductive, and the conductive film deposited on the silicon wafer and carrier may arc with the target material and its protective cover, causing damage to the substrate.

[0003] To avoid arcing and damage to the substrate during conductive film deposition, an insulating pad is usually added to the carrier disk to separate the substrate from the carrier disk, thereby isolating the substrate from the deposition cavity. However, the insulating pad is easily coated with film and loses its insulating function, resulting in low reliability and short service life. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a carrier disk with high reliability and long service life.

[0005] The present invention also proposes a coating apparatus having the above-described carrier disk.

[0006] According to a first aspect of the present invention, a carrier tray is applied in a coating apparatus and includes: a support assembly, the support assembly including a lower support member, an upper support member, and an insulating member, the upper support member being disposed above the lower support member and spaced apart from the lower support member, the bottom of the upper support member having an upper mounting groove, the top of the lower support member having a lower mounting groove disposed opposite to the upper mounting groove, a first gap between the lower surface of the upper support member and the upper surface of the lower support member being smaller than a second gap between the top wall of the upper mounting groove and the bottom wall of the lower mounting groove, the insulating member being embedded in the upper mounting groove and the lower mounting groove, and the insulating member abutting between the upper support member and the lower support member; and a carrier disposed on the upper support member.

[0007] The carrier disk according to embodiments of the present invention has at least the following beneficial effects:

[0008] In the carrier tray of this application, the lower support member is used to contact the transport mechanism within the coating apparatus, and the transport mechanism serves to transport the carrier tray; the upper support member is used to support the carrier; the insulating member serves to separate the upper and lower support members and support the upper support member. By providing an insulating member between the lower and upper support members, the lower and upper support members are insulated, thereby insulating the carrier used to support the silicon wafer from the lower support member, and subsequently from the transport mechanism, thus achieving insulation between the carrier and the coating cavity. This reduces the risk of arcing during the coating process and damage to the substrate.

[0009] Furthermore, the bottom of the upper support member is provided with an upper mounting groove, and the top of the lower support member is provided with a lower mounting groove that is opposite to the upper mounting groove. The first gap between the lower surface of the upper support member and the upper surface of the lower support member is smaller than the second gap between the top wall of the upper mounting groove and the bottom wall of the lower mounting groove. The insulating member is embedded in the upper mounting groove and the lower mounting groove, and the insulating member abuts against the upper support member and the lower support member.

[0010] It is understandable that by setting an upper mounting groove at the bottom of the upper support and a lower mounting groove at the top of the lower support opposite to the upper mounting groove, the insulating component can be embedded between the upper and lower supports. This reduces the width of the first gap between the lower surface of the upper support and the upper surface of the lower support, thereby reducing the risk that the coating material will pass through the first gap and be deposited on the insulating component during the coating process. This also reduces the risk that the insulating component will lose its insulating function after being coated, and improves the reliability and service life of the insulating component.

[0011] According to some embodiments of the present invention, the sidewalls of the upper mounting groove and the lower mounting groove are spaced apart from the sidewalls surrounding the insulating member.

[0012] According to some embodiments of the present invention, the upper mounting groove has an upper isolation groove on the four sides of the top wall of the upper mounting groove, and the lower mounting groove has a lower isolation groove on the four sides of the bottom wall of the lower mounting groove, which is opposite to the upper isolation groove. The top of the insulating member covers a portion of the opening of the upper isolation groove and is spaced apart from the top wall of the upper isolation groove, and the bottom of the insulating member covers a portion of the opening of the lower isolation groove and is spaced apart from the bottom wall of the lower isolation groove.

[0013] According to some embodiments of the present invention, the insulating member is fixedly connected to the lower support member by a first screw, and the first screw is spaced apart from the upper support member.

[0014] According to some embodiments of the present invention, the insulating member is fixedly connected to the upper support member by a second screw, and the second screw is spaced apart from the lower support member.

[0015] According to some embodiments of the present invention, the top of the insulating member is provided with a first clearance groove, the bottom wall of the first clearance groove is provided with a first mounting hole, the lower support member is provided with a second mounting hole opposite to the first mounting hole, the second mounting hole is a blind hole, and the first screw passes through the first mounting hole and the second mounting hole.

[0016] According to some embodiments of the present invention, the bottom of the insulating member is provided with a second clearance groove, and the top of the insulating member is provided with a third mounting hole communicating with the second clearance groove. The upper support member is provided with a fourth mounting hole opposite to the third mounting hole. The second screw passes through the fourth mounting hole and the third mounting hole, and the second screw is fixedly connected to a nut provided in the second clearance groove.

[0017] According to some embodiments of the present invention, the nut is spaced apart from the lower support member.

[0018] According to some embodiments of the present invention, the nut is made of an insulating material.

[0019] According to a second aspect of the present invention, a coating apparatus includes: a coating cavity; a transport mechanism disposed within the coating cavity; a carrier tray as described above, disposed on the transport mechanism, with a lower support member in contact with the transport mechanism; and a coating mechanism disposed within the coating cavity and located above the transport mechanism.

[0020] The coating apparatus according to embodiments of the present invention has at least the following beneficial effects:

[0021] In the coating apparatus of this application, the lower support member is used to contact the transport mechanism within the coating apparatus, and the transport mechanism functions as a transport tray; the upper support member is used to support the carrier; the insulating member separates the upper and lower support members and supports the upper support member. By providing an insulating member between the lower and upper support members, the lower and upper support members are insulated, thereby insulating the carrier used to support the silicon wafer from the lower support member, and subsequently insulating the carrier from the transport mechanism, thus achieving insulation between the carrier and the coating cavity. This reduces the risk of arcing during the coating process and damage to the substrate.

[0022] Furthermore, the bottom of the upper support member is provided with an upper mounting groove, and the top of the lower support member is provided with a lower mounting groove that is opposite to the upper mounting groove. The first gap between the lower surface of the upper support member and the upper surface of the lower support member is smaller than the second gap between the top wall of the upper mounting groove and the bottom wall of the lower mounting groove. The insulating member is embedded in the upper mounting groove and the lower mounting groove, and the insulating member abuts against the upper support member and the lower support member.

[0023] It is understandable that by setting an upper mounting groove at the bottom of the upper support and a lower mounting groove at the top of the lower support opposite to the upper mounting groove, the insulating component can be embedded between the upper and lower supports. This reduces the width of the first gap between the lower surface of the upper support and the upper surface of the lower support, thereby reducing the risk that the coating material will pass through the first gap and be deposited on the insulating component during the coating process. This also reduces the risk that the insulating component will lose its insulating function after being coated, and improves the reliability and service life of the insulating component.

[0024] Additional aspects and advantages of the invention will be set forth in the following description. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 This is a schematic diagram of the carrier disk according to an embodiment of the present invention;

[0027] Figure 2 This is a top view of the carrier disk according to an embodiment of the present invention;

[0028] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure of section CC shown in the figure;

[0029] Figure 4 This is an exploded structural diagram of a partial cross-sectional view of the carrier disk according to an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of a coating apparatus with a hidden coating cavity according to an embodiment of the present invention.

[0031] Icon labels:

[0032] 10. Carrier plate; 100. Support assembly; 101. First gap; 102. Third gap; 110. Lower support; 111. Lower mounting groove; 112. Lower isolation groove; 113. Second mounting hole; 120. Upper support; 121. Upper mounting groove; 122. Upper isolation groove; 123. Fourth mounting hole; 130. Insulator; 131. First clearance groove; 132. First mounting hole; 133. Second clearance groove; 134. Third mounting hole; 140. First screw; 150. Second screw; 160. Nut; 200. Carrier;

[0033] 20. Transportation agencies;

[0034] 30. Coating mechanism. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0037] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0038] like Figure 1 As shown, this application provides a carrier disk 10, which is used in a coating apparatus. The carrier disk 10 includes a support assembly 100 and a carrier 200. The support assembly 100 supports the carrier 200, and the carrier 200 carries a substrate. The substrate may be a silicon wafer.

[0039] like Figures 2 to 4 As shown, the support assembly 100 includes a lower support member 110, an upper support member 120, and an insulating member 130. The upper support member 120 is disposed above the lower support member 110 and spaced apart from the lower support member 110. The insulating member 130 is disposed between the upper support member 120 and the lower support member 110. The carrier 200 is disposed on the upper support member 120.

[0040] Further integration Figure 5It is understood that the lower support 110 is used to contact the transport mechanism 20 within the coating apparatus, which functions as a transport tray 10; the upper support 120 is used to support the carrier 200; and the insulating member 130 separates the upper support 120 from the lower support 110 and supports the upper support 120. By providing the insulating member 130 between the lower support 110 and the upper support 120, the lower support 110 and the upper support 120 are insulated, thereby insulating the carrier 200 used to support the silicon wafer from the lower support 110, and subsequently insulating the carrier 200 from the transport mechanism 20. This achieves insulation between the carrier 200 and the coating cavity, thereby reducing the risk of arcing during the coating process and damaging the substrate.

[0041] Combination Figure 3 and Figure 4 Furthermore, the bottom of the upper support member 120 is provided with an upper mounting groove 121, and the top of the lower support member 110 is provided with a lower mounting groove 111 opposite to the upper mounting groove 121. The first gap 101 between the lower surface of the upper support member 120 and the upper surface of the lower support member 110 is smaller than the second gap between the top wall of the upper mounting groove 121 and the bottom wall of the lower mounting groove 111. The insulating member 130 is embedded in the upper mounting groove 121 and the lower mounting groove 111, and the insulating member 130 abuts against the upper support member 120 and the lower support member 110.

[0042] It is understandable that by providing an upper mounting groove 121 at the bottom of the upper support member 120 and a lower mounting groove 111 at the top of the lower support member 110 opposite to the upper mounting groove 121, the insulating member 130 can be embedded between the upper support member 120 and the lower support member 110. This reduces the width of the first gap 101 between the lower surface of the upper support member 120 and the upper surface of the lower support member 110, thereby reducing the risk that the coating material will pass through the first gap 101 and be deposited on the insulating member 130 during the coating process. This also reduces the risk that the insulating member 130 will lose its insulating function due to the coating, and improves the reliability and service life of the insulating member 130.

[0043] Furthermore, the sidewalls of the upper mounting groove 121 and the lower mounting groove 111 are spaced apart from the sidewalls surrounding the insulating member 130. A third gap 102 is formed between the sidewalls surrounding the insulating member 130 and the sidewalls of the upper mounting groove 121 and the lower mounting groove 111. Thus, even when the coating material is deposited onto the sidewalls surrounding the insulating member 130 through the first gap 101, the coating material will not directly contact the sidewalls of the upper support member 120 and the lower support member 110, further reducing the risk that the insulating member 130 will lose its insulating function due to the coating.

[0044] Furthermore, the upper mounting groove 121 has an upper isolation groove 122 on the four sides of its top wall, and the lower mounting groove 111 has a lower isolation groove 112 on the four sides of its bottom wall, which is opposite to the upper isolation groove 122. The top of the insulating member 130 covers part of the opening of the upper isolation groove 122 and is spaced apart from the top wall of the upper isolation groove 122, and the bottom of the insulating member 130 covers part of the opening of the lower isolation groove 112 and is spaced apart from the bottom wall of the lower isolation groove 112.

[0045] Understandably, the function of the upper isolation groove 122 is to prevent the top edges of the insulating component 130 from directly contacting the upper support component 120, and the function of the lower isolation groove 112 is to prevent the bottom edges of the insulating component 130 from directly contacting the lower support component 110. In this way, even when the coating material is deposited onto the sidewalls around the insulating component 130 through the first gap 101, the coating material will not directly contact the top wall of the upper support component 120 and the bottom wall of the lower support component 110, which can further reduce the risk that the insulating component 130 will lose its insulating function after being coated with a film.

[0046] Combination Figure 3 and Figure 4 In some embodiments, the insulating member 130 is fixedly connected to the lower support member 110 by a first screw 140, and the first screw 140 is spaced apart from the upper support member 120. The insulating member 130 is fixedly connected to the upper support member 120 by a second screw 150, and the second screw 150 is spaced apart from the lower support member 110.

[0047] Understandably, screws are typically made of metal and are conductive. By fixing the insulating member 130 to the lower support member 110 with the first screw 140, and by spacing the first screw 140 from the upper support member 120, a conductive connection between the upper support member 120 and the lower support member 110 can be prevented through the first screw 140. Similarly, by fixing the insulating member 130 to the upper support member 120 with the second screw 150, and by spacing the second screw 150 from the lower support member 110, a conductive connection between the upper support member 120 and the lower support member 110 can be prevented through the second screw 150. Furthermore, the combined action of the first screw 140 and the second screw 150 achieves the secure fixing of the lower support member 110, the upper support member 120, and the insulating member 130.

[0048] Furthermore, the top of the insulating member 130 is provided with a first clearance groove 131, the bottom wall of the first clearance groove 131 is provided with a first mounting hole 132, and the lower support member 110 is provided with a second mounting hole 113 opposite to the first mounting hole 132. The second mounting hole 113 is a blind hole, and the first screw 140 passes through the first mounting hole 132 and the second mounting hole 113.

[0049] Understandably, the first clearance groove 131 is used to accommodate the head of the first screw 140, preventing the first screw 140 from contacting the upper support member 120. The second mounting hole 113 is a threaded hole, with the first screw 140 threadedly connected to it. Furthermore, the second mounting hole 113 is a blind hole, which can form a sealing structure.

[0050] Furthermore, the bottom of the insulating member 130 is provided with a second clearance groove 133, and the top of the insulating member 130 is provided with a third mounting hole 134 communicating with the second clearance groove 133. The upper support member 120 is provided with a fourth mounting hole 123 opposite to the third mounting hole 134. The second screw 150 passes through the fourth mounting hole 123 and the third mounting hole 134, and the second screw 150 is fixedly connected to a nut 160 provided in the second clearance groove 133. In this way, the upper support member 120 and the insulating member 130 can be fixed by means of the second screw 150 and the nut 160.

[0051] In some embodiments, the nut 160 is spaced apart from the lower support 110.

[0052] In other embodiments, the nut 160 may be made of an insulating material, and the nut 160 may contact the lower support 110.

[0053] like Figure 5 As shown, this application also provides a coating apparatus, including: a coating chamber, a carrier plate 10, a transport mechanism 20, and a coating mechanism 30.

[0054] The transport mechanism 20 is disposed inside the coating cavity, the carrier plate 10 is disposed on the transport mechanism 20 and the lower support member 110 is in contact with the transport mechanism 20; the coating mechanism 30 is disposed inside the coating cavity and is located above the transport mechanism 20.

[0055] The coating mechanism 30 includes a target material and a target material cover, and the transport mechanism 20 is a guide wheel.

[0056] In the coating apparatus of this application, the lower support member 110 is used to contact the transport mechanism 20 within the coating apparatus, and the transport mechanism 20 functions as a transport tray 10; the upper support member 120 is used to support the carrier 200; the insulating member 130 serves to separate the upper support member 120 and the lower support member 110, and to support the upper support member 120. By providing the insulating member 130 between the lower support member 110 and the upper support member 120, the lower support member 110 and the upper support member 120 can be insulated, thereby isolating the carrier 200 used to support the silicon wafer from the lower support member 110, and subsequently isolating the carrier 200 from the transport mechanism 20, thus achieving insulation between the carrier 200 and the coating cavity, thereby reducing the risk of arcing during the coating process and damaging the substrate.

[0057] Furthermore, the bottom of the upper support member 120 is provided with an upper mounting groove 121, and the top of the lower support member 110 is provided with a lower mounting groove 111 opposite to the upper mounting groove 121. The first gap 101 between the lower surface of the upper support member 120 and the upper surface of the lower support member 110 is smaller than the second gap between the top wall of the upper mounting groove 121 and the bottom wall of the lower mounting groove 111. The insulating member 130 is embedded in the upper mounting groove 121 and the lower mounting groove 111, and the insulating member 130 abuts against the upper support member 120 and the lower support member 110.

[0058] It is understandable that by providing an upper mounting groove 121 at the bottom of the upper support member 120 and a lower mounting groove 111 at the top of the lower support member 110 opposite to the upper mounting groove 121, the insulating member 130 can be embedded between the upper support member 120 and the lower support member 110. This reduces the width of the first gap 101 between the lower surface of the upper support member 120 and the upper surface of the lower support member 110, thereby reducing the risk that the coating material will pass through the first gap 101 and be deposited on the insulating member 130 during the coating process. This also reduces the risk that the insulating member 130 will lose its insulating function due to the coating, and improves the reliability and service life of the insulating member 130.

[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0060] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A carrier disk used in a coating apparatus, characterized in that, include: A support assembly includes a lower support member, an upper support member, and an insulating member. The upper support member is disposed above and spaced apart from the lower support member. The bottom of the upper support member has an upper mounting groove, and the top of the lower support member has a lower mounting groove opposite to the upper mounting groove. A first gap between the lower surface of the upper support member and the upper surface of the lower support member is smaller than a second gap between the top wall of the upper mounting groove and the bottom wall of the lower mounting groove. The insulating member is embedded in the upper mounting groove and the lower mounting groove, and the insulating member abuts against the upper support member and the lower support member. A carrier, which is mounted on the upper support.

2. The carrier disk according to claim 1, characterized in that, The sidewalls of the upper mounting groove and the lower mounting groove are spaced apart from the sidewalls of the insulating component.

3. The carrier disk according to claim 2, characterized in that, The upper mounting groove has an upper isolation groove on its four sides around the top wall, and the lower mounting groove has a lower isolation groove on its four sides around the bottom wall, which is opposite to the upper isolation groove. The top of the insulating member covers a portion of the opening of the upper isolation groove and is spaced apart from the top wall of the upper isolation groove. The bottom of the insulating member covers a portion of the opening of the lower isolation groove and is spaced apart from the bottom wall of the lower isolation groove.

4. The carrier disk according to claim 1, characterized in that, The insulating component is fixedly connected to the lower support component by a first screw, and the first screw is spaced apart from the upper support component.

5. The carrier disk according to claim 1, characterized in that, The insulating component is fixedly connected to the upper support component by a second screw, and the second screw is spaced apart from the lower support component.

6. The carrier disk according to claim 4, characterized in that, The top of the insulating component is provided with a first clearance groove, the bottom wall of the first clearance groove is provided with a first mounting hole, the lower support component is provided with a second mounting hole opposite to the first mounting hole, the second mounting hole is a blind hole, and the first screw passes through the first mounting hole and the second mounting hole.

7. The carrier disk according to claim 5, characterized in that, The bottom of the insulating component is provided with a second clearance groove, and the top of the insulating component is provided with a third mounting hole communicating with the second clearance groove. The upper support component is provided with a fourth mounting hole opposite to the third mounting hole. The second screw passes through the fourth mounting hole and the third mounting hole, and the second screw is fixedly connected to a nut provided in the second clearance groove.

8. The carrier disk according to claim 7, characterized in that, The nut is spaced apart from the lower support member.

9. The carrier disk according to claim 7, characterized in that, The nut is made of insulating material.

10. A coating apparatus, characterized in that, include: Coating cavity; A transport mechanism, wherein the transport mechanism is disposed within the coating cavity; The carrier as described in any one of claims 1 to 9, wherein the carrier is disposed on the transport mechanism, and the lower support member is in contact with the transport mechanism; A coating mechanism is disposed within the coating cavity and located above the transport mechanism.

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