An enameled wire grinding apparatus and a grinding method
By adding a wire pressing mechanism to the enameled wire grinding equipment and heating it before grinding, the problems of vibration and deflection during the enameled wire grinding process were solved, thus achieving uniformity of the grinding pits and ensuring the quality of subsequent processes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANCHANG TRANSPORTATION COLLEGE
- Filing Date
- 2024-05-11
- Publication Date
- 2026-06-12
AI Technical Summary
The existing enameled wire grinding process has poor performance, which leads to a decline in the quality of subsequent processes. This is mainly manifested in the inconsistent depth of grinding pits caused by vibration and deflection of the enameled wire during grinding.
An improved enameled wire grinding device is adopted, which adds a wire pressing mechanism to fix the two ends of the enameled wire at the grinding position, thereby reducing the vibration and deflection during grinding. The enameled wire is also heated before grinding to improve the fixing effect.
This improved the grinding effect, resulting in consistent grinding pit depth, ensuring the quality of subsequent processes, and reducing the defect rate.
Smart Images
Figure CN118404447B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of enameled wire grinding technology, and particularly relates to an enameled wire grinding equipment and grinding method. Background Technology
[0002] When connecting LED flip chips to copper core enameled wire, laser soldering is unsuitable due to the small size and fragility of the chips. Therefore, related technologies propose using eutectic encapsulation. Specifically, the location where the chip needs to be mounted on the copper core enameled wire is ground to form a pair of appropriately sized pits. A copper-tin alloy is then placed in the pits to form a flexible copper-tin alloy support. During chip encapsulation, the flexible copper-tin alloy support is molten, and the LED flip chip is placed on the molten alloy surface to complete the eutectic encapsulation. In this eutectic encapsulation process, the grinding process on the enameled wire is the primary step. However, the grinding effect provided by related technologies is poor, reducing the quality of subsequent processes. Summary of the Invention
[0003] In view of this, embodiments of this application provide an enameled wire grinding equipment and grinding method to improve the grinding effect and ensure the completion quality of subsequent processes.
[0004] A first aspect of this application provides an enameled wire grinding apparatus, comprising:
[0005] A grinding mechanism used to grind enameled wire;
[0006] The motion mechanism is used to drive the grinding platform to move vertically.
[0007] The drive mechanism has a fixed component mounted on the grinding platform, and a drive component used to drive the grinding mechanism to move horizontally.
[0008] The crimping mechanism includes:
[0009] The pressure line support rod is connected to the drive assembly;
[0010] The wire pressing fixing block is connected to the wire pressing support rod;
[0011] The wire pressing fork has a cylindrical part protruding from the upper end for mounting a compression spring. The cylindrical part and the compression spring are embedded in the wire pressing fixing block. The lower end of the wire pressing fork is used to press the two ends of the enameled wire to be ground.
[0012] A retaining pin passes through the slotted hole of the pressure fixing block and the pressure fork head, and is fixed by fasteners. The retaining pin is used to adjust the initial compression degree of the compression spring and the initial position height of the pressure fork head.
[0013] When the compression spring is in a relaxed state, the initial position of the bottom surface of the wire pressing fork is lower than the position of the grinding head of the grinding mechanism; when the compression spring is in a fully compressed state, the position of the bottom surface of the wire pressing fork is higher than the position of the grinding head.
[0014] Optionally, the enameled wire grinding equipment also includes a processing platform, which includes:
[0015] A position adjustment table is used to adjust the position of the machining platform in the horizontal and vertical directions;
[0016] The heating block is provided with a groove for placing the enameled wire, and the heating block is used to heat the part of the enameled wire to be ground.
[0017] A cover plate, installed on the wire groove, is used to prevent the enameled wire from detaching from the wire groove.
[0018] Optionally, the heating block is used to heat the temperature of the enameled wire to be ground to 230°C, and the wire pressing block and wire pressing fork are made of PEEK material.
[0019] Optionally, the processing platform also includes a heat sink, which is connected to the position adjustment stage.
[0020] Optionally, the fastener is a nut, and the retaining pin has threads that mate with the nut.
[0021] Optionally, the motion mechanism is a lead screw and slider linear module, the drive mechanism is a telescopic cylinder, the cylinder body of the telescopic cylinder is a fixed component, and the telescopic component of the telescopic cylinder is a drive component.
[0022] The second aspect of this application provides a grinding method implemented using the enameled wire grinding equipment described in the first aspect above, the method comprising:
[0023] Move the enameled wire from the position to be ground to the processing position;
[0024] The two ends of the enameled wire to be ground are fixed by the wire pressing mechanism;
[0025] The grinding mechanism grinds the area of the enameled wire to be ground.
[0026] Optionally, moving the enameled wire from the grinding position to the machining position includes:
[0027] Move the enameled wire to the position to be ground to the position of the heating block; for example, the position of the heating block is the processing position.
[0028] The heating block heats the area of the enameled wire to be ground to a preset temperature. For example, the preset temperature is 230°C.
[0029] Optionally, the two ends of the enameled wire at the position to be ground are fixed by a wire pressing mechanism, including:
[0030] The initial compression of the compression spring and the initial position height of the line fork head are adjusted by adjusting the fixed height of the fixing pin.
[0031] The two ends of the enameled wire to be ground are fixed by the wire pressing block, the wire pressing fork, the compression spring and the fixing pin.
[0032] Optionally, the two ends of the enameled wire to be ground are fixed by a wire-pressing fixing block, a wire-pressing fork, a compression spring, and a fixing pin, including:
[0033] The drive mechanism operates, causing the grinding mechanism and the wire pressing mechanism to move horizontally above the position of the enameled wire to be ground;
[0034] The motion mechanism operates, causing the grinding platform to move downwards, allowing the grinding head of the grinding mechanism to contact the enameled wire to be ground.
[0035] The beneficial effects of the embodiments in this application compared with the prior art are:
[0036] This application provides an enameled wire grinding equipment and grinding method, which improves the enameled wire grinding process by adding a wire pressing mechanism and adding a fixed action at both ends of the enameled wire grinding position before the grinding begins, so as to reduce the amplitude and deflection of the enameled wire vibration during grinding, so that the depth of the two grinding pits is consistent, thereby improving the grinding effect and ensuring the completion quality of subsequent processes. Attached Figure Description
[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0038] Figure 1 This illustration shows a structural schematic diagram of an enameled wire grinding device provided in an embodiment of this application;
[0039] Figure 2 A schematic diagram of a grinding mechanism provided in an embodiment of this application is shown;
[0040] Figure 3 A schematic diagram of a wire pressing mechanism provided in an embodiment of this application is shown;
[0041] Figure 4 A schematic diagram of the structure of a processing platform provided in an embodiment of this application is shown.
[0042] 1. Support frame; 2. Lead screw and slider linear module; 3. Grinding platform; 4. Telescopic cylinder;
[0043] 5. Grinding mechanism; 501. Fixing component; 502. Clamping component; 503. Grinding machine; 5031. Grinding head; 504. Cylinder connecting component;
[0044] 6. Wire pressing mechanism; 601. Wire pressing support rod; 602. Wire pressing fixing block; 603. Wire pressing fork head; 604. Fixing pin; 605. Compression spring;
[0045] 7. Machining platform; 701. Position adjustment table; 702. Heating block; 703. Heat dissipation block; 704. Cover plate; 705. Hexagonal copper column;
[0046] 8. Enameled wire. Detailed Implementation
[0047] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.
[0048] The grinding process provided by the related technologies has poor grinding effect, which reduces the quality of subsequent processes. Specifically:
[0049] (1) Because finer enameled wires exhibit greater flexibility, they will experience strong vibrations during grinding. These vibrations will cause uneven depths of the grinding pits, which will reduce the quality of subsequent processes.
[0050] (2) The enameled wire may deflect during the grinding process, and the deflection of the enameled wire will also cause the two grinding pits to be inconsistent in depth, reducing the quality of subsequent processes.
[0051] In view of this, the present application provides an enameled wire grinding equipment and grinding method, which improves the enameled wire grinding process by adding a wire pressing mechanism and adding the action of fixing the two ends of the enameled wire grinding position before the grinding begins, so as to reduce the amplitude and deflection of the enameled wire vibration during grinding, so that the depth of the two grinding pits is consistent, thereby improving the grinding effect and ensuring the completion quality of subsequent processes.
[0052] To illustrate the technical solution described in this application, specific embodiments are provided below.
[0053] Please see Figures 1 to 4 As shown in the figure, this application provides an enameled wire grinding device.
[0054] like Figure 1 As shown, the enameled wire grinding equipment includes: a support frame 1, a lead screw and slider linear module 2, a grinding platform 3, a telescopic cylinder 4, a grinding mechanism 5, a wire pressing mechanism 6, and a processing platform 7, which are used to grind the enameled wire 8.
[0055] like Figure 1 As shown, support frame 1 is mounted on the workbench. As an example, support frame 1 is connected to the workbench by bolts. As an example, the mounting holes of support frame 1 are slotted holes, allowing for easy adjustment of the mounting position of support frame 1.
[0056] like Figure 1 As shown, the lead screw and slider linear module 2 is mounted on the support frame 1. As an example, the lead screw and slider linear module 2 includes a motor, a timing pulley, a lead screw, and a nut seat. For example, the lead screw and slider linear module 2 drives the lead screw to rotate via the motor and timing pulley, thereby moving the nut seat up and down, which in turn drives the component fixed to the nut seat to move together. For example, this component is a grinding platform 3. As an example, the grinding platform 3 is fixedly connected to the nut seat by bolts. It should be understood that the lead screw and slider linear module 2 can also be replaced by other motion mechanisms with the same function.
[0057] like Figure 1 and Figure 2 As shown, the cylinder body (i.e., the fixed assembly) of the telescopic cylinder 4 is fixedly connected to the grinding platform 3 by bolts. The telescopic component (i.e., the drive assembly) of the telescopic cylinder 4 is connected to the grinding mechanism 5 by threads, and the horizontal movement of the grinding mechanism 5 is driven by the extension and retraction of the telescopic component. As an example, the telescopic component of the telescopic cylinder 4 is fixedly connected to the cylinder connector 504. It should be understood that the telescopic cylinder 4 can also be replaced by other drive mechanisms with the same function.
[0058] like Figure 2 As shown, the grinder 503 in the grinding mechanism 5 is clamped and fixed by bolts between the fixing member 501 and the clamping member 502. As an example, the fixing member 501 is fixedly connected to the cylinder connector 504.
[0059] like Figure 2 As shown, the pressing mechanism 6 is bolted to the grinding mechanism 5 via a pressing support rod 601. For example, the pressing support rod 601 is fixedly connected to the fixing member 501. The pressing fixing block 602 is bolted to the pressing support rod 601. With this configuration, the pressing fixing block 602 and the pressing support rod 601 can move together with the grinding mechanism 5. The pressing fork 603 works in conjunction with the pressing fixing block 602 to achieve sliding movement between them.
[0060] like Figure 2 and Figure 3As shown, the retaining pin 604 is locked onto the wire clamping block 602. For example, the retaining pin 604 passes through the slotted holes of the wire clamping block 602 and the wire clamping fork 603, and is fixed by a fastener. For example, the fastener is a nut, and the retaining pin 604 has threads that mate with the nut.
[0061] like Figure 3 As shown, as an example, the height position of the fixing pin 604 can be adjusted by using the slotted holes of the wire clamping block 602 and the wire clamping fork 603, thereby adjusting the initial compression degree of the compression spring 605 and the initial position height of the wire clamping fork 603.
[0062] like Figure 3 As shown, a cylindrical part protrudes from the wire pressing fork head 603, and a compression spring 605 is sleeved on the cylindrical part.
[0063] Specifically, the crimping mechanism 6 must meet the following requirements after assembly:
[0064] (1) The pressure fork 603 can slide smoothly in the pressure fixing block 602. For example, when the pressure fork 603 slides upward relative to the pressure fixing block 602, the compression spring 605 can be compressed; when the pressure fork 603 slides downward relative to the pressure fixing block 602, the compression of the compression spring 605 can be gradually released.
[0065] (2) When the compression spring 605 is in a relaxed state, the bottom surface of the wire pressing fork 603 needs to be lower than the position of the grinding head 5031 of the grinder 503; when the compression spring 605 is in a fully compressed state, the bottom surface of the wire pressing fork 603 needs to be higher than the position of the grinding head 5031 of the grinder 503.
[0066] like Figure 4 As shown, the machining platform 7 is connected to the worktable through the position adjustment table 701, which can realize horizontal and vertical adjustment.
[0067] As an example, the heating block 702 is connected to the position adjustment stage 701 via a hexagonal copper pillar 705.
[0068] As an example, the heating block 702 is provided with a groove for placing the enameled wire 8, which guides the enameled wire 8 in the horizontal direction.
[0069] As an example, the heating block 702 heats the enameled wire 8 through heat transfer, raising the temperature of the enameled wire 8, which is beneficial for subsequent grinding of the enameled wire 8 and improves the grinding effect.
[0070] As an example, the cover plate 704 is fixed to the heating block 702 to prevent the enameled wire 8 from detaching from the groove of the heating block 702, so as to ensure that the enameled wire 8 can only move back and forth in the groove direction when it moves.
[0071] As an example, the heat sink 703 is connected to the position adjustment stage 701, and the heat sink 703 is used to dissipate heat from the heated enameled wire 8.
[0072] As an example, the machining platform 7 can stabilize the temperature at 230°C to soften the enameled wire 8 during grinding, thereby improving the grinding effect.
[0073] Because the pressure fixing block 602 and the pressure fork 603 require repeated friction during use, traditional metal materials such as stainless steel or aluminum alloy will experience surface wear due to prolonged friction, increasing the friction between parts and causing uneven sliding. Therefore, in this embodiment, the pressure fixing block 602 and the pressure fork 603 are made of PEEK material. This material is heat-resistant, self-lubricating, has high mechanical strength, and is easy to process. This design ensures good wear resistance for the pressure fixing block 602 and the pressure fork 603, effectively meeting their material requirements.
[0074] The above-mentioned enameled wire grinding equipment can fix the two ends of the enameled wire 8 at the grinding position through the wire pressing mechanism 6, so as to reduce the amplitude and deflection of the vibration of the enameled wire 8 during grinding, so that the depth of the two grinding pits is consistent, thereby improving the grinding effect and ensuring the quality of subsequent processes.
[0075] Based on the above-mentioned enameled wire grinding equipment, this application embodiment also provides a grinding method, specifically including the following steps:
[0076] S110. When the enameled wire 8 is moved to the processing position (i.e., the position of the heating block 702), the enameled wire 8 stops moving.
[0077] At this point, the area of the enameled wire 8 that needs to be ground is located within the groove of the heating block 702. The groove of the heating block 702 and the cover plate 704 help to reduce the amplitude and deflection of the vibration of the enameled wire 8 during grinding.
[0078] S120, The enameled wire 8 is heated by the heating block 702.
[0079] Heating the enameled wire 8 is beneficial for grinding.
[0080] S130. The above-mentioned wire pressing mechanism 6 is used to fix the two ends of the grinding position of the enameled wire 8.
[0081] Specifically, by using the wire pressing fixing block 602, the wire pressing fork 603, and the compression spring 605 to fix both ends of the grinding position of the enameled wire 8, the amplitude and degree of vibration of the enameled wire 8 during grinding can be reduced.
[0082] Optionally, step S130 may also include the following steps:
[0083] S131. By adjusting the fixed height of the fixing pin 604, the initial compression degree of the compression spring 605 and the initial position height of the wire pressing fork head 603 can be adjusted, which can adapt to enameled wires of different diameters, that is, adapt to the wire diameter of the enameled wire 8 to be ground.
[0084] As an example, the hole for mounting the fixing pin 604 on the wire clamping block 602 is a slotted hole, allowing manual adjustment of the fixing pin 604's position. When the fixing pin 604 is installed in different positions, the initial compression degree of the compression spring 605 varies, and the initial height of the wire clamping fork 603 also differs. When installing the fixing pin 604, it is necessary to ensure that the initial position of the bottom surface of the wire clamping fork 603 is lower than the grinding head 5031 of the grinder 503. This ensures that the wire clamping fork 603 contacts the enameled wire 8 first, and after pressing the enameled wire 8, the grinder 503 performs the grinding.
[0085] S132, the telescopic cylinder 4 is activated, driving the grinding mechanism 5 and the wire pressing mechanism 6 to move horizontally above the position of the enameled wire 8 that needs to be ground, so that the grinding head 5031 of the grinding machine 503 and the position of the enameled wire 8 that needs to be ground are on the same vertical line.
[0086] S133. After the grinding machine 503 moves horizontally into position, the lead screw slider linear module 2 drives the grinding platform 3 to move downward, so that the grinding head 5031 of the grinding machine 503 can contact the surface of the enameled wire 8.
[0087] S140. Grind the areas of the enameled wire 8 that need grinding using a grinding machine 503.
[0088] For example, when the enameled wire 8 is being polished, the surface of the enameled wire 8 is mainly polished by the polishing machine 503 to remove the enamel coating and form pits for subsequent processing.
[0089] In the above grinding method, before the grinding head 5031 of the grinding machine 503 contacts the enameled wire 8, the wire pressing fork 603 will contact the enameled wire 8 in advance, and the compression of the compression spring 605 will generate a downward pressing force on the enameled wire 8, pressing the enameled wire 8 tightly on the heating block 702, so that the two ends of the grinding position of the enameled wire 8 can be completely fixed, thereby reducing the amplitude and deflection of the vibration of the enameled wire 8 during grinding, and making the depth of the grinding pit as consistent as possible for each grinding.
[0090] As an example, during the grinding of the enameled wire 8, the pressure fork 603 first contacts the enameled wire 8 on the processing platform 7. After the pressure fork 603 contacts the enameled wire 8, the grinding platform 3 continues to move downward. At this time, the grinding mechanism 5 and the pressure fixing block 602 continue to move downward, while the position of the pressure fork 603 remains unchanged. At this time, the compression spring 605 is in a compressed state. When the compression spring 605 is compressed, it applies downward pressure to the pressure fork 603, which in turn applies downward pressure to the enameled wire 8. The processing platform 7 applies upward support force to the enameled wire 8. Under these two forces, the two ends of the grinding position of the enameled wire 8 can be fixed.
[0091] In summary, the enameled wire grinding equipment and grinding method provided in this application embodiment, through the aforementioned wire pressing mechanism 6, ensures that both ends of the enameled wire 8 at the grinding position are fixed by the wire pressing fork head 603 during grinding in the grinding machine 503. This greatly reduces the amplitude and degree of vibration caused by grinding, solves the problem of inconsistent grinding pit depth caused by the vibration and deflection of the enameled wire 8, and reduces the defect rate of grinding.
[0092] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. A wire grinding machine, characterized in that, include: A grinding mechanism used to grind enameled wire; The motion mechanism is used to drive the grinding platform to move vertically. A drive mechanism, wherein a fixed component of the drive mechanism is mounted on the grinding platform, and a drive component of the drive mechanism is used to drive the grinding mechanism to move horizontally; The wire pressing mechanism includes: A wire support rod is connected to the drive assembly; The wire pressing fixing block is connected to the wire pressing support rod; The wire pressing fork has a cylindrical part protruding from its upper end for mounting a compression spring. The cylindrical part and the compression spring are embedded in the wire pressing fixing block. The lower end of the wire pressing fork is used to press the two ends of the enameled wire to be ground. A fixing pin passes through the slotted hole of the wire pressing fixing block and the wire pressing fork head, and is fixed by a fastener. The fixing pin is used to adjust the initial compression degree of the compression spring and the initial position height of the wire pressing fork head. The enameled wire grinding equipment also includes a processing platform, which comprises: A position adjustment table is used to adjust the position of the processing platform in the horizontal and vertical directions; The heating block is provided with a groove for placing the enameled wire, and the heating block is used to heat the part of the enameled wire to be ground; A cover plate is provided on the wire groove to prevent the enameled wire from detaching from the wire groove; The heating block is used to heat the temperature of the enameled wire to be ground to 230°C, and the wire pressing fixing block and the wire pressing fork are made of PEEK material; When the compression spring is in a relaxed state, the initial position of the bottom surface of the wire pressing fork is lower than the position of the grinding head of the grinding mechanism, so that when the motion mechanism drives the grinding platform to move vertically downward, the wire pressing fork contacts and presses the enameled wire before the grinding head. When the compression spring is in a fully compressed state, the bottom surface of the wire pressing fork is higher than the position of the grinding head, so that the wire pressing fork can slide smoothly upward within the wire pressing fixing block made of PEEK material, and the grinding head can grind the enameled wire under a 230°C heating state.
2. The enameled wire grinding equipment according to claim 1, characterized in that, The processing platform also includes a heat sink, which is connected to the position adjustment table.
3. The enameled wire grinding equipment according to claim 1 or 2, characterized in that, The fastener is a nut, and the fixing pin has threads that mate with the nut.
4. The enameled wire grinding equipment according to claim 1 or 2, characterized in that, The motion mechanism is a lead screw and slider linear module, the drive mechanism is a telescopic cylinder, the cylinder body of the telescopic cylinder is a fixed component, and the telescopic component of the telescopic cylinder is a drive component.
5. A grinding method based on the enameled wire grinding equipment according to any one of claims 1 to 4, characterized in that, The method includes: Move the enameled wire from the position to be ground to the processing position; The wire pressing mechanism is used to fix both ends of the enameled wire at the position to be ground. The grinding mechanism is used to grind the area of the enameled wire to be ground.
6. The grinding method implemented by the enameled wire grinding equipment according to claim 5, characterized in that, Moving the enameled wire from the grinding position to the processing position includes: Move the enameled wire to the position to be ground to the position of the heating block; The heating block heats the enameled wire to the preset temperature at the grinding location.
7. The grinding method implemented by the enameled wire grinding equipment according to claim 5, characterized in that, The step of fixing the two ends of the enameled wire at the grinding position via the wire pressing mechanism includes: The initial compression degree of the compression spring and the initial position height of the line clamping fork head are adjusted by adjusting the fixed height of the fixing pin. The two ends of the enameled wire to be ground are fixed by the wire pressing block, the wire pressing fork, the compression spring and the fixing pin.
8. The grinding method implemented by the enameled wire grinding equipment according to claim 7, characterized in that, The method of fixing the two ends of the enameled wire at the grinding position by means of the wire pressing fixing block, the wire pressing fork, the compression spring and the fixing pin includes: The drive mechanism operates, causing the grinding mechanism and the wire pressing mechanism to move horizontally above the position of the enameled wire to be ground; The motion mechanism operates, causing the grinding platform to move downwards, so that the grinding head of the grinding mechanism can contact the enameled wire to be ground.