A low temperature storage module

Abstract

The application belongs to the technical field of detection equipment, and provides a low-temperature storage module, which comprises a working support, a water collecting and refrigerating assembly, an adapter, a driving assembly and a cover plate assembly.

Description

Technical Field

[0001] This invention belongs to the field of detection equipment technology, and in particular relates to a low-temperature storage module. Background Technology

[0002] When testing biological samples, such as test samples or probes, these samples or probes need to be stored at a set low temperature for later retrieval. Currently, these samples or probes are generally placed directly in refrigerated structures (such as refrigeration equipment), requiring repeated manual removal during use, which is labor-intensive. Furthermore, the test samples or probes cannot be maintained at a constant low temperature during handling, and consumables (such as test tube racks, PCR plates, deep-well plates, etc.) and adapters containing these consumables will generate condensation in low-temperature environments. Removing samples from a low-temperature environment can lead to increased condensation on the consumables due to temperature changes; if this condensation enters the test sample or probe, it will affect the test results. Summary of the Invention

[0003] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a low-temperature storage module to solve the problems of biological samples, adapters and condensation generated on them when stored at low temperatures.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A low-temperature storage module, comprising:

[0006] Working stand;

[0007] A water-collecting and cooling assembly is provided, wherein multiple water-collecting and cooling assemblies are arranged horizontally side by side on the working support, and / or multiple water-collecting and cooling assemblies are arranged vertically in parallel, and the water-collecting and cooling assemblies are used to support the adapter;

[0008] A drive assembly is disposed on the working support;

[0009] A cover plate assembly is disposed on the working support and connected to the output end of the drive assembly. The drive assembly can drive the cover plate assembly to move up and down in the vertical direction, and the cover plate assembly presses against the test tube opening of the adapter.

[0010] Preferably, the water collection and cooling assembly includes:

[0011] Side plate, which is connected to the working bracket;

[0012] A water collection rack is connected to the side plate, and the water collection rack is provided with a first receiving groove for accommodating an adapter of a first size;

[0013] The first receiving groove is provided with a first installation through groove;

[0014] A thermoelectric cooler is disposed in the first mounting slot and attached to the bottom of the adapter;

[0015] A cooling component is disposed at the bottom of the semiconductor refrigeration chip.

[0016] Preferably, a first drain hole is provided in the first receiving groove, and the first drain hole is located on the outer periphery of the first mounting groove.

[0017] Preferably, the water collection rack is further provided with a second receiving tank, the second receiving tank is located on the outer periphery of the first receiving tank, the first receiving tank is located at the bottom of the second receiving tank, and the projected area of ​​the second receiving tank on the horizontal plane is greater than the projected area of ​​the first receiving tank on the horizontal plane.

[0018] Preferably, the first receiving groove is provided with a wire passage groove that communicates with the first mounting through groove.

[0019] Preferably, each set of adapters has two sets of semiconductor cooling chips at its bottom.

[0020] Preferably, temperature sensors are provided on both sides of the semiconductor cooling chip.

[0021] Preferably, the water collection and cooling assembly further includes a collection box detachable from the water collection frame, the collection box being disposed at the bottom of the cooling assembly and communicating with the first drain hole.

[0022] Preferably, one of the water collection racks or the collection box has a slot on its side wall, and the other has a protrusion that slides and engages with the slot.

[0023] Preferably, a drain hole is provided on the front side wall of the collection box.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] In this invention, an adapter is placed on a water-collecting cooling assembly, and consumables containing the sample to be tested are placed on the adapter. The adapter cools the consumables through contact with them. The water-collecting cooling assembly maintains the adapter at a constant temperature, and simultaneously collects any condensation on the adapter. A drive assembly moves the cover assembly vertically up and down, pressing the cover onto the test tube opening of the adapter, thus preventing condensation, impurities, or dust from dripping into the test tube during storage. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the low-temperature storage module in this invention;

[0027] Figure 2 This is a schematic diagram of the water-collecting cooling component and the adapter of the first size in the present invention from a first angle;

[0028] Figure 3 This is a schematic diagram of the water-collecting cooling component and the adapter of the first size in the present invention from a second angle.

[0029] Figure 4 This is a schematic diagram of the water-collecting cooling component and the adapter of the second size in the present invention from a first angle.

[0030] Figure 5 This is a schematic diagram of the water-collecting cooling component and the adapter of the second size in the present invention from a first angle.

[0031] Figure 6 This is a schematic diagram of the water collection and cooling component in this invention;

[0032] Figure 7 This is a structural schematic diagram of the adapter support member at a first angle in this invention;

[0033] Figure 8 This is a schematic diagram of the second angle of the adapter support member in this invention;

[0034] Figure 9 This is a schematic diagram of the water collection and cooling component of the present invention from a first angle;

[0035] Figure 10 This is a schematic diagram of the water collection and cooling component of the present invention from a second angle;

[0036] Figure 11 This is a schematic diagram of the collection box in this invention;

[0037] Figure 12 This is a schematic diagram of the drive assembly and cover plate assembly from a first angle in this invention;

[0038] Figure 13 This is a schematic diagram of the drive assembly and cover plate assembly from a second angle in this invention;

[0039] Figure 14 This is a schematic diagram of the drive component in the present invention from a first angle;

[0040] Figure 15 This is a schematic diagram of the drive component in the present invention from a first angle.

[0041] Among them, 1. Working bracket; 11. Base; 12. Vertical support frame;

[0042] 2. Water collection and cooling assembly; 21. Side plate; 22. Water collection rack; 221. First receiving groove; 222. Second receiving groove; 223. First drain hole; 224. Slot; 225. First mounting through groove; 226. Cable routing groove; 227. Adapter support; 228. Water collection side plate; 23. Semiconductor cooling chip; 24. Cooling assembly; 241. Cooling support plate; 2411. Second drain hole; 242. Water cooling radiator assembly; 25. Collection box; 251. Handle; 252. Protruding structure; 253. Drain hole;

[0043] 4. Drive assembly; 41. Motor mounting bracket; 43. Lead screw; 44. Rotating block; 45. Slide rail; 46. Slider;

[0044] 5. Cover plate assembly; 51. Main support plate; 52. Connecting plate; 53. Pressure plate; 54. Elastic pad; 55. Elastic connector. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0046] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0047] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0048] In the description of this invention, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0049] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0050] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0051] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0052] To address the issue of condensation forming on the outside of test tubes and on the adapters used to hold the test tubes during low-temperature storage, such as... Figures 1-15 As shown, this embodiment provides a low-temperature storage module, which includes a working bracket 1, a water collection and cooling assembly 2, a driving assembly 4, and a cover plate assembly 5. The working bracket 1 includes a base 11 and a vertical support frame 12. The vertical support frame 12 is connected to the base 11, and the base 11 is used to support the vertical support frame 12.

[0053] Water-collecting and cooling components 2 are arranged horizontally in parallel and / or vertically in parallel. An adapter is placed on the water-collecting and cooling components 2, and consumables containing the sample to be tested are placed on the adapter. The adapter contacts the consumables to cool them. In this embodiment, the consumables include PCR plates, deep-well plates, and test tube racks, etc.

[0054] The water collection and cooling assembly 2 can keep the adapter at a constant temperature, and at the same time, the condensate on the adapter will be collected by the water collection and cooling assembly 2.

[0055] The drive component 4 is mounted on the working bracket 1.

[0056] The cover plate assembly 5 is connected to the drive assembly 4. The drive assembly 4 can drive the cover plate assembly 5 to move up and down in the vertical direction. The cover plate assembly 5 presses against the test tube opening of the adapter, thereby ensuring that no condensation, impurities, or dust drips into the test tube during storage.

[0057] In this embodiment, the working bracket 1 supports the working of the driving component 4. The driving component 4 drives the cover plate component 5 to descend. The cover plate component 5 covers the test tube opening of the adapter. The cover plate component 5 rises to detach from the test tube. The adapter and the test tube on it are available for picking up and putting down.

[0058] Each set of cover plate assemblies 5 located above each adapter can move up and down synchronously. In other embodiments, if there are multiple rows or columns of adapters, the cover plate assemblies 5 located in the same column or row can move synchronously, or each set of cover plate assemblies 5 can move up and down independently. To save production costs and reduce the number of sets of drive assemblies 4, in this embodiment, the adapters are arranged along the same column, and the cover plate assemblies 5 located in the same column are driven to move up and down by sharing a set of drive assemblies 4.

[0059] The water-collecting cooling assembly 2 includes a side plate 21, a water collection frame 22, a thermoelectric cooler 23, and a cooling component 24. The side plate 21 is connected to the working support 1. The water collection frame 22 is connected to the side plate 21 and supports the water collection frame 22, the thermoelectric cooler 23, and the cooling component 24. Specifically, the water collection frame 22 is connected to the vertical support frame 12. The water collection frame 22 is provided with a first receiving groove 221 for accommodating an adapter of a first size. The bottom of the first receiving groove 221 is flat to stably place the adapter of the first size. A first mounting through groove 225 is opened in the first receiving groove 221. A first drain hole 223 is opened in the first receiving groove 221. The first drain hole 223 is located on the outer periphery of the first mounting through groove 225 to ensure that the generated condensate does not flow to the thermoelectric cooler 23 and affect its operation. The first drain hole 223 is connected to the outside. After the first size adapter placed in the first receiving tank 221 is pre-cooled, condensate will be generated. Some of the condensate will evaporate as it flows downward on the first size adapter, and some of the condensate will flow to the outside through the first drain hole 223.

[0060] A thermoelectric cooler 23 is disposed within the first mounting slot 225 and is attached to the bottom of the adapter. The thermoelectric cooler 23 cools the first-sized adapter placed in the first receiving slot 221 to a preset temperature, thereby storing low-temperature liquids, such as samples, reagents, or probes. Specifically, the thermoelectric cooler 23 is placed within the first mounting slot 225, and its bottom is supported by a cooling assembly 24.

[0061] The cooling component 24 is located at the bottom of the thermoelectric cooler 23. The cooling component 24 is used to cool the thermoelectric cooler 23 and dissipate the heat generated by the thermoelectric cooler 23 to the external environment.

[0062] Preferably, the water collection rack 22 is further provided with a second receiving groove 222, which is located on the outer periphery of the first receiving groove 221. The first receiving groove 221 is located at the bottom of the second receiving groove 222. The projected area of ​​the second receiving groove 222 on the horizontal plane is larger than the projected area of ​​the first receiving groove 221 on the horizontal plane. The second receiving groove 222 is used to accommodate the adapter of the second size.

[0063] Two stepped first receiving tanks 221 and second receiving tanks 222 are provided on the water collection rack 22, which can accommodate adapters of different sizes, thus enabling the storage of different materials.

[0064] Regarding the location of the first drain hole 223 in the first receiving tank 221, since the size of the first receiving tank 221 is slightly larger than the size of the first-sized adapter, in order to quickly drain the condensate generated on the first-sized adapter, the first drain hole 223 is located at the connection between the side wall and the bottom wall of the first receiving tank 221.

[0065] Preferably, each of the four sets of sidewalls and the bottom wall of the first receiving tank 221 is provided with a first drain hole 223 to allow the condensate generated on the adapter to drain away quickly. More preferably, each set of sidewalls and the bottom wall of the first receiving tank 221 is provided with at least two sets of first drain holes 223.

[0066] Preferably, to facilitate the wiring of the semiconductor cooling chip 23, a wire passage groove 226 communicating with the first mounting through groove 225 is provided in the first receiving groove 221.

[0067] Preferably, each set of first-size adapters has two sets of semiconductor cooling pads 23 at its bottom to cover the entire bottom of the first-size adapter.

[0068] Preferably, temperature sensors are provided on both sides of the thermoelectric cooler 23. The temperature sensor located on the upper surface of the thermoelectric cooler 23 is used to detect the cooling temperature and determine whether the cooling temperature has reached the predetermined temperature of the system. The temperature sensor located on the lower surface of the thermoelectric cooler 23 is used to detect whether the temperature is too high, causing component failure.

[0069] The specific structure of the first drain hole 223 communicating with the outside is as follows: the water collection and cooling assembly 2 also includes a collection box 25 that can be detached from the water collection frame 22. The collection box 25 is located at the bottom of the cooling assembly 24 and communicates with the first drain hole 223.

[0070] Preferably, one of the water collection rack 22 or the collection box 25 has a slot 224 on its side wall, and the other has a protrusion 252 that slides and engages with the slot 224, allowing the collection box 25 to be pulled out, the water poured out, and then inserted again for use. Specifically, the water collection rack 22 has a slot 224 on its side wall, and the collection box 25 has a protrusion 252 that slides and engages with the slot 224.

[0071] Preferably, the water collection frame 22 includes an adapter support 227 and water collection side plates 228 disposed on both sides of the adapter and connected to the adapter. One side wall of the water collection side plate 228 and the collection box 25 is provided with a slot 224, and the other side wall is provided with a protrusion structure 252 that slides and engages with the slot 224. Specifically, the side wall of the water collection side plate 228 is provided with a slot 224, and the collection box 25 is provided with a protrusion structure 252 that slides and engages with the slot 224.

[0072] Preferably, a drain hole 253 is provided on the front side wall of the collection box 25. If the condensate in the collection box 25 exceeds a certain height, it will overflow from the drain hole 253. The water inside will not come into contact with the cooling component 24 or the semiconductor refrigeration chip 23, thus affecting the operation of the cooling component 24 and the semiconductor refrigeration chip 23.

[0073] Preferably, a handle 251 is provided on the front side wall of the collection box 25, which facilitates pulling out the collection box 25. Preferably, the handle 251 is a groove or a handle.

[0074] Preferably, the side plate 21 is provided with weight-reducing holes to reduce the overall structural weight.

[0075] Preferably, the cooling assembly 24 includes a cooling support plate 241 and a water-cooled radiator assembly 242. The cooling support plate 241 is connected to the water collection rack 22, and the water-cooled radiator assembly 242 is disposed between the cooling support plate 241 and the water collection rack 22. The circulating water of the water-cooled radiator assembly 242 is used to cool the semiconductor cooling chip 23.

[0076] Preferably, the cooling support plate 241 is provided with a second drain hole 2411, and there is a gap between the water-cooled radiator assembly 242 and the water collection rack 22, with the second drain hole 2411 communicating with the gap. Liquid flowing downward through the first drain hole 223 drips into the collection box after passing through the gap between the water-cooled radiator assembly 242 and the water collection rack 22 and the second drain hole 2411.

[0077] Preferably, the drive assembly 4 includes: a motor mounting bracket 41 connected to the working support 1, a motor mounted on the motor mounting bracket 41, a lead screw 43 connected to the output end of the motor, a rotating block 44 connected to the lead screw 43, and a cover plate assembly 5 connected to the rotating block 44. The motor drives the lead screw 43 to rotate, the rotating block 44 moves in the vertical direction, and drives the cover plate assembly 5 to rise and fall.

[0078] Preferably, the drive assembly 4 further includes a slide rail 45 and a slider 46. The slide rail 45 is mounted on the motor mounting bracket 41, and the slide rail 45 and the slider 46 are slidably engaged. The slider 46 is connected to the rotating block 44. By setting the slide rail 45 and the slider 46, the rotating block 44 and the cover plate assembly 5 are guided to move in the vertical direction, resulting in more precise movement.

[0079] Preferably, the cover plate assembly 5 includes a main support plate 51, a connecting plate 52, a pressure plate 53, and an elastic pad 54. The connecting plate 52 is connected to the main support plate 51, the pressure plate 53 is connected to the connecting plate 52, and the elastic pad 54 is disposed at the bottom of the pressure plate 53. The elastic pad 54 covers the test tube of the adapter.

[0080] Preferably, an elastic connector 55 is provided between the connecting plate 52 and the pressure plate 53. When the pressure plate 53 and the elastic pad 54 are placed over the test tube opening, if there is a positional deviation that results in an incomplete seal, the elastic connector 55 can adjust the relative position and angle between the pressure plate 53 and the connecting plate 52, thereby ensuring that the elastic pad 54 is properly placed over the test tube opening.

[0081] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A low-temperature storage module, characterized in that, include: Working support (1); Water collection and cooling assembly (2), multiple water collection and cooling assemblies (2) are arranged horizontally side by side on the working support (1), and / or multiple water collection and cooling assemblies (2) are arranged parallel to each other in the vertical direction, the water collection and cooling assembly (2) is used to carry the adapter; Drive component (4), which is disposed on the working support (1); The cover plate assembly (5) is disposed on the working bracket (1) and connected to the output end of the drive assembly (4). The drive assembly (4) can drive the cover plate assembly (5) to move up and down in the vertical direction. The cover plate assembly (5) presses against the test tube opening of the adapter. The water collection and cooling assembly (2) includes: Side plate (21), which is connected to the working bracket (1); A water collection rack (22) is connected to the side plate (21). The water collection rack (22) is provided with a first receiving groove (221) for accommodating an adapter of a first size. The first receiving groove (221) is provided with a first installation through groove (225); A semiconductor cooling chip (23) is disposed in the first mounting slot (225) and the semiconductor cooling chip (23) is attached to the bottom of the adapter; A cooling component (24) is disposed at the bottom of the semiconductor cooling chip (23). The cooling component (24) includes a cooling support plate (241) and a water cooling radiator assembly (242). The cooling support plate (241) is connected to the water collection rack (22). The water cooling radiator assembly (242) is disposed between the cooling support plate (241) and the water collection rack (22). The semiconductor cooling chip (23) is cooled by circulating water from the water cooling radiator assembly (242). The first receiving groove (221) is provided with a first drain hole (223), which is located on the outer periphery of the first mounting groove (225); the water collection rack (22) is also provided with a second receiving groove (222), which is used to accommodate an adapter of the second size. The second receiving groove (222) is located on the outer periphery of the first receiving groove (221), and the first receiving groove (221) is located at the bottom of the second receiving groove (222). The projected area of ​​the second receiving groove (222) on the horizontal plane is greater than the projected area of ​​the first receiving groove (221) on the horizontal plane.

2. The low-temperature storage module according to claim 1, characterized in that, The first receiving groove (221) has a wire passage groove (226) that communicates with the first mounting through groove (225).

3. The low-temperature storage module according to claim 1, characterized in that, Each adapter has two sets of semiconductor cooling chips (23) at its bottom.

4. The low-temperature storage module according to claim 1, characterized in that, Temperature sensors are provided on both sides of the semiconductor cooling chip (23).

5. The low-temperature storage module according to claim 1, characterized in that, The water collection and cooling assembly (2) also includes a collection box (25) detachable from the water collection frame (22). The collection box (25) is located at the bottom of the cooling assembly (24) and communicates with the first drain hole (223).

6. The low-temperature storage module according to claim 5, characterized in that, A slot (224) is provided on the side wall of one of the water collection racks (22) or the collection box (25), and a protrusion (252) is provided on the other side wall to slide and engage with the slot (224).

7. The low-temperature storage module according to claim 6, characterized in that, A drain hole (253) is provided on the front side wall of the collection box (25).

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