Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systems

Abstract

This application relates to microelectronic device package assemblies including stiffener devices and related microelectronic devices and electronic systems. A microelectronic device package assembly includes a package board and a stiffener device attached to the package board. The package board has a first side and a second side. The stiffener device includes an upper stiffener, a lower stiffener, and one or more damper devices. The upper stiffener is over the first side of the package board and has a die side and a package side. The lower stiffener is interposed between the upper stiffener and the package board and has a damper side and a board side. The lower stiffener includes a through-package anchor extending from the board side and through the package board. The one or more damper devices are interposed between the upper stiffener and the lower stiffener and in contact with each of the upper stiffener and the lower stiffener.