A method for packaging a master-size ceramic copper clad board

Abstract

This invention relates to the field of packaging technology with release films, specifically to a packaging method for a master-size ceramic copper-clad substrate. The method includes the following steps: Step 1: The master-size ceramic copper-clad substrate is baked with nitrogen to obtain a pre-treated master-size ceramic copper-clad substrate, for later use; Step 2: (1) Several release films are cut to the same size as the pre-treated master-size ceramic copper-clad substrate, for later use; (2) Several pre-treated master-size ceramic copper-clad substrates are neatly stacked, with each substrate separated by the cut release film, to obtain an LOT substrate; (3) Support plates are placed on the top and bottom surfaces of the LOT substrate, and the release film is repeatedly wrapped around the substrate; (4) The product from step (3) is wrapped in a pearl cotton bag, and finally, it is placed in an aluminum foil bag along with a desiccant. After vacuum sealing, heat sealing, cooling, and inspection, it is placed in a cardboard box with shock-absorbing cotton and stored in the warehouse, completing the packaging.

Description

Technical Field

[0001] This invention relates to the field of packaging technology with release films, specifically a packaging method using a master-sized ceramic copper-clad substrate. Background Technology

[0002] With the continued rise in demand for power semiconductors, the demand for copper-clad ceramic substrates (CCLs) of various sizes is also increasing daily. Based on different shipping methods, they are generally divided into three types: master-size delivery, small-size delivery, and tray delivery. Considering factors such as later packaging efficiency, and given that copper-clad ceramic substrates used in power electronics, environmental protection, and white goods industries in Europe and America are mostly shipped in master-size form, manufacturers need not only a mature pre-cutting method but also a dedicated packaging method to ensure that products are not oxidized, scratched, or damaged during transportation and storage. This ensures that the ceramic substrate remains in its master-size state before production, guaranteeing normal production. After the ceramic substrate production process is completed, the master substrate can be smoothly slicing without risks such as oxidation, chipping, or breakage.

[0003] In most cases, electronic components such as chips are soldered onto the surface of the ceramic substrate before the master plate is slicing. If any abnormality occurs during slicing at this stage, the resulting losses can be incalculable, and it also increases the risk of ceramic cracking later, posing significant safety hazards. Furthermore, there is currently no universally accepted packaging method in the field of master plate slicing for copper-clad ceramic substrates. To ensure that customers experience no breakage before use and can smoothly slice the substrate after use, there is an urgent need to establish a packaging method that can effectively prevent product damage during transportation and handling.

[0004] In summary, the present invention provides a packaging method for a master-sized ceramic copper-clad substrate. Summary of the Invention

[0005] The purpose of this invention is to provide a packaging method for a master-size ceramic copper-clad substrate to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A method for packaging a master-size ceramic copper-clad substrate includes the following steps:

[0008] Step 1: Place the master-sized ceramic copper-clad substrate into an oven and bake it at 105-115℃ for 5-20 minutes with nitrogen. Then, cool it down to below 80℃ and remove it to obtain the pre-treated master-sized ceramic copper-clad substrate for later use.

[0009] Step 2: (1) Cut several sheets of release film to the same size as the pre-processed master ceramic copper-clad substrate, and set aside; (2) Stack several pre-processed master ceramic copper-clad substrates neatly, and separate each sheet with the cut release film to obtain the LOT substrate; (3) Place support plates on the top and bottom surfaces of the LOT substrate and wrap them repeatedly with release film; (4) Wrap the product in (3) with pearl cotton bag, and finally put it into an aluminum foil bag with desiccant. After vacuuming, heat sealing, cooling, and inspection, seal the box and put it into the warehouse to complete the packaging.

[0010] Furthermore, the preparation method of the separator film is as follows: modified polyethylene, polycarbonate, compatibilizer, antistatic agent and antioxidant are added into a single screw extruder, melt extrusion, casting and blow molding are performed to form a film, and then heat set and allowed to cool naturally to room temperature to obtain the separator film.

[0011] Furthermore, the raw materials of the separator membrane include the following components, by weight: 60-80 parts modified polyethylene, 10-20 parts polycarbonate, 5-10 parts compatibilizer, 0.3-2 parts antistatic agent, and 0.1-3 parts antioxidant.

[0012] Furthermore, the polycarbonate is an aromatic polycarbonate; in this invention, bisphenol A type polycarbonate is preferred, with a melt flow rate (300℃ / 1.2kg) of 10-12g / 10min and a molecular weight of 45000.

[0013] Furthermore, the compatibilizer includes, but is not limited to, one or more combinations of polyethylene maleic anhydride copolymer, polyethylene glycol polyethylene copolymer, and N-phenylmaleamide-styrene copolymer.

[0014] Furthermore, the parameters of the single-screw extruder are as follows: die temperature 170-190℃, screw speed 100-150 r / min, casting roll temperature 80-100℃, and draw ratio 70-120.

[0015] Furthermore, the heat setting temperature is 120–130°C, and the heat setting time is 30–90 minutes.

[0016] Furthermore, the thickness of the isolation membrane is 0.05–0.3 mm.

[0017] Further, the preparation method of the modified polyethylene is as follows: (1) Carbon fiber is placed in a 60-70 wt% nitric acid solution and soaked at 50-70°C for 3-6 hours. After filtration, washing and drying, pretreated carbon fiber is obtained; (2) The pretreated carbon fiber is dispersed in deionized water, the pH value is adjusted to 4-6, and then 3-(N-allylamino)propyltrimethoxysilane and condensing agent are added. The mixture is stirred and reacted at 5-15°C for 1-10 hours. After the reaction is completed, the mixture is filtered, washed and dried to obtain modified carbon fiber; (3) Low-density polyethylene is added to a single screw extruder and heated to 110-125°C. After it is completely melted, an initiator and modified carbon fiber are added. The temperature is then raised to 145-160°C and melt-blended at a speed of 100-150 r / min for 2-10 minutes. Finally, the mixture is extruded and granulated, and cooled to obtain modified polyethylene.

[0018] Furthermore, the mass ratio of the carbon fiber and the nitric acid solution is 1:(2-5).

[0019] Furthermore, the carbon fiber is chopped carbon fiber or powdered carbon fiber.

[0020] Furthermore, the mass ratio of the pretreated carbon fiber, 3-(N-allylamino)propyltrimethoxysilane, and condensing agent is (1-4):10:(0.1-0.2).

[0021] Furthermore, the condensing agent includes, but is not limited to, one or more combinations of dicyclohexylcarbodiimide, diisopropylcarbodiimide, and N,Nˋ-disuccinimidyl carbonate.

[0022] Furthermore, the mass ratio of the low-density polyethylene, initiator, and modified carbon fiber is 100:(1-2):(3-5).

[0023] Furthermore, the initiator includes, but is not limited to, any one of dicumyl peroxide, benzoyl peroxide, or 1,3-di-tert-butyl peroxide.

[0024] Considering that traditional separators can easily damage the surface of the master-sized ceramic copper-clad substrate, this invention utilizes carbon fiber, a material with excellent antistatic properties and the ability to improve the tensile properties of resin, to modify polyethylene resin and process it into a separator. In this invention, to enhance the compatibility of carbon fiber in the resin, the carbon fiber is first pretreated with nitric acid. Nitric acid immersion oxidizes the carbon fiber, effectively increasing the surface roughness and active functional groups, which is more conducive to subsequent grafting. However, the nitric acid immersion pretreatment time needs to be controlled within 3-6 hours. If the time is too short, the oxidation degree of the carbon fiber surface is insufficient, affecting subsequent grafting and compromising the dispersion of the carbon fiber. If the time is too long, the carbon fiber will be severely etched, greatly affecting its antistatic properties and tensile strength, causing the modified polyethylene to fail to meet the required performance, thus affecting the tensile strength and antistatic properties of the separator. In this scheme, the carboxyl groups of pretreated carbon fibers are further grafted with the imino groups of 3-(N-allylamino)propyltrimethoxysilane to synthesize modified carbon fibers. The resulting modified carbon fibers exhibit good compatibility with polyethylene resin and are less prone to aggregation in subsequent reactions. After grafting with low-density polyethylene, the modification effect on polyethylene is balanced. Simultaneously, to enhance the tensile strength and elongation of the separator, polycarbonate and a compatibilizer are added. Through blending modification, a separator with a tensile strength >2000 Psi and an elongation >300% is finally prepared. This separator possesses excellent tensile properties and antistatic properties. The antistatic property facilitates the sheeting of the master-size ceramic copper-clad substrate, while providing a certain degree of oxygen barrier, which can greatly protect the master-size ceramic copper-clad substrate.

[0025] Furthermore, the support plate is selected from RZ-1 type support plate or RZ-5 type support plate, with a thickness of 0.5 to 0.8 mm;

[0026] The component ratio parameters of the RZ-1 type support plate are as follows: epoxy resin dust 68%, glass fiber dust 25%, color masterbatch 2%, reinforcing agent 3%, and isotope agent 2%.

[0027] The component ratio parameters of the RZ-5 support plate are: 63% epoxy resin powder, 30% glass fiber powder, 1% color masterbatch, 4% reinforcing agent, and 2% isotope, all purchased from Suzhou Shuohaoran Electronic Technology Co., Ltd.

[0028] Furthermore, the operating environment humidity of the packaging method is <50%.

[0029] Furthermore, the sealing process involves sequentially placing vacuum-sealed aluminum foil bags containing the master-size ceramic copper-clad substrate into fixed 5-compartment packaging boxes or small corrugated cardboard boxes, with shock-absorbing cotton placed around the product; at the same time, for ease of packaging, the number of substrates in the cardboard box may be adjusted appropriately.

[0030] Furthermore, the storage requirements for master-size ceramic copper-clad substrates are as follows: (1) If there are special circumstances that prevent the master-size ceramic copper-clad substrates from being packaged on time, they must be stored in a nitrogen cabinet with humidity controlled at <40% and the maximum storage time in the nitrogen cabinet is 15 days; (2) The maximum storage time for master-size ceramic copper-clad substrates after vacuum packaging is 6 months; (3) Master-size ceramic copper-clad substrates after unpacking from vacuum packaging must be stored in a nitrogen cabinet and the maximum storage time is 1 month.

[0031] Compared with the prior art, the beneficial effects achieved by the present invention are: (1) In order to prevent the master-size ceramic copper-clad substrate from being oxidized by moisture in the later stage, nitrogen baking treatment is performed before packaging; (2) The master-size ceramic copper-clad substrate is separated by a release film, which is conducive to the separation of pieces and provides oxygen isolation. Special support plates are added to both ends and wrapped with release film. Then it is put into an aluminum foil bag and vacuum sealed, which can fix the master-size ceramic copper-clad substrate well, protect the master-size ceramic copper-clad substrate well, and prevent it from falling apart, while further preventing it from getting damp; (3) The packaged aluminum foil bag is put into a carton with shockproof cotton in sequence, which can effectively prevent the master-size ceramic copper-clad substrate from being bumped and damaged; (4) The storage method applicable to the master-size copper-clad substrate with this packaging method is determined, which is more conducive to its preservation. Attached Figure Description

[0032] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0033] Figure 1 The master-sized ceramic copper-clad substrate awaiting nitrogen baking;

[0034] Figure 2 Ceramic copper-clad substrate for master templates wrapped in pearl cotton bags;

[0035] Figure 3 Ceramic copper-clad substrate for master-size aluminum foil bag vacuum sealing;

[0036] Figure 4 The dimensions of the master template after packaging are for the ceramic copper-clad substrate;

[0037] Figure 5 The image shows the appearance of the isolation film prepared in Comparative Example 4 after rubbing a master-sized ceramic copper-clad substrate.

[0038] Figure 6 The image shows the appearance of the isolation membrane prepared in Example 3 after rubbing against a master-sized ceramic copper-clad substrate. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] In the following examples, all raw materials were sourced from the following sources: low-density polyethylene, type 2420K, part number: 236, melt flow rate 4 g / 10 min, density 0.924 g / cm³. 3 Purchased from Dongguan Suyu Chemical Co., Ltd.; Bisphenol A type polycarbonate melt flow rate (300℃ / 1.2kg): 10~12g / 10min, molecular weight: 45000, CAS No.: 25037-45-0, purchased from Merck; Polyethylene maleic anhydride copolymer purity 99%, CAS No.: 9006-26-2, Type 1010 antioxidant purity 99%, purchased from Hubei Yongkuo Technology Co., Ltd.; Short-cut carbon fiber purity 99%, diameter 7μm, length 6mm, carbon content ≥95%, purchased from Shanghai Koraman Reagent Co., Ltd.; 3-(N-allylamino)propyltrimethoxysilane purity 98%. The following materials were purchased from Hubei Hengjingrui Chemical Co., Ltd.: dicyclohexylcarbodiimide (99% purity) and dicumyl peroxide (99% purity) were purchased from Hubei Xinkang Pharmaceutical Chemical Co., Ltd.; QCS type antistatic agent (99% purity, item number: WD3360) was purchased from Hubei Wande Chemical Co., Ltd.; the component ratio parameters of RZ-1 type support plate were: epoxy resin dust 68%, glass fiber dust 25%, color masterbatch 2%, reinforcing agent 3%, and isotope 2%, and the component ratio parameters of RZ-5 type support plate were: epoxy resin dust 63%, glass fiber dust 30%, color masterbatch 1%, reinforcing agent 4%, and isotope 2%, all purchased from Suzhou Shuohaoran Electronic Technology Co., Ltd.

[0041] Preparation before the experiment: Selecting the support plate material:

[0042] 1. The parameters of the RZ-1 type support plate are shown in Tables 1 and 2 below:

[0043] Table 1

[0044]

[0045] Table 2

[0046]

[0047]

[0048] 2. The parameters of the RZ-5 type support plate are shown in Tables 3 and 4 below:

[0049] Table 3

[0050]

[0051] Table 4

[0052]

[0053] Comparing the parameters of the RZ-1 and RZ-5 support plates, it can be seen that the RZ-5 support plate has greater bending strength. Therefore, the RZ-5 support plate is preferred in this scheme.

[0054] Example 1: A packaging method for a master-size ceramic copper-clad substrate:

[0055] Step 1: After placing the master-size ceramic copper-clad substrate into the oven, nitrogen gas is introduced at a flow rate of 90L / min for 20 minutes to fill the oven with nitrogen. After baking in nitrogen at 110℃ for 10 minutes, the temperature is reduced to below 80℃ and the substrate is removed to obtain the pre-treated master-size ceramic copper-clad substrate for later use.

[0056] Step 2: Preparation of modified polyethylene: (1) 10 parts of short-cut carbon fiber were placed in 30 parts of 65wt% nitric acid solution and soaked at 60℃ for 4h. After filtration, washing and drying, pretreated carbon fiber was obtained; (2) 10 parts of pretreated carbon fiber were dispersed in 100 parts of deionized water, the pH value was adjusted to 5, and then 50 parts of 3-(N-allylamino)propyltrimethoxysilane and 0.6 parts of dicyclohexylcarbodiimide were added. The mixture was stirred at 5℃ for 5h and the reaction was stopped. After filtration, washing and drying, modified carbon fiber was obtained; (3) 100 parts of low-density polyethylene were added to a single screw extruder and heated to 120℃. After it was completely melted, 1.5 parts of dicumyl peroxide and 4 parts of modified carbon fiber were added. The temperature was then raised to 155℃ and melt-blended at 100r / min for 10min. Finally, the mixture was extruded and granulated, and cooled to obtain modified polyethylene.

[0057] Step 3: Preparation of the release film: 75 parts of modified polyethylene, 15 parts of bisphenol A type polycarbonate, 10 parts of polyethylene maleic anhydride copolymer, 1.5 parts of QCS type antistatic agent, and 2 parts of 1010 type antioxidant are added into a single screw extruder. The die temperature is set to 175℃, the screw speed to 100r / min, the casting roll temperature to 90℃, and the draw ratio to 100. The film is melt-extruded, cast, and blow-molded, and then heat-set at 125℃ for 60min. After it cools naturally to room temperature, a release film with a thickness of 0.2mm is obtained.

[0058] Step 4: Packaging: (1) Cut 9 sheets of release film to the same size as the pre-processed master ceramic copper-clad substrate and set aside; (2) Stack 10 pre-processed master ceramic copper-clad substrates neatly, separating each sheet with the cut release film to obtain the LOT substrate; (3) Place a 0.8mm thick RZ-5 type support plate on the top and bottom surfaces of the LOT substrate and wrap it repeatedly with 5 layers of release film; (4) Wrap the product in (3) with pearl cotton bag, and finally put it into an aluminum foil bag, place a desiccant, then evacuate for 15s, heat seal for 4s, cool for 5s, and finally check for air leakage. If there is no air leakage, put it into a cardboard box with shockproof cotton, put it into storage, and complete the packaging.

[0059] Example 2: Example 2 is based on Example 1, but with adjustments made to the amount of raw materials used in the separator; specifically:

[0060] Step 3: Preparation of the release film: 60 parts of modified polyethylene, 10 parts of bisphenol A type polycarbonate, 5 parts of polyethylene maleic anhydride copolymer, 1.5 parts of QCS type antistatic agent, and 2 parts of 1010 type antioxidant are added to a single screw extruder. The die temperature is set to 175℃, the screw speed to 100r / min, the casting roller temperature to 90℃, and the draw ratio to 100. The film is melt-extruded, cast, and blow-molded, and then heat-set at 125℃ for 60min. After naturally cooling to room temperature, a release film with a thickness of 0.2mm is obtained. Other processes remain unchanged.

[0061] Example 3: Example 3 is based on Example 1, but with adjustments made to the amount of raw materials used in the separator; specifically:

[0062] Step 3: Preparation of the release film: 80 parts of modified polyethylene, 20 parts of bisphenol A type polycarbonate, 10 parts of polyethylene maleic anhydride copolymer, 1.5 parts of QCS type antistatic agent, and 2 parts of 1010 type antioxidant are added to a single screw extruder. The die temperature is set to 175℃, the screw speed to 100r / min, the casting roller temperature to 90℃, and the draw ratio to 100. The film is melt-extruded, cast, and blow-molded, and then heat-set at 125℃ for 60min. After naturally cooling to room temperature, a release film with a thickness of 0.2mm is obtained. Other processes remain unchanged.

[0063] Comparative Example 1: Comparative Example 1 is based on Example 1, with the following adjustments: the master size ceramic copper-clad substrate is not subjected to nitrogen baking, while other processes remain unchanged.

[0064] Comparative Example 2: Comparative Example 2 is based on Example 1, with the following adjustment: the carbon fiber was soaked in 70wt% nitric acid for 10 hours during the preparation of modified polyethylene, while other processes remained unchanged; specifically:

[0065] Step 2: Preparation of modified polyethylene: (1) 10 parts of short-cut carbon fiber are placed in 50 parts of 70wt% nitric acid solution and soaked at 60℃ for 10h. After filtration, washing and drying, pretreated carbon fiber is obtained; (2) 10 parts of pretreated carbon fiber are dispersed in 100 parts of deionized water, the pH value is adjusted to 5, and then 50 parts of 3-(N-allylamino)propyltrimethoxysilane and 0.6 parts of dicyclohexylcarbodiimide are added. The mixture is stirred at 5℃ for 5h and the reaction is stopped. After filtration, washing and drying, modified carbon fiber is obtained; (3) 100 parts of low-density polyethylene are added to a single screw extruder and heated to 120℃. After it is completely melted, 1.5 parts of dicumyl peroxide and 4 parts of modified carbon fiber are added. The temperature is then raised to 155℃ and melt-blended at 100r / min for 10min. Finally, the mixture is extruded and granulated, cooled, and modified polyethylene is obtained.

[0066] Comparative Example 3: Comparative Example 3 is based on Example 1, with the following adjustments: bisphenol A type polycarbonate and polyethylene maleic anhydride copolymer are not added to the separator membrane component, while other processes remain unchanged; specifically:

[0067] Step 3: Preparation of the release film: 75 parts of modified polyethylene, 1.5 parts of QCS type antistatic agent, and 2 parts of 1010 type antioxidant are added to a single screw extruder. The die temperature is set to 175℃, the screw speed to 100r / min, the casting roller temperature to 90℃, and the draw ratio to 100. The film is melt-extruded, cast, and blow-molded. Then, it is heat-set at 125℃ for 60 minutes and allowed to cool naturally to room temperature to obtain a release film with a thickness of 0.2mm.

[0068] Comparative Example 4: Comparative Example 4 is based on Example 1, with the following adjustment: ordinary polyethylene separator film is used, while other processes remain unchanged.

[0069] Performance testing: The tensile strength and air permeability of the separators used in Examples 1-3 and Comparative Examples 1-4 were tested according to GB / T 1040.1-2018. The specific test results are shown in Table 5.

[0070] (1) The tensile properties of the separator were tested according to the standard GB / T 1040.1-2018;

[0071] (2) Test the air permeability of the separator membrane using a gas permeability tester;

[0072] Table 5

[0073]

[0074] As can be seen from the values ​​in Table 5 above, Example 3 has the best tensile strength and the lowest air permeability. Further impact tests and storage experiments were conducted on the vacuum-sealed master-size ceramic copper-clad substrate of Example 3, and the specific test results are shown in Table 6:

[0075] 1. Collision test: Drop test according to the method of one corner, three edges, and six faces, first drop the corner, then drop the three edges, and finally drop the six faces (drop height 1m);

[0076] 2. Storage experiment: (1) The vacuum-sealed master-size ceramic copper-clad substrate was placed in a warehouse at 25°C and 60% humidity for 6 months, and its performance was tested.

[0077] (2) The vacuum-sealed master-size ceramic copper-clad substrate was unsealed and placed in a nitrogen cabinet for one month. Its performance was then tested. The specific test results are shown in Table 6.

[0078] Table 6

[0079]

[0080] Results Analysis: As can be seen from Table 6 above, the packaging method for the master-size ceramic copper-clad substrate provided by this invention can still provide tight protection for the master-size ceramic copper-clad substrate after multiple impact tests; and combined with Figure 5 , Figure 6 As can be seen from the content, the isolation film provided in this invention has good antistatic properties, can play a good role in segmentation, and the isolation film is tight and has excellent oxygen barrier properties, which can effectively protect the ceramic copper-clad substrate of the master size for oxidation for a long time.

[0081] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0082] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A packaging method for a master-size ceramic copper-clad substrate, characterized in that: Includes the following steps: Step 1: Place the master-sized ceramic copper-clad substrate into an oven and bake it at 105-115℃ for 5-20 minutes with nitrogen. Then, cool it down to below 80℃ and remove it to obtain the pre-treated master-sized ceramic copper-clad substrate for later use. Step 2: (1) Cut several isolation films to the same size as the pre-processed master ceramic copper-clad substrate, and set aside; (2) Stack several pre-processed master ceramic copper-clad substrates neatly, and separate each one with the cut isolation film to obtain the LOT substrate. (3) Place support plates on the top and bottom surfaces of the LOT substrate and wrap them repeatedly with release film; (4) Wrap the product in (3) with pearl cotton bag, and finally put it into an aluminum foil bag with desiccant. After vacuuming, heat sealing, cooling, and inspection, seal the box and put it into the warehouse to complete the packaging. The method for preparing the separator film is as follows: modified polyethylene, polycarbonate, compatibilizer, antistatic agent, and antioxidant are added into a single-screw extruder, melt-extruded, cast, and blow-molded into a film, then heat-set, and allowed to cool naturally to room temperature to obtain the separator film; wherein, the raw materials of the separator film include the following components, by weight: 60-80 parts of modified polyethylene, 10-20 parts of polycarbonate, 5-10 parts of compatibilizer, 0.3-2 parts of antistatic agent, and 0.1-3 parts of antioxidant; The modified polyethylene is prepared as follows: (1) Carbon fiber is placed in a 60-70 wt% nitric acid solution and soaked at 50-70°C for 3-6 hours. After filtration, washing and drying, pretreated carbon fiber is obtained; (2) Pretreated carbon fiber is dispersed in deionized water, pH is adjusted to 4-6, and 3-(N-allylamino)propyltrimethoxysilane and condensing agent are added. The mixture is stirred at 5-15°C for 1-10 hours. After the reaction is completed, the mixture is filtered, washed and dried to obtain modified carbon fiber; (3) Low-density polyethylene is added to a single screw extruder and heated to 110-125°C. After it is completely melted, an initiator and modified carbon fiber are added. The temperature is then raised to 145-160°C and melt-blended at a speed of 100-150 r / min for 2-10 minutes. Finally, the mixture is extruded and granulated, and cooled to obtain modified polyethylene. The support plate is selected from RZ-1 type support plate or RZ-5 type support plate, with a thickness of 0.5-0.8mm; wherein, the component ratio parameters of RZ-1 type support plate are: epoxy resin dust 68%, glass fiber dust 25%, color masterbatch 2%, reinforcing agent 3%, and isotope agent 2%; the component ratio parameters of RZ-5 type support plate are: epoxy resin dust 63%, glass fiber dust 30%, color masterbatch 1%, reinforcing agent 4%, and isotope agent 2%.

2. The packaging method for a master-size ceramic copper-clad substrate according to claim 1, characterized in that: The mass ratio of the carbon fiber and nitric acid solution is 1:(2-5), wherein the carbon fiber is chopped carbon fiber or powdered carbon fiber; the mass ratio of the pretreated carbon fiber, 3-(N-allylamino)propyltrimethoxysilane, and condensing agent is (1-4):10:(0.1-0.2), wherein the condensing agent includes one or more combinations of dicyclohexylcarbodiimide, diisopropylcarbodiimide, and N,Nˋ-disuccinimidyl carbonate; the mass ratio of the low-density polyethylene, initiator, and modified carbon fiber is 100:(1-2):(3-5), wherein the initiator includes any one of dicumyl peroxide, benzoyl peroxide, or 1,3-di-tert-butyl peroxide.

3. The packaging method for a master-size ceramic copper-clad substrate according to claim 1, characterized in that: The parameters of the single-screw extruder are as follows: die temperature 170-190℃, screw speed 100-150 r / min, casting roll temperature 80-100℃, and draw ratio 70-120; the heat setting temperature is 120-130℃, and the heat setting time is 30-90 min; the thickness of the release liner is 0.05-0.3 mm.

4. The method of packaging a master-size ceramic CCL as claimed in claim 1, wherein: The polycarbonate is an aromatic polycarbonate; the compatibilizer includes one or more of the following: polyethylene maleic anhydride copolymer, polyethylene glycol polyethylene copolymer, and N-phenylmaleamide-styrene copolymer.

5. The method of packaging a master-size ceramic CCL according to claim 1, wherein: The operating environment humidity for the packaging method is <50%.

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