Radio frequency circuit, power control method and electronic device

Abstract

The present application discloses a radio frequency circuit, a power control method and an electronic device, which relate to the radio frequency field and are used to obtain accurate gain parameters of PA and LNA when a sub-board is replaced. The radio frequency circuit includes: a main board and a sub-board, the main board includes a baseband chip, an RFIC, a first memory, and a first connector; the sub-board includes a second connector, a PA, an LNA, a second memory, a coupler and a test socket; the baseband chip detects switching from electrical connection with the first sub-board to electrical connection with the second sub-board according to the identification of the first sub-board and the identification of the second sub-board; the output power is controlled according to the difference between the gain of the first transmission channel and the gain of the second transmission channel, or the difference between the first coupling degree and the second coupling degree; the antenna receiving power is obtained according to the difference between the gain of the first LNA and the gain of the second LNA.

Description

Technical Field

[0001] The present application relates to the field of radio frequency, and in particular to a radio frequency circuit, a power control method and an electronic device. Background Art

[0002] For distributed RF circuits, the power amplifier (PA) and low noise amplifier (LNA) are located on the sub-board, the baseband chip and radio frequency integrated circuit (RFIC) are located on the main board, and the gain parameters of PA and LNA are also stored on the main board. If the sub-board is damaged, both the main board and the sub-board need to be replaced at the same time, which results in high maintenance costs. If only the sub-board is replaced, the maintenance cost can be significantly reduced, but the gain parameters of PA and LNA will no longer be accurate, which will lead to inaccurate calculated transmit power and receive power. Summary of the invention

[0003] The embodiments of the present application provide a radio frequency circuit, a power control method and an electronic device, which are used to obtain accurate gain parameters of a PA and an LNA when a sub-board is replaced.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, a distributed radio frequency circuit is provided, comprising: a main board, and a first sub-board or a second sub-board electrically connected to the main board, the main board comprising a baseband chip, an RFIC, a first memory, and a first connector, the baseband chip is electrically connected to the RFIC, the baseband chip is electrically connected to the first connector and the first memory, and the RFIC is electrically connected to the first connector; the first sub-board or the second sub-board comprises a second connector, a second memory, and a test socket, the first sub-board or the second sub-board further comprises at least one of the following: a PA and a coupler, and an LNA; the second connector is electrically connected to the input end of the PA, the output end of the LNA, the coupled output end of the coupler, and the second memory, respectively, the output end of the PA is electrically connected to the input end of the coupler, the through output end of the coupler and the input end of the LNA are both electrically connected to the test socket, and the first connector is electrically connected to the second connector; the first memory stores the identification of the sub-board electrically connected to the main board, the transmission channel gain, the coupling degree, and the LNA gain; the second memory stores the identification of the sub-board, the transmission channel gain, the coupling degree, and the LNA gain Channel gain, coupling degree, LNA gain; the transmit channel gain refers to the difference between the power of the RF signal measured by the test socket and the power of the RF signal input by the PA, the coupling degree refers to the difference between the power of the RF signal measured by the test socket and the power of the RF signal measured by the coupled output end of the coupler, and the LNA gain refers to the difference between the power of the RF signal output by the LNA and the power of the RF signal measured by the test socket; the baseband chip is used to: detect that the main board is switched from being electrically connected to the first sub-board to being electrically connected to the second sub-board according to the identifier of the first sub-board stored in the first memory and the identifier of the second sub-board stored in the second memory; perform at least one of the following steps: control the output power of the RFIC according to the difference between the first transmit channel gain of the first sub-board and the second transmit channel gain of the second sub-board, or the difference between the first coupling degree of the first sub-board and the second coupling degree of the second sub-board; obtain the antenna receiving power according to the difference between the first LNA gain of the first sub-board and the second LNA gain of the second sub-board.

[0006] The distributed radio frequency circuit provided in the embodiment of the present application stores the identification of the electrically connected sub-board, PA gain parameters (transmitting channel gain, coupling degree), and LNA gain parameters (LNA gain) on the main board, and stores the identification of the sub-board, PA gain parameters (transmitting channel gain, coupling degree), and LNA gain parameters (LNA gain) on the sub-board. When the identification of the sub-board changes, it is detected that the main board switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board. By compensating the PA gain parameters before and after the replacement, accurate PA gain parameters are obtained, thereby accurately controlling the output power of the RFIC. By compensating the LNA gain parameters before and after the replacement, accurate LNA gain parameters are obtained, thereby obtaining accurate antenna receiving power. It is achieved that accurate PA and LNA gain parameters are obtained when the sub-board is replaced.

[0007] In a possible implementation, the baseband chip is used to: Under open-loop power control, the gear of the control word of the RFIC is determined according to the transmit power obtained by P+GA1-GA2, and the gear of the control word is used to control the output power of the RFIC, P is the target transmit power, GA1 is the first transmit channel gain, and GA2 is the second transmit channel gain. This implementation provides an implementation of how to control the output power of the RFIC, which is suitable for an open-loop power control scheme.

[0008] In a possible implementation, the baseband chip is used to: under closed-loop power control, update the power of the coupled signal fed back by the coupler according to CP1-CP2, the power of the coupled signal fed back by the coupler is used to control the output power of the RFIC, CP1 is the first coupling degree, and CP2 is the second coupling degree. This implementation provides another implementation of how to control the output power of the RFIC, which is suitable for a closed-loop power control solution.

[0009] In a possible implementation, the sub-board also includes an adjustable attenuator, and the coupling output end of the coupler is electrically connected to the second connector through the adjustable attenuator. The baseband chip is used to: under closed-loop power control, increase the attenuation value of the adjustable attenuator by CP1-CP2 to control the output power of the RFIC to remain unchanged when connected to the first sub-board, CP1 is the first coupling degree, and CP2 is the second coupling degree. This implementation provides another implementation of how to control the output power of the RFIC, which is suitable for a closed-loop power control scheme. The coupling degree before and after the sub-board is replaced remains unchanged, and the transmission power of the RFIC is controlled to remain unchanged, thereby making the target transmission power unchanged.

[0010] In a possible implementation, the baseband chip is used to: after detecting that the main board switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board, obtain the antenna received power according to the baseband chip received power-link gain+GL1-GL2, where GL1 is the first LNA gain and GL2 is the second LNA gain. This implementation provides an implementation for how to obtain the antenna received power.

[0011] In a second aspect, a power control method is provided, which is applied to the radio frequency circuit as described in the first aspect and any embodiment thereof, the method comprising: detecting that the main board switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board based on an identifier of the first sub-board stored in a first memory and an identifier of the second sub-board stored in a second memory; performing at least one of the following steps: controlling the output power of the radio frequency integrated circuit RFIC based on a difference between a first transmission channel gain of the first sub-board and a second transmission channel gain of the second sub-board, or a difference between a first coupling degree of the first sub-board and a second coupling degree of the second sub-board; and obtaining the antenna receiving power based on a difference between a first low noise amplifier LNA gain of the first sub-board and a second LNA gain of the second sub-board.

[0012] In a possible implementation, the output power of the radio frequency integrated circuit RFIC is controlled according to the difference between the first transmission channel gain of the first sub-board and the second transmission channel gain of the second sub-board, or the difference between the first coupling degree of the first sub-board and the second coupling degree of the second sub-board, including: under open-loop power control, the gear position of the control word of the RFIC is determined according to the transmission power obtained by P+GA1-GA2, the gear position of the control word is used to control the output power of the RFIC, P is the target transmission power, GA1 is the first transmission channel gain, and GA2 is the second transmission channel gain.

[0013] In a possible implementation, the output power of the radio frequency integrated circuit RFIC is controlled according to the difference between the first transmission channel gain of the first sub-board and the second transmission channel gain of the second sub-board, or the difference between the first coupling degree of the first sub-board and the second coupling degree of the second sub-board, including: under closed-loop power control, the power of the coupling signal fed back by the coupler is updated according to CP1-CP2, the power of the coupling signal fed back by the coupler is used to control the output power of the RFIC, CP1 is the first coupling degree, and CP2 is the second coupling degree.

[0014] In a possible implementation, the sub-board also includes an adjustable attenuator, and the coupled output end of the coupler is electrically connected to the second connector through the adjustable attenuator. According to the difference between the first transmission channel gain of the first sub-board and the second transmission channel gain of the second sub-board, or the difference between the first coupling degree of the first sub-board and the second coupling degree of the second sub-board, the output power of the radio frequency integrated circuit RFIC is controlled, including: under closed-loop power control, the attenuation value of the adjustable attenuator is increased by CP1-CP2 to control the output power of the RFIC to remain unchanged when connected to the first sub-board, CP1 is the first coupling degree, and CP2 is the second coupling degree.

[0015] In a possible implementation, after detecting that the main board switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board, the antenna receiving power is obtained according to the difference between the first low noise amplifier LNA gain of the first sub-board and the second LNA gain of the second sub-board, including: obtaining the antenna receiving power according to the baseband chip receiving power-link gain+GL1-GL2, where GL1 is the first LNA gain and GL2 is the second LNA gain.

[0016] In a third aspect, an electronic device is provided, comprising an antenna and a radio frequency circuit as described in the first aspect and any embodiment thereof, wherein the radio frequency circuit is used to output a radio frequency signal to the antenna, or to receive a radio frequency signal from the antenna.

[0017] In a fourth aspect, a computer-readable storage medium is provided, storing instructions, which, when executed on an electronic device, enable the electronic device to execute the method described in the second aspect and any embodiment thereof.

[0018] In a fifth aspect, a computer program product is provided, comprising instructions, which, when executed on the electronic device, cause the electronic device to execute the method as described in the second aspect and any embodiment thereof.

[0019] The technical effects of the second to fifth aspects refer to the technical effects of the first aspect and any of its embodiments, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the appearance of an electronic device provided in an embodiment of the present application;

[0021] Figure 2 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0022] Figure 3 A schematic diagram of the structure of a radio frequency circuit provided in an embodiment of the present application;

[0023] Figure 4 A schematic diagram of the structure of another radio frequency circuit provided in an embodiment of the present application;

[0024] Figure 5 A schematic diagram of a power control method provided in an embodiment of the present application;

[0025] Figure 6 A schematic diagram of the structure of another radio frequency circuit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0026] First, some concepts involved in this application are described.

[0027] The terms "first", "second", etc. involved in the embodiments of the present application are only used to distinguish features of the same type and cannot be understood as indicating relative importance, quantity, order, etc.

[0028] The terms "exemplary" or "for example" and the like in the embodiments of the present application are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the related concepts in a specific way.

[0029] The terms "coupling" and "electrical connection" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0030] Flexible printed circuit (FPC) is a kind of flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of light weight, thin thickness and good bending performance. Flexible circuit boards can be used for electrical connection between different circuit boards. Flexible circuit boards can be electrically connected to each other through board to board (BTB) connectors.

[0031] The electronic device provided in the embodiment of the present application can be mobile or fixed. The electronic device can be deployed on land (for example, indoors or outdoors, handheld or vehicle-mounted, etc.), on the water (for example, ships, etc.), or in the air (for example, airplanes, balloons, and satellites, etc.). The electronic device can be called user equipment (UE), access terminal, terminal unit, subscriber unit, terminal station, mobile station (MS), mobile station, terminal agent or terminal device, etc. For example, the electronic device can be a mobile phone, a tablet computer, a laptop computer, a smart bracelet, a smart screen, a smart watch, a headset, a smart speaker, a terminal in industrial control, a terminal in self-driving, a terminal in remote medical, a terminal in smart grid, a terminal in transportation safety, a terminal in smart city, a terminal in smart home, etc. The embodiment of the present application takes the electronic device as a folding screen mobile phone as an example for explanation, but the specific type and structure of the electronic device are not limited.

[0032] Figure 1 This is a schematic diagram of the appearance of a folding screen mobile phone provided in an embodiment of the present application. Figure 1 A in the middle is a front view of a foldable screen mobile phone. Figure 1 B in the figure is a schematic diagram of the back of a foldable screen mobile phone. The front of a foldable screen mobile phone refers to the plane where the largest display screen is located when it is unfolded, and the back of a foldable screen mobile phone refers to the plane opposite to the front. Figure 1As shown in A and B, the foldable screen mobile phone includes a first frame 101, a second frame 102 and a hinge 103. The hinge 103 is located between the second frame 102 and the first frame 101. The first frame 101 and the second frame 102 are hingedly connected by the hinge 103, so that the first frame 101 and the second frame 102 can be folded.

[0033] like Figure 1 As shown in Figure A, the folding screen mobile phone includes a first camera 104 and a first display screen 105, and the first camera 104 can be located on the second frame 102. Figure 1 As shown in Figure B, the folding screen mobile phone also includes a second camera 106, a third camera 107, and a second display screen 108. The third camera 107 can be located on the second frame 102, and the second camera 106 and the second display screen 108 can be located on the first frame 101.

[0034] Since the first display screen 105 occupies most of the front area of ​​the folding screen mobile phone, for example, the first display screen 105 occupies more than 90% of the front area of ​​the stacked screen mobile phone, that is, the screen ratio of the first display screen 105 is greater than 90%, so the first display screen 105 can also be called the main display screen (referred to as the main screen). The size of the second display screen 108 is smaller than the first display screen 105, so the second display screen 108 can also be called the secondary display screen (referred to as the secondary screen). Since the third camera 107 and the first display screen 105 are located on opposite sides of the folding screen mobile phone, when the user uses the folding screen mobile phone, when the first display screen 105 faces the user, the third camera 107 faces away from the user, so the third camera 107 can also be called a rear camera. Since the first camera 104 and the first display screen 105 are located on the same side of the foldable screen mobile phone, and the second camera 106 and the second display screen 108 are located on the same side of the foldable screen mobile phone, when the user uses the foldable screen mobile phone, when the first display screen 105 is facing the user, the first camera 104 is also facing the user; when the second display screen 108 is facing the user, the second camera 106 is also facing the user, so the first camera 104 and the second camera 106 can also be called front cameras.

[0035] When the foldable screen mobile phone is unfolded, the first display screen 105 can be used to display images and receive user touch operations, and the first camera 104 or the third camera 107 can be used to shoot images. When the foldable screen mobile phone is folded, the third camera 107 or the second camera 106 can be used to shoot images; the second display screen 108 can be used to display images and receive user touch operations.

[0036] It should be noted that the electronic device provided in the embodiments of the present application is not limited to Figure 1 The left and right double folding mobile phone shown can also be a top and bottom double folding mobile phone, a triple folding mobile phone, a non-folding mobile phone, etc., and the specific form is not limited.

[0037] like Figure 2 As shown, taking the electronic device 201 as a mobile phone as an example, at the hardware level, the electronic device 201 may include a processor 210, an external memory interface 220, an internal memory 221, a universal serial bus (USB) interface 230, a power management module 240, a battery 241, a wireless charging coil 242, an antenna 1, an antenna 2, a mobile communication module 250, a wireless communication module 260, an audio module 270, a speaker 270A, a receiver 270B, a microphone 270C, an earphone interface 270D, a sensor module 280, a button 290, a motor 291, an indicator 292, a camera 293, a display screen 294, and a subscriber identification module (SIM) card interface 295. Optionally, in some embodiments, an audio digital signal processor (ADSP) 243 is also included.

[0038] It is understood that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 201. In other embodiments of the present application, the electronic device 201 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0039] The processor 210 may include one or more processing units, for example, the processor 210 may be a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on chip (SoC), a central processing unit (CPU), an application processor (AP), a network processor (NP), a digital signal processor (DSP), a microcontroller unit (MCU), a programmable logic device (PLD), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a baseband processor, and a neural network processor (NPU). Among them, different processing units may be independent devices or integrated into one or more processors. For example, the processor 210 may be an application processor AP. Alternatively, the processor 210 may be integrated into a system on chip (SoC). Alternatively, the processor 210 may be integrated into an integrated circuit (IC) chip. The processor 210 may include an analog front end (AFE) and a micro-controller unit (MCU) in an IC chip.

[0040] ADSP 243 can be coupled with audio module 270 and sensor module 280, and ADSP 243 can be used to process audio signals and sensor data. When the processor is in a dormant state, ADSP 243 can still keep working, thereby reducing the power consumption of the electronic device.

[0041] It is understandable that the interface connection relationship between the modules illustrated in the embodiment of the present application is only a schematic illustration and does not constitute a structural limitation on the electronic device 201. In other embodiments of the present application, the electronic device 201 may also adopt different interface connection methods in the above embodiments, or a combination of multiple interface connection methods.

[0042] The external memory interface 220 can be used to connect an external memory card, such as a micro SanDisk (Micro SD) card, to expand the storage capacity of the electronic device 201. The external memory card communicates with the processor 210 through the external memory interface 220 to implement a data storage function. For example, files such as music and videos can be stored in the external memory card.

[0043] The internal memory 221 can be used to store computer executable program codes, which include computer instructions. The processor 210 executes various functional applications and data processing of the electronic device 201 by running the computer instructions stored in the internal memory 221, such as executing the method involved in the embodiment of the present application. In addition, the internal memory 221 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (UFS), etc.

[0044] The memory involved in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct RAM bus RAM (DR RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0045] The electronic device 201 can implement audio functions such as music playing and recording through the audio module 270, the speaker 270A, the receiver 270B, the microphone 270C, the headphone interface 270D and the application processor.

[0046] The audio module 270 is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signal. In some embodiments, the audio module 270 can be arranged in the processor 210, or some functional modules of the audio module 270 can be arranged in the processor 210. The speaker 270A, also known as the "speaker", is used to convert the audio electrical signal into a sound signal. The receiver 270B, also known as the "earpiece", is used to convert the audio electrical signal into a sound signal. The microphone 270C, also known as the "microphone" or "microphone", is used to convert the sound signal into an electrical signal. The electronic device 201 can be provided with at least one microphone 270C. The headphone interface 270D is used to connect a wired headset. The headphone interface 270D can be a USB interface 230, or it can be a 3.5mm open mobile terminal platform (OMTP) standard interface, or a cellular telecommunications industry association of the USA (CTIA) standard interface.

[0047] The button 290 includes a power button, a volume button, etc. The button 290 may be a mechanical button. It may also be a touch button. The electronic device 201 may receive a button input and generate a key signal input related to the user settings and function control of the electronic device 201. The motor 291 may generate a vibration prompt. The motor 291 may be used for an incoming call vibration prompt or for touch vibration feedback. The indicator 292 may be an indicator light, which may be used to indicate the charging status, power changes, messages, missed calls, notifications, etc. The SIM card interface 295 is used to connect a SIM card. The SIM card may be inserted into or removed from the SIM card interface 295 to achieve contact and separation with the electronic device 201. The electronic device 201 may support 1 or N SIM card interfaces, where N is a positive integer greater than 1. The SIM card interface 295 may support a Nano SIM card, a Micro SIM card, a SIM card, etc. In some embodiments, the electronic device 201 uses an embedded SIM (eSIM) card. The eSIM card can be embedded in the electronic device 201 and cannot be separated from the electronic device 201 .

[0048] The electronic device 201 can realize the display function through a GPU, a display screen 294, and an application processor. The GPU is a microprocessor for image processing, which connects the display screen 294 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 210 may include one or more GPUs, which execute computer instructions to generate or change display information.

[0049] The sensor module 280 may include a pressure sensor, a gyroscope or gravity sensor, an air pressure sensor, a magnetic field sensor, an acceleration sensor, a distance sensor, a structured light sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, and the like.

[0050] The battery 241 may include one or more batteries to power the load.

[0051] The power management module 240 is used to receive charging input from a charger. The charger may be a wireless charger, such as a wireless charging base, other electronic devices 201 with reverse wireless charging function, etc. The power management module 240 may receive wireless charging input through a wireless charging coil 242 of the electronic device. The charger may also be a wired charger, for example, the power management module 240 may receive charging input from a wired charger through a USB interface 230. The power management module 240 is also called a charging chip.

[0052] The power management module 240 can charge the battery 241 and also power the electronic device. The power management module 240 receives input from the battery 241 and powers the processor 210, the internal memory 221, the external memory interface 220, the display screen 294, the camera 293, and the wireless communication module 260. The power management module 240 can also be used to monitor the capacity, voltage, battery cycle number, battery health status (leakage, impedance) and other parameters of the battery 241. In some other embodiments, the power management module 240 can also be set in the processor 210.

[0053] The display screen 294 is used to display images, videos, etc. The display screen 294 includes a display panel. Figure 1 As shown in FIG. 1A , the plane where the display screen 294 of the electronic device 201 is located is called the front side. In some embodiments, the electronic device 201 may include one or more display screens 294 .

[0054] The camera 293 is used to capture static images or dynamic videos (collectively referred to as images). In some embodiments, the electronic device 201 may include 1 or N cameras 293, where N is a positive integer greater than 1. The camera 293 generally includes an optical lens and a photosensitive element. The photosensitive element may be any photosensitive device such as a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). In the process of capturing an image, the reflected light of the object being photographed is projected onto the photosensitive element after passing through the optical lens. The photosensitive element converts the received light signal into an electrical signal, which is sent to the processor 210 after being processed by the ISP. The processor 210 then obtains a frame of image. The camera 293 may include the following: Figure 1 The first camera 104 (front camera) shown in A and Figure 1 The second camera 106 and the third camera 107 (main camera) shown in B, the front camera refers to the camera 293 and the display screen 294 are located in the same plane of the electronic device 201, and the main camera refers to the camera 293 and the display screen 294 are located in different planes.

[0055] The processor 210 may also be provided with a memory for storing computer instructions and data. In some embodiments, the memory in the processor 210 is a cache memory. The memory may store computer instructions or data that the processor 210 has just used or circulated. If the processor 210 needs to use the computer instructions or data again, it may be directly called from the memory. This avoids repeated access, reduces the waiting time of the processor 210, and thus improves the efficiency of the system.

[0056] In some embodiments, the processor 210 may include one or more interfaces. The interface may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a USB interface, etc.

[0057] The wireless communication function of the electronic device 201 can be implemented through the antenna 1, the antenna 2, the mobile communication module 250, the wireless communication module 260, the modem processor, the baseband processor, and the like.

[0058] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 201 can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve the utilization of antennas. For example, antenna 1 can be reused as a diversity antenna for a wireless local area network. In some other embodiments, the antenna can be used in combination with a tuning switch.

[0059] The mobile communication module 250 (also called the radio frequency circuit) can provide solutions for wireless communications including 2G / 3G / 4G / 5G, etc., applied to the electronic device 201. The wireless communication module 260 can provide solutions for wireless communications including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), satellite communications (such as satellite data communications and satellite voice communications), frequency modulation (FM), near field communication technology (NFC), infrared technology (IR), etc., applied to the electronic device 201. For example, the wireless communication module 260 can include a satellite communication chip to achieve satellite communication. For another example, the antenna 1 of the electronic device 201 is coupled to the mobile communication module 250, and the antenna 2 is coupled to the wireless communication module 260, so that the electronic device 201 can communicate with the network and other devices through wireless communication technology.

[0060] like Figure 3 As shown, an embodiment of the present application provides a distributed radio frequency circuit, including a main board 31 and a sub-board 32. The main board 31 includes a baseband chip 311, a radio frequency integrated circuit (RFIC) 312, a first connector 313, and a first memory 314. The baseband chip 311 and the RFIC 312 can also be integrated in the SoC. The sub-board 32 includes a second connector 321, a power amplifier (PA) 322, a low noise amplifier (LNA) 323, a coupler 324, a test socket 325, and a second memory 326. The second connector 321 includes a connection terminal A, a connection terminal B, a connection terminal C, and a connection terminal D. The test socket 325 includes a connection terminal E. The first connector 313 includes a connection terminal G, a connection terminal H, a connection terminal J, and a connection terminal K.

[0061] The first memory 314 and the second memory 326 can be read-only memory (ROM) or flash memory, which can maintain data integrity when power is turned off. The first connector 313 and the second connector 321 can be BTB connectors, and the connecting line 33 can be an FPC. Alternatively, the first connector 313 and the second connector 321 can be cable sockets, and the connecting line 33 can be a radio frequency (RF) cable. The FPC is used to transmit data signals or control signals, such as data signals between the baseband chip 311 and the second memory 326, and the RF cable is used to transmit radio frequency signals. The first connector 313, the second connector 321, and the connecting line 33 can also be in other forms, which are not limited in the embodiments of the present application. The motherboard 31 can be located at Figure 1 In the first frame 101 of the left-right double-folding mobile phone shown, the sub-plate 32 can be located Figure 1 The second frame 102 of the left-right foldable dual-phone is shown. The main board 31 and the sub-board 32 can also be located in different frames of the upper and lower double-foldable mobile phone or the triple-foldable mobile phone, or in the same frame of the non-foldable mobile phone, which is not specifically limited.

[0062] For the mainboard 31 , the baseband chip 311 is electrically connected to the RFIC 312 , the first memory 314 , and the connection terminal G. The RFIC 312 is electrically connected to the connection terminals H, J, and K of the first connector 313 .

[0063] For the sub-board 32, the connection terminal A of the second connector 321 is electrically connected to the input terminal of the PA 322, and is used to output the radio frequency signal from the main board 31 to the PA 312. The connection terminal B is electrically connected to the coupling output terminal of the coupler 324, and is used to output the coupling signal from the coupler 324 to the main board 31. The connection terminal C is electrically connected to the output terminal of the LNA 323, and is used to output the radio frequency signal from the LNA 323 to the main board 31. The connection terminal D of the second connector 321 is electrically connected to the second memory 326. The output terminal of the PA 322 is electrically connected to the input terminal of the coupler 324, the through output terminal of the coupler 324 is electrically connected to the antenna 34 through the connection terminal E of the test socket 325, and the input terminal of the LNA 323 is electrically connected to the antenna 34 through the connection terminal E of the test socket 325. Optionally, the through output terminal of the coupler 324 and the input terminal of the LNA 323 can be electrically connected to the connection terminal E of the test socket 325 through a device such as a duplexer.

[0064] The first connector 313 is electrically connected to the second connector 321 through the connection line 33, so that the main board 31 is electrically connected to the sub-board through the connection line 33. Among them, the connection end G is electrically connected to the connection end D, the connection end H is electrically connected to the connection end C, the connection end J is electrically connected to the connection end A, and the connection end K is electrically connected to the connection end B.

[0065] The baseband chip 311 is used to transmit Figure 2 The processor 210 is used to convert the data of the processor 210 into a baseband signal, including modulation and demodulation, digital filtering, equalization processing, etc. of the baseband signal. The RFIC 312 is used to convert the baseband signal from the baseband chip 311 into a radio frequency signal, and send it to the PA 322 through the first connector 313, the connecting line 33 and the second connector 321. The PA 322 is used to amplify the transmitted radio frequency signal and transmit it through the antenna 34. The LNA 323 is used to amplify the radio frequency signal received from the antenna 34, and send it to the RFIC 312 through the second connector 321, the connecting line 33 and the first connector 313. The RFIC 312 converts the radio frequency signal into a baseband signal and sends it to the baseband chip 311. The baseband chip 311 converts the baseband signal into data and sends it to the processor 210. The coupler 324 is used to couple the RF signal output by the PA 322 to obtain a coupled signal, and output the coupled signal through the coupled output terminal. The power of the coupled signal is linearly related to the power of the RF signal output by the PA 322. For example, the power of the coupled signal = K* the power of the RF signal + b. The coupler 324 feeds back the coupled signal to the baseband chip 311 through the second connector 321, the connecting line 33 and the first connector 313, so that the baseband chip 311 indirectly obtains the power of the RF signal. The test socket 325 (or test socket) is used to test the transmitted or received RF signal. The power of the RF signal is the transmitted power or the received power.

[0066] In the prior art, for a distributed RF circuit, gain parameters of the PA 322 and the LNA 323 of the slave board are stored on the main board, and calibration of the gain parameters of the PA 322 and the LNA 323 of the slave board is completed when the main board and the slave board are electrically connected to form a whole.

[0067] For calibrating the gain parameters of PA 322 using an open-loop power control scheme, Figure 4 As shown, the coupling output end of the coupler 324 does not feed back the coupling signal. The output power of the baseband chip 311 is a constant value, traversing each gear of the RFIC 312 control word, and each gear of the control word is used to control the output power of the RFIC 312. The transmission power corresponding to the control word of each gear is detected by the test socket 325, that is, the mapping table between the control word and the transmission power can be obtained, as shown in Table 1 for example.

[0068] For example, if the transmission power needs to be 25 dBm, the control word of the RFIC 312 is set to 48. If the transmission power needs to be adjusted more finely, the transmission power of the baseband chip 311 is adjusted.

[0069] Table 1

[0070]

[0071] As shown in Table 2, for calibrating the gain parameters of the PA in a closed-loop manner, Figure 3 As shown, the coupler 324 feeds back the coupling signal. The output power of the baseband chip 311 is a constant value, and the control words of each gear of the RFIC 312 are traversed. The transmission power corresponding to the control word of each gear is detected by the test socket 325, and the power of the coupling signal fed back by the coupler 324 corresponding to the control word of each gear is detected, that is, a mapping table between the control word, the transmission power, and the power of the coupling signal can be obtained, as shown in Table 2 for example.

[0072] For example, if the transmission power needs to be 25dBm, the control word of RFIC 312 is adjusted so that the power of the coupled signal is maintained at 0dBm. If the transmission power needs to be adjusted more finely, the output power of the baseband chip 311 is adjusted. If the detection range of power coupling is limited (for example, the power is too small), the aforementioned open-loop power control scheme can be switched. Since the coupler fluctuates less with temperature and impedance, power control using a closed-loop method is more accurate.

[0073] Table 2

[0074]

[0075] As shown in Table 3, for calibration of the gain parameters of the LNA, the antenna receiving power can be obtained by subtracting the link gain from the baseband chip receiving power, where the link gain refers to the sum of the gain of the LNA 323 and the gain of the RFIC 312.

[0076] Table 3

[0077]

[0078] If the sub-board is damaged and needs to be repaired, both the main board and the sub-board need to be replaced at the same time, which results in high repair costs. If only the sub-board is replaced, the repair cost can be significantly reduced, but the gain parameters of the PA and LNA will no longer be accurate, which will lead to inaccurate calculated transmit power and receive power. Inaccurate transmit power will lead to increased power consumption or poor uplink communication quality, and inaccurate receive power will lead to inaccurate reporting of the reference signal receiving power (RSRP) of the received RF signal, which may deteriorate downlink communication quality.

[0079] To this end, the RF circuit, power control method and electronic device provided in the embodiments of the present application, and the distributed RF circuit provided in the embodiments of the present application, store the identification, PA gain parameters and LNA gain parameters of the electrically connected sub-board on the main board, and store the identification, PA gain parameters and LNA gain parameters of the sub-board on the sub-board. By changing the identification of the sub-board, it is detected that the main board switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board. By compensating the PA gain parameters before and after the replacement, accurate PA gain parameters are obtained, thereby accurately controlling the output power of the RFIC. By compensating the LNA gain parameters before and after the replacement, accurate LNA gain parameters are obtained, thereby obtaining accurate antenna received power. It is achieved that accurate PA and LNA gain parameters are obtained when the sub-board is replaced.

[0080] Specific, combined Figure 3 The RF circuit shown in Figure 5 As shown, the embodiment of the present application provides a power control method, including S101-S106, wherein the execution order of S104 and S105 can be interchanged, and at least one of S104 and S105 can be executed:

[0081] S101, configure the identifier of the first sub-board, the first transmission channel gain GA1, the first coupling degree CP1, and the first LNA gain GL1. Configure the identifier of the second sub-board, the second transmission channel gain GA2, the second coupling degree CP2, and the second LNA gain GL2.

[0082] In the embodiment of the present application, the main board 31 is first electrically connected to the first sub-board through the connecting wire 33. When the first sub-board is damaged and replaced with the second sub-board, the main board is electrically connected to the second sub-board through the connecting wire 33. That is, the second sub-board is a spare sub-board for replacing the first sub-board.

[0083] Before leaving the factory, the transmission channel gain GA, coupling degree CP, and LNA gain GL of the sub-board 32 can be measured, and the identification, transmission channel gain GA, coupling degree CP, and LNA gain GL of the sub-board 32 can be stored in the second memory 326 of the sub-board 32 (the first sub-board or the second sub-board). For example, the identification, first transmission channel gain GA1, first coupling degree CP1, and first LNA gain GL1 of the first sub-board are stored in the second memory 326 of the first sub-board, and the identification, second transmission channel gain GA2, second coupling degree CP2, and second LNA gain GL2 of the second sub-board are stored in the second memory 326 of the second sub-board. When the main board 31 is powered on, or periodically, the baseband chip 311 can obtain the identification, transmission channel gain GA, coupling degree CP, and LNA gain GL of the sub-board 32 from the second memory 326 in the sub-board 32 through the connection terminal G and the connection terminal D, and store them in the first memory 314.

[0084] For any sub-board 32 , the identifier of the sub-board 32 is unique and is used to distinguish different sub-boards.

[0085] The transmission channel gain GA refers to the difference between the power of the RF signal measured through the connection terminal E of the test socket 325 and the power of the RF signal input by the PA 322, that is, the difference between the power of the RF signal measured through the connection terminal E of the test socket 325 and the power of the RF signal input by the connection terminal A of the second connector 321.

[0086] The coupling degree CP refers to the difference between the power of the RF signal measured through the test socket 325 and the power of the RF signal fed back through the coupled output end of the coupler 324, that is, the difference between the power of the RF signal measured through the connection end E of the test socket 325 and the power of the RF signal measured through the connection end B of the second connector 321.

[0087] The LNA gain GL refers to the difference between the power of the RF signal output by the LNA 323 and the power of the RF signal measured by the test socket 325, that is, the difference between the power of the RF signal measured by the connection terminal C of the second connector 321 and the power of the RF signal measured by the connection terminal E of the test socket 325.

[0088] The measurement method of the transmission channel gain GA, coupling degree CP, and LNA gain GL of the sub-board 32 (the first sub-board or the second sub-board) is as follows:

[0089] For the first sub-board, it is assumed that before the first sub-board leaves the factory, the connection terminal A of the second connector 321 is electrically connected to the RF signal source, and the connection terminal E of the test socket 325 and the connection terminal B of the second connector 321 are electrically connected to the spectrum analyzer respectively. It is assumed that the power of the RF signal output by the RF signal source to the PA 312 through the connection terminal A of the second connector 321 is 0 dB, the power of the RF signal measured by the spectrum analyzer from the connection terminal E of the test socket 325 is 30 dB, and the power of the RF signal measured from the connection terminal B of the second connector 321 is 5 dB. Then the first transmission channel gain GA1 is equal to: the power of the RF signal measured by the spectrum analyzer from the connection terminal E of the test socket 325, minus the power of the RF signal output by the RF signal source to the PA 312 through the connection terminal A of the second connector 321, that is, the first transmission channel gain GA1 is 30-0=30 dB.

[0090] The first coupling degree CP1 is equal to: the power of the RF signal measured by the spectrum analyzer from the connection end E of the test socket 325 minus the power of the RF signal measured by the spectrum analyzer from the connection end B of the second connector 321 , that is, the first coupling degree CP1 is 30-5=25dB.

[0091] Connect the connection end C of the second connector 321 to the spectrum analyzer, and connect the connection end E of the test socket 325 to the RF signal source. Under the G0 gain level of LNA 323, assume that the power of the RF signal output by the RF signal source to LNA 323 through the connection end E of the test socket 325 is -60dBm, and the power of the RF signal measured by the spectrum analyzer from the connection end C of the second connector 321 is -42dB. Then the first LNA gain GL1 under the G0 gain level is equal to: the power of the RF signal measured by the spectrum analyzer from the connection end C of the second connector 321 minus the power of the RF signal output by the RF signal source to LNA 323 through the connection end E of the test socket 325, that is, the first LNA gain GL1 under the G0 gain level is -42+60=18dB. By analogy, by traversing each gain level of LNA 323, the column of the first LNA gain in the mapping table shown in Table 4 can be obtained based on Table 3.

[0092] Table 4

[0093]

[0094] For the second sub-board, it is assumed that before the second sub-board leaves the factory, the connection terminal A of the second connector 321 is electrically connected to the RF signal source, and the connection terminal E of the test socket 325 and the connection terminal B of the second connector 321 are electrically connected to the spectrum analyzer respectively. It is assumed that the power of the RF signal output by the RF signal source to the PA 312 through the connection terminal A of the second connector 321 is 0 dB, the power of the RF signal measured by the spectrum analyzer from the connection terminal E of the test socket 325 is 29 dB, and the power of the RF signal measured from the connection terminal B of the second connector 321 is 5 dB. Then the gain GA2 of the second transmitting channel is equal to: the power of the RF signal measured by the spectrum analyzer from the connection terminal E of the test socket 325, minus the power of the RF signal output by the RF signal source to the PA 312 through the connection terminal A of the second connector 321, that is, the gain GA2 of the second transmitting channel is 29-0=29 dB.

[0095] The second coupling degree CP2 is equal to: the power of the RF signal measured by the spectrum analyzer from the connection end E of the test socket 325 minus the power of the RF signal measured by the spectrum analyzer from the connection end B of the second connector 321, that is, the second coupling degree CP2 is 29-5=24dB.

[0096] Connect the connection end C of the second connector 321 to the spectrum analyzer, and connect the connection end E of the test socket 325 to the RF signal source. Under the G0 gain level of LNA 323, assume that the power of the RF signal output by the RF signal source to LNA 323 through the connection end E of the test socket 325 is -60 dB, and the power of the RF signal measured by the spectrum analyzer from the connection end C of the second connector 321 is -44 dB. Then the second LNA gain GL2 under the G0 gain level is equal to: the power of the RF signal measured by the spectrum analyzer from the connection end C of the second connector 321 minus the power of the RF signal output by the RF signal source to LNA 323 through the connection end E of the test socket 325, that is, the second LNA gain GL2 under the G0 gain level is -44+60=16 dB. By analogy, by traversing each gain level of LNA 323, the column of the second LNA gain in the mapping table shown in Table 4 can be obtained based on Table 3.

[0097] S102 . The baseband chip 311 obtains the identifier of the first sub-board, the first transmission channel gain GA1 , the first coupling degree CP1 , and the first LNA gain GL1 .

[0098] The main board 31 is first electrically connected to the first sub-board. In a possible implementation manner, the first memory 314 of the main board 31 pre-stores the identification of the first sub-board, the first transmission channel gain GA1, the first coupling degree CP1, and the first LNA gain GL1. The baseband chip 311 obtains the identification of the first sub-board, the first transmission channel gain GA1, the first coupling degree CP1, and the first LNA gain GL1 from the first memory 314.

[0099] In another possible implementation, the first memory 314 of the main board 31 does not store the identification of the first sub-board, the first transmission channel gain GA1, the first coupling degree CP1, and the first LNA gain GL1. After the main board 31 is powered on, or periodically, the baseband chip 311 obtains the identification of the first sub-board, the first transmission channel gain GA1, the first coupling degree CP1, and the first LNA gain GL1 from the second memory 326 of the first sub-board, and stores them in the first memory 314.

[0100] S103 , the baseband chip 311 detects that the main board 31 switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board based on the identifier of the first sub-board stored in the first memory 313 and the identifier of the second sub-board stored in the second memory 326 .

[0101] Each time the main board 31 is powered on, or periodically, the baseband chip 311 determines whether the sub-board 32 has been replaced due to maintenance or other reasons by comparing the identification of the sub-board 32 stored in the first memory 314 with the identification of the sub-board 32 stored in the second memory 326 to see if they are the same.

[0102] If the main board 31 is first electrically connected to the first sub-board through the connection line 33, the identification of the first sub-board is stored in the first memory 314 of the main board 31. The baseband chip 311 can obtain the identification of the first sub-board from the second memory 326 of the first sub-board through the connection terminal G and the connection terminal D. Since the identification of the first sub-board stored in the first memory 314 is the same as the identification of the first sub-board stored in the second memory 326 of the first sub-board, it is determined that the first sub-board has not been replaced.

[0103] If the first sub-board is damaged and replaced with the second sub-board, that is, the main board is electrically connected to the second sub-board through the connecting line 33, the identification of the first sub-board is stored in the first memory 314 of the main board 31. The baseband chip 311 can obtain the identification of the second sub-board from the second memory 326 of the second sub-board through the connecting terminal G and the connecting terminal D. Since the identification of the first sub-board stored in the first memory 314 is different from the identification of the second sub-board stored in the second memory 326 of the second sub-board, it is determined that the first sub-board has been replaced with the second sub-board.

[0104] S104, the baseband chip 311 controls the output power of the RFIC 312 according to the difference between the first transmission channel gain GA1 of the first sub-board and the second transmission channel gain GA2 of the second sub-board, or the difference between the first coupling degree CP1 of the first sub-board and the second coupling degree CP2 of the second sub-board.

[0105] The first transmission channel gain GA1 of the first sub-board and the first coupling degree CP1 of the first sub-board come from the first memory 314 of the main board 31 , and the second transmission channel gain GA2 of the second sub-board and the second coupling degree CP2 of the second sub-board come from the second memory 326 of the sub-board 32 .

[0106] Exemplarily, assume that the first transmission channel gain GA1 of the first sub-board is 30dB, the first coupling degree CP1 of the first sub-board is 25dB, the second transmission channel gain GA2 of the second sub-board is 29dB, and the second coupling degree CP2 of the second sub-board is 24dB.

[0107] Under open-loop power control, assuming the target transmit power P of the RF signal, the baseband chip 311 determines the gear of the closest control word of the RFIC 312 according to the transmit power obtained by P+GA1-GA2, thereby controlling the output power of the RFIC 312. Exemplarily, as shown in Table 1, assuming the target output power P is 25dBm, P+GA1-GA2=25+30-29=26dBm, the baseband chip 311 can determine that the control word gear corresponding to 26dBm is 50, so the output power of the RFIC 312 is controlled to be 26dBm according to the control word gear 50. If it is necessary to adjust the transmit power more finely, the output power of the baseband chip 311 is adjusted.

[0108] Under closed-loop power control, power control is more accurate. In one possible implementation, the baseband chip 311 updates the power of the coupled signal fed back by the coupler according to CP1-CP2, and the power of the coupled signal fed back by the coupler is used to control the output power of RFIC 312. Exemplarily, as shown in Table 2, assuming that CP1-CP2=25-24=1dB, the data in the power column of the coupled signal in Table 2 is added by 1 to obtain the updated power of the coupled signal. In this way, if the power of the coupled signal is 1dBm after replacing the second sub-board, the output power of RFIC 312 is controlled to be 25dBm according to the corresponding control word gear 48. If the transmit power needs to be adjusted more finely, the output power of the baseband chip 311 is adjusted.

[0109] For the closed-loop power control scheme, in another possible implementation, as Figure 6 As shown, the sub-board 32 may also include an adjustable attenuator 327, and the coupling output end of the coupler 324 is electrically connected to the connection end B of the second connector 321 through the adjustable attenuator 327. During calibration, the attenuation values ​​of the adjustable attenuators 327 of the first sub-board and the second sub-board are set to the default attenuation value (for example, 3dB). The baseband chip 311 increases the attenuation value of the adjustable attenuator 327 by CP1-CP2=25-24=1dB, that is, the attenuation value of the attenuator 327 becomes 4dB, so that the coupling degree (that is, the attenuation of the feedback power) before and after the replacement of the sub-board remains unchanged, and the transmission power of the RFIC 312 is controlled to remain unchanged, so that the target transmission power remains unchanged.

[0110] For example, for the first sub-board, the power of the RF signal measured by the spectrum analyzer from the connection end E of the test socket 325 is 30dBm, minus the power of the RF signal measured by the spectrum analyzer from the connection end B of the second connector 321 of 5dBm, then the first coupling degree CP1 is 30-5=25dB. For the second sub-board, the power of the RF signal measured by the spectrum analyzer from the connection end E of the test socket 325 is 29dBm, minus the power of the RF signal measured by the spectrum analyzer from the connection end B of the second connector 321 of 5dBm, then the second coupling degree CP2 is 29-5=24dB. If the attenuation value of the adjustable attenuator 327 is not increased by 1dB, when the main board is electrically connected to the second sub-board and works normally, the power of the RF signal at the connection end E is 30dBm. After 24dB attenuation, the power of the RF signal at the connection end B of the second connector 321 is actually 6dBm, which is 1dBm higher than the 5dBm at the first sub-board. This will cause the power of the coupled signal fed back to the baseband chip 311 to be 1dBm larger, and the baseband chip 311 will control the RFIC 312 to reduce the output power. Therefore, the attenuation value of the adjustable attenuator 327 is increased by 1dB, so that a total of 25dB of attenuation is generated, and the power of the RF signal at the connection end B of the second connector 321 is still 5dBm, that is, the same as the power of the coupled signal fed back by the first sub-board. The baseband chip 311 can control the RFIC 312 to keep the output power of the main board connected to the first sub-board unchanged. For example, as shown in Table 2, when the main board is connected to the first sub-board, the power of the coupling signal fed back by the first sub-board is 0dBm, the control word of RFIC 312 is 48, and the output power of RFIC312 is 25. When the main board is connected to the second sub-board, the attenuation value is increased by the adjustable attenuator 327, and the power of the coupling signal fed back by the second sub-board is still 0dBm, the control word of RFIC 312 is 48, and the output power of RFIC 312 is 25.

[0111] S105 . The baseband chip 311 obtains antenna receiving power according to the difference between the first LNA gain GL1 of the first sub-board and the second LNA gain GL2 of the second sub-board.

[0112] The first LNA gain GL1 of the first sub-board comes from the first memory 314 of the main board 31 , and the second LNA gain GL2 of the second sub-board comes from the second memory 326 of the sub-board 32 .

[0113] Assume that at the G0 gain level of LNA 323, the first LNA gain GL1 of the first sub-board is 18dB, and the second LNA gain GL2 of the second sub-board is 16dB (refer to the second LNA gain column in Table 4). It can be obtained that the antenna received power = baseband chip received power - link gain + GL1-GL2 = -35-50 + 18-16 = -83dBm. Other gain levels are similar and will not be repeated here.

[0114] S106 . The baseband chip 311 stores the difference in parameters before and after the sub-board is replaced in the first memory 314 .

[0115] For example, the baseband chip 311 stores the difference between the first transmission channel gain GA1 of the first sub-board and the second transmission channel gain GA2 of the second sub-board in the first memory 314, and stores the difference between the first LNA gain GL1 of the first sub-board and the second LNA gain GL2 of the second sub-board in the first memory 314. This allows the baseband chip 311 to quickly calculate the result the next time it executes S104 or S105.

[0116] The distributed radio frequency circuit, power control method and electronic device provided in the embodiments of the present application store the identification of the electrically connected sub-board, PA gain parameters (transmitting channel gain, coupling degree), and LNA gain parameters (LNA gain) on the main board, and store the identification of the sub-board, PA gain parameters (transmitting channel gain, coupling degree), and LNA gain parameters (LNA gain) on the sub-board. When the identification of the sub-board changes, it is detected that the main board switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board. By compensating the PA gain parameters before and after the replacement, accurate PA gain parameters are obtained, thereby accurately controlling the output power of the RFIC. By compensating the LNA gain parameters before and after the replacement, accurate LNA gain parameters are obtained, thereby obtaining accurate antenna receiving power. It is achieved that accurate PA and LNA gain parameters are obtained when the sub-board is replaced.

[0117] The present application also provides a computer-readable storage medium, which includes instructions. When the instructions are executed on the electronic device, the electronic device executes each step in the method embodiment, such as executing Figure 5 The method shown.

[0118] The present application also provides a computer program product including instructions. When the instructions are executed on the electronic device, the electronic device executes each step in the method embodiment, such as executing Figure 5 The method shown.

[0119] Regarding the technical effects of the computer-readable storage medium and the computer program product, refer to the technical effects of the previous method embodiments.

[0120] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and modules described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0121] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one device or distributed on multiple devices. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0122] In addition, each functional module in each embodiment of the present application may be integrated into one device, or each module may exist physically separately, or two or more modules may be integrated into one device.

[0123] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A radio frequency circuit, characterized in that: include: A main board, and a first sub-board or a second sub-board electrically connected to the main board, the main board comprising a baseband chip, a radio frequency integrated circuit RFIC, a first memory, and a first connector, the baseband chip is electrically connected to the RFIC, the baseband chip is electrically connected to the first connector and the first memory, and the RFIC is electrically connected to the first connector; the first sub-board or the second sub-board comprises an adjustable attenuator, a second connector, a second memory, and a test socket, the first sub-board or the second sub-board further comprises at least one of the following: a power amplifier PA and a coupler, a low noise amplifier LNA; the second connector is electrically connected to the input end of the PA, the output end of the LNA, and the second memory, respectively, the coupled output end of the coupler is electrically connected to the second connector through the adjustable attenuator, the output end of the PA is electrically connected to the The input end of the coupler is electrically connected, the through output end of the coupler and the input end of the LNA are both electrically connected to the test socket, and the first connector is electrically connected to the second connector; the first memory stores the identification of the sub-board electrically connected to the main board, the transmission channel gain, the coupling degree, and the LNA gain; the second memory stores the identification of the sub-board, the transmission channel gain, the coupling degree, and the LNA gain; the transmission channel gain refers to the difference between the power of the RF signal measured by the test socket and the power of the RF signal input by the PA, the coupling degree refers to the difference between the power of the RF signal measured by the test socket and the power of the RF signal measured by the coupling output end of the coupler, and the LNA gain refers to the difference between the power of the RF signal output by the LNA and the power of the RF signal measured by the test socket; the baseband chip is used for: According to the identification of the first sub-board stored in the first memory and the identification of the second sub-board stored in the second memory, detecting that the main board switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board; Do at least one of the following steps: The output power of the RFIC is controlled according to the difference between the first transmission channel gain of the first sub-board and the second transmission channel gain of the second sub-board, or the difference between the first coupling degree of the first sub-board and the second coupling degree of the second sub-board; wherein, under closed-loop power control, the attenuation value of the adjustable attenuator of the second sub-board is increased by CP1-CP2 to control the output power of the RFIC to remain unchanged when connected to the first sub-board, CP1 is the first coupling degree, and CP2 is the second coupling degree; The antenna receiving power is obtained according to the difference between the first LNA gain of the first sub-board and the second LNA gain of the second sub-board.

2. The circuit according to claim 1, characterized in that The baseband chip is used for: Under open-loop power control, the gear position of the control word of the RFIC is determined according to the transmission power obtained by P+GA1-GA2. The gear position of the control word is used to control the output power of the RFIC. P is the target transmission power, GA1 is the first transmission channel gain, and GA2 is the second transmission channel gain.

3. The circuit according to claim 1, characterized in that The baseband chip is used for: Under closed-loop power control, the power of the coupling signal fed back by the coupler is updated according to CP1-CP2. The power of the coupling signal is used to control the output power of the RFIC. CP1 is the first coupling degree, and CP2 is the second coupling degree.

4. The circuit according to any one of claims 1 to 3, characterized in that: The baseband chip is used for: After detecting that the mainboard switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board, the antenna receiving power is obtained according to the baseband chip receiving power-link gain+GL1-GL2, where GL1 is the first LNA gain and GL2 is the second LNA gain.

5. A power control method, characterized in that: Applied to the radio frequency circuit according to any one of claims 1 to 4, the method comprises: According to the identification of the first sub-board stored in the first memory and the identification of the second sub-board stored in the second memory, detecting that the main board switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board; performing at least one of the following steps: According to the difference between the first transmission channel gain of the first sub-board and the second transmission channel gain of the second sub-board, or the difference between the first coupling degree of the first sub-board and the second coupling degree of the second sub-board, the output power of the radio frequency integrated circuit RFIC is controlled; wherein, under the closed-loop power control, the attenuation value of the adjustable attenuator of the second sub-board is increased by CP1-CP2 to control the output power of the RFIC in the main board to remain unchanged when connected to the first sub-board, CP1 is the first coupling degree, and CP2 is the second coupling degree; The antenna receiving power is obtained according to the difference between the first low noise amplifier LNA gain of the first sub-board and the second LNA gain of the second sub-board.

6. The method according to claim 5, characterized in that The controlling the output power of the radio frequency integrated circuit RFIC according to the difference between the first transmission channel gain of the first sub-board and the second transmission channel gain of the second sub-board, or the difference between the first coupling degree of the first sub-board and the second coupling degree of the second sub-board, comprises: Under open-loop power control, the gear position of the control word of the RFIC is determined according to the transmission power obtained by P+GA1-GA2. The gear position of the control word is used to control the output power of the RFIC. P is the target transmission power, GA1 is the first transmission channel gain, and GA2 is the second transmission channel gain.

7. The method according to claim 5, characterized in that The controlling the output power of the radio frequency integrated circuit RFIC according to the difference between the first transmission channel gain of the first sub-board and the second transmission channel gain of the second sub-board, or the difference between the first coupling degree of the first sub-board and the second coupling degree of the second sub-board, comprises: Under closed-loop power control, the power of the coupling signal fed back by the coupler is updated according to CP1-CP2. The power of the coupling signal is used to control the output power of the RFIC. CP1 is the first coupling degree, and CP2 is the second coupling degree.

8. The method according to any one of claims 5 to 7, characterized in that: The obtaining antenna receiving power according to the difference between the first low noise amplifier LNA gain of the first sub-board and the second LNA gain of the second sub-board includes: After detecting that the mainboard switches from being electrically connected to the first sub-board to being electrically connected to the second sub-board, the antenna receiving power is obtained according to the baseband chip receiving power-link gain+GL1-GL2, where GL1 is the first LNA gain and GL2 is the second LNA gain.

9. An electronic device, characterized in that: It comprises an antenna and a radio frequency circuit as described in any one of claims 1 to 4, wherein the radio frequency circuit is used to output a radio frequency signal to the antenna or receive a radio frequency signal from the antenna.

10. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on an electronic device, the electronic device executes the method according to any one of claims 5 to 8.

11. A computer program product, characterized in that The method comprises instructions which, when executed on an electronic device, cause the electronic device to execute the method as described in any one of claims 5 to 8.

Images