A lamination device for manufacturing integrated circuit chips

By designing a film pressing device for integrated circuit chip manufacturing, including a transportation mechanism, a flip mechanism and a film pressing mechanism, the problem that the prior art cannot simultaneously press multiple surfaces and ensure the consistent position of the chip and film is achieved, and efficient double-sided film pressing and good coating effect are achieved.

CN118866785BActive Publication Date: 2025-03-28HEFEI JINGYAOCHENG INFORMATION TECHNOLOGY CO LTD
3 Cites 0 Cited by

Patent Information

Application Number
CN202410930205.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-07-11
Publication Date
2025-03-28
Estimated Expiration
2044-07-11

AI Technical Summary

Technical Problem

The prior art cannot simultaneously perform film compression processing on multiple surfaces of an integrated circuit chip, and cannot ensure that the chip and film are in a consistent position when coating, resulting in low processing efficiency and poor coating effect.

Method used

A film pressing device for integrated circuit chip manufacturing is designed, including a transportation mechanism, a flip mechanism and a film pressing mechanism. The transport mechanism and the flip mechanism cooperate with each other to flip the chip during the chip transportation process, and keep the chip suspended through multiple sets of flip rods to buffer the chip after the film is pressed. The film pressing mechanism uses a film pressing roller that presses back and forth, and controls the downward pressure distance of the film pressing roller by adjusting the cam length to ensure that the chip remains in the center state.

Benefits of technology

The film compression treatment of both sides of the chip is achieved, which improves the processing efficiency and coating effect. At the same time, the yield and film compression effect of the device are ensured through suspended buffering and centralized maintenance.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The present invention discloses a laminating device for integrated circuit chip manufacturing, and specifically relates to the technical field of laminating devices, including a box base, a hydraulic valve is fixedly installed at the rear end of the box base, and laminating mechanisms for laminating chips are provided on both sides of the box base, a transport mechanism for transporting chips is provided on the upper side of the box base, and a flip mechanism for flipping chips is provided in the middle of the upper side of the box base. The laminating device for integrated circuit chip manufacturing described in the present invention can transport and flip chips, so that the device can perform laminating treatment on two surfaces during the transportation of chips. Multiple groups of flip rods can be set to keep the chip suspended for a period of time, so that the chip after laminating can be buffered, which can not only ensure the laminating effect of the device, but also effectively improve the processing efficiency of the device. When the chip is suspended, it will contact the inclined surface and the rubber ring to ensure that it will not be worn or fall off.
Need to check novelty before this filing date? Find Prior Art