A method for manufacturing an LED display device and the LED display device itself.

Abstract

This application relates to a method for manufacturing an LED display device and the LED display device itself. The method for manufacturing the LED display device includes the following steps: etching a conductive metal layer into multiple independent sets of conductive pins within a first mold using a grid-like second mold; forming metal lines on each set of conductive pins, with the metal lines on different sets of conductive pins being independent of each other; and transferring a light-emitting chip to the metal lines. This application utilizes the separating effect of the grid-like second mold to allow for the formation of individual LED display devices within the first mold, eliminating the need for cutting after formation; and directly forming metal lines on the conductive pins to electrically connect the light-emitting chip and the conductive pins, eliminating the need for drilling and setting metal guide pillars to achieve electrical connection between the light-emitting chip and the pins. This simplifies the circuit fabrication process within the package and solves the technical problems of complex and costly LED device manufacturing processes in related technologies.

Description

Technical Field

[0001] This application relates to the field of semiconductor lighting technology, specifically to a method for manufacturing an LED display device and the LED display device itself. Background Technology

[0002] As is well known, LED devices have advantages such as high brightness, high contrast, high color gamut, long life, strong impact resistance, and high reliability, and are widely used in high-definition display fields such as high-end rental, vehicle display, live cinema broadcasting, and virtual shooting.

[0003] As the LED display market continues to develop, people's requirements for LED displays are becoming increasingly stringent, especially for small-pitch module panels where high display quality is required. This also means that the package size of LED display devices is getting smaller and smaller, which places extremely high demands on the transfer of micro-pitch LED chips, the fabrication of conductive lines, the reliability of packaged device soldering, and the cutting of finished devices.

[0004] In related technologies, conventional LED devices typically have pins on the back of the substrate and metal lines on the front. Electrical connections between the metal lines on the front and the pins on the back are achieved by drilling holes in the substrate. Multiple LED devices are manufactured at once and then cut into individual LED devices. However, this manufacturing method requires drilling holes, placing metal guide posts in the holes, and finally cutting, resulting in a complex and costly LED device manufacturing process.

[0005] Therefore, it is necessary to design a new method for manufacturing LED display devices to overcome the above problems. Summary of the Invention

[0006] This application provides a method for manufacturing an LED display device and an LED display device, which can solve the technical problems of complex manufacturing process and high cost of LED devices in related technologies.

[0007] In a first aspect, embodiments of this application provide a method for manufacturing an LED display device, which includes the following steps:

[0008] Within the first mold, a grid-like second mold is used to etch the conductive metal layer into multiple sets of independent conductive pins.

[0009] Metal lines are formed on each group of conductive pins, and the metal lines on the conductive pins of different groups are independent of each other;

[0010] The light-emitting chip is transferred to the metal circuit.

[0011] In conjunction with the first aspect, in one embodiment, the etching of a conductive metal layer into multiple independent sets of conductive pins within a first mold using a mesh-like second mold includes:

[0012] A grid-like second mold is placed on a conductive metal layer inside the first mold;

[0013] The conductive metal layer is etched using exposure, development, and etching methods to obtain multiple sets of conductive pins that correspond one-to-one with the grids of the second mold; wherein, one grid corresponds to one set of conductive pins.

[0014] In conjunction with the first aspect, in one embodiment, the first mold has a conductive bottom wall; the etching of a conductive metal layer into multiple independent sets of conductive pins within the first mold using a mesh-like second mold includes:

[0015] An electrolyte is filled into the first mold, and an electric current is applied to the conductive bottom wall to form a conductive metal layer on the conductive bottom wall.

[0016] In conjunction with the first aspect, in one embodiment, before forming metal lines on each group of said conductive pins, and before the metal lines on different groups of said conductive pins are independent of each other, the method further includes:

[0017] An insulating adhesive is applied between the plurality of conductive pins corresponding to each grid of the second mold, such that the insulating adhesive connects the plurality of conductive pins in each group of conductive pins.

[0018] In conjunction with the first aspect, in one embodiment, forming metal lines on each group of the conductive pins includes:

[0019] A metal circuit layer is deposited on each set of the conductive pins and the insulating adhesive;

[0020] The metal lines are etched onto the metal line layer in each grid of the second mold using exposure, development, and etching methods.

[0021] In conjunction with the first aspect, in one embodiment, depositing a metal circuit layer on each set of the conductive pins and the insulating adhesive includes:

[0022] Chemically deposit metal onto each set of conductive pins and insulating adhesive to deposit a first layer of metal onto each set of conductive pins and insulating adhesive;

[0023] Electroplating deposited metal on the first metal layer to deposit a second metal layer on the first metal layer, forming the metal circuit layer.

[0024] In conjunction with the first aspect, in one embodiment, transferring the light-emitting chip to the metal circuitry to form an independent LED display device in each grid of the second mold includes:

[0025] Inject encapsulating adhesive into the first mold, so that the encapsulating adhesive fills each grid of the second mold;

[0026] The encapsulating adhesive is pressed onto the upper surface of the second mold using a cover plate, so that an independent LED display device is formed in each grid of the second mold.

[0027] In conjunction with the first aspect, in one embodiment, an overflow port is formed between the cover plate and the first mold.

[0028] In conjunction with the first aspect, in one embodiment, the second mold includes a plurality of templates arranged in a crisscross pattern, the plurality of templates being spliced ​​together to form a plurality of grids distributed in an array; each template has a cutout on its bottom surface corresponding to each grid, the cutouts connecting two adjacent grids; an isolation groove is provided at the intersection of the plurality of templates to separate two adjacent grids, the isolation groove penetrating the bottom surface of the template.

[0029] In conjunction with the first aspect, in one embodiment, each template has a through groove between two adjacent grids, the through groove penetrating the top and bottom surfaces of the template, so that two parallel sub-templates are formed between two adjacent grids; the bottom surface of each sub-template is provided with the hollow, and an extension plate is formed on both sides of each hollow, the extension plate is in contact with the surface of the conductive metal layer, and the hollow is connected to the through groove.

[0030] Secondly, embodiments of this application provide an LED display device manufactured using the above-described manufacturing method, comprising: conductive pins; a metal circuit, wherein the metal circuit is electrically connected to the conductive pins, and a light-emitting chip is electrically connected to the metal circuit.

[0031] The beneficial effects of the technical solutions provided in this application include:

[0032] The grid-like second mold separates individual LED display devices within the first mold, eliminating the need for cutting after molding. Furthermore, metal circuits are directly formed on the conductive pins to electrically connect the light-emitting chip and the conductive pins, eliminating the need for drilling and setting metal guide pillars to achieve electrical connection between the light-emitting chip and the pins. This simplifies the circuit fabrication process within the package and solves the technical problems of complex and costly LED device manufacturing processes in related technologies. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A flowchart illustrating a method for manufacturing an LED display device according to an embodiment of this application;

[0035] Figure 2 A cross-sectional view of an LED display device provided in an embodiment of this application;

[0036] Figure 3 This is a top view schematic diagram of an LED display device provided in an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the structure in which a conductive metal layer is formed in the first mold, as provided in an embodiment of this application.

[0038] Figure 5 A top view of the first mold provided in an embodiment of this application;

[0039] Figure 6 This is a structural schematic diagram of step S11 provided in an embodiment of this application;

[0040] Figure 7 for Figure 6 Schematic diagram of the cross section of AA;

[0041] Figure 8 This is a front view schematic diagram of the second mold being placed in the first mold according to an embodiment of this application;

[0042] Figure 9 for Figure 8 Cross-sectional view of BB;

[0043] Figure 10 This is a schematic diagram of step S121 provided in an embodiment of this application;

[0044] Figure 11 for Figure 10 Schematic diagram of the structure after processing steps S122 to S124;

[0045] Figure 12 This is a structural schematic diagram of step S21 provided in an embodiment of this application;

[0046] Figure 13 This is a side view diagram of the application provided in an embodiment of the present application after the application of insulating adhesive;

[0047] Figure 14This is a schematic diagram of step S221 provided in an embodiment of this application;

[0048] Figure 15 This is a structural diagram of step S222 provided in an embodiment of this application;

[0049] Figure 16 for Figure 15 A top-down view;

[0050] Figure 17 This is a schematic diagram of the structure for transferring a light-emitting chip to a metal circuit according to an embodiment of this application;

[0051] Figure 18 for Figure 17 A top-down view;

[0052] Figure 19 This is a schematic diagram of the structure for injecting encapsulating adhesive into a first mold, as provided in an embodiment of this application.

[0053] In the picture:

[0054] 1. First mold; 11. Conductive bottom wall;

[0055] 2. Second mold; 21. Template; 211. Sub-template; 2111. Hollowing out; 2112. Extension plate;

[0056] 212, Isolation groove; 2121, Separation groove; 2122, Connecting groove; 213, Through groove; 22, Grid;

[0057] 3. Conductive metal layer; 4. Metal circuit layer; 5. Cover plate; 6. Glue overflow port; 7. Protective film;

[0058] 100. LED display device; 101. Conductive pin; 102. Metal circuit; 103. Light-emitting chip;

[0059] 104. Insulating adhesive; 105. Encapsulating adhesive. Detailed Implementation

[0060] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0061] This application provides a method for manufacturing an LED display device and an LED display device, which can solve the technical problems of complex manufacturing process and high cost of LED devices in related technologies.

[0062] See Figure 1 As shown, this application provides a method for manufacturing an LED display device 100, which may include the following steps:

[0063] S1: Within the first mold 1, a grid-shaped second mold 2 is used to etch the conductive metal layer 3 into multiple independent sets of conductive pins 101. In this embodiment, it is preferable to place the grid-shaped second mold 2 above the conductive metal layer 3. After etching, a set of conductive pins 101 is formed below each grid 22, and the conductive pins 101 under different grids 22 are spaced apart from each other, that is, there is a gap between two adjacent sets of conductive pins 101, so that the multiple sets of conductive pins 101 are not interconnected.

[0064] S2: A metal line 102 is formed on each group of conductive pins 101, and the metal lines 102 on different groups of conductive pins 101 are independent of each other. In this step, the required metal line 102 is formed on a group of conductive pins 101 in each grid 22, and the metal line 102 is in direct contact with the conductive pin 101 to realize the electrical connection between the metal line 102 and the conductive pin 101.

[0065] S3: Transfer the light-emitting chip 103 to the metal line 102 so that an independent LED display device 100 is formed in each grid 22.

[0066] In this embodiment, each LED display device 100 manufactured using the above method includes a set of conductive pins 101. Each set of conductive pins 101 includes multiple conductive pins 101. For example, this embodiment uses a set of conductive pins 101 with four conductive pins 101 as an example. Adjacent sets of conductive pins 101 are independent of each other, and the four conductive pins 101 in each set are also independent of each other. Of course, in other embodiments, other numbers of conductive pins 101 can be provided according to the needs of each LED display device 100, and this is not limited here. The first mold 1 in this embodiment has a groove, and the conductive metal layer 3 and the second mold 2 are both placed in the groove, where the LED display device 100 is manufactured.

[0067] In this embodiment, multiple sets of independent conductive pins 101 can be formed within the first mold 1 using a grid-like second mold 2. Subsequent metal lines 102 are formed in each grid 22. The metal lines 102 in different grids 22 are separated from each other by the second mold 2, and the metal lines 102 in each grid 22 are electrically connected to a set of conductive pins 101 below that grid 22. Under the separation effect of the grid-like second mold 2, individual LED display devices 100 are finally formed. After forming, it is not necessary to cut to form individual LED display devices 100. Furthermore, metal lines 102 are directly formed on the conductive pins 101 to electrically connect the light-emitting chip 103 and the conductive pins 101. It is not necessary to use drilling and setting metal guide pillars to achieve electrical connection between the light-emitting chip 103 and the pins, which simplifies the circuit manufacturing process in the package and solves the technical problems of complex manufacturing process and high cost of LED devices in related technologies.

[0068] Further, see Figure 6 As shown, in one embodiment, the etching of the conductive metal layer 3 into multiple independent sets of conductive pins 101 using a mesh-like second mold 2 within the first mold 1 may include:

[0069] S11: Place a grid-like second mold 2 on the conductive metal layer 3 inside the first mold 1. Figure 7 (As shown). That is, in this step, before the second mold 2 is placed, the first mold 1 already contains a conductive metal layer 3 (as shown). Figure 5 (As shown).

[0070] S12: The conductive metal layer 3 is etched by exposure, development and etching to obtain multiple sets of conductive pins 101 that correspond one-to-one with the grids 22 of the second mold 2; wherein, one grid 22 corresponds to one set of conductive pins 101.

[0071] In this embodiment, the material of the mesh-shaped second mold 2 is preferably a high-temperature resistant and insulating material, and the conductive metal layer 3 is preferably a copper layer; after the mesh-shaped second mold 2 is placed on the conductive metal layer 3, the second mold 2 is tightly attached to the conductive metal layer 3. Then, etching is performed through the following steps:

[0072] S121: Coating: A protective film 7 is applied to the conductive metal layer 3 by hot pressing or coating, such as a dry film or a wet film (see...). Figure 10 (As shown).

[0073] S122: Exposure: Align the film with the required circuit diagram with the substrate with the pressed dry or wet film, and use ultraviolet light to transfer the film pattern onto the photosensitive dry or wet film on the exposure machine.

[0074] S123: Development: Using the weak alkalinity of a developer (e.g., sodium carbonate), the unexposed dry / wet film is dissolved and washed away, while the exposed portion is retained.

[0075] S124: Etching: After the unexposed dry / wet film is removed by the developer, the surface of the conductive metal layer 3 is exposed. This exposed conductive metal layer 3 surface is dissolved and etched away with acidic copper chloride to obtain the desired circuit, forming multiple sets of conductive pins 101. Figure 11 (As shown). In this embodiment, the mesh-shaped second mold 2 combined with a mature etching process can obtain an independent conductive pin 101 without cutting. The forming steps of the conductive pin 101 are simple and easy to implement. Of course, in other embodiments, the mesh-shaped second mold 2 can also be combined with other etching processes to obtain an independent conductive pin 101. There is no limitation here, as long as an independent conductive pin 101 can be obtained.

[0076] In some optional embodiments, the first mold 1 has a conductive bottom wall 11; the step of etching the conductive metal layer 3 into multiple independent sets of conductive pins 101 using a mesh-like second mold 2 within the first mold 1 may include: filling the first mold 1 with an electrolyte and energizing the conductive bottom wall 11 to form a conductive metal layer 3 on the conductive bottom wall 11. Figure 4 (As shown). In this embodiment, before step S11, a conductive metal layer 3 can be formed in the first mold 1. The first mold 1 in this embodiment can be a metal conductive groove mold. Before forming the conductive metal layer 3, the four walls of the metal conductive groove mold can be insulated, allowing only the bottom wall of the metal conductive groove mold to conduct electricity. An electrolyte is placed inside the metal conductive groove mold, and energizing the metal conductive groove mold will cause the electrolyte to react, forming a conductive metal layer 3 on the bottom wall of the metal conductive groove mold. Of course, only the bottom wall of the first mold 1 can be set as a conductive bottom wall 11, and the side walls can be made of a non-conductive material, thus eliminating the need for insulation treatment of the four walls of the first mold 1.

[0077] In this embodiment, the first mold 1 is conductive, allowing for circuit electroplating during necessary processes when energized. The conductive metal layer 3 is formed by placing an electrolyte within the first mold 1 and undergoing an electrolytic reaction. This ensures the conductive metal layer 3 is in close contact with the four walls of the first mold 1, and allows for the formation of a thinner conductive metal layer 3 within the first mold 1. In other embodiments, the pre-formed conductive metal layer 3 can be directly placed into the first mold 1 to prepare the conductive pins 101. Since the fabrication of small LED display devices requires extremely high thickness of the conductive metal layer 3, directly placing a pre-formed and relatively thin conductive metal layer 3 into the first mold 1 makes it difficult to lay the conductive metal layer 3 flat. An uneven surface prevents subsequent LED display device fabrication. Compared to directly placing a pre-formed conductive metal layer 3 into the first mold 1, this embodiment uses an electrolytic reaction to form the conductive metal layer 3 within the first mold 1, making it easier to obtain a flat and even conductive metal layer 3. This is beneficial for subsequent fabrication of LED display devices with high dimensional accuracy and a flat bottom surface.

[0078] Preferred, see Figure 6 As shown, the second mold 2 includes multiple templates 21 arranged in a crisscross pattern, and the multiple templates 21 are spliced ​​together to form multiple arrayed grids 22; the bottom surface of each template 21 has a cutout 2111 corresponding to each grid 22. Figure 7As shown), the cutout 2111 connects two adjacent grids 22; at the intersection of multiple templates 21, there is an isolation groove 212 that separates two adjacent grids 22, and the isolation groove 212 penetrates the bottom surface of the template 21. In this embodiment, each template 21 has a through groove 213 between two adjacent grids 22. The through groove 213 penetrates not only the bottom surface of the template 21 downwards but also the top surface of the template 21 upwards, forming two sub-templates 211 between two adjacent grids 22. The two sub-templates 211 have the same structure and are arranged in parallel. The bottom surface of each sub-template 2111 has a cutout 2111, and extension plates 2112 are formed on both sides of each cutout 2111. The extension plates 2112 are in contact with the surface of the conductive metal layer 3. The cutout 2111 penetrates the bottom surface of the template 21 downwards, so the surface of the conductive metal layer 3 is exposed at the corresponding position of the cutout 2111. The surface of the conductive metal layer 3 is covered by the extension plates 2112 at the corresponding positions. The cutouts 2111 on two adjacent sub-templates 211 are connected by the through groove 213, and the conductive metal layer is exposed at the corresponding positions of the through groove 213. The surface of the grid 22 is also exposed. The four walls of each grid 22 are surrounded by four templates 211. Each template 211 has a cutout 2111 in the middle of each side wall of the grid 22. When etching the conductive metal layer 3, the developer can enter each grid 22 and flow between the grids 22 through the cutout 2111. The developer can not only dissolve and erode the conductive metal layer 3 exposed in each grid 22, but also dissolve the conductive metal layer 3 exposed at the cutout 2111. This allows the four cutouts 2111 on the four side walls of each grid 22 to separate the four conductive pins 101 in an LED display device 100 from each other. At the same time, since the conductive metal layer 3 is covered by the extension plate 2112 and cannot come into contact with the developer, the conductive metal layer 3 is not dissolved and eroded at the position where it is attached to the extension plate 2112. This results in the conductive pins 101 being fanned outward.

[0079] Meanwhile, the intersection of the two horizontal sub-templates 211 and the two vertical sub-templates 211 forms the vertex of each grid 22. In order to separate the conductive pins 101 under two adjacent grids 22, this embodiment also provides an isolation groove 212 at the intersection of the templates 21. Figure 9 As shown), the isolation groove 212 at this location may include a separation groove 2121 located at the center and a connecting groove 2122 located on each sub-template 211. Figure 8As shown, four connecting grooves 2122 are distributed around the separation groove 2121. The separation groove 2121 penetrates the template 21 vertically, and the connecting groove 2122 penetrates the bottom surface of the template 211 downwards. The connecting groove 2122 connects the separation groove 2121 with the through groove 213. Therefore, the surface of the conductive metal layer 3 will also be exposed at the positions corresponding to the separation groove 2121, the connecting groove 2122 and the through groove 213. In this way, after etching, the developer can dissolve and erode the conductive metal layer 3 connecting the two adjacent grids 22, so that the conductive pins 101 under the two adjacent grids 22 are separated from each other.

[0080] See Figure 11 As shown, by setting cutouts 2111 and isolation grooves 212 on the template 21, after etching, four spaced conductive pins 101 are left in each grid 22. The four conductive pins 101 are located at the four corners of the grid 22. At the same time, for each conductive pin 101, not only is the area covered by the protective film 7 not etched away, but also the area of ​​the conductive metal layer 3 located below the position where the cutouts 2111 and isolation grooves 212 are not set on the template 211 (that is, the area directly below the extension plate 2112) is not exposed to the developer because its surface is pressed by the template 211, so it is not etched away. Therefore, a larger area of ​​conductive pins 101 can be formed. Finally, the four conductive pins 101 of the LED display device 100 are all fanned outward, which can improve the welding reliability of the LED display device 100. Furthermore, the size of the fan-out of the conductive pins 101 can be controlled by controlling the thickness of the template 211.

[0081] Further, see Figure 12 As shown, in one embodiment, before forming metal lines 102 on each group of conductive pins 101, and before the metal lines 102 on different groups of conductive pins 101 are independent of each other, the process may further include: applying insulating adhesive 104 between the plurality of conductive pins 101 corresponding to each grid 22 of the second mold 2, such that the insulating adhesive 104 connects the plurality of conductive pins 101 in each group of conductive pins 101. Figure 13 (As shown).

[0082] In this embodiment, after etching away the excess conductive metal layer 3, an insulating adhesive 104 is applied to the areas of each grid 22 without the conductive metal layer 3 by dispensing or spraying, and then dried and cured. Next, a film stripping step can be performed, that is, the exposed protective film 7 protecting the surface of the conductive pins 101 in step S121 is peeled off with a sodium hydroxide solution to expose the conductive pins 101 of the device. Then, a metal circuit 102 is formed on the conductive pins 101 in each grid 22. In this embodiment, the insulating adhesive 104 can connect and fix the independent conductive pins 101 in a group of conductive pins 101 together, while preventing the conductive pins 101 from being electrically connected to each other. Furthermore, the thickness of the insulating adhesive 104 in this embodiment will not exceed the thickness of the conductive metal layer 3, which is also beneficial for manufacturing a thinner LED display device 100. In other embodiments, the insulating adhesive 104 may not be provided.

[0083] Further, see Figure 16 As shown, in some optional embodiments, forming metal lines 102 on each group of conductive pins 101 may include:

[0084] S21: Deposit a metal circuit layer 4 on each group of the conductive pins 101 and the insulating adhesive 104. Figure 14 (As shown). In this embodiment, the metal circuit layer 4 is preferably a copper layer.

[0085] S22: The metal lines 102 are etched onto the metal line layer 4 within each grid 22 of the second mold 2 using exposure, development, and etching methods. Figure 15 (As shown).

[0086] In this embodiment, when etching the metal lines 102, the same coating, exposure, development, etching, and subsequent stripping steps as in steps S121-S124 can be used to etch the desired metal lines 102 from the metal line layer 4. The structure of the metal lines 102 varies depending on the arrangement of the light-emitting chips 103. Figure 16 The example is a common metal circuit 102 structure.

[0087] Based on the above technical solution, in one embodiment, depositing a metal circuit layer 4 on each group of conductive pins 101 and the insulating adhesive 104 may include:

[0088] S211: Perform chemical deposition of metal on each set of conductive pins 101 and insulating adhesive 104 to deposit a first layer of metal on each set of conductive pins 101 and insulating adhesive 104.

[0089] S212: Electroplating deposited metal on the first metal layer to deposit a second metal layer on the first metal layer, forming the metal circuit layer 4.

[0090] In this embodiment, the metal deposited is preferably copper. The conductive pin 101 and the insulating adhesive 104 are immersed in the chemical copper plating solution in the first mold 1 for copper plating. Chemical copper plating can be deposited on any conductive and non-conductive substrate. After chemical copper plating, the thickness of the copper layer is increased by an addition method (i.e., electroplating copper) to finally obtain the metal circuit layer 4.

[0091] Further, see Figure 19 As shown, the step of transferring the light-emitting chip 103 to the metal line 102 to form an independent LED display device 100 in each grid 22 of the second mold 2 may include: injecting encapsulating adhesive 105 into the first mold 1 to fill each grid 22 of the second mold 2 with the encapsulating adhesive 105; pressing the encapsulating adhesive 105 to be flush with the upper surface of the second mold 2 by the cover plate 5, so that an independent LED display device 100 is formed in each grid 22 of the second mold 2.

[0092] See Figure 17 As shown, in this embodiment, the light-emitting chips 103 are transferred to various positions on the metal lines 102 according to their arrangement. Figure 18 The example shown is the most common arrangement of the light-emitting chips 103. See also... Figure 19 As shown, after the light-emitting chip 103 is transferred, encapsulating adhesive 105 is injected into the groove-shaped first mold 1. The cover plate 5 is pressed to be flush with the upper surface of the second mold 2. Under the separation of the grid-shaped second mold 2, the template 21 can separate the encapsulating adhesive 105 in each grid 22. After the encapsulating adhesive 105 is cured, the cover plate 5, the second mold 2 and the first mold 1 are removed, and finally an independent LED display device 100 is obtained.

[0093] In the above technical solution, an overflow port 6 can be formed between the cover plate 5 and the first mold 1. For example, Figure 19 As shown, the outer contour size of the cover plate 5 can be set to be slightly smaller than the opening of the groove-shaped first mold 1. Therefore, there will be overflow outlets 6 on the four sides of the groove-shaped first mold 1, which can squeeze out the excess encapsulating glue 105 from the first mold 1 and the second mold 2.

[0094] To reduce the manufacturing cost of the LED display device 100, improve the soldering reliability of small-pitch packaged devices, and reduce the difficulty of cutting micro-devices, this application optimizes the manufacturing process of the LED display device 100 and the module board packaging process. Furthermore, both the first mold 1 and the second mold 2 in this application can be reused, which can reduce manufacturing costs.

[0095] See Figure 2 As shown, this application embodiment also provides an LED display device 100. The LED display device 100 in this embodiment can be manufactured using the manufacturing method in any of the above embodiments. The LED display device 100 may include: a conductive pin 101; a metal line 102, the metal line 102 being electrically connected to the conductive pin 101, and the metal line 102 being electrically connected to a light-emitting chip 103. In this embodiment, the light-emitting chip 103 disposed in one LED display device 100 emits red, green, and blue light. The red, green, and blue light chips each have an H electrode, which is either a positive or negative electrode. The red light chip also has an R electrode, the green light chip also has a G electrode, and the blue light chip also has a B electrode. The H electrode is the common electrode of the light-emitting chips 103, and the H electrodes of each light-emitting chip 103 are electrically connected to the same conductive pin 101 through the metal line 102.

[0096] In this embodiment, the metal line 102 is directly etched onto the conductive pin 101 using photoresist (improving the manufacturing precision of the metal line 102). The metal line 102 is directly electrically connected to the conductive pin 101, and the metal line 102 is also directly electrically connected to the light-emitting chip 103, thus obtaining a smaller LED display device 100.

[0097] Furthermore, the LED display device 100 in this embodiment includes four independent conductive pins 101. The four conductive pins 101 are connected by insulating adhesive 104 located between the conductive pins 101, which serves to isolate the four conductive pins 101 and protect the interior of the LED display device 100. The metal circuit 102 and the light-emitting chip 103 are also encapsulated with encapsulating adhesive 105, which also serves to protect the interior of the LED display device 100. The conductive pins 101 fan outwards from the encapsulating adhesive 105. Figure 3 As shown, this allows the tiny LED display device 100 to have a larger conductive pin 101, and the fan-out size of the conductive pin 101 is controllable (the fan-out size of the pin can be controlled by controlling the thickness of the template 211), thereby improving the soldering reliability of the conductive pin 101 of the LED display device 100.

[0098] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0099] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0100] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for manufacturing an LED display device, characterized in that, It includes the following steps: In the first mold (1), the conductive metal layer (3) is etched into multiple sets of independent conductive pins (101) using a grid-shaped second mold (2). Metal lines (102) are formed on each group of conductive pins (101), and the metal lines (102) on different groups of conductive pins (101) are independent of each other; The light-emitting chip (103) is transferred to the metal line (102) so that an independent LED display device is formed in each grid (22) of the second mold (2); The second mold (2) includes multiple templates (21) arranged in a crisscross pattern, and the multiple templates (21) are spliced ​​together to form multiple grids (22) in an array distribution. Each template (21) has a cutout (2111) on its bottom surface corresponding to each grid (22), and the cutout (2111) connects two adjacent grids (22); At the intersection of the multiple templates (21), there is an isolation groove (212) that separates two adjacent grids (22), and the isolation groove (212) penetrates the bottom surface of the template (21).

2. The manufacturing method as described in claim 1, characterized in that, The process of etching a conductive metal layer (3) into multiple independent sets of conductive pins (101) using a mesh-like second mold (2) within a first mold (1) includes: A grid-shaped second mold (2) is placed on the conductive metal layer (3) inside the first mold (1); The conductive metal layer (3) is etched by exposure, development and etching to obtain multiple sets of conductive pins (101) that correspond one-to-one with the grid (22) of the second mold (2); wherein, one grid (22) corresponds to one set of conductive pins (101).

3. The manufacturing method as described in claim 1 or 2, characterized in that, The first mold (1) has a conductive bottom wall (11); the process of etching a conductive metal layer (3) into multiple sets of independent conductive pins (101) within the first mold (1) using a mesh-like second mold (2) includes: Electrolyte is filled into the first mold (1), and electricity is applied to the conductive bottom wall (11) to form a conductive metal layer (3) on the conductive bottom wall (11).

4. The manufacturing method as described in claim 1, characterized in that, Before forming metal lines (102) on each group of conductive pins (101), and before the metal lines (102) on different groups of conductive pins (101) are independent of each other, the method further includes: An insulating adhesive (104) is applied between the plurality of conductive pins (101) corresponding to each grid (22) of the second mold (2), such that the insulating adhesive (104) connects the plurality of conductive pins (101) in each group of conductive pins (101).

5. The manufacturing method as described in claim 4, characterized in that, The process of forming metal lines (102) on each set of conductive pins (101) includes: A metal circuit layer (4) is deposited on each set of the conductive pins (101) and the insulating adhesive (104). The metal lines (102) are etched on the metal line layer (4) in each grid (22) of the second mold (2) by means of exposure, development and etching.

6. The manufacturing method as described in claim 5, characterized in that, The deposition of a metal circuit layer (4) on each set of the conductive pins (101) and the insulating adhesive (104) includes: Chemically deposit metal on each set of the conductive pins (101) and the insulating adhesive (104) to deposit a first layer of metal on each set of the conductive pins (101) and the insulating adhesive (104); Electroplating deposited metal on the first metal layer to deposit a second metal layer on the first metal layer, forming the metal circuit layer (4).

7. The manufacturing method as described in claim 1, characterized in that, The step of transferring the light-emitting chip (103) to the metal line (102) to form an independent LED display device in each grid (22) of the second mold (2) includes: Inject encapsulating adhesive (105) into the first mold (1) so that the encapsulating adhesive (105) fills each grid (22) of the second mold (2); The encapsulating adhesive (105) is pressed onto the upper surface of the second mold (2) by the cover plate (5), so that an independent LED display device is formed in each grid (22) of the second mold (2).

8. The manufacturing method as described in claim 1, characterized in that, Each template (21) has a through groove (213) between two adjacent grids (22). The through groove (213) penetrates the top and bottom surfaces of the template (21), so that two parallel sub-templates (211) are formed between two adjacent grids (22). Each of the sub-templates (211) has a cutout (2111) on its bottom surface, and an extension plate (2112) is formed on both sides of each cutout (2111). The extension plate (2112) is in contact with the surface of the conductive metal layer (3), and the cutout (2111) is connected to the through groove.

9. An LED display device manufactured using the method described in any one of claims 1-8, characterized in that, It includes: Conductive pin (101); Metal circuit (102) is electrically connected to the conductive pin (101), and a light-emitting chip (103) is electrically connected to the metal circuit (102).

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