Semiconductor vacuum cavity sealing groove repairing method and repairing device

Abstract

The invention discloses a semiconductor vacuum cavity sealing groove repairing method which comprises the following steps that S1, a workpiece is clamped and fixed, and a necking type sealing groove needing to be repaired is formed in the workpiece; s2, the machining face of a repairing device abuts against a groove opening of the sealing groove, and the machining face is of an arc-shaped structure; and S3, the height of the repairing device relative to the workpiece is adjusted, pressure is transmitted to the notch through the machining face, and the notch is extruded by the machining face to shrink. The invention provides a method for repairing a sealing groove of a semiconductor vacuum cavity, which can repair the sealing groove when the size of the sealing groove is too large and cannot be matched with a sealing ring, reduce the size of the sealing groove and ensure the sealing effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a semiconductor vacuum chamber sealing groove repairing method and a repairing device. Background Art

[0002] With the continuous innovation of semiconductor technology, the status of semiconductor vacuum system in the semiconductor manufacturing process has become increasingly prominent, and its role has become increasingly critical and prominent, playing a vital role in the field of semiconductor manufacturing. It is mainly composed of multiple key components such as vacuum, vacuum pump, vacuum gauge, gas supply system and control system. These parts work together to ensure the precise manufacturing of semiconductor materials and devices. The vacuum chamber, as the core component of the entire system, provides the main operating space for the manufacture of semiconductor materials and devices. It must have excellent sealing to effectively isolate the outside air and other impurities to ensure the purity of the operating environment; it must have excellent sealing to maintain high vacuum to meet the needs of extremely low pressure environment in the semiconductor manufacturing process.

[0003] For example, the publication number "CN118360582A" discloses a "vacuum chamber mechanism", which includes a vacuum pump; a closed chamber with a vacuum cavity; an adsorption mechanism, which is arranged in the closed chamber, and the adsorption mechanism includes at least three supporting straws for adsorbing and fixing the product; a control pipeline assembly, wherein the vacuum pump, the closed chamber and the adsorption mechanism are all connected to the control pipeline assembly, and the control pipeline assembly is used to evacuate and break the vacuum of the closed chamber and the adsorption mechanism. However, in actual applications, due to factors such as processing errors and wear during use, the size of the sealing groove will be larger, which will make the sealing groove unable to fit the sealing ring, thereby reducing the sealing effect. Summary of the invention

[0004] In view of the problem in the prior art mentioned in the background technology that a sealing groove of a vacuum chamber is too large to fit a sealing ring during manufacture and use, the present invention provides a method for repairing a sealing groove of a semiconductor vacuum chamber, which can repair the sealing groove when the sealing groove is too large to fit a sealing ring, thereby reducing the size of the sealing groove and ensuring the sealing effect.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions.

[0006] A method for repairing a sealing groove of a semiconductor vacuum chamber comprises the following steps: S1. Clamp and fix the workpiece, and the workpiece is provided with a shrink-type sealing groove that needs to be repaired; S2, placing the machined surface of the repair device against the notch of the sealing groove, wherein the machined surface is an arc-shaped structure; S3. Adjust the height of the repair device relative to the workpiece, and transmit the pressure to the notch through the machining surface. The notch is squeezed by the machining surface and shrinks.

[0007] The sealing of the vacuum chamber is crucial to the smooth operation of the entire semiconductor vacuum system. It is an indispensable and rigid requirement. For this reason, the sealing groove of the vacuum chamber is mostly sealed with a dovetail structure with high sealing performance and a corresponding sealing ring. The width of the sealing groove has become the key to ensure the sealing performance of the entire vacuum chamber and even the entire semiconductor vacuum system, and must be strictly controlled. However, the dovetail sealing groove structure is characterized by a narrow internal wide mouth, which is difficult to process. In addition, the bumps and scratches during the process and the wear and tear during use often cause the sealing groove width to be too wide, which affects the sealing performance and practicality. There are even serious incidents in which the sealing groove cannot hold the sealing ring and make it detach from the groove. Therefore, it is necessary to repair the size of the sealing groove. At present, there are generally two methods to repair the excessive width of the sealing groove. The first is to add materials for welding, fill the excessively wide part with welding, and then reprocess and repair it; the second is to change the groove design to use a larger sealing groove size. The cost of these two methods is not economical, and the repair process is complicated and difficult. In many cases, these two methods are difficult to repair.

[0008] Because the sealing groove is a dovetail structure, which is characterized by being wide inside and narrow outside, if it is repaired by the first method of adding materials, the difficulty will increase. After welding, the flange will be uneven or even deformed, and it is easy to produce pores. It often requires repeated welding to meet the use requirements. The rework after welding is also a difficult operation, and the cost is often much higher than machining a new sealing groove.

[0009] The second method is to increase the size of the first-level sealing groove. Although this method can meet the use requirements, it is necessary to purchase corresponding sealing rings to match the grooves before installation and use. In addition, the size of the sealing grooves of each vacuum chamber is increased differently, and it is necessary to purchase sealing rings of various sizes accordingly, which undoubtedly wastes resources and increases time costs.

[0010] The current repair methods are expensive and difficult, and often the sealing groove characteristics become worse or even unusable and can only be scrapped during the repair process. Or some vacuum chambers cannot increase the size of the sealing groove due to structural limitations, so they can only be scrapped and replaced with new vacuum chambers.

[0011] Therefore, in the present application, a repair method is used, in which the machining surface of the repair device is brought into contact with the notch of the sealing groove, and pressure is applied to the repair device, so that a downward-inclined extrusion pressure is generated on the notch through the arc-shaped machining surface. Since the notch is a shrinking structure (generally a dovetail groove shape), the notch will move downward under the action of the extrusion force, thereby shrinking the notch, so that the beveled edge inside the sealing groove can better fit the sealing ring, thereby improving the sealing effect.

[0012] Preferably, the notch includes an upper contact surface, the upper contact surface abuts the processing surface, and the upper contact surface moves downward after being pressed. It is necessary to control the abutment between the processing surface and the upper contact surface of the notch, wherein the upper contact surface is the side of the notch away from the bottom of the sealing groove, so that when the processing surface abuts the upper contact surface to apply pressure to the notch, the notch is prevented from being squeezed toward both sides, and the notch can be squeezed downward, thereby reducing the notch.

[0013] Preferably, the arc diameter of the processing surface is D, the slot width is L, and D≥10L. The arc diameter of the processing surface is set to be more than ten times greater than the slot width, so as to avoid the processing surface from exerting extrusion pressure on both sides of the slot, thereby preventing the slot from being enlarged, allowing the slot to deform downward and shrink.

[0014] Preferably, in step S2, the center of the processed surface is adjusted to align with the center of the notch. The center of the processed surface is aligned with the center of the notch, so that the processed surface is symmetrically located on the left and right sides of the notch, thereby making the extrusion force of the processed surface on the left and right sides of the notch uniform, making the settlement of the left and right sides of the notch uniform, thereby improving the tightness of the connection with the sealing ring.

[0015] Preferably, when the overall size of the sealing groove needs to be repaired, the processing surface is moved along the extension direction of the sealing groove in step S3. When the overall size of the sealing groove is too large, the processing surface is moved along the extension direction of the sealing groove. During the movement of the processing surface along the extension direction of the sealing groove, the size of the sealing groove can be repaired in the area where the processing surface passes. During a complete movement cycle of the processing surface, the vertical position of the processing surface needs to be kept unchanged, so that the repair amount of the entire processing groove during this repair process can be controlled to be uniform.

[0016] Preferably, in step S3, the height between the repair device and the workpiece is progressively reduced. In step S3, the relative height between the repair device and the workpiece is progressively reduced, that is, the pressure on the sealing groove is gradually increased, so as to ensure the stability during the repair process. When the sealing groove needs to be repaired as a whole, it is necessary to reduce the height between the repair device and the workpiece after the processing surface runs a complete cycle along the extension track of the sealing groove.

[0017] Preferably, a repair device comprises a base, a mounting groove is provided at the end of the base, a workpiece is connected in a rolling manner in the mounting groove, and a processing surface abutting the groove is provided on the processing piece. The application provides a repair device, wherein the base is the main body of the repair device, which can be installed on a machine tool or a machining center, and the movement of the repair device is achieved by driving, wherein the end of the base (the side close to the workpiece) is provided with a mounting groove, wherein the mounting groove can be rotatably connected to the workpiece, and the part of the workpiece abutting the sealing groove is the processing surface. Due to the use of a rotating connection, the workpiece rolls on the sealing groove during the process of driving the base to move along the extension direction of the sealing groove, thereby reducing the friction loss to the sealing groove and ensuring the smoothness of the repair process.

[0018] Preferably, the base includes a guide base and a processing base, the processing base is rotatably connected to the guide base, and the guide base drives the processing base to move along the extension direction of the sealing groove. The substrate is divided into two parts, namely a guide substrate for guiding and a processing substrate for processing the sealing groove. The processing substrate is rotatably connected to the guide substrate, wherein the processing substrate can rotate around the guide substrate and is not constrained in the rotation direction. During operation, the guide substrate pulls the processing substrate to move. During the height adjustment process, the guide substrate moves up and down, and the processing substrate is synchronously adjusted with the guide substrate. Therefore, during operation, the guide substrate is in front and the processing substrate is behind. The position of the guide substrate is limited by the left and right sides of the notch of the sealing groove. On the curved path, the processing substrate can adaptively be centered relative to the sealing groove, thereby ensuring the uniformity of left and right pressurization of the sealing groove. The guide substrate moves along the processing path set by the machine tool or the machining center. Even if there is an error between the movement trajectory of the guide substrate and the extension trajectory of the sealing groove, the processing substrate can also adaptively correct the deviation due to the flexible rotation between the processing substrate and the guide substrate.

[0019] Preferably, the processing part and the sealing groove are connected in a universal rotation. The processing part and the sealing groove are connected in a universal rotation so that the processing part can be universally rotated relative to the sealing groove, thereby improving flexibility. When the entire sealing groove needs to be repaired, the processing surface needs to move along the extension direction of the sealing groove. When the overall shape of the sealing groove is irregular or has an arc turning, the universal rotation of the processing part can make it more flexible and stable when passing through the area, thereby ensuring the quality of the repair.

[0020] Preferably, the processing part includes a processing sphere and a planetary sphere, the spherical surface of the processing sphere is the processing surface, and the planetary sphere abuts the processing sphere and the installation groove respectively. The processing part includes a processing sphere and a planetary sphere, wherein the processing sphere is the part that needs to extrude the sealing groove, and the planetary sphere is arranged inside the sealing groove, as a component between the processing sphere and the sealing groove, the planetary sphere abuts the sealing groove and the processing sphere, thereby improving the rotation flexibility of the processing sphere, and at the same time, the base transmits pressure to the processing sphere through the planetary sphere, so that the pressure acts on a circle area where the processing sphere and the planetary sphere abut, in the force transmission direction, it is closer to the abutment position between the processing sphere and the sealing groove, to ensure the stability of the extrusion, and at the same time prevent the processing sphere from being able to rotate flexibly under pressure.

[0021] The beneficial effects of the present invention are as follows: (1) The sealing groove can be shrunk without generating additional consumables, can meet the design dimensions, ensure the repair effect, save processing time, and will not cause excessive damage to the vacuum chamber; (2) The sealing groove can be repaired as a whole, ensuring the uniformity of the repair on both sides of the sealing groove and maintaining a smooth repair process; (3) The mobility of the repair device during the repair process is improved to ensure a more stable force transmission effect; (4) It can ensure the adaptability of the repair device to the extended shape of the sealing groove, and ensure that the processed substrate can always adaptively maintain alignment with the center position of the sealing groove during the processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an axonometric view of the present invention.

[0023] Figure 2 It is a structural schematic diagram of the present invention.

[0024] Figure 3 It is a partial cross-sectional view of the repair device in the present invention.

[0025] Figure 4 yes Figure 3 A partial enlarged view of point A in the middle.

[0026] Figure 5 This is an axonometric view of Example 2.

[0027] In the figure: 1 workpiece; 2 sealing groove, 21 notch, 211 upper contact surface; 3 base body, 31 mounting groove, 32 guide base body, 33 processing base body, 34 adapter sleeve; 4 machining parts, 41 machining spheres, 42 planetary spheres, 421 machining surfaces; 5. Repair device. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0029] Embodiment 1: like Figure 1 , 2 As shown, a semiconductor vacuum chamber sealing groove repair method includes the following steps: S1, clamping and fixing a workpiece 1, wherein the workpiece 1 is provided with a shrink-shaped sealing groove 2 that needs to be repaired; S2, the processing surface 421 of the repair device 5 is abutted against the notch 21 of the sealing groove 2, and the processing surface 421 is an arc-shaped structure; S3. Adjust the height of the repair device 5 relative to the workpiece 1, and transmit pressure to the notch 21 through the processing surface 421. The notch 21 is squeezed by the processing surface 421 to shrink.

[0030] The sealing of the vacuum chamber is crucial to the smooth operation of the entire semiconductor vacuum system. It is an indispensable rigid requirement. For this reason, the sealing groove 2 of the vacuum chamber is mostly sealed with a dovetail structure with high sealing performance and a corresponding sealing ring. The width of the sealing groove 2 has become the key to ensure the sealing performance of the entire vacuum chamber and even the entire semiconductor vacuum system, and must be strictly controlled. However, the dovetail-shaped sealing groove 2 has a narrow internal wide mouth, which is difficult to process. In addition, the bumps and scratches during the process, the wear and tear during use, etc. often cause the width of the sealing groove 2 to be too wide, which affects the sealing performance and practicality. There are even serious incidents in which the sealing groove 2 cannot hold the sealing ring and make it detach from the groove. Therefore, it is necessary to repair the size of the sealing groove. At present, there are generally two methods for repairing the over-wide size of the sealing groove 2. The first method is to add materials for welding, fill the over-wide part with welding, and then reprocess and repair it; the second method is to change the groove design to use a larger size of the sealing groove 2. The cost of these two methods is not economical, and the repair process is complicated and difficult. In many cases, these two methods are difficult to repair.

[0031] Because the sealing groove 2 is a dovetail structure, which is characterized by being wide inside and narrow outside, if it is repaired by the first method of adding materials, the difficulty increases. After welding, the flange will be uneven or even deformed, and it is easy to produce pores. It often requires repeated welding to meet the use requirements. The rework after welding is also a difficult operation, and the cost is often much higher than machining a new sealing groove 2.

[0032] The second method is to increase the size of the first-level sealing groove 2. Although this method can meet the use requirements, it is necessary to purchase corresponding sealing rings that match the grooves before installation and use. Moreover, the size increases of the sealing grooves 2 of each vacuum chamber are different, and it is necessary to purchase sealing rings of various sizes accordingly, which undoubtedly wastes resources and increases time costs.

[0033] The current repair methods are expensive and difficult, and often the characteristics of the sealing groove 2 become worse or even unusable and can only be scrapped during the repair process. Or some vacuum chambers cannot increase the size of the sealing groove 2 due to structural limitations, so they can only be scrapped and replaced with new vacuum chambers.

[0034] Therefore, in the present application, a repair method is used, in which the processing surface 421 of the repair device 5 is brought into contact with the notch 21 of the sealing groove 2, and pressure is applied to the repair device 5, so that a downward-inclined extrusion pressure is generated on the notch 21 through the arc-shaped processing surface 421. Since the notch 21 is a shrinking structure (generally a dovetail groove shape), the notch 21 will move downward under the action of the extrusion force, thereby shrinking the notch 21, so that the beveled edge inside the sealing groove 2 can better fit the sealing ring, thereby improving the sealing effect.

[0035] like Figure 2 As shown, the slot 21 includes an upper contact surface 211, the upper contact surface 211 abuts against the processing surface 421, and the upper contact surface 211 moves downward after being pressed. It is necessary to control the processing surface 421 to abut against the upper contact surface 211 of the slot 21, wherein the upper contact surface 211 is the side of the slot 21 away from the bottom of the sealing slot 2, so that when the processing surface 421 abuts against the upper contact surface 211 to apply pressure to the slot 21, the slot 21 is prevented from being squeezed toward both sides, and the slot 21 can be squeezed downward, thereby reducing the size of the slot 21.

[0036] like Figure 2 As shown, the arc diameter of the processing surface 421 is D, the width of the slot 21 is L, and D≥10L. The arc diameter of the processing surface 421 is set to be more than ten times greater than the width of the slot 21, so as to avoid the processing surface 421 from exerting squeezing force on both sides of the slot 21, thereby preventing the slot 21 from being enlarged, so that the slot 21 can be deformed downward and the slot 21 can be reduced.

[0037] like Figure 2 As shown, in step S2, the center of the processed surface 421 is adjusted to be aligned with the center of the notch 21. The center of the processed surface 421 is aligned with the center of the notch 21, so that the processed surface 421 is located at a symmetrical position on the left and right sides of the notch 21, thereby making the extrusion force of the processed surface 421 on the left and right sides of the notch 21 uniform, making the settlement of the left and right sides of the notch 21 uniform, thereby improving the tightness of the connection with the sealing ring.

[0038] When the overall size of the sealing groove 2 needs to be repaired, in step S3, the processing surface 421 is moved along the extension direction of the sealing groove 2. When the overall size of the sealing groove 2 is too large, the processing surface 421 is moved along the extension direction of the sealing groove 2. During the movement of the processing surface 421 along the extension direction of the sealing groove 2, the size of the sealing groove 2 can be repaired in the area where the processing surface 421 passes. During a complete movement cycle of the processing surface 421, it is necessary to ensure that the vertical position of the processing surface 421 remains unchanged, so that the repair amount of the entire processing groove in this repair process can be controlled to be uniform.

[0039] In step S3, the height between the repair device 5 and the workpiece 1 is progressively reduced. In step S3, the relative height between the repair device 5 and the workpiece 1 is progressively reduced, that is, the pressure generated on the sealing groove 2 is gradually increased, so as to ensure the stability during the repair process. When the sealing groove 2 needs to be repaired as a whole, it is necessary to reduce the height between the repair device 5 and the workpiece 1 after the processing surface 421 runs a complete cycle along the extension track of the sealing groove 2.

[0040] Embodiment 2: like Figure 3 As shown, a repair device includes a base 3, a mounting groove 31 is provided at the end of the base 3, a workpiece 4 is connected in a rolling manner in the mounting groove 31, and a processing surface 421 is provided on the processing piece 4 to abut the notch 21. The application provides a repair device, wherein the base 3 is the main body of the repair device, which can be installed on a machine tool or a machining center, and the movement of the repair device is achieved by driving, wherein the end of the base 3 (the side close to the workpiece 1) is provided with a mounting groove 31, wherein the mounting groove 31 can be rotatably connected to the workpiece 4, and the part of the workpiece 4 abutting against the sealing groove 2 is the processing surface 421. Due to the use of a rotating connection, the workpiece 4 rolls on the sealing groove 2 during the process of driving the base 3 to move along the extension direction of the sealing groove 2, thereby reducing the friction loss to the sealing groove 2 and ensuring the smoothness of the repair process.

[0041] like Figure 4 As shown, the processing piece 4 is universally connected to the sealing groove 2. The processing piece 4 is universally connected to the sealing groove 2, so that the processing piece 4 can be universally rotated relative to the sealing groove 2, thereby improving flexibility. When the entire sealing groove 2 needs to be repaired, the processing surface 421 needs to move along the extension direction of the sealing groove 2. When the overall shape of the sealing groove 2 is irregular or has an arc turning, the universal rotation of the processing piece 4 can make it more flexible and stable when passing through the area, thereby ensuring the quality of the repair.

[0042] like Figure 4As shown, the processing part 4 includes a processing sphere 41 and a planetary sphere 42, the spherical surface of the processing sphere 41 is a processing surface 421, and the planetary sphere 42 abuts against the processing sphere 41 and the mounting groove 31 respectively. The processing part 4 includes a processing sphere 41 and a planetary sphere 42, wherein the processing sphere 41 is the part that needs to be squeezed into the sealing groove 2, and the planetary sphere 42 is arranged inside the sealing groove 2, as a component between the processing sphere 41 and the sealing groove 2, and the planetary sphere 42 abuts against the sealing groove 2 and the processing sphere 41, thereby improving the rotation flexibility of the processing sphere 41, and at the same time, the base 3 transmits the pressure to the processing sphere 41 through the planetary sphere 42, so that the pressure acts on a circle area where the processing sphere 41 and the planetary sphere 42 abut, and in the force transmission direction, it is closer to the abutment position between the processing sphere 41 and the sealing groove 2, so as to ensure the stability of the extrusion, and at the same time, prevent the processing sphere 41 from being able to rotate flexibly under pressure.

[0043] The assembly and working process of this embodiment are as follows: This embodiment clamps the base 3 of the repair device through a machine tool, applies pressure through the processing ball 41 and rolls and squeezes the notch 21 area along the center line of the sealing groove 2 to cause plastic deformation to achieve dimensional shrinkage, and then the machine tool performs a slight processing or simple local manual processing to restore its size to meet its high-precision sealing requirements.

[0044] The structure of the base 3 is as follows: the shape can be clamped to the tool bar of the machine tool, and can be clamped to the fixture of the lathe and the machining center. The planetary sphere 42 and the central sphere are placed in the lower mounting groove 31 in sequence, and the closing part is shrunk to keep the steel ball in the mounting groove 31. The mounting groove 31 part needs to be quenched and its hardness should be between HR55-62.

[0045] Processing of the ball 41 and the planetary ball 42: ensuring that the surface roughness is above 1.6Ra and the hardness is between HR60 and HR66. They can be purchased on the market or obtained from discarded bearings.

[0046] First, clamp the base 3 of the device on the machine tool (if the sealing groove 2 is a full circle, it can be done on a lathe; if the sealing groove 2 is a square or other more complex shape, it can be done on a machining center), clamp the workpiece 1 on the machine tool worktable, and then adjust the center of the processing ball 41 to be consistent with the center line of the sealing groove 2, adjust the height of the base 3 through the planetary ball 42 to transmit the pressure to the processing ball 41 to generate a certain pressure on both sides of the sealing groove 2. The initial pressure does not need to be too large, so that the processing ball 41 will squeeze the areas on both sides of the sealing groove 2 to shrink the size of the sealing groove 2. Then, according to the processing program, it slowly runs along the center line of the sealing groove 2. Because there is rolling friction between the planetary sphere 42 and the processing sphere 41, the processing sphere 41 will also roll along. As the processing sphere 41 rolls on both sides of the sealing surface and runs for a full circle, the size of the sealing groove 2 will shrink evenly to a certain size. At this time, the groove width size is measured with a measuring tool. If the size of the groove 21 is still too large, the height of the base 3 is adjusted again to apply secondary pressure to the sealing groove 2, and the program is run again for one circle, and this is repeated until all dimensions meet the requirements or are slightly smaller. Generally, 2-3 cycles are required to make the groove width size meet the requirements.

[0047] After the slot 21 is squeezed to the right size, the slot width is processed and chamfered in the same way as the new sealing slot 2, and then the burrs are manually removed. The repaired sealing slot 2 has the same performance as the new vacuum chamber, and the appearance is almost the same as the new vacuum chamber.

[0048] Embodiment 3: like Figure 5As shown, different from Example 1, in this embodiment, the base 3 includes a guide base 32 and a processing base 33. The processing base 33 is rotatably connected to the guide base 32. The guide base 32 drives the processing base 33 to move along the extension direction of the sealing groove 2. In this embodiment, the guide base and the processing base are connected by an adapter sleeve 34. The adapter sleeve is connected to the guide base, and the connection between the adapter sleeve and the processing base can be a rotational connection or a fixed connection. The base 3 is set into two parts, namely the guide base 32 for guiding and the processing base 33 for processing the sealing groove 2. The processing base 33 is rotatably connected to the guide base 32, wherein the processing base 33 can rotate around the guide base 32 and is not constrained in the rotation direction. During the working process, the guide base 32 pulls the processing base 33 to move. During the height adjustment process, the guide base 32 moves up and down, and the processing base 33 is adjusted synchronously with the guide base 32. Therefore, during the working process, the guide base 32 is in front, and the guide base 32 is in front. The processing substrate 33 is at the back, and the position of the guide substrate 32 is limited by the left and right sides of the notch 21 of the sealing groove 2. On the curved path, the processing substrate 33 can adaptively be centered relative to the sealing groove 2, thereby ensuring the uniformity of the left and right pressurization of the sealing groove 2, and the guide substrate 32 moves along the processing path set by the machine tool or the machining center. Even if there is an error between the movement trajectory of the guide substrate 32 and the extension trajectory of the sealing groove 2, due to the flexible rotation between the processing substrate 33 and the guide substrate 32, the processing substrate 33 can also adaptively correct the deviation.

[0049] The repair device in this embodiment also includes: a base 3, a mounting groove 31 is provided at the end of the base 3, a workpiece 4 is connected in a rolling manner in the mounting groove 31, and a processing surface 421 is provided on the workpiece 4 to abut the notch 21. The application provides a repair device, wherein the base 3 is the main body of the repair device, which can be installed on a machine tool or a machining center, and the movement of the repair device is achieved by driving, wherein the end of the base 3 (the side close to the workpiece 1) is provided with a mounting groove 31, wherein the mounting groove 31 can be rotatably connected to the workpiece 4, and the part of the workpiece 4 abutting against the sealing groove 2 is the processing surface 421. Due to the use of a rotating connection, when the base 3 is driven to move along the extension direction of the sealing groove 2, the workpiece 4 rolls on the sealing groove 2, thereby reducing the friction loss of the sealing groove 2 and ensuring the smoothness of the repair process. The workpiece 4 and the sealing groove 2 are connected by a universal rotation. The processing part 4 and the sealing groove 2 are set to be universally rotated, so that the processing part 4 can be universally rotated relative to the sealing groove 2, thereby improving flexibility. When the entire sealing groove 2 needs to be repaired, the processing surface 421 needs to move along the extension direction of the sealing groove 2. When the overall shape of the sealing groove 2 is irregular or has an arc turning, the universal rotation of the processing part 4 can make it more flexible and stable when passing through the area, thereby ensuring the quality of the repair. The processing part 4 includes a processing sphere 41 and a planetary sphere 42. The spherical surface of the processing sphere 41 is the processing surface 421, and the planetary sphere 42 abuts against the processing sphere 41 and the installation groove 31 respectively. The processing part 4 includes a processing sphere 41 and a planetary sphere 42, wherein the processing sphere 41 is the part that needs to extrude the sealing groove 2, and the planetary sphere 42 is arranged inside the sealing groove 2. As a component between the processing sphere 41 and the sealing groove 2, the planetary sphere 42 abuts the sealing groove 2 and the processing sphere 41, thereby improving the rotation flexibility of the processing sphere 41, and at the same time allowing the base 3 to transmit pressure to the processing sphere 41 through the planetary sphere 42, so that the pressure acts on a circle area where the processing sphere 41 and the planetary sphere 42 abut, and in the force transmission direction, it is closer to the abutment position between the processing sphere 41 and the sealing groove 2, thereby ensuring the stability of the extrusion and preventing the processing sphere 41 from being able to rotate flexibly under pressure.

[0050] The assembly and working process of this embodiment are as follows: the base 3 of this embodiment includes a guide base 32 and a processing base 33, wherein the guide base 32 and the processing base 33 are rotatably connected, the processing base 33 can revolve around the guide base 32, the processing base 33 is parallel to the axis of the guide base 32, and the guide base 32 is a cylindrical structure; in this embodiment, the guide base 32 of the repair device is clamped by a machine tool, and pressure is applied by the processing ball 41 and the notch 21 area is rolled and squeezed along the center line of the sealing groove 2 to cause plastic deformation to achieve dimensional shrinkage, and then the machine tool can perform a little processing or simple local manual processing to restore its size to meet its high-precision sealing requirements.

[0051] During the machining process, the machine tool clamps the main guide substrate 32 and plans the movement path, and the machining substrate 33 moves with the guide substrate 32. When moving along the extension direction of the sealing groove 2, the machining substrate 33 is driven by the guide substrate 32 to move, but the left and right positions of the machining substrate 33 are limited by the abutment areas on both sides of the notch 21. Even if there is a difference between the travel path of the guide substrate 32 and the extension path of the sealing groove 2, the notch 21 can still be used to limit the machining substrate 33, so that the machining substrate 33 can be corrected and turned relative to the guide substrate 32, thereby ensuring that the guide substrate 32 is in the center position.

[0052] The structure of the base 3 is as follows: the shape can be clamped to the tool bar of the machine tool, and can be clamped to the fixture of the lathe and the machining center. The planetary sphere 42 and the central sphere are placed in the lower mounting groove 31 in sequence, and the closing part is shrunk to keep the steel ball in the mounting groove 31. The mounting groove 31 part needs to be quenched and its hardness should be between HR55-62.

[0053] Processing of the ball 41 and the planetary ball 42: ensuring that the surface roughness is above 1.6Ra and the hardness is between HR60 and HR66. They can be purchased on the market or obtained from discarded bearings.

[0054] First, clamp the guide base 32 of the device on the machine tool (if the sealing groove 2 is a full circle, it can be done on a lathe; if the sealing groove 2 is a square or other more complex shape, it can be done on a machining center), clamp the workpiece 1 on the machine tool worktable, and then adjust the center of the processing ball 41 on the processing base 33 to be consistent with the center line of the sealing groove 2, adjust the height of the guide base 32 (the guide base 32 drives the processing base 33 to move up and down synchronously), and transmit the pressure to the processing ball 41 through the planetary ball 42 to generate a certain pressure on both sides of the sealing groove 2. The initial pressure does not need to be too large, so that the processing ball 41 will press the sealing groove 2 The two sides of the area are squeezed to shrink the size of the sealing groove 2, and then the process is slowly run along the center line of the sealing groove 2 according to the processing program. Because there is rolling friction between the planetary sphere 42 and the processing sphere 41, the processing sphere 41 will also roll and run. As the processing sphere 41 rolls on both sides of the sealing surface and runs a full circle, the size of the sealing groove 2 will shrink evenly to a certain size. At this time, the groove width size is measured with a measuring tool. If the size of the groove 21 is still too large, the height of the base 3 is adjusted again to apply secondary pressure to the sealing groove 2, and the program is run again for one circle, and this is repeated until all sizes meet the requirements or are slightly smaller. Generally, 2-3 cycles are required to make the groove width size meet the requirements.

[0055] After the slot 21 is squeezed to the right size, the slot width is processed and chamfered in the same way as the new sealing slot 2, and then the burrs are manually removed. The repaired sealing slot 2 has the same performance as the new vacuum chamber, and the appearance is almost the same as the new vacuum chamber.

Claims

1. A method for repairing a sealing groove of a semiconductor vacuum chamber, characterized in that: The following steps are included: S1, clamping and fixing a workpiece (1), wherein the workpiece (1) is provided with a shrink-shaped sealing groove (2) that needs to be repaired; S2, placing the processing surface (421) of the repair device (5) against the notch (21) of the sealing groove (2), wherein the processing surface (421) is an arc-shaped structure; S3. Adjust the height of the repair device (5) relative to the workpiece (1), and transmit pressure to the notch (21) through the processing surface (421), so that the notch (21) is squeezed by the processing surface (421) and shrinks.

2. A semiconductor vacuum chamber sealing groove repair method according to claim 1, characterized in that: The notch (21) comprises an upper contact surface (211), the upper contact surface (211) abuts against the processing surface (421), and the upper contact surface (211) moves downward after being pressed.

3. A semiconductor vacuum chamber sealing groove repair method according to claim 1, characterized in that: The arc diameter of the processing surface (421) is D, the width of the slot (21) is L, and D≥10L.

4. A semiconductor vacuum chamber sealing groove repair method according to claim 1, characterized in that: In step S2, the center of the processed surface (421) is adjusted to be aligned with the center of the notch (21).

5. A semiconductor vacuum chamber sealing groove repair method according to any one of claims 1 to 4, characterized in that: When the overall size of the sealing groove (2) needs to be repaired, in step S3, the processing surface (421) is moved along the extension direction of the sealing groove (2).

6. A semiconductor vacuum chamber sealing groove repair method according to any one of claims 1 to 4, characterized in that: In step S3, the height between the repair device (5) and the workpiece (1) is reduced incrementally.

7. A repair device, used in a semiconductor vacuum chamber sealing groove repair method according to any one of claims 1 to 6, characterized in that: It comprises a base (3), the end of the base (3) is provided with a mounting groove (31), a processing piece (4) is rollingly connected in the mounting groove (31), and the processing piece (4) is provided with a processing surface (421) abutting against the notch (21).

8. A repair device according to claim 7, characterized in that: The base (3) comprises a guide base (32) and a processing base (33); the processing base (33) is rotatably connected to the guide base (32); and the guide base (32) drives the processing base (33) to move along the extension direction of the sealing groove (2).

9. A repair device according to claim 7 or 8, characterized in that: The processing part (4) and the sealing groove (2) are universally rotatably connected.

10. A repair device according to claim 7 or 8, characterized in that: The processing part (4) comprises a processing sphere (41) and a planetary sphere (42); the spherical surface of the processing sphere (41) is a processing surface (421); and the planetary sphere (42) abuts against the processing sphere (41) and the mounting groove (31) respectively.

Images