Coating and compounding process for black PI adhesive tape production

Abstract

The invention discloses a coating composite process for black PI (polyimide) adhesive tape production, which belongs to the technical field of adhesive tape production processes, and is characterized in that an unwinding mechanism is arranged on each of two sides of a supporting frame, so that an adhesive tape base material pre-placed in the unwinding mechanism is pulled out from the unwinding mechanism and is guided by a plurality of reversing rollers, and the advancing direction of the adhesive tape base material is changed; the coating action mechanism is used for coating the angle base material entering the working range of the coating action mechanism, and meanwhile, the adhesive tape base material pre-put in the other unwinding mechanism is also pulled into the guide range of the same reversing roller, so that the newly introduced adhesive tape base material covers the coated adhesive tape base material; then, the two adhesive tape base materials enter a composite action mechanism arranged between the two unwinding mechanisms together, and the composite action mechanism conducts composite machining treatment on the two adhesive tape base materials; and finally, the adhesive tape base material is wound by the winding mechanism. Therefore, the technical problem of how to improve the efficiency of the adhesive tape coating and compounding process is solved.

Description

Technical Field

[0001] The invention relates to the technical field of adhesive tape production technology, in particular to a coating and compounding process for producing black PI adhesive tape. Background Art

[0002] Black PI tape, also known as black polyimide tape, the English name of polyimide is: Polyimide, which is referred to as PI; this is a polymer material with high heat resistance, high strength, excellent electrical insulation and chemical stability; the industry often refers to it as black PI tape. This tape is often used for insulation, protection, shielding and fixing of electronic and electrical products, such as smart phones, tablet computers, TVs, etc. It is a high-performance, multifunctional insulating tape product.

[0003] The production of black PI tape usually involves processes such as coating, lamination and hot melting. For example, after preparing the raw materials needed to produce the tape, it is usually necessary to put the hot melt adhesive into a glue gun or corresponding hot melt equipment to heat the hot melt adhesive to a specified temperature so that it reaches a fluid state. Then use a handheld glue gun or automatic glue coating equipment to evenly apply the melted hot melt adhesive to the predetermined position of the tape substrate; finally, press the tape substrate coated with hot melt adhesive with another layer of material, such as backing material, release paper, etc.; and maintain a certain pressure so that the hot melt adhesive is evenly distributed and solidified between the two layers of material; after waiting for the hot melt adhesive to completely cool and solidify, a strong adhesive layer can be formed.

[0004] Based on this, Chinese patent CN113351432A discloses a hot melt adhesive tape coating mechanism, which includes a frame, a main impeller pump, a slave impeller pump and a glue coating port, the side walls of the main impeller pump and the slave impeller pump are fixedly connected with a fixed bracket, the main impeller pump, the slave impeller pump and the glue coating port are connected through a glue delivery pipe, a transmission mechanism is arranged between the main impeller pump and the slave impeller pump, an L-shaped plate is fixedly arranged on the side wall on the same side of the slave impeller pump and the transmission mechanism, a pressure adjustment mechanism is arranged on the L-shaped plate, and the pressure adjustment mechanism includes a conversion component, a telescopic component and a centrifugal component. The hot melt adhesive tape coating mechanism can dynamically adjust the hot melt adhesive delivery rate, and can also mark the number of changes and the amplitude of the pump hydraulic pressure change, so that the qualified rate of the coating can be quickly judged.

[0005] However, the hot melt adhesive cloth-based tape coating mechanism disclosed above still has the technical problem of poor coating and laminating efficiency. Specifically, in the coating and laminating process of black PI tape, it is necessary to press the tape substrate coated with hot melt adhesive together with another layer of material; and maintain a certain pressure so that the hot melt adhesive is evenly distributed and solidified between the two layers of material. After the coating mechanism disclosed in the existing patent has coated one side of the tape, it is necessary to circulate the coated tape to another station or set it up for lamination processing; during the turnover process, the glue and other media coated on the tape are easily contaminated and affect the laminating effect; moreover, the process of circulating the tape also requires special personnel to monitor and handle it; it is not conducive to improving the production effect. Summary of the invention

[0006] Based on this, it is necessary to provide a coating and laminating process for the production of black PI tape in order to address the technical problem of how to improve the efficiency of the tape coating and laminating process.

[0007] A coating and laminating process for producing black PI tape comprises the following steps: S1: A reeling mechanism is provided on each side of the supporting frame, and a roll of the tape base material to be compounded is placed in each reeling mechanism in advance; S2: A coating action mechanism is arranged at the lower side of one of the unwinding mechanisms, so that the adhesive tape substrate pre-placed in the unwinding mechanism is pulled out from the unwinding mechanism, guided by a plurality of reversing rollers and changes its forward direction, and then enters the working range of the coating action mechanism; S3: The coating action mechanism coats the angle substrate that enters its working range, and allows the coated tape substrate to enter the guiding range of another reversing roller. At the same time, the tape substrate pre-placed in another unwinding mechanism is also pulled into the guiding range of the same reversing roller, so that the newly introduced tape substrate covers the coated tape substrate. S4: After the two adhesive tape substrates are guided by a plurality of reversing rollers and change their forward directions, they enter the composite action mechanism disposed between the two unwinding mechanisms, and the composite action mechanism performs composite processing on the two adhesive tape substrates; the composite action mechanism and the winding mechanism share a power mechanism to realize linkage; S5: The tape substrate that has completed the composite processing enters the coiling working range of the winding mechanism to complete the winding action.

[0008] Furthermore, a process for using the reeling mechanism as a traction mechanism to traction the tape base material roll in the unwinding mechanism comprises the following steps: S11: The roll of adhesive tape base material to be coated and compounded is placed in advance in the unwinding tray; S12: After the substrate is pulled out from the unwinding tray, it passes through a number of reversing rollers, a coating action mechanism or a composite action mechanism, and then enters the traction range of the winding mechanism; S13: The winding mechanism pulls the substrate and winds it inside. When the substrate is pulled, the unwinding material tray rotates following its movement, thereby driving the unwinding shaft. The unwinding bearing structure is used to support the unwinding shaft to rotate in the supporting frame, and the unwinding damper is used to decelerate or brake the rotational movement of the unwinding shaft, so that after the winding mechanism stops outputting power, the unwinding damper can decelerate or brake the unwinding shaft in time, thereby making the tape substrate tensioned between a number of reversing rollers, which is convenient for coating or compounding of the tape substrate.

[0009] Furthermore, the process of coating the tape substrate using the coating action mechanism includes the following steps: S21: After the vertical driving cylinder connected to the side of the supporting frame through the coating frame is started, the vertical reciprocating action block is driven downward, thereby driving the rotary driving cylinder to move downward to a preset height, so that the coating execution part can contact the surface of the tape substrate to be coated; S22: After the rotary drive cylinder is started, the rotary connection part is driven to swing back and forth, and then the rotary connection part drives the coating drive cylinder to swing back and forth; S23: The coating driving cylinder drives the coating reciprocating motion part downward or upward according to a preset program, so that the coating execution part can evenly coat the glue and other materials on the surface of the tape substrate.

[0010] Furthermore, the process of processing the tape substrate using the composite action mechanism includes the following steps: S31: The tape substrate guided by a plurality of reversing rollers enters between the composite active roller and the composite driven roller provided in the composite connection frame, and the operator rotates the composite adjustment part to adjust the interval between the composite driven roller and the composite active roller, so that the interval between the composite driven roller and the composite active roller meets the preset requirements; S32: After the motor is powered on and started, it drives the power output wheel to rotate, and the first transmission belt transmits the rotational power of the power output wheel to the transmission composite wheel; S33: The composite transmission shaft is driven to rotate by the composite transmission wheel, and then the composite transmission shaft drives the composite active roller to rotate; S34: When the composite active roller rotates, it cooperates with the composite driven roller to allow the tape substrate to be pressed and passed between the two. The pressure between the composite active roller and the composite driven roller can enable the two tape substrates and the glue between the two tape substrates to be composited.

[0011] Furthermore, the process of linking the winding mechanism with the composite action mechanism comprises the following steps: S41: The transmission composite wheel and the winding driving wheel are coaxially arranged so that the transmission composite wheel and the winding driving wheel are linked; S42: When the winding driving wheel rotates, the winding driven wheel is driven to rotate with it through the second transmission belt; S43: When the winding driven wheel rotates, it drives the winding shaft to rotate. The winding shaft is inserted into the winding bearing structure, and the winding bearing structure is arranged on the supporting frame. Therefore, the tape substrate processed by the composite action mechanism enters the working range of the winding shaft to realize the winding process under the rotating action of the winding shaft.

[0012] In summary, the present invention proposes a device for producing black PI tape, which comprises: a supporting frame, a unwinding mechanism, a plurality of reversing rollers, a coating action mechanism, a compound action mechanism and a winding mechanism; one unwinding mechanism is arranged on each side of the supporting frame, and a plurality of reversing rollers are distributed between the two unwinding mechanisms; the coating action mechanism is arranged on the adjacent side of one of the unwinding mechanisms, and the coating action mechanism and the plurality of reversing rollers are connected to the supporting frame; the compound action mechanism is connected to the side of the supporting frame between the two unwinding mechanisms; the winding mechanism is arranged on the side of the supporting frame adjacent to the coating action mechanism, and the winding mechanism is linked with the compound action mechanism; based on this, the present invention provides a coating and compounding process for producing black PI tape by arranging one unwinding mechanism on each side of the supporting frame, and making each unwinding mechanism pre-place a roll of tape base material to be compounded; and a coating action mechanism is arranged below the adjacent side of one of the unwinding mechanisms. The coating action mechanism allows the tape substrate pre-placed in the unwinding mechanism to be pulled out from it, guided by a number of reversing rollers and changed in forward direction, and then enters the working range of the coating action mechanism; then, the coating action mechanism coats the angle substrate entering its working range, and allows the tape substrate after coating to enter the guiding range of another reversing roller. At the same time, the tape substrate pre-placed in the other unwinding mechanism is also pulled into the guiding range of the same reversing roller, so that the newly introduced tape substrate covers the coated tape substrate; thereafter, the two tape substrates are guided by a number of reversing rollers at the same time and change in forward direction, and then enter the composite action mechanism arranged between the two unwinding mechanisms together, and the composite action mechanism performs composite processing on the two tape substrates; the composite action mechanism and the winding mechanism share a power mechanism to achieve linkage; finally, the tape substrate that has completed the composite processing enters the coil working range of the winding mechanism to complete the winding action. Therefore, the coating and compounding process for producing black PI tape of the present invention can complete the coating and compounding processing of multi-layer substrates in the same workstation or equipment, avoiding multiple turnovers of semi-finished products and solving the technical problem of how to improve the efficiency of the tape coating and compounding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of a coating and compounding device for producing black PI tape according to the present invention; Figure 2 It is a schematic structural diagram of another direction of a coating and compounding device for producing black PI tape according to the present invention; Figure 3 This is a schematic diagram of the structure of a coating and compounding device for producing black PI tape according to the present invention; Figure 4 This is a schematic structural diagram of a partial structure of a coating and compounding device for producing black PI tape according to the present invention. DETAILED DESCRIPTION

[0014] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0015] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0016] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0017] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0019] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0020] Please also read Figures 1 to 4 A coating and compounding device for producing black PI tape comprises: a supporting frame 1, a reeling mechanism 2, a plurality of reversing rollers 3, a coating action mechanism 4, a compound action mechanism 5 and a rewinding mechanism 6; one of the unwinding mechanisms 2 is arranged on each side of the supporting frame 1, and a plurality of reversing rollers 3 are distributed between the two unwinding mechanisms 2; the coating action mechanism 4 is arranged on the adjacent side of one of the unwinding mechanisms 2, and the coating action mechanism 4 and the plurality of reversing rollers 3 are connected to the supporting frame 1; the compound action mechanism 5 is connected to the side of the supporting frame 1 between the two unwinding mechanisms 2; the rewinding mechanism 6 is arranged on the side of the supporting frame 1 adjacent to the coating action mechanism 4, and the rewinding mechanism 6 is linked with the compound action mechanism 5.

[0021] Specifically, a process for using the aforementioned coating composite device for producing black PI tape comprises the following steps: S1: A reeling mechanism 2 is provided on each side of the supporting frame 1, and a roll of adhesive tape base material to be compounded is placed in advance in each reeling mechanism 2; S2: A coating action mechanism 4 is arranged at the lower side of one of the unwinding mechanisms 2, so that the adhesive tape substrate pre-placed in the unwinding mechanism 2 is pulled out from the unwinding mechanism 2, guided by a plurality of reversing rollers 3 and changes its forward direction, and then enters the working range of the coating action mechanism 4; S3: the coating action mechanism 4 coats the angle substrate that enters its working range, and makes the coated tape substrate enter the guiding range of another reversing roller 3. At the same time, the tape substrate pre-placed in the other unwinding mechanism 2 is also pulled into the guiding range of the same reversing roller 3, so that the newly introduced tape substrate covers the coated tape substrate. S4: After the two adhesive tape substrates are guided by a plurality of reversing rollers 3 and change their forward directions, they enter the composite action mechanism 5 disposed between the two unwinding mechanisms 2, and the composite action mechanism 5 performs composite processing on the two adhesive tape substrates; the composite action mechanism 5 and the rewinding mechanism 6 share a power mechanism to realize linkage; S5: The tape substrate that has completed the composite processing enters the coiling working range of the coiling mechanism 6 to complete the coiling action.

[0022] Specifically, the unwinding mechanism 2 has an unwinding bearing structure 201, an unwinding shaft 202, an unwinding material disc 203, an unwinding damper 204 and an unwinding connecting frame 205; the unwinding bearing structure 201 is penetrated by the supporting frame 1, the unwinding shaft 202 is connected to the unwinding bearing structure 201, one end of the unwinding shaft 202 is connected to the unwinding material disc 203, and the other end of the unwinding shaft 202 is connected to the unwinding damper 204; the unwinding connecting frame 205 respectively connects the unwinding damper 204 and the supporting frame 1.

[0023] Specifically, in a coating and laminating process for producing a black PI tape according to the present invention, a process in which a winding mechanism 6 is used as a traction mechanism to traction a tape base material roll in an unwinding mechanism 2 comprises the following steps: S11: The roll of adhesive tape base material to be coated and compounded is pre-placed into the unwinding tray 203; S12: After the substrate is pulled out from the unwinding material tray 203, it passes through a plurality of reversing rollers 3, a coating action mechanism 4 or a compound action mechanism 5, and then enters the traction range of the winding mechanism 6; S13: The winding mechanism 6 pulls the substrate and winds it inside. When the substrate is pulled, the unwinding material tray 203 rotates following its movement, thereby driving the unwinding shaft 202. The unwinding bearing structure 201 is used to support the unwinding shaft 202 to rotate in the supporting frame 1, and the unwinding damper 204 is used to decelerate or brake the rotational movement of the unwinding shaft 202, so that after the winding mechanism 6 stops outputting power, the unwinding damper 204 can decelerate or brake the unwinding shaft 202 in time, thereby allowing the tape substrate to be tensioned between the plurality of reversing rollers 3, which is convenient for coating or compounding of the tape substrate.

[0024] Furthermore, the coating action mechanism 4 has a coating frame 401, a vertical driving cylinder 402, a vertical reciprocating action block 403, a rotating driving cylinder 404, a rotating connecting part 405, a coating driving cylinder 406, a coating reciprocating action part 407 and a coating execution part 408; the coating frame 401 is connected to the side of the supporting frame 1, the vertical driving cylinder 402 is connected to the coating frame 401, the vertical driving cylinder 402 is drivingly connected to the vertical reciprocating action block 403, and the rotating driving cylinder 404 is connected to the vertical reciprocating action block 403; the rotating driving cylinder 404 is drivingly connected to the rotating connecting part 405, and the coating driving cylinder 406 is connected to the side of the rotating connecting part 405; the coating driving cylinder 406 is drivingly connected to the coating reciprocating action part 407, and the coating execution part 408 is connected below the coating reciprocating action part 407.

[0025] Specifically, in a coating and laminating process for producing a black PI tape according to the present invention, a process for coating a tape substrate using a coating action mechanism 4 comprises the following steps: S21: After the vertical driving cylinder 402 connected to the side of the supporting frame 1 through the coating frame 401 is started, the vertical reciprocating action block 403 is driven downward, thereby driving the rotary driving cylinder 404 to move downward to a preset height, so that the coating execution part 408 can contact the surface of the tape substrate to be coated; S22: After the rotation drive cylinder 404 is started, the rotation connection part 405 is driven to swing back and forth, and then the coating drive cylinder 406 is driven to swing back and forth by the rotation connection part 405; S23: The coating driving cylinder 406 drives the coating reciprocating motion part 407 downward or upward according to a preset program, so that the coating execution part 408 can evenly coat the glue and other materials on the surface of the tape substrate.

[0026] Furthermore, the composite action mechanism 5 comprises a composite connection frame 501, a composite active roller 502, a composite transmission shaft 503, a transmission composite wheel 504, a first transmission belt 505, a power output wheel 506, a motor 507, a composite driven roller 508 and a composite adjustment unit 509; the composite connection frame 501 is connected to the side of the support frame 1, the composite active roller 502 is movably arranged in the composite connection frame 501, and the composite transmission shaft 503 is power-connected to the composite active roller 502; the transmission The dynamic composite wheel 504 is connected to the composite transmission shaft 503, the first transmission belt 505 is respectively connected to the transmission composite wheel 504 and the power output wheel 506, the motor 507 is connected to the side of the support frame 1, and the motor 507 is drivingly connected to the power output wheel 506; the composite driven roller 508 is movably arranged in the composite connection frame 501 relative to the composite active roller 502; the composite adjustment part 509 is respectively connected to the composite driven roller 508 and the composite connection frame 501.

[0027] Specifically, in a coating and laminating process for producing a black PI tape according to the present invention, a process for processing a tape substrate using a laminating action mechanism 5 comprises the following steps: S31: The adhesive tape substrate guided by the plurality of reversing rollers 3 enters between the composite active roller 502 and the composite driven roller 508 provided in the composite connection frame 501, and the operator rotates the composite adjustment part 509 to adjust the interval between the composite driven roller 508 and the composite active roller 502, so that the interval between the composite driven roller 508 and the composite active roller 502 meets the preset requirements; S32: After the motor 507 is powered on and started, it drives the power output wheel 506 to rotate, and the first transmission belt 505 transmits the rotational power of the power output wheel 506 to the transmission composite wheel 504; S33: The composite transmission shaft 503 is driven to rotate by the composite transmission wheel 504, and then the composite transmission shaft 503 drives the composite active roller 502 to rotate; S34: When the composite active roller 502 rotates, it cooperates with the composite driven roller 508 to allow the tape substrate to be pressed and passed between the two. The pressure between the composite active roller 502 and the composite driven roller 508 can enable the two tape substrates and the glue between the two tape substrates to be composited.

[0028] Furthermore, the winding mechanism 6 has a winding bearing structure 601, a winding shaft 602, a winding driven wheel 603, a second transmission belt 604 and a winding active wheel 605; the winding bearing structure 601 is passed through the supporting frame 1, the winding shaft 602 is connected to the winding bearing structure 601, and one end of the winding shaft 602 is dynamically connected to the winding driven shaft 603; the second transmission belt 604 respectively connects the winding driven wheel 603 and the winding active wheel 605, and the winding active wheel 605 is connected to the transmission composite wheel 504.

[0029] Specifically, in a coating and laminating process for producing a black PI tape according to the present invention, a process in which a winding mechanism 6 and a laminating action mechanism 5 are linked together comprises the following steps: S41: The transmission composite wheel 504 and the winding driving wheel 605 are coaxially arranged so that the transmission composite wheel 504 and the winding driving wheel 605 are linked; S42: When the winding driving wheel 605 rotates, the winding driven wheel 603 is driven to rotate along with it through the second transmission belt 604; S43: When the winding driven wheel 603 rotates, it drives the winding shaft 602 to rotate. The winding shaft 602 is inserted into the winding bearing structure 601, and the winding bearing structure 601 is set on the supporting frame 1. Therefore, the tape substrate processed by the composite action mechanism 5 enters the working range of the winding shaft 602 to realize the winding process under the rotating action of the winding shaft 602.

[0030] In summary, the present invention proposes a device for producing black PI tape, which comprises: a supporting frame 1, a reeling mechanism 2, a plurality of reversing rollers 3, a coating action mechanism 4, a compound action mechanism 5 and a rewinding mechanism 6; one of the two sides of the supporting frame 1 is provided with the unwinding mechanism 2, and a plurality of reversing rollers 3 are distributed between the two unwinding mechanisms 2; the coating action mechanism 4 is provided on the adjacent side of one of the unwinding mechanisms 2, and the coating action mechanism 4 and the plurality of reversing rollers 3 are connected to the supporting frame 1; the compound action mechanism 5 is connected to the side of the supporting frame 1 between the two unwinding mechanisms 2; the rewinding mechanism 6 is provided on the side of the supporting frame 1 adjacent to the coating action mechanism 4, and the rewinding mechanism 6 is linked with the compound action mechanism 5; based on this, the present invention provides a coating and compounding process for producing black PI tape by providing an unwinding mechanism 2 on each side of the supporting frame 1, and each unwinding mechanism 2 is pre-placed with a roll of tape base material to be compounded; and the adjacent side of one of the unwinding mechanisms 2 A coating action mechanism 4 is arranged below, so that the tape substrate pre-placed in the unwinding mechanism 2 is pulled out from it, guided by a plurality of reversing rollers 3 and changes its forward direction, and then enters the working range of the coating action mechanism 4; then, the coating action mechanism 4 coats the angle substrate entering its working range, and makes the tape substrate after coating enter the guiding range of another reversing roller 3, and at the same time, the tape substrate pre-placed in the other unwinding mechanism 2 is also pulled into the guiding range of the same reversing roller 3, so that the newly introduced tape substrate covers the coated tape substrate; thereafter, the two tape substrates are guided by a plurality of reversing rollers 3 at the same time and change their forward directions, and then enter the composite action mechanism 5 arranged between the two unwinding mechanisms 2 together, and the composite action mechanism 5 performs composite processing on the two tape substrates; the composite action mechanism 5 and the winding mechanism 6 share a power mechanism to realize linkage; finally, the tape substrate that has completed the composite processing enters the coil working range of the winding mechanism 6 to complete the winding action. Therefore, the coating and compounding process for producing black PI tape of the present invention can complete the coating and compounding processing of multi-layer substrates in the same workstation or equipment, avoiding multiple turnovers of semi-finished products and solving the technical problem of how to improve the efficiency of the tape coating and compounding process.

[0031] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0032] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A coating and laminating process for the production of black PI tape, It is characterized in that It includes the following steps: S1: A reeling mechanism is provided on each side of the supporting frame, and a roll of the tape base material to be compounded is placed in each reeling mechanism in advance; S2: A coating action mechanism is arranged at the lower side of one of the unwinding mechanisms, so that the adhesive tape substrate pre-placed in the unwinding mechanism is pulled out from the unwinding mechanism, guided by a plurality of reversing rollers and changes its forward direction, and then enters the working range of the coating action mechanism; S3: The coating action mechanism coats the angle substrate that enters its working range, and allows the coated tape substrate to enter the guiding range of another reversing roller. At the same time, the tape substrate pre-placed in another unwinding mechanism is also pulled into the guiding range of the same reversing roller, so that the newly introduced tape substrate covers the coated tape substrate. S4: After the two adhesive tape substrates are guided by a plurality of reversing rollers and change their forward directions, they enter the composite action mechanism disposed between the two unwinding mechanisms, and the composite action mechanism performs composite processing on the two adhesive tape substrates; the composite action mechanism and the winding mechanism share a power mechanism to realize linkage; S5: The tape substrate that has completed the composite processing enters the coiling working range of the winding mechanism to complete the winding action.

2. A coating and laminating process for producing black PI tape according to claim 1, It is characterized in that A process for using a reeling mechanism as a traction mechanism to traction a tape base material roll in an unwinding mechanism comprises the following steps: S11: The roll of adhesive tape base material to be coated and compounded is placed in advance in the unwinding tray; S12: After the substrate is pulled out from the unwinding tray, it passes through a number of reversing rollers, a coating action mechanism or a composite action mechanism, and then enters the traction range of the winding mechanism; S13: The winding mechanism pulls the substrate and winds it inside. When the substrate is pulled, the unwinding material tray rotates following its movement, thereby driving the unwinding shaft. The unwinding bearing structure is used to support the unwinding shaft to rotate in the supporting frame, and the unwinding damper is used to decelerate or brake the rotational movement of the unwinding shaft, so that after the winding mechanism stops outputting power, the unwinding damper can decelerate or brake the unwinding shaft in time, thereby making the tape substrate tensioned between a number of reversing rollers, which is convenient for coating or compounding of the tape substrate.

3. A coating and laminating process for producing black PI tape according to claim 2, It is characterized in that The process of coating the tape substrate using a coating action mechanism comprises the following steps: S21: After the vertical driving cylinder connected to the side of the supporting frame through the coating frame is started, the vertical reciprocating action block is driven downward, thereby driving the rotary driving cylinder to move downward to a preset height, so that the coating execution part can contact the surface of the tape substrate to be coated; S22: After the rotary drive cylinder is started, the rotary connection part is driven to swing back and forth, and then the rotary connection part drives the coating drive cylinder to swing back and forth; S23: The coating driving cylinder drives the coating reciprocating motion part downward or upward according to a preset program, so that the coating execution part can evenly coat the glue and other materials on the surface of the tape substrate.

4. A coating and laminating process for producing black PI tape according to claim 3, It is characterized in that The process of processing a tape substrate using a composite action mechanism comprises the following steps: S31: The tape substrate guided by a plurality of reversing rollers enters between the composite active roller and the composite driven roller provided in the composite connection frame, and the operator rotates the composite adjustment part to adjust the interval between the composite driven roller and the composite active roller, so that the interval between the composite driven roller and the composite active roller meets the preset requirements; S32: After the motor is powered on and started, it drives the power output wheel to rotate, and the first transmission belt transmits the rotational power of the power output wheel to the transmission composite wheel; S33: The composite transmission shaft is driven to rotate by the composite transmission wheel, and then the composite driving roller is driven to rotate by the composite transmission shaft; S34: When the composite active roller rotates, it cooperates with the composite driven roller to allow the tape substrate to be pressed and passed between the two. The pressure between the composite active roller and the composite driven roller can enable the two tape substrates and the glue between the two tape substrates to be composited.

5. A coating and laminating process for producing black PI tape according to claim 4, It is characterized in that The process of linking the winding mechanism with the compound action mechanism includes the following steps: S41: The transmission composite wheel and the winding driving wheel are coaxially arranged so that the transmission composite wheel and the winding driving wheel are linked; S42: When the winding driving wheel rotates, the winding driven wheel is driven to rotate with it through the second transmission belt; S43: When the winding driven wheel rotates, it drives the winding shaft to rotate. The winding shaft is inserted into the winding bearing structure, and the winding bearing structure is arranged on the supporting frame. Therefore, the tape substrate processed by the composite action mechanism enters the working range of the winding shaft to realize the winding process under the rotating action of the winding shaft.

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