Light-emitting display device

Abstract

A light emitting display device is provided. The light emitting display device includes a unit pixel group including a first unit pixel, a second unit pixel, a third unit pixel, and a fourth unit pixel arranged in a 2 * 2 matrix, and each of the first unit pixel, the second unit pixel, the third unit pixel, and the fourth unit pixel includes a first light-emitting region, a second light-emitting region, and a third light-emitting region, which emit three-primary-color light, respectively, the first light-emitting region, the second light-emitting region, and the third light-emitting region of the first unit pixel are sequentially arranged in a first inclined direction, and the first light-emitting region, the second light-emitting region, and the third light-emitting region of the second unit pixel are sequentially arranged in a second inclined direction. The first, second, and third light emitting regions of the third unit pixel are sequentially arranged in a third inclined direction, and the first, second, and third light emitting regions of the fourth unit pixel are sequentially arranged in a fourth inclined direction.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0076847 filed in the Korean Intellectual Property Office on June 15, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Embodiments relate to a light emitting display device. Background Art

[0003] A display device is a device that displays a picture, and includes a liquid crystal display (LCD), an organic light emitting diode (OLED) display, and the like. Such display devices are used in various electronic devices such as mobile phones, navigation devices, digital cameras, e-books, portable game consoles, and terminals. An organic light emitting display device has a self-luminous property, and unlike a liquid crystal display device, does not require a separate light source, so that the thickness and weight can be reduced. For example, an organic light emitting display device has high quality characteristics such as low power consumption, high brightness, and fast response speed. Summary of the invention

[0004] The embodiment provides a light emitting display device including a space for a laser drilling process that implements an electrical connection for transmitting a voltage by using a laser.

[0005] The embodiment also provides a light emitting display device capable of preventing the color development phenomenon.

[0006] Embodiments also provide a light-emitting display device with high resolution.

[0007] However, the embodiments of the disclosure are not limited to the embodiments set forth herein. The above and other embodiments will become more apparent to those skilled in the art to which the disclosure pertains by referring to the detailed description of the disclosure given below.

[0008] According to the embodiment, the light-emitting display device may include a unit pixel group, the unit pixel group includes a first unit pixel, a second unit pixel, a third unit pixel and a fourth unit pixel arranged in a 2×2 matrix shape in a first direction and a second direction perpendicular to each other, and each of the first unit pixel, the second unit pixel, the third unit pixel and the fourth unit pixel may include a first light-emitting region, a second light-emitting region and a third light-emitting region that respectively emit three primary colors of light, the first light-emitting region, the second light-emitting region and the third light-emitting region of the first unit pixel may be sequentially arranged in a first inclined direction inclined relative to the first direction and the second direction, the first light-emitting region, the second light-emitting region and the third light-emitting region of the second unit pixel may be sequentially arranged in a second inclined direction, the first light-emitting region, the second light-emitting region and the third light-emitting region of the third unit pixel may be sequentially arranged in a third inclined direction, the first light-emitting region, the second light-emitting region and the third light-emitting region of the fourth unit pixel may be sequentially arranged in a fourth inclined direction, the first inclined direction, the second inclined direction, the third inclined direction and the fourth inclined direction may form a rhombus shape, and a position for performing a laser drilling process may be formed in a central portion of the unit pixel group.

[0009] The second inclined direction may be symmetrical to the first inclined direction with respect to the second direction, the third inclined direction may be symmetrical to the first inclined direction with respect to the first direction, and the fourth inclined direction may be parallel to the first inclined direction and may be opposite to the first inclined direction.

[0010] The first virtual line may extend in a first oblique direction and may obliquely connect a corner of a first unit pixel, the second virtual line may extend in a second oblique direction and may obliquely connect a corner of a second unit pixel, the third virtual line may extend in a third oblique direction and may obliquely connect a corner of a third unit pixel, the fourth virtual line may extend in a fourth oblique direction and may obliquely connect a corner of a fourth unit pixel, and the first virtual line, the second virtual line, the third virtual line, and the fourth virtual line may form a diamond shape.

[0011] The first light-emitting region of the first unit pixel may be adjacent to the third light-emitting region of the second unit pixel, the third light-emitting region of the first unit pixel may be adjacent to the first light-emitting region of the third unit pixel, the third light-emitting region of the third unit pixel may be adjacent to the first light-emitting region of the fourth unit pixel, and the third light-emitting region of the fourth unit pixel may be adjacent to the first light-emitting region of the second unit pixel.

[0012] The second unit pixel may be adjacent to the first unit pixel along the second direction, the third unit pixel may be adjacent to the first unit pixel along the first direction, and the fourth unit pixel may be adjacent to the first unit pixel in an oblique direction.

[0013] The connection electrode may be disposed at a central portion of the unit pixel group.

[0014] The light-emitting display device may also include: a pixel defining layer having openings corresponding to the first light-emitting area, the second light-emitting area and the third light-emitting area; an anode overlapping a portion of the opening of the pixel defining layer in a plan view; a light-emitting layer on the anode and arranged in the opening of the pixel defining layer; and a cathode arranged on the pixel defining layer and the light-emitting layer, and the connecting electrode can be electrically connected to the cathode by a laser drilling process.

[0015] The connecting electrode and the anode may be made of the same material and provided on the same layer.

[0016] The low driving voltage line and the auxiliary low driving voltage line may be disposed on different insulating layers and have different extension directions, the low driving voltage line and the auxiliary low driving voltage line may transmit the low driving voltage transmitted to the cathode, and the connection electrode may be electrically connected to the auxiliary low driving voltage line.

[0017] According to the embodiment, the light-emitting display device may include a first unit pixel group, a second unit pixel group, a third unit pixel group, and a fourth unit pixel group arranged in a 2×2 matrix shape in a first direction and a second direction perpendicular to each other, and each of the first unit pixel group, the second unit pixel group, the third unit pixel group, and the fourth unit pixel group may include a first unit pixel, a second unit pixel, a third unit pixel, and a fourth unit pixel arranged in a 2×2 matrix shape, each of the first unit pixel, the second unit pixel, the third unit pixel, and the fourth unit pixel may include a first light-emitting region, a second light-emitting region, and a third light-emitting region that respectively emit three primary colors of light, a position for a laser drilling process may correspond to a position where the corners of the four unit pixel groups meet, and the position where the laser drilling process is performed is in all of the first unit pixel group, the second unit pixel group, the third unit pixel group, and the fourth unit pixel group.

[0018] The first, second, and third light emitting regions of each of the first, second, third, and fourth unit pixels, in which the laser drilling process is performed, may be arranged in a diamond shape.

[0019] The first light emitting region, the second light emitting region, and the third light emitting region of the first unit pixel may be sequentially arranged in a first oblique direction oblique to the first direction and the second direction, and the first light emitting region, the second light emitting region, and the third light emitting region of the second unit pixel may be sequentially arranged in the second oblique direction. The first light emitting region, the second light emitting region, and the third light emitting region of the third unit pixel may be sequentially arranged in a third oblique direction. The first light emitting region, the second light emitting region, and the third light emitting region of the fourth unit pixel may be sequentially arranged in a fourth oblique direction, and the first oblique direction, the second oblique direction, the third oblique direction, and the fourth oblique direction may form a rhombus shape.

[0020] The second inclined direction may be symmetrical to the first inclined direction with respect to the second direction, the third inclined direction may be symmetrical to the first inclined direction with respect to the first direction, and the fourth inclined direction may be parallel to and opposite to the first inclined direction.

[0021] The first virtual line may extend in a first oblique direction and may obliquely connect a corner of a first unit pixel, the second virtual line may extend in a second oblique direction and may obliquely connect a corner of a second unit pixel, the third virtual line may extend in a third oblique direction and may obliquely connect a corner of a third unit pixel, the fourth virtual line may extend in a fourth oblique direction and may obliquely connect a corner of a fourth unit pixel, and the first virtual line, the second virtual line, the third virtual line, and the fourth virtual line may form a diamond shape.

[0022] The first light-emitting region of the first unit pixel may be adjacent to the third light-emitting region of the second unit pixel, the third light-emitting region of the first unit pixel may be adjacent to the first light-emitting region of the third unit pixel, the third light-emitting region of the third unit pixel may be adjacent to the first light-emitting region of the fourth unit pixel, and the third light-emitting region of the fourth unit pixel may be adjacent to the first light-emitting region of the second unit pixel.

[0023] The second unit pixel may be adjacent to the first unit pixel along the second direction, the third unit pixel may be adjacent to the first unit pixel along the first direction, and the fourth unit pixel may be adjacent to the first unit pixel in an oblique direction.

[0024] The connection electrode may be disposed at a position where corners of the first unit pixel group, the second unit pixel group, the third unit pixel group, and the fourth unit pixel group meet.

[0025] The light-emitting display device may also include: a pixel defining layer having openings corresponding to the first light-emitting area, the second light-emitting area and the third light-emitting area; an anode overlapping a portion of the opening of the pixel defining layer in a plan view; a light-emitting layer on the anode and arranged in the opening of the pixel defining layer; and a cathode arranged on the pixel defining layer and the light-emitting layer, wherein the connecting electrode can be electrically connected to the cathode by a laser drilling process, and the connecting electrode and the anode can be made of the same material and arranged on the same layer.

[0026] The low driving voltage line and the auxiliary low driving voltage line may be disposed on different insulating layers and have different extension directions. The low driving voltage line and the auxiliary low driving voltage line may transmit the low driving voltage transmitted to the cathode, and the connection electrode may be electrically connected to the auxiliary low driving voltage line.

[0027] The additional connection electrode may be disposed at a central portion of the unit pixel group, and the additional connection electrode and the anode may be made of the same material and disposed at the same layer.

[0028] According to an embodiment, three-color light-emitting areas or light-emitting devices are sequentially arranged in one direction from four adjacent unit pixels and can be arranged in a diamond shape, and laser drilling can be performed in the central area of ​​the diamond shape even in a light-emitting display device with a large number of pixels per inch.

[0029] According to the embodiment, by arranging unit pixels using a color-changing arrangement among a plurality of unit pixels, the color development phenomenon may be prevented from occurring.

[0030] According to the embodiment, by preventing light emitting regions or light emitting devices of the same color from being disposed adjacent to each other in two adjacent unit pixels, a light emitting display apparatus with high resolution can be provided by preventing a user from viewing a low resolution image. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic top plan view of a display area of ​​a light-emitting display device according to an embodiment.

[0032] Figure 2 It shows that according to Figure 1 A schematic plan view of a light emitting device in a light emitting display device of an embodiment and a position for a laser drilling process.

[0033] Figure 3 is based on Figure 1 A schematic cross-sectional view of a light-emitting display device of an embodiment.

[0034] Figure 4 is a schematic diagram of an equivalent circuit of a pixel of a light emitting display device according to an embodiment.

[0035] Figure 5 , Figure 6 , Figure 7 and Figure 8 is a schematic plan view illustrating a light emitting device and a position of a laser drilling process in a light emitting display device according to an embodiment.

[0036] Fig. 9 It is a view comparing the schematic diagram and the picture of the unit pixel pattern of the comparative example and the embodiment in Table 1.

[0037] Fig.10 is a schematic top plan view showing a light emitting device and a location for a laser drilling process according to an embodiment.

[0038] Fig.11 is a schematic block diagram of an electronic device according to an embodiment. DETAILED DESCRIPTION

[0039] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of various embodiments or implementations of the invention. As used herein, "embodiment" and "implementation" are interchangeable words as non-limiting examples of the apparatus or method disclosed herein. However, it is apparent that various embodiments may be practiced without these specific details or with one or more equivalent arrangements. Here, various embodiments need not be exclusive, nor need they be limited to disclosure. For example, the specific shape, configuration, and characteristics of an embodiment may be used or implemented in another embodiment.

[0040] Unless otherwise specified, the illustrated embodiments will be understood to provide features of the invention. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be further combined, separated, interchanged and / or rearranged without departing from the invention.

[0041] The use of cross hatching and / or shading in the drawings is usually provided to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for the specific material, material properties, size, ratio, commonality between the shown elements and / or any other characteristics, attributes, properties, etc. of the element. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the embodiments can be implemented differently, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0042] When an element (or layer) is referred to as being "on" another element or layer, "connected to" or "bonded to" another element or layer, the element (or layer) may be directly on, directly connected to or directly bonded to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly bonded to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection and / or a fluid connection with or without intervening elements. In addition, the DR1 direction, the DR2 direction and the DR3 direction are not limited to directions corresponding to the three axes of a rectangular coordinate system (such as, the X-axis, the Y-axis and the Z-axis), and may be interpreted in a broader sense. For example, the DR1 direction, the DR2 direction and the DR3 direction may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of A and B" may be interpreted to mean only A, only B or any combination of A and B. Furthermore, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as any combination of only X, only Y, only Z, or two or more of X, Y, and Z. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0043] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the disclosed teachings, the first element discussed below may be referred to as the second element.

[0044] For descriptive purposes, spatially relative terms such as "under," "below," "below," "down," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein to describe the relationship of one element to other elements as shown in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, the spatially relative terms are intended to also cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is turned over, an element described as "under" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the term "under" can cover both above and below orientations. In addition, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and therefore, the spatially relative descriptors used herein are interpreted accordingly.

[0045] The terms used here are for the purpose of describing specific embodiments, rather than being intended to be limiting. As used here, unless the context clearly indicates otherwise, the singular forms "one", "one (kind / person)" and "the (described)" are intended to also include plural forms. In addition, the terms "include" and its variations, "comprising" and its variations when used in this specification sheet illustrate the presence of the features, integral bodies, steps, operations, elements, components and / or its groups, but do not exclude the presence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or its groups. It is also noted that, as used here, the terms "substantially (substantially)", "about (approximately)" and other similar terms are used as approximate terms rather than degree terms, and are therefore used to explain the inherent deviations of measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0046] Various embodiments are described herein with reference to schematically illustrated cross-sections and / or exploded illustrations of embodiments and / or intermediate structures. Therefore, variations in the shapes of the illustrations caused by, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments disclosed herein should not necessarily be interpreted as being limited to the specific illustrated shapes of the regions, but will include deviations in shapes caused by, for example, manufacturing. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and thus need not be intended to be limiting.

[0047] As is customary in the art, some embodiments are described and shown in the accompanying drawings according to functional blocks, units and / or modules. It will be appreciated by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits (such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc.) that can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and can be optionally driven by firmware and / or software. It is also contemplated that each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed microprocessors and related circuits) for performing other functions. In addition, without departing from the scope of the invention, each block, unit and / or module of some embodiments can be physically divided into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the invention.

[0048] Hereinafter, the structure of the display area of ​​the light emitting display device will be described in detail with reference to the accompanying drawings. Figure 1 Describe a schematic plan structure.

[0049] Figure 1 is a schematic top plan view of a display area of ​​a light-emitting display device according to an embodiment. Figure 1 A portion of a display area is shown, and a pixel may include a light emitting device and a pixel driving unit.

[0050] exist Figure 1 In the embodiment, the arrangement RBL of the light emitting device may have a rhombus shape. For example, the light emitting device may correspond to the light emitting region in a plan view, and the light emitting region may correspond to the pixel defining layer (see FIG. Figure 3 380 in the figure) or a light emitting layer disposed in the opening (see Figure 3 The EML in .

[0051] First, the following will describe Figure 1 The structure of the pixel driving unit in FIG. Figure 1 In FIG. 1 , a total of three pixel driving units PCa, PCb, and PCc adjacent to each other are schematically shown by dotted lines. The three pixel driving units PCa, PCb, and PCc may each form a pixel driving unit of a unit pixel PXU, and Figure 1 A total of four unit pixels PXU are shown in the figure. A combination including four unit pixels PXU is also referred to as a unit pixel group. Each unit pixel PXU may include three pixels corresponding to three primary colors. The three pixel driving units PCa, PCb, and PCc included in a single unit pixel PXU may have a structure extending along the first direction DR1, and each of the three pixel driving units PCa, PCb, and PCc may be a pixel driving unit corresponding to a pixel of the three primary colors of the display light. The structure of the pixel driving units PCa, PCb, and PCc may vary, and according to an embodiment, the pixel driving units PCa, PCb, and PCc may have a structure as follows: Figure 4 The same circuit structure as shown in .

[0052] exist Figure 1 In the figure, some of the wirings connected to the pixel driving units PCa, PCb and PCc are also shown. Figure 1 A first scan signal line 151 and a second scan signal line 151-1 extending in a first direction DR1 are shown, and data lines 171a, 171b and 171c, a driving voltage line, an initialization voltage line 173 and a low driving voltage line 174 (also called a second driving voltage line) extending in a second direction DR2 are also shown.

[0053] For example, the pixel driving units PCa, PCb, and PCc may be commonly connected to the first scan signal line 151, the second scan signal line 151-1, the driving voltage line, the initialization voltage line 173, and the low driving voltage line 174. For example, the first pixel driving unit PCa may be connected to the first data line 171a, the second pixel driving unit PCb may be connected to the second data line 171b, and the third pixel driving unit PCc may be connected to the third data line 171c. Each of the pixel driving units PCa, PCb, and PCc may correspond to an area obtained by dividing a plane area separated by the first scan signal line 151, the second scan signal line 151-1, and the low driving voltage line 174 into three areas.

[0054] Figure 1 The auxiliary low driving voltage line 174-1 extending in the first direction DR1 is also shown. The auxiliary low driving voltage line 174-1 and the low driving voltage line 174 may be disposed on different insulating layers and may extend in different directions. For example, the auxiliary low driving voltage line 174-1 may be connected to the low driving voltage line 174 extending in the second direction DR2, and the low driving voltage ELVSS (see FIG. Figure 4 ) can be transmitted in the first direction DR1 and the second direction DR2 so that a low driving voltage ELVSS having a constant level is applied throughout the entire display area of ​​the light-emitting display device. The low driving voltage ELVSS supplied from an external low voltage power supply system can be applied to the cathode of the light-emitting device.

[0055] Reference Figure 3 , the cathode Cathode can be disposed above the pixel defining layer 380, and can be disposed on the top in the third direction DR3. In an embodiment, a laser drilling process / method can be used to electrically connect the cathode Cathode and the auxiliary low driving voltage line 174-1. The laser drilling process / method can be the following method: in this method, a laser is used to melt the conductive material formed under the cathode Cathode, so that the auxiliary low driving voltage line 174-1 disposed below can be electrically connected to the cathode Cathode. Figure 1 In the embodiment of FIG. 1 , the connection electrode CE may be formed between the auxiliary low driving voltage line 174 - 1 and the cathode Cathode, and may provide an electrical connection between the auxiliary low driving voltage line 174 - 1 and the cathode Cathode. Figure 1 In an embodiment, the connection electrode CE may be electrically connected to the auxiliary low driving voltage line 174-1 through the opening OP1. The connection electrode CE may be electrically connected to the cathode Cathode through a laser drilling process. As a result, the cathode Cathode may receive the low driving voltage ELVSS through the auxiliary low driving voltage line 174-1. In an embodiment, the connection electrode CE may correspond to a position where the laser drilling process is performed.

[0056] Although the position where the laser drilling process is performed overlaps the connection electrode CE in a plan view, the first scan signal line 151 and the second scan signal line 151-1 disposed below can be blocked by the connection electrode CE during the laser drilling process, and can prevent short circuit with the connection electrode CE and can prevent the low driving voltage ELVSS from being transmitted. Therefore, by using the connection electrode CE, wiring can be formed at the lower part of the area where the laser drilling process is performed, so that the formation of wiring and components is performed in a narrow area, thereby improving integration.

[0057] A light emitting device (or light emitting region) may be formed / arranged above the third direction DR3 of the pixel driving units PCa, PCb, and PCc. Figure 1 , showing that a plurality of light emitting devices (or light emitting areas) included in four unit pixels PXU adjacent to each other in a 2×2 matrix structure may be arranged in a rhombus shape, and also in an arrangement RBL of light emitting devices (also referred to as an arrangement of light emitting areas). For example, the rhombus shape may have 4 corners and 4 sides. In the rhombus shape, the angle formed by two adjacent sides may be an acute angle of 90 degrees or less, or an obtuse angle greater than 90 degrees. Each side of the rhombus may extend in an inclined direction forming a certain angle with each of the first direction DR1 and the second direction DR2, and after determining the inclined direction of one side (hereinafter, referred to as the first inclined direction DDR1 (see Figure 2 ), the two sides adjacent to the side can extend in symmetric directions relative to the first oblique direction DDR1 with reference to the first direction DR1 and the second direction DR2, respectively. For example, the remaining sides can extend in the same or opposite oblique direction as the first oblique direction DDR1.

[0058] exist Figure 1 In the embodiment of the present invention, according to the arrangement RBL of the light emitting devices, the light emitting devices (or light emitting regions) may be arranged in a rhombus shape with adjacent sides forming a 90 degree angle. Figure 2 An arrangement RBL of light emitting devices is described.

[0059] Figure 2 It shows that according to Figure 1 A plan view of a light emitting device and a location for a laser drilling process in the light emitting device according to an embodiment of the present invention. Figure 2 , the approximate planar positions of the unit pixels PXU11, PXU12, PXU21, and PXU22 are shown by dotted lines.

[0060] Set in Figure 2The four unit pixels PXU11, PXU12, PXU21, and PXU22 may form a unit pixel group. Over the three pixel driving units PCa, PCb, and PCc included in each of the unit pixels PXU11, PXU12, PXU21, and PXU22, three light emitting devices may be disposed.

[0061] Reference Figure 1 and Figure 2 , pixel defining layer (refer to Figure 3 380) may be formed above the pixel driving units PCa, PCb, and PCc. The pixel defining layer may have an opening that exposes a portion of anodes Anode11a, Anode12a, Anode21a, Anode22a, Anode11b, Anode12b, Anode21b, Anode22b, Anode11c, Anode12c, Anode21c, and / or Anode22c as part of the light emitting device. For example, each light emitting layer EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and / or EML22c may be disposed in the opening OP of the pixel defining layer.

[0062] Each light-emitting layer EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c and / or EML22c may be formed by an inkjet method and may include at least one quantum dot material. The pixel defining layer and each light-emitting layer EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c and / or EML22c may be formed by a cathode (refer to Figure 3 The first pixel driving unit PCa can be electrically connected to each of the first anodes Anode11a, Anode12a, Anode21a and Anode22a, the second pixel driving unit PCb can be electrically connected to each of the second anodes Anode11b, Anode12b, Anode21b and Anode22b, and the third pixel driving unit PCc can be electrically connected to each of the third anodes Anode11c, Anode12c, Anode21c and Anode22c.

[0063] exist Figure 2, the structure of connecting each anode Anode11a, Anode12a, Anode21a, Anode22a, Anode11b, Anode12b, Anode21b, Anode22b, Anode11c, Anode12c, Anode21c and / or Anode22c to each pixel driving unit PCa, PCb and PCc is omitted, but in Figure 3 In the embodiment, there may be a structure in which the transistors of each pixel driving unit PCa, PCb and PCc are connected.

[0064] exist Figure 1 and Figure 2 In the embodiment of the present invention, the first light-emitting device may include first anodes Anode11a, Anode12a, Anode21a and Anode22a, first light-emitting layers EML11a, EML12a, EML21a and EML22a, and a cathode. The second light-emitting device may include second anodes Anode11b, Anode12b, Anode21b and Anode22b, second light-emitting layers EML11b, EML12b, EML21b and EML22b, and a cathode. The third light-emitting device may include third anodes Anode11c, Anode12c, Anode21c and Anode22c, third light-emitting layers EML11c, EML12c, EML21c and EML22c, and a cathode. Figure 2 In the embodiment, the cathode can be arranged across the entire area.

[0065] exist Figure 2 In the present invention, the light-emitting region corresponding to each light-emitting device may refer to a region where a light-emitting layer included in each light-emitting device is disposed, or to a region corresponding to a pixel defining layer (refer to Figure 3 The area corresponding to the opening OP of 380 in FIG. Figure 2 The shape of each light emitting layer EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c and / or EML22c shown in FIG. Figure 3 The shape of the opening OP of 380) corresponds to that of the light emitting area.

[0066] Each luminescent layer (or Figure 3 The plane shape of the pixel defining layer 380 may have a polygonal shape such as a triangular shape or a circular shape or an elliptical shape, and according to an embodiment, the edge of the polygon may also have a sawtooth structure. Figure 2 Each light-emitting layer (or Figure 3The planar shape of the opening OP of the pixel defining layer 380.

[0067] Figure 3 The opening OP of the pixel defining layer 380 corresponding to the first light emitting layers EML11a, EML12a, EML21a and EML22a or the planar shape of the first light emitting layers EML11a, EML12a, EML21a and EML22a may be a rectangle having at least one chamfered corner, or may be in a pentagonal shape having chamfered corners. Figure 3 The opening OP of the pixel defining layer 380 corresponding to the second light-emitting layers EML11b, EML12b, EML21b and EML22b or the planar shape of the second light-emitting layers EML11b, EML12b, EML21b and EML22b may be a rectangular shape including a protrusion structure and a chamfered structure, or may include a structure including a portion extending in the second direction DR2 and a portion bent in an inclined direction, and having a chamfered structure and a protrusion structure.

[0068] Figure 3 A planar shape of the opening OP of the pixel defining layer 380 corresponding to the third light emitting layers EML11c, EML12c, EML21c, and EML22c may be a triangular structure including a protrusion structure and a chamfered structure, and Figure 2 In the embodiment of the present invention, the triangular shape may be a structure in which one corner is chamfered and two remaining corners are protruding. For example, the first light-emitting layers EML11a, EML12a, EML21a and EML22a may display a first color light, the second light-emitting layers EML11b, EML12b, EML21b and EML22b may display a second color light, and the third light-emitting layers EML11c, EML12c, EML21c and EML22c may display a third color light. The first color light, the second color light and the third color light may be lights of three primary colors.

[0069] Considering the lifetime of the material of the light emitting layer, the area of ​​each light emitting layer EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c and / or EML22c may be formed differently. For example, the area ratio may be Figure 2 Each luminescent layer (or Figure 3 The planar shape of the opening OP of the pixel defining layer 380 may vary according to the embodiment. Figure 3 The arrangement of the opening OP of the pixel defining layer 380 may vary. Figure 3 The planar shape of the opening OP of the pixel defining layer 380 in FIG. 1 may vary, but the description describes the example of Figure 2 The basic structure shown in .

[0070] exist Figure 2 , the three light emitting layers (or light emitting regions) of the first unit pixel PXU11 may be sequentially arranged in an oblique direction (also referred to as the first oblique direction DDR1) extending between the first direction DR1 and the second direction DR2. For example, the second unit pixel PXU21 may be adjacent to the first unit pixel PXU11 along the second direction DR2, and may have three light emitting layers (or light emitting regions), which are sequentially arranged in another oblique direction (also referred to as the second oblique direction DDR2), and the other oblique direction (also referred to as the second oblique direction DDR2) is symmetrical to the first oblique direction DDR1 with respect to the second direction DR2. For example, the three light emitting layers (or light emitting regions) of the second unit pixel PXU21 may be formed by rotating the three light emitting layers (or light emitting regions) of the first unit pixel PXU11 by about 90 degrees in a counterclockwise direction, and may be sequentially arranged along another oblique direction (hereinafter referred to as the second oblique direction DDR2). The second oblique direction DDR2 may extend between the second direction DR2 and the opposite direction of the first direction DR1. For example, the third unit pixel PXU12 may be adjacent to the first unit pixel PXU11 in the first direction DR1. The three light emitting layers (or light emitting regions) of the third unit pixel PXU12 may be formed by rotating the three light emitting layers (or light emitting regions) of the first unit pixel PXU11 by about 90 degrees in the clockwise direction, and may be sequentially arranged along another oblique direction (hereinafter, also referred to as the third oblique direction DDR3). The third oblique direction DDR3 may extend between the first direction DR1 and the opposite direction of the second direction DR2. For example, the fourth unit pixel PXU22 may be adjacent to the first unit pixel PXU11 in the oblique direction. The three light emitting layers (or light emitting regions) of the fourth unit pixel PXU22 may be formed by rotating the three light emitting layers (or light emitting regions) of the first unit pixel PXU11 by about 180 degrees in the clockwise direction, and may be sequentially arranged along another oblique direction (hereinafter, referred to as the fourth oblique direction DDR4), which is parallel to the first oblique direction DDR1 but at an angle of 180 degrees. The fourth oblique direction DDR4 may be opposite to the first oblique direction DDR1, and may extend between an opposite direction of the first direction DR1 and an opposite direction of the second direction DR2. Figure 2In the embodiment, the third light-emitting layer EML11c of the first unit pixel PXU11 may be adjacent to the first light-emitting layer EML12a of the third unit pixel PXU12, the first light-emitting layer EML11a of the first unit pixel PXU11 may be adjacent to the third light-emitting layer EML21c of the second unit pixel PXU21, the first light-emitting layer EML21a of the second unit pixel PXU21 may be adjacent to the third light-emitting layer EML22c of the fourth unit pixel PXU22, and the first light-emitting layer EML22a of the fourth unit pixel PXU22 may be adjacent to the third light-emitting layer EML12c of the third unit pixel PXU12.

[0071] According to the four tilt directions DDR1, DDR2, DDR3 and DDR4 mentioned above, Figure 2 As shown in , the arrangement RBL of the light emitting devices may be arranged in a rhombus shape. In the above, the tilt directions DDR1, DDR2, DDR3, and DDR4 may be arrangement directions according to the order of the first light emitting layer EML11a, EML12a, EML21a, and EML22a, the second light emitting layer EML11b, EML12b, EML21b, and EML22b, and the third light emitting layer EML11c, EML12c, EML21c, and EML22c. Figure 2 By connecting each light emitting layer in a direction in which each light emitting layer is sequentially arranged in a unit pixel group consisting of four unit pixels, the arrangement RBL of the light emitting device can be rotated along a rhombus shape. For example, by connecting the end of the first tilted direction DDR1 and the front of the second tilted direction DDR2, connecting the end of the second tilted direction DDR2 and the front of the third tilted direction DDR3, connecting the end of the third tilted direction DDR3 and the front of the fourth tilted direction DDR4, and connecting the end of the fourth tilted direction DDR4 and the front of the first tilted direction DDR1, the arrangement RBL of the light emitting device can be rotated in a rhombus shape. Therefore, light emitting layers or light emitting areas displaying the same color can be arranged not to be adjacent to each other. For example, the first virtual line VL1 may extend in the first oblique direction DDR1 and may obliquely connect the corner of the first unit pixel PXU11, the second virtual line VL2 may extend in the second oblique direction DDR2 and may obliquely connect the corner of the second unit pixel PXU21, the third virtual line VL3 may extend in the third oblique direction DDR3 and may obliquely connect the corner of the third unit pixel PXU12, the fourth virtual line VL4 may extend in the fourth oblique direction DDR4 and may obliquely connect the corner of the fourth unit pixel PXU22. The first virtual line VL1, the second virtual line VL2, the third virtual line VL3, and the fourth virtual line VL4 may form a rhombus shape.

[0072] The following will describe Figure 2The light-emitting layer (or Figure 3 The arrangement of the opening OP of the pixel defining layer 380.

[0073] First, each of the light emitting layers EML11a, EML11b, and EML11c of the first unit pixel PXU11 may be arranged in a first oblique direction DDR1 between the first direction DR1 and the second direction DR2. Figure 2 In the region of the first unit pixel PXU11, the first light emitting layer EML11a may be disposed in the lower left region, the second light emitting layer EML11b may be disposed in the middle region, and the third light emitting layer EML11c may be disposed in the upper right region.

[0074] The light emitting layers EML21a, EML21b, and EML21c of the second unit pixel PXU21 may be arranged in a second oblique direction DDR2 between the opposite direction of the first direction DR1 and the second direction DR2. Figure 2 In the region of the second unit pixel PXU21, the first light emitting layer EML21a may be disposed in the lower right region, the second light emitting layer EML21b may be disposed in the middle region, and the third light emitting layer EML21c may be disposed in the upper left region.

[0075] exist Figure 2 , the third unit pixel PXU12 may be adjacent to the first unit pixel PXU11 in the first direction DR1. Each of the light emitting layers EML12a, EML12b, and EML12c of the third unit pixel PXU12 may be arranged in an inclined direction (eg, a third inclined direction DDR3) between the first direction DR1 and the opposite direction of the second direction DR2. Figure 2 In the region of the third unit pixel PXU12, the first light emitting layer EML12a may be disposed in the upper left region, the second light emitting layer EML12b may be disposed in the middle region, and the third light emitting layer EML12c may be disposed in the lower right region.

[0076] exist Figure 2 , the fourth unit pixel PXU22 may be adjacent to the first unit pixel PXU11 along an oblique direction (e.g., a third oblique direction DDR3). Each light emitting layer EML22a, EML22b, and EML22c of the fourth unit pixel PXU22 may be arranged in a fourth oblique direction DDR4, which is a direction between the opposite direction of the first direction DR1 and the opposite direction of the second direction DR2.

[0077] For example, in Figure 2In the region of the fourth unit pixel PXU22, the first light emitting layer EML22a may be disposed in the upper right region, the second light emitting layer EML22b may be disposed in the middle region, and the third light emitting layer EML22c may be disposed in the lower left region. Figure 2 , the fourth unit pixel PXU22 may be a unit pixel disposed adjacent to the first unit pixel PXU11 in an oblique direction. Therefore, by connecting four oblique directions DDR1, DDR2, DDR3, and DDR4 in a unit pixel group including four unit pixels PXU11, PXU12, PXU21, and PXU22, the unit pixel group may have a rhombus shape like the arrangement RBL of the light emitting device.

[0078] For example, each light emitting layer EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and / or EML22c included in each unit pixel PXU11, PXU12, PXU21, and PXU22 may be disposed Figure 1 As described above, in each unit pixel, the light-emitting layer or the light-emitting region can be arranged in four different inclined directions, and in the case where the four inclined directions in the unit pixel group can be connected to form a diamond structure, the arrangement RBL of the light-emitting device can have a diamond structure, or it can be a structure in which a plurality of light-emitting layers or light-emitting regions are arranged in a diamond shape.

[0079] For example, in Figure 2 In the embodiment, a position LDP for performing a laser drilling process may be provided, and an opening OP1 may be provided to connect the upper connection electrode CE and the lower auxiliary low driving voltage line 174-1 by overlapping the connection electrode CE with the auxiliary low driving voltage line 174-1 (refer to Figure 1 174-1) electrical connection.

[0080] The laser drilling process can electrically connect the connection electrode CE and the integrally formed cathode by melting the insulating layer provided between the connection electrode CE and the cathode with a laser. However, in the case where the area of ​​the melted portion caused by the laser is wide, and in the case where the laser irradiates the anode or other conductive materials, a short circuit may occur, thereby causing a malfunction of the pixel. Therefore, a specific area needs to be allocated for the laser drilling process. Figure 2 In the embodiment, multiple light-emitting layers (or pixel defining layers (see Figure 3The opening OP) of the reference numeral 380) may have a rhombus shape arrangement so that a sufficient space for the laser drilling process may be provided in the center portion. Therefore, an improper / defective short circuit may be prevented by accurately arranging / accurately overlapping the connection electrode CE and the position LDP for the laser drilling process.

[0081] In a unit pixel group, Figure 2 The connection electrode CE and the location LDP for the laser drilling process may be formed around the corner where all the unit pixels PXU11, PXU12, PXU21, and PXU22 meet (i.e., the center portion of the unit pixel group including the unit pixels PXU11, PXU12, PXU21, and PXU22), and the connection electrode CE and the location LDP for the laser drilling process may be formed across all the unit pixels PXU11, PXU12, PXU21, and PXU22. Figure 2 In the embodiment of the present invention, in the case where a certain area is required for the connection electrode CE and the location LDP for the laser drilling process, since only 1 / 4 of the corresponding area of ​​each unit pixel PXU11, PXU12, PXU21, and PXU22 is required for forming the location LDP, the laser drilling process can be performed even in a high-resolution display device or a high-pixel-density display device. In addition, the location LDP for the laser drilling process can be formed in a position that does not overlap with each light-emitting layer, anode, and / or light-emitting region, so that the light-emitting device may not be damaged during the laser drilling process.

[0082] Reference Figure 3 A cross-sectional structure of a light-emitting display device having the same planar shape as the above-described planar shape is described. Figure 3 is based on Figure 1 A schematic cross-sectional view of a light-emitting display device of an embodiment.

[0083] exist Figure 3 In the cross-sectional view of FIG. 3 , the layers corresponding to the various layers in the light-emitting device may be referred to as light-emitting device layers, and the light-emitting device layers include an anode Anode, a cathode Cathode, a pixel defining layer 380, a functional layer FL, and a light-emitting layer EML. The conductive layer, the semiconductor layer, and the insulating layer as the driving component layer may form a transistor and a capacitor. For example, the light-emitting device may be disposed in the light-emitting device layer.

[0084] exist Figure 3 In the figure, one of the first light emitting device, the second light emitting device and the third light emitting device is shown, an opening OP set in the pixel defining layer 380 to expose a portion of the anode Anode is shown, and an opening OP2 through which current is transmitted from the transistors in the pixel driving units PCa, PCb and PCc to the anode Anode is shown.

[0085] For example, in Figure 3 In FIG. 1 , the position LDP where the laser drilling process is performed is schematically shown. Figure 3 In FIG. 1 , only one transistor is depicted to illustrate the lower structure of the anode (eg, the structure of the driving component layer). A brief description of the structure of the driving component layer from the substrate 110 to the interlayer insulating layer 161 is as follows.

[0086] The substrate 110 may include an inflexible material such as glass or a flexible material such as plastic or polyimide. In the case where the substrate 110 is a flexible substrate, the substrate 110 may have a double-layer structure having a polyimide layer and a barrier layer formed on top thereof using an inorganic insulating material.

[0087] A lower shielding layer BML including metal may be formed on the substrate 110. The lower shielding layer BML may overlap one of the channels of the transistors provided in the pixel driving units PCa, PCb, and PCc included in the pixel in a plane. According to an embodiment, the lower shielding layer BML and the low driving voltage line (refer to Figure 1 174) can be set on the same layer.

[0088] The substrate 110 and the lower shielding layer BML may be covered by a buffer layer 111. The buffer layer 111 may play a role in blocking impurities from penetrating (or penetrating) into the semiconductor layer ACT, and may include silicon oxide (SiO x ), Silicon Nitride (SiN x ) or silicon oxynitride (SiON x ) of an inorganic insulating layer. A semiconductor layer ACT formed of a silicon semiconductor (e.g., polycrystalline silicon) or an oxide semiconductor may be formed on the buffer layer 111. The semiconductor layer ACT may be a semiconductor layer provided in the pixel driving units PCa, PCb, and PCc included in the pixel. The semiconductor layer ACT may include a channel of a transistor (e.g., a driving transistor) and a first region and a second region provided on the side (e.g., opposite sides) of the channel. For example, the channel of the transistor may be a portion of the semiconductor layer ACT that overlaps with the gate electrode GE, and the first region and the second region may be portions of the semiconductor layer ACT that do not overlap with the gate electrode GE. For example, the first region and the second region provided on the side (e.g., opposite sides) of the semiconductor layer ACT may function as the first electrode and the second electrode of the transistor. The first region and the second region may not be covered by the gate electrode GE, and may have characteristics generated by a doping process or plasma treatment.

[0089] The first gate insulating layer 141 may be formed on the semiconductor layer ACT. The first gate insulating layer 141 may include silicon oxide (SiOx ), Silicon Nitride (SiN x ), Silicon Oxynitride (SiON x ) and other inorganic insulating layers.

[0090] The first gate conductive layer may include a gate electrode GE of a transistor disposed in the pixel driving units PCa, PCb, and PCc, and may be disposed above the first gate insulating layer 141. The auxiliary low drive voltage line 174-1 may be disposed in the first gate conductive layer, and in addition to the gate electrode GE of the transistor disposed in the pixel driving units PCa, PCb, and PCc, a scan line may also be formed. For example, the first gate conductive layer may include a first electrode of a capacitor in the pixel driving units PCa, PCb, and PCc. The first gate conductive layer may include a metal or a metal alloy such as aluminum (Al), copper (Cu), molybdenum (Mo), or titanium (Ti), and may be formed by a single layer or multiple layers.

[0091] After forming the first gate conductive layer, plasma treatment or doping process may be performed to make the exposed region of the semiconductor layer ACT conductive. For example, the semiconductor layer ACT covered by the gate electrode GE may not be conductive, and the portion of the semiconductor layer ACT not covered by the gate electrode GE may have the same characteristics as the conductive layer.

[0092] The interlayer insulating layer 161 may be disposed over the first gate conductive layer and the first gate insulating layer 141. The interlayer insulating layer 161 may include silicon oxide (SiO x ), Silicon Nitride (SiN x ), Silicon Oxynitride (SiON x ) and the like, and according to the embodiment, a thick inorganic insulating material layer may be formed. For example, according to the embodiment, the interlayer insulating layer 161 may be formed as an organic insulating layer and may include one or more materials selected from polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0093] An anode layer including an anode Anode and a connection electrode CE may be disposed on the interlayer insulating layer 161. The anode Anode may be connected to a second region of the semiconductor layer ACT serving as a second electrode of the transistor through an opening OP2 (hereinafter, referred to as an anode opening) disposed in the interlayer insulating layer 161 and the first gate insulating layer 141. As a result, the anode Anode may receive an output of the transistor.

[0094] The connection electrode CE may be formed of the same material as the anode Anode and may be connected to the auxiliary low driving voltage line 174-1 through an opening OP1 (such as an opening for a laser drilling process) provided in the interlayer insulating layer 161. As a result, the connection electrode CE may receive the low driving voltage ELVSS.

[0095] The anode layer may be formed of a single layer or multiple layers including a transparent conductive oxide or a metal material. The transparent conductive oxide may include indium tin oxide (ITO), polycrystalline-ITO, indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), and indium tin zinc oxide (ITZO). The metal material may include silver (Ag), molybdenum (Mo), copper (Cu), gold (Au), and aluminum (Al).

[0096] A pixel defining layer 380 including an opening OP may be disposed above the anode layer. The opening OP of the pixel defining layer 380 (such as a light emitting device opening) corresponds to the light emitting region and / or the light emitting layer EML, thereby exposing a portion of the anode Anode, and the opening OP of the pixel defining layer 380 may have a tapered sidewall.

[0097] The light emitting layer EML may be disposed in the opening OP of the pixel defining layer 380, and according to an example, as shown in FIG. Figure 3 As shown in , the light emitting layer EML may also be disposed on the pixel defining layer 380. The light emitting layer EML may be formed by an inkjet method, and according to an embodiment, the light emitting layer EML may include at least one quantum dot material. In the case where the light emitting layer EML is formed by an inkjet method, the pixel defining layer 380 may perform a role of separating / separating the injected liquid. For example, the light emitting layer EML may be disposed only in the opening OP of the pixel defining layer 380.

[0098] The light emitting layer EML may include a quantum dot material, and according to an embodiment, a color conversion layer including the quantum dot material may be separately disposed above the cathode. In the specification, a quantum dot may be a crystal of a semiconductor compound, and may include any material that emits light of various wavelengths according to the size of the crystal or the control of the element ratio in the quantum dot compound. For example, the diameter of the quantum dot may have a range of about 1 nm to about 10 nm.

[0099] Quantum dots can be synthesized by wet chemical processes, metal organic chemical deposition processes, molecular beam epitaxy processes or similar processes. A wet chemical process can be a method of growing quantum dot particles by mixing an organic solvent and a precursor material. In the case of crystal growth, the organic solvent can naturally act as a dispersant deposited on the surface of the quantum dot crystal, and it controls the growth of the crystal. Therefore, the growth of quantum dot particles can be easily controlled and can be performed at a lower cost than processes such as metal organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE).

[0100] The quantum dots may include Group III-VI semiconductor compounds, Group II-VI semiconductor compounds, Group III-V semiconductor compounds, Group I-III-VI semiconductor compounds, Group IV-VI semiconductor compounds, Group IV elements or compounds, or any combination thereof.

[0101] Examples of II-VI semiconductor compounds may include binary compounds (such as CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, etc.), ternary compounds (such as CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, Cd ZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, etc.), quaternary compounds (such as CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, etc.) or any combination thereof.

[0102] Examples of III-V semiconductor compounds may include binary compounds (such as GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, etc.), ternary compounds (such as GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InAlP, InNAs, InNSb, InPAs, InPSb, GaAlNP, etc.), quaternary compounds (such as GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, etc.), or any combination thereof. For example, the III-V semiconductor compounds may also include Group II elements. Examples of Group III-V semiconductor compounds may also include Group II elements such as InZnP, InGaZnP, InAlZnP, and the like.

[0103] Examples of III-VI semiconductor compounds may include binary compounds such as GaS, Ga 2 S 3 ,GaSe,Ga 2 Se 3 、GaTe、InS、InSe、In2 Se 3 etc.), ternary compounds (such as InGaS 3 and InGaSe 3 ) or any combination thereof.

[0104] Examples of Group I-III-VI semiconductor compounds may include ternary compounds such as AgInS, AgInS 2 、AgInSe 2 、AgGaS、AgGaS 2 、AgGaSe 2 、CuInS、CuInS 2 、CuInSe 2 、CuGaS 2 、CuGaSe 2 、CuGaO 2 、AgGaO 2 、AgAlO 2 etc.), quaternary compounds (such as AgInGaS 2 and AgInGaSe 2 ) or any combination thereof.

[0105] Examples of IV-VI semiconductor compounds may include binary compounds (such as SnS, SnSe, SnTe, PbS, PbSe, PbTe, etc.), ternary compounds (such as SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, etc.), quaternary compounds (such as SnPbSSe, SnPbSeTe, and SnPbSTe), or any combination thereof.

[0106] The Group IV element or compound may include a simple substance (such as Si, Ge, etc.), a binary compound (such as SiC, SiGe, etc.), or any combination thereof.

[0107] Each element included in a multi-component compound such as a binary compound, a ternary compound, and a quaternary compound may be included in the particle at a uniform concentration or a non-uniform concentration. For example, the chemical formula refers to the kind of element included in the compound, and the ratio of the elements in the compound may be different. For example, AgInGaS 2 Can refer to AgIn x Ga 1-x S 2 Here, x may be a real number between 0 and 1. For example, the quantum dot may have a single structure or a dual core-shell structure in which the concentration of each element included in the quantum dot is uniform.

[0108] For example, the material included in the core and the material included in the shell may be different from each other. The shell of the quantum dot may be used as a protective layer to maintain the semiconductor properties by preventing the chemical denaturation of the core and / or as a charging layer for imparting electrophoretic properties to the quantum dot. The shell may be a single layer or a multilayer. The interface between the core and the shell may have a concentration gradient in which the concentration of the element included in the shell decreases toward the center.

[0109] Examples of quantum dot shells may include metal or non-metal oxides, semiconductor compounds, or combinations thereof. Examples of metal or non-metal oxides include binary compounds (such as SiO 2 、Al 2 O 3 、TiO 2 、ZnO、MnO、Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 , NiO, etc.), ternary compounds (such as MgAl 2 O 4 、CoFe 2 O 4 、NiFe 2 O 4 、CoMn 2 O 4 The semiconductor compound may include, for example, a III-VI semiconductor compound, a II-VI semiconductor compound, a III-V semiconductor compound, a III-VI semiconductor compound, a I-III-VI semiconductor compound, a IV-VI semiconductor compound, or any combination thereof. For example, the semiconductor compound may be CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaS, GaSe, AgGaS, AgGaS2, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, or any combination thereof.

[0110] The quantum dots may have a full width at half maximum (FWHM) of an emission wavelength spectrum of about 45 nm or less (e.g., about 40 nm or less, e.g., about 30 nm or less), and may improve color purity or color reproducibility within this range. For example, since light emitted by the quantum dots is emitted in all directions, a wide viewing angle may be improved.

[0111] For example, the shape of the quantum dot can be in the form of spherical, pyramidal, multi-armed or cubic nanoparticles, nanotubes, nanowires, nanofibers, nanosheets, etc. Since the energy band gap is controlled by adjusting the size of the quantum dot or the ratio of elements in the quantum dot compound, light of various wavelengths can be generated from the quantum dot light emitting layer.

[0112] Therefore, by using quantum dots as described above (by using quantum dots of different sizes or having different ratios of elements in the quantum dot compound), a light emitting device that emits light of various wavelengths can be realized. For example, the size of the quantum dots or the ratio of elements in the quantum dot compound can be selected to emit red light, green light and / or blue light. For example, quantum dots can be configured to emit white light by combining light of various colors.

[0113] For example, the first functional layer FL1 may be disposed between the anode Anode and the light-emitting layer EML, and the second functional layer FL2 may be disposed above the light-emitting layer EML. For example, the first functional layer FL1 may include a charge injection layer and / or a charge transport layer, and the second functional layer FL2 may include an electron transport layer and / or an electron injection layer. For example, the combination of the functional layer FL and the light-emitting layer EML may be referred to as an intermediate layer. The first functional layer FL1 and the second functional layer FL2 may also be formed in the opening OP of the pixel defining layer 380. Therefore, in Figure 3 In the embodiment of the present invention, all of the intermediate layers may be disposed in the upper portion of the pixel defining layer 380 and in the opening OP. However, according to the embodiment, although the functional layer FL may be formed over the pixel defining layer 380 and in the opening OP, the light emitting layer EML may be disposed only in the opening OP of the pixel defining layer 380.

[0114] The cathode Cathode formed on the pixel defining layer 380 and the opening OP may be disposed above the second functional layer FL2. The anode Anode, the light emitting layer EML, and the cathode Cathode may form a light emitting device, and the light emitting device may include the functional layer FL. The current transmitted through the anode Anode may be transmitted to the cathode Cathode through the first functional layer FL1, the light emitting layer EML, and the second functional layer FL2. Therefore, the light emitting layer EML may emit light due to the current flowing therethrough, so that the first light emitting device may exhibit brightness.

[0115] Reference Figure 3 , the cathode Cathode may be connected to the connection electrode CE at the location LDP where the laser drilling process is performed, and may receive the low driving voltage ELVSS from the auxiliary low driving voltage line 174-1 through the connection electrode CE. Figure 3, the cross-sectional structure of the position LDP where the laser drilling process is performed is shown, and the cathode Cathode, the functional layer FL and the light emitting layer EML can be connected to the connection electrode CE below in a clean manner through the opening OP of the pixel defining layer 380. However, since the cathode Cathode and the connection electrode CE can be electrically connected by melting the intermediate layer and the pixel defining layer 380 by laser, Figure 3 Compared to the relatively unclean cross-section structure.

[0116] For example, according to an embodiment, a spacer may be further formed on the pixel defining layer 380, and the spacer may have a tapered sidewall similar to the pixel defining layer 380. For example, an encapsulation layer may be provided according to an embodiment. The encapsulation layer may include at least one inorganic layer and at least one organic layer, and may have a three-layer structure including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The encapsulation layer may protect the light-emitting layer EML from moisture or oxygen penetrating from the outside. According to an embodiment, the encapsulation layer may include a structure in which an inorganic layer and an organic layer are stacked in sequence.

[0117] According to an embodiment, a sensing insulating layer and a sensing electrode may be disposed on the encapsulation layer for touch sensing.

[0118] According to an embodiment, a film including a polarizer may be attached to the encapsulation layer to reduce the reflection of external light. For example, a color filter or a color conversion layer may be further formed to improve the color quality, and a polarizer may not be attached. A light blocking layer may be provided between the color filter or the color conversion layer. For example, according to an embodiment, a layer having a material capable of absorbing some wavelengths of external light (hereinafter referred to as a reflection regulating material) may also be included, and a polarizer may not be attached. For example, according to an embodiment, the front surface of the light-emitting display device may be flattened by covering the front surface of the light-emitting display device with an additional organic layer (also referred to as a flattening layer).

[0119] Figure 3 is a cross-sectional structure according to an embodiment, and various deformable structures may be feasible. Figure 4 A circuit structure of a pixel included in a light-emitting display device is described.

[0120] Figure 4 FIG. 1 is a schematic diagram of an equivalent circuit of a pixel of a light-emitting display device according to an embodiment. Figure 4 , a circuit diagram of three pixels PXa, PXb and PXc is shown.

[0121] The plurality of pixels may include a first pixel PXa, a second pixel PXb, and a third pixel PXc. The first pixel PXa, the second pixel PXb, and the third pixel PXc may each include a plurality of transistors T1, T2, and T3, a storage capacitor Cst, and light emitting devices EDa, EDb, and EDc. For example, each pixel PXa, PXb, and PXc may be distinguished by light emitting devices EDa, EDb, and EDc and pixel driving units PCa, PCb, and PCc, and the pixel driving units PCa, PCb, and PCc may be connected to the light emitting devices EDa, EDb, and EDc. Figure 1 The dotted line in the figure corresponds to the part indicated by the dotted line.

[0122] Reference Figure 4 , the pixel driving units PCa, PCb, and PCc may include a plurality of transistors T1, T2, and T3 corresponding to portions other than the light emitting devices EDa, EDb, and EDc from each pixel PXa, PXb, and PXc, and a storage capacitor Cst. For example, according to an embodiment, capacitors (Cleda, Cledb, and Cledc, hereinafter referred to as light emitting capacitors) connected to ends (e.g., opposite ends) of the light emitting devices EDa, EDb, and EDc may be included, and the light emitting capacitors Cleda, Cledb, and Cledc may not be included in the pixel driving units PCa, PCb, and PCc, and may be included in the light emitting devices EDa, EDb, and EDc.

[0123] A plurality of transistors T1, T2 and T3 may include a single driving transistor T1 (also referred to as a first transistor) and two switching transistors T2 and T3, and the two switching transistors T2 and T3 are distinguished as an input transistor T2 (also referred to as a second transistor) and an initialization transistor T3 (also referred to as a third transistor). Each transistor T1, T2 and T3 may include a gate electrode, a first electrode and a second electrode, and may also include a semiconductor layer including a channel. Therefore, a current may flow or be blocked in a channel of a semiconductor layer according to a voltage of a gate electrode. For example, the first electrode and the second electrode may be a source electrode or a drain electrode according to a voltage applied to transistors T1, T2 and T3. The gate electrode of the driving transistor T1 may be connected to an end of a storage capacitor Cst, and it is also connected to a second electrode (e.g., an output side electrode) of the input transistor T2.

[0124] In addition, the first electrode of the driving transistor T1 can be connected to the driving voltage line transmitting the driving voltage ELVDD, and the second electrode of the driving transistor T1 can be connected to the anode Anode of the light emitting devices EDa, EDb and EDc, the discharge terminal (i.e., the first electrode) of the storage capacitor Cst, the first electrode of the initialization transistor T3 and the ends of the light emitting capacitors Cleda, Cledb and Cledc. The driving transistor T1 can receive the data voltages DVa, DVb and DVc through the switching operation of the input transistor T2, and can supply the driving current to the light emitting devices EDa, EDb and EDc according to the voltage of the gate electrode. Therefore, the storage capacitor Cst can store and can maintain the voltage of the gate electrode of the driving transistor T1.

[0125] The gate electrode of the input transistor T2 may be connected to the first scan signal line 151 transmitting the first scan signal SC. The first electrode of the input transistor T2 may be connected to the data lines 171a, 171b, and 171c transmitting the data voltages DVa, DVb, and DVc, and the second electrode of the input transistor T2 may be connected to the first electrode of the storage capacitor Cst and the gate electrode of the driving transistor T1.

[0126] A plurality of data lines 171a, 171b, and 171c may transmit different data voltages DVa, DVb, and DVc, respectively, and the input transistor T2 of each pixel PXa, PXb, and PXc may be connected to different data lines 171a, 171b, and 171c. Since the gate electrode of the input transistor T2 of each pixel PXa, PXb, and PXc may be connected to the same first scan signal line 151, they may receive the first scan signal SC at the same timing. The input transistor T2 of each pixel PXa, PXb, and PXc may be turned on at the same timing by the first scan signal SC at the same time, but different data voltages DVa, DVb, and DVc may be transmitted to the gate electrode of the driving transistor T1 and the storage capacitor Cst of each pixel PXa, PXb, and PXc through different data lines 171a, 171b, and 171c.

[0127] Figure 4 This is an embodiment in which the gate electrode of the initialization transistor T3 and the gate electrode of the input transistor T2 receive different scan signals.

[0128] The gate electrode of the initialization transistor T3 may be connected to the second scan signal line 151-1 transmitting the second scan signal SS. The first electrode of the initialization transistor T3 may be connected to the cathode (i.e., the second electrode) of the storage capacitor Cst, the second electrode of the driving transistor T1, the anode Anode of the light emitting devices EDa, EDb, and EDc, and the cathodes of the light emitting capacitors Cleda, Cledb, and Cledc. The second electrode of the initialization transistor T3 may be connected to the initialization voltage line 173 transmitting the initialization voltage VINT. The initialization transistor T3 may be turned on according to the second scan signal SS, and may transmit the initialization voltage VINT to the anodes of the light emitting devices EDa, EDb, and EDc, the cathodes of the light emitting capacitors Cleda, Cledb, and Cledc, and the terminal (i.e., the second electrode) of the storage capacitor Cst to reset the voltage of the anodes of the light emitting devices EDa, EDb, and EDc.

[0129] The initialization voltage line 173 can also perform the function of sensing the voltage of the anode of the light emitting devices EDa, EDb and EDc before applying the initialization voltage VINT, thereby being used as the sensing wiring SL. Through the sensing operation, it can be confirmed whether the voltage of the anode is maintained at the target voltage. The sensing operation can be separated from the initialization operation of transmitting the initialization voltage VINT in time, and the initialization operation can be performed after the sensing operation is performed.

[0130] exist Figure 4 In the embodiment, since the turn-on periods of the initialization transistor T3 and the input transistor T2 are different, the writing operation performed by the input transistor T2 and the initialization operation (and / or sensing operation) performed by the initialization transistor T3 can be performed at different times.

[0131] A first end (i.e., a first electrode) of the storage capacitor Cst may be connected to the gate electrode of the driving transistor T1 and the second electrode of the input transistor T2, and the other end (i.e., a second electrode) of the storage capacitor Cst may be connected to the first electrode of the initialization transistor T3, the second electrode of the driving transistor T1, the anode of the light-emitting device EDa, EDb or EDc, and the first end (i.e., a cathode) of the light-emitting capacitor Cleda, Cledb or Cledc.

[0132] The light emitting devices EDa, EDb and EDc may receive the output current of the driving transistor T1 through the anode, and the cathodes of the light emitting devices EDa, EDb and EDc may receive the low driving voltage ELVSS through the auxiliary low driving voltage line 174-1. The light emitting devices EDa, EDb and EDc may emit light according to the output current of the driving transistor T1.

[0133] For example, the light emitting capacitors Cleda, Cledb, and Cledc may be formed at end portions (e.g., opposite end portions) of the light emitting devices EDa, EDb, and EDc so that the voltage across the light emitting devices EDa, EDb, and EDc may be kept constant. Therefore, the light emitting devices EDa, EDb, and EDc may display constant brightness.

[0134] Hereinafter, a method having the following characteristics will be described. Figure 4 The operation of the pixel of the circuit shown in FIG.

[0135] exist Figure 4 In the embodiment, each of the transistors T1, T2, and T3 may be an N-type transistor and may be turned on when a high level voltage is applied to a gate electrode. However, according to an embodiment, each of the transistors T1, T2, and T3 may be a P-type transistor.

[0136] In the case where the emission period ends, a frame may start. Thereafter, a high-level second scan signal SS may be supplied to turn on the initialization transistor T3. In the case where the initialization transistor T3 is turned on, an initialization operation and / or a sensing operation may be performed.

[0137] An embodiment in which both the initialization operation and the sensing operation are performed will be described below.

[0138] The sensing operation may be performed before the initialization operation is performed. For example, when the initialization transistor T3 is turned on, the initialization voltage line 173 may perform the role of the sensing wiring SL to sense the voltage of the anode of the light emitting devices EDa, EDb, and EDc. Through the sensing operation, it may be sensed whether the voltage of the anode is maintained at the target voltage.

[0139] Thereafter, an initialization operation may be performed, and voltages of the storage capacitor Cst, the second electrode of the driving transistor T1, and the anodes of the light emitting devices EDa, EDb, and EDc may be changed to the initialization voltage VINT transmitted from the initialization voltage line 173 to perform the initialization operation.

[0140] As described above, the sensing operation and the initialization operation of transmitting the initialization voltage VINT can be separated in time, so that the pixel can perform various operations using a minimum number of transistors and reducing the area occupied by the pixel. As a result, the resolution of the display panel can be improved.

[0141] When the first scan signal SC is changed to a high level, the first scan signal SC is applied together with the initialization operation or at a separate timing so that the input transistor T2 can be turned on and an input operation can be performed. For example, the data voltages DVa, DVb, and DVc from the data lines 171a, 171b, and 171c can be input through the turned-on input transistor T2 and stored at the gate electrode of the driving transistor T1 and the end of the storage capacitor Cst. The data voltages DVa, DVb, and DVc and the initialization voltage VINT can be applied to the ends (e.g., opposite ends) of the storage capacitor Cst through the initialization operation and the write operation.

[0142] When the initialization transistor T3 is turned on, when an output current is generated from the driving transistor T1, because the output current can be output to the outside through the initialization transistor T3 and the initialization voltage line 173, the output current may not be input to the anodes of the light emitting devices EDa, EDb and EDc.

[0143] For example, during the input period of the first scan signal SC having a high level voltage, the driving voltage ELVDD may be applied as a low level voltage, or the low driving voltage ELVSS may be applied as a high level voltage to prevent current from flowing through the light emitting devices EDa, EDb, and EDc. Thereafter, when the first scan signal SC changes to a low level, the driving transistor T1 may generate and output an output current based on the high level driving voltage ELVDD applied to the driving transistor T1 and the gate voltage of the driving transistor T1 stored in the storage capacitor Cst. The output current of the driving transistor T1 may be input to the light emitting devices EDa, EDb, and EDc, and a light emitting operation may be performed at a position where the light emitting devices EDa, EDb, and EDc emit light.

[0144] In the following, reference will be made to Figure 5 , Figure 6 , Figure 7 and Figure 8 describe Figure 2 A modified embodiment of the embodiment. Figure 5 , Figure 6 , Figure 7 and Figure 8 is a schematic plan view illustrating a light emitting device and a position of a laser drilling process in a light emitting display device according to an embodiment.

[0145] exist Figure 5In the embodiment of the present invention, the anode opening OP2 may be added to electrically connect each anode Anode11a, Anode12a, Anode21a, Anode22a, Anode11b, Anode12b, Anode21b, Anode22b, Anode11c, Anode12c, Anode21c and / or Anode22c to the transistors of the pixel driving units PCa, PCb and PCc, and the pixel driving units PCa, PCb and PCc include the following: Figure 2 Each unit pixel PXU11, PXU12, PXU21, and PXU22 shown in FIG. Therefore, the shape of the anodes Anode11a, Anode12a, Anode21a, Anode22a, Anode11b, Anode12b, Anode21b, Anode22b, Anode11c, Anode12c, Anode21c, and / or Anode22c may be changed.

[0146] In order to arrange the light-emitting region or light-emitting layer as Figure 1 and Figure 2 The diamond shape shown in the figure can change the position of the anode opening OP2 for each unit pixel PXU11, PXU12, PXU21 and PXU22, and therefore, the shape of each anode Anode11a, Anode12a, Anode21a, Anode22a, Anode11b, Anode12b, Anode21b, Anode22b, Anode11c, Anode12c, Anode21c and / or Anode22c can also be modified.

[0147] For example, the anodes Anode11b, Anode12b, Anode21b, and Anode22b disposed in the middle region of each unit pixel PXU11, PXU12, PXU21, and PXU22 may overlap with the second light-emitting layers EML11b, EML12b, EML21b, and EML22b in a plan view and have a protrusion, and the protrusion and the anode opening OP2 for the anode may overlap each other in a plan view.

[0148] For example, the remaining anodes Anode11a, Anode12a, Anode21a, Anode22a, Anode11c, Anode12c, Anode21c and / or Anode22c may have a portion in a plan view that is formed wider than the corresponding light-emitting layers EML11a, EML12a, EML21a, EML22a, EML11c, EML12c, EML21c and / or EML22c, and the portion may have a structure in which an anode opening OP2 for the anode is provided.

[0149] Figure 5 The detailed structure is as follows.

[0150] Three light emitting devices may be disposed above the three pixel driving units PCa, PCb, and PCc included in each of the unit pixels PXU11, PXU12, PXU21, and PXU22. Figure 1 and Figure 5 , the first pixel driving unit PCa can be connected to each of the first anodes Anode11a, Anode12a, Anode21a and Anode22a through the anode opening OP2, the second pixel driving unit PCb can be connected to each of the second anodes Anode11b, Anode12b, Anode21b and / or Anode22b through the anode opening OP2, and the third pixel driving unit PCc can be connected to each of the third anodes Anode11c, Anode12c, Anode21c and Anode22c through the anode opening OP2. Figure 5 Each anode Anode11a, Anode12a, Anode21a, Anode22a, Anode11b, Anode12b, Anode21b, Anode22b, Anode11c, Anode12c, Anode21c and / or Anode22 may have a protrusion, and the protrusion may be connected to each pixel driving unit PCa, PCb and PCc through the anode opening OP2.

[0151] exist Figure 6 and Figure 7 In the figure, it is shown that Figure 2 Examples of light-emitting layers or light-emitting regions having different planar shapes. Figure 6 and Figure 7 In the description, the pixel defining layer (refer to Figure 3 380) in the opening (refer to Figure 3 The shapes of the light emitting layers EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c and / or EML22c disposed in the openings.

[0152] and Figure 2 Differently, the anode is not shown separately. Figure 6 and Figure 7 , the position LDP where the laser drilling process is performed is also shown, and the connection electrode CE disposed under the opening OP is overlapped and the connection electrode CE and the auxiliary low driving voltage line (refer to Figure 1The 174-1) is electrically connected to the opening OP1.

[0153] First, the following will describe Figure 6 Embodiment of the invention.

[0154] exist Figure 6 In the embodiment of the present invention, the pixel defining layer (refer to Figure 3 The opening OP corresponding to the first light emitting layers EML11a, EML12a, EML21a and EML22a or the planar shape of the first light emitting layers EML11a, EML12a, EML21a and EML22a may be a triangle with at least one chamfered corner, and Figure 6 In an embodiment, three corners of the triangular shape may be chamfered to have a hexagonal shape.

[0155] Pixel defining layer (refer to Figure 3 The planar shape of the opening OP corresponding to the second light emitting layers EML11b, EML12b, EML21b, and EML22b of 380) may be a hexagon or a rectangle having at least one chamfered corner, and Figure 6 In an embodiment, four corners of the quadrilateral shape may be chamfered to form a hexagonal shape.

[0156] A plane shape of the opening OP of the pixel defining layer corresponding to the third light emitting layers EML11c, EML12c, EML21c, and EML22c (or a plane shape of the opening OP of the third light emitting layers EML11c, EML12c, EML21c, and EML22c) may be a triangle having at least one chamfered corner, and Figure 6 In an embodiment, three corners of the triangle may be chamfered to form a hexagonal shape.

[0157] In the above content, the first light-emitting layers EML11a, EML12a, EML21a and EML22a can display the first color light among the three primary colors, the second light-emitting layers EML11b, EML12b, EML21b and EML22b can display the second color light among the three primary colors, and the third light-emitting layers EML11c, EML12c, EML21c and EML22c can display the third color light among the three primary colors.

[0158] For example, the region corresponding to each color of each light emitting layer EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and / or EML22c may be variably formed in consideration of the lifetime of the material of the light emitting layer. Figure 6 The area ratios shown in can be changed variously.

[0159] exist Figure 7 In the figure, it is shown that Figure 2 and Figure 6 The planar shape of the light-emitting layer or the light-emitting region is different from that of the planar shape. Figure 7 In the embodiment of the present invention, the pixel defining layer (refer to Figure 3 The plane shape of the opening OP corresponding to the first light emitting layer EML11a, EML12a, EML21a, and EML22a (or the plane shape of the opening OP of the first light emitting layer EML11a, EML12a, EML21a, and EML22a) may be a triangle having at least one chamfered corner. For example, the corners adjacent to the dotted line area divided by each unit pixel PXU11, PXU12, PXU21, and PXU22 in the triangle shape of the first light emitting layer EML11a, EML12a, EML21a, and EML22a may not be chamfered, and the remaining two corners may have a chamfered structure. As a result, the plane shape of the opening OP may have a pentagonal shape.

[0160] Pixel defining layer (refer to Figure 3 The planar shape of the opening OP corresponding to the second light emitting layers EML11b, EML12b, EML21b, and EML22b (or the planar shape of the opening OP of the second light emitting layers EML11b, EML12b, EML21b, and EML22b) may be a hexagonal shape or a rectangle having at least one corner cut off. Figure 6 In an embodiment, two opposite corners of the rectangular shape may be cut off to have a hexagonal shape.

[0161] Pixel defining layer (refer to Figure 3 The planar shape of the opening OP corresponding to the third light-emitting layers EML11c, EML12c, EML21c, and EML22c (or the planar shape of the opening OP of the third light-emitting layers EML11c, EML12c, EML21c, and EML22c) may be a hexagonal shape, a heptagonal shape, or a square shape having at least one chamfered corner, and Figure 6 In an embodiment, two opposite corners of the square shape may be chamfered to form a hexagonal shape.

[0162] In the above, the first light-emitting layers EML11a, EML12a, EML21a and EML22a can display the first color light among the three primary colors, the second light-emitting layers EML11b, EML12b, EML21b and EML22b can display the second color light among the three primary colors, and the third light-emitting layers EML11c, EML12c, EML21c and EML22c can display the third color light among the three primary colors. For example, the region corresponding to each color of each light-emitting layer EML11a, EML12a, EML21a, EML22a, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c and / or EML22c can be formed in various ways according to the lifetime of the material constituting the light-emitting layer. For example, Figure 7 The area ratios shown in can be changed variously.

[0163] exist Figure 8 Embodiments (i.e., Figure 2 In a modified embodiment of Figure 2 Different from the embodiment of the present invention, a position LDP2 for performing a laser drilling process is formed at a position where the edges of four adjacent unit pixel groups meet. For example, the position LDP2 for performing laser drilling can be set throughout all four unit pixel groups. For example, a connection electrode (or additional connection electrode) CE2 set below the position LDP2 for performing laser drilling can also be formed, and an opening OP1 can also be formed to connect the connection electrode CE2 and the auxiliary low driving voltage line (refer to Figure 1 174-1) electrical connection. Figure 8 In, with Figure 2 Similarly to the embodiment of the present invention, the location LDP for the laser drilling process and the connection electrode CE may be formed in each unit pixel group. However, in another example, the laser drilling process may not be performed in each unit pixel group. That is, Figure 8 and Figure 2 The difference is that a location LDP2 where the laser drilling process is performed and a connection electrode CE2 are additionally provided. The connection electrode CE2 may be similar to the connection electrode CE except for the location of the connection electrode CE2 in a plan view.

[0164] Figure 8 The detailed structure is as follows.

[0165] exist Figure 8, a total of 16 unit pixels are shown in dotted lines, and the 16 unit pixels may be divided into four unit pixel groups, each unit pixel group including four unit pixels PXU11, PXU12, PXU21, and PXU22. Each unit pixel group may have four unit pixels PXU11, PXU12, PXU21, and PXU22 arranged in a 2×2 matrix. Each unit pixel group may have a rhombus shape arrangement RBL of the light emitting device.

[0166] exist Figure 8 In the embodiment, a location LDP for a laser drilling process may be provided at a central portion of each unit pixel group (eg, where the corners of all four unit pixels PXU11, PXU12, PXU21, and PXU22 meet). Figure 8 In the embodiment, the opening OP1 may be formed to connect the connection electrode CE disposed below the position LDP where the laser drilling process is performed and the auxiliary low driving voltage line 174-1. The opening OP1 may overlap the connection electrode CE to be electrically connected to the auxiliary low driving voltage line (refer to Figure 1 174-1).

[0167] According to an embodiment, each unit pixel group may not have a location LDP for a laser drilling process.

[0168] Four unit pixel groups having such a structure may be arranged in a 2×2 matrix, and a position LDP2 where a laser drilling process is performed may be formed at a position where corners of all four unit pixel groups meet. Figure 8 In the example, the opening OP1 can be arranged to be aligned with the auxiliary low drive voltage line (refer to Figure 1 174-1) and the connection electrode CE2 disposed below the position LDP2 where the laser drilling process is performed, and the auxiliary low driving voltage line (reference Figure 1 174-1) is electrically connected to the connection electrode CE2 disposed below the location LDP2 where the laser drilling process is performed. In the case where only four adjacent unit pixels disposed around the location LDP2 where the laser drilling process is performed are considered, as shown in FIG. Figure 8 As shown in the figure, the arrangement of the light-emitting devices (the arrangement of the corners of the four unit pixel groups adjacent to each other) RBL2 can have a diamond structure, and the multiple light-emitting layers or light-emitting areas in the four unit pixels adjacent to the position LDP2 where the laser drilling process is performed are also arranged in a diamond shape.

[0169] Figure 8 is based on Figure 2 The embodiment of the embodiment is realized by the embodiment of Figures 5 to 7 Modifications of modifications.

[0170] Table 1 is a table comparing display characteristics according to the embodiment and the comparative example, and Fig. 9 This is a diagram comparing the schematic diagrams and pictures of the unit pixel patterns of the comparative example and the embodiment in Table 1. Fig. 9 In the figure, (A) is a schematic diagram and a picture of a unit pixel pattern of Comparative Example 1, (B) is a schematic diagram and a picture of a unit pixel pattern of Comparative Example 2, (C) is a schematic diagram and a picture of a unit pixel pattern of Comparative Example 3, and (D) is a schematic diagram and a picture of a unit pixel pattern of an embodiment. Fig. 9 and Table 1, will compare and describe Figure 6 The display characteristics of the embodiments and various comparative examples. Fig. 9 and Table 1, with Figure 6 The embodiment of the present invention shows the arrangement of the light emitting regions within the unit pixel (PXU) of the three comparative examples together. Except for the arrangement of the light emitting regions, the three comparative examples and the embodiment can be formed identically. For example, the thickness of the color filter (CF) formed in the light emitting display device can also be formed equally, and the aperture ratios of red (R), green (G), and blue (B) can also be formed equally.

[0171] Table 1

[0172]

[0173]

[0174] The three comparative examples and the embodiment with the above-described settings have differences in color efficiency, color matching rate, reflectivity, and reflected color, but they can all be included in the usable range and may not have large differences. For example, Fig. 9 The color coordinate values ​​described in Table 1 may be values ​​on the CIE 1931 color space.

[0175] However, the three comparative examples have disadvantages compared to the embodiment in terms of the color development phenomenon, which means that in the case of displaying white within a black background, a specific color may be visible at the boundary between black and white. Fig. 9 The colors of Table 1 are represented by numerical values, and the higher the corresponding numerical value, the better the color.

[0176] In Comparative Example 1, green and magenta are well visible from the top and bottom, and in Comparative Example 3, red is well visible from the bottom and cyan is recognizable / observable from the top.

[0177] In contrast, in an embodiment, the colors on the left and bottom are similar to each other, and the colors on the top and right may be similar to each other, but the values ​​in each direction may not be high, so the colors may not be very visible to the user.

[0178] For example, in Comparative Example 2, the color development phenomenon may be smaller than that in the embodiment, but in the case of forming a unit pixel pattern as in Comparative Example 2, since space for the laser drilling process cannot be formed, Comparative Example 2 is difficult to be adopted when a laser drilling process is required.

[0179] Therefore, in the embodiment, even if the area of ​​the pixel is reduced at high resolution, the laser drilling process can be performed and the color development phenomenon can be improved. For example, hereinafter, unlike the above-mentioned embodiment, an embodiment in which light emitting layers of the same color are disposed adjacent to each other will be described.

[0180] Fig.10 is a schematic plan view showing a light emitting device according to an embodiment and a location for a laser drilling process. Fig.10 In, with Figure 2 Similarly, only two unit pixels PXU12 and PXU22 disposed in the right column of the unit pixel groups arranged in a diamond shape are shown. Fig.10 In the embodiment, two light emitting layers EML12c and EML22c corresponding to the same color are arranged adjacent to each other. Fig.10 In the embodiment, each of the light emitting layers EML12a, EML12b, and EML12c of the third unit pixel PXU12 may be obliquely arranged in an oblique direction between the first direction DR1 and the opposite direction of the second direction DR2.

[0181] For example, in the region of the third unit pixel PXU12, the first light emitting layer EML12a may be disposed in the upper left region, the second light emitting layer EML12b may be disposed in the middle region, and the third light emitting layer EML12c may be disposed in the lower right region. For example, each of the light emitting layers EML22a, EML22b, and EML22c of the fourth unit pixel PXU22 may be arranged obliquely in an oblique direction between the opposite direction of the first direction DR1 and the opposite direction of the second direction DR2.

[0182] In addition, in the region of the fourth unit pixel PXU22, the first light emitting layer EML22a may be disposed in the lower left region, the second light emitting layer EML22b may be disposed in the middle region, and the third light emitting layer EML22c may be disposed in the upper right region. Fig.10 In a region marked with a dotted line in FIG. 1 , two adjacent unit pixels PXU12 and PXU22 may have third light emitting layers EML12c and EML22c of the same color arranged adjacent to each other.

[0183] Compared with other embodiments, Fig.10 The embodiment has the following disadvantages.

[0184] although Fig.10 The embodiment is a light-emitting display device for displaying a high-resolution image, but the third light-emitting layers EML12c and EML22c of the same color are adjacent to each other, so that the two third light-emitting layers EML12c and EML22c are Fig.10 The images may be grouped by dotted lines, so there is a problem that the user recognizes the light-emitting layer or the light-emitting device as a relatively low-resolution image.

[0185] For example, in Fig.10 In the embodiment of the present invention, the first light emitting layers EML12a and EML22a are disposed on the left side of all the unit pixels PXU12 and PXU22, and the third light emitting layers EML12c and EML22c are disposed on the right side of all the unit pixels PXU12 and PXU22. Fig.10 Understanding of the embodiments Fig. 9 The color development phenomenon may display colors corresponding to the first light emitting layers EML12a and EML22a on the left, and colors corresponding to the third light emitting layers EML12c and EML22c on the right. As a result, there may be a disadvantage that the color development phenomenon occurs relatively greatly.

[0186] Therefore, with Fig.10 Unlike the embodiment of the present invention, the colors of the light-emitting layers closest to each other in the embodiment can be arranged in different colors between the unit pixels PXU12 and PXU22 to eliminate the problem of resolution degradation and reduce color deviation, thereby improving display quality. The embodiment of the light-emitting display device as described above can be included in an electronic device, and the light-emitting display device according to the embodiment can be used in a medium-sized electronic device such as a monitor or a television (TV). However, the example of the electronic device is not limited thereto.

[0187] In the following, reference will be made to Fig.11 Embodiments of an electronic device which may include the light emitting display device according to the embodiment are described. Fig.11 is a schematic block diagram of an electronic device according to an embodiment.

[0188] The electronic device 1 can output various information through the display module MD2 in the operating system. When the processor PROC executes the application stored in the memory MM, the display module MD2 can provide application information to the user through the display panel MD21. For example, the display panel MD21 can include the light emitting device described previously.

[0189] The processor PROC may obtain external input through the input module MD1 or the sensor module MD41, and may execute a corresponding application for the external input. For example, in the case where the user selects a camera icon displayed on the display panel MD21, the processor PROC may obtain user input through the input sensor MD41-2, and may activate the camera module MD51. The processor PROC may transmit video data corresponding to a captured image to the display module MD2 through the camera module MD51. The display module MD2 may display an image corresponding to the captured image through the display panel MD21.

[0190] In another example, when personal information authentication is performed in the display module MD2, the fingerprint sensor MD41-1 can obtain the input fingerprint information as input data. The processor PROC can compare the input data obtained by the fingerprint sensor MD41-1 with the authentication data stored in the memory MM, and can execute the application according to the comparison result. The display module MD2 can display information executed according to the logic of the application through the display panel MD21.

[0191] In another example, when the music streaming icon displayed on the display module MD2 is selected, the processor PROC can obtain user input through the input sensor MD41-2 and activate the music streaming application stored in the memory MM. When a music playback command is input into the music streaming application, the processor PROC can activate the sound output module MD43 to provide the user with audio information corresponding to the music playback command.

[0192] In the above, the operation of the electronic device 1 is explained. Next, a detailed description is provided about the configuration of the electronic device 1. Although some of the components of the above-mentioned electronic device 1 may be integrated with each other and provided as a single configuration, a single configuration is also divided into two or more components and provided.

[0193] Reference Fig.11 , the electronic device 1 can communicate with the external electronic device 2 through a network (e.g., a local wireless communication network or a long-distance wireless communication network). According to an embodiment, the electronic device 1 may include a processor PROC, a memory MM, an input module MD1, a display module MD2, a power module MD3, an embedded module MD4, and an external module MD5. According to an embodiment, the electronic device 1 may omit at least one of the mentioned components, or have one or more other components added. According to an embodiment, some of the mentioned components (e.g., a sensor module MD41, an antenna module MD42, or a sound output module MD43) may be integrated into another component (e.g., a display module MD2).

[0194] The processor PROC can control at least one other component (e.g., hardware or software component) of the electronic device 1 connected to the processor PROC by executing software, and can perform data processing or various calculations. According to an embodiment, as at least a part of data processing and calculation, the processor PROC can store commands or data received from other components (e.g., input module MD1, sensor module MD41, or communication module MD53) in the volatile memory MM1, and can process the commands or data stored in the volatile memory MM1. Therefore, the obtained data can be stored in the non-volatile memory MM2.

[0195] The processor PROC may include a main processor MPROC and an auxiliary processor SPROC. The main processor MPROC may include one or more central processing units MPROC-1 (CPU) or application processors (AP). The main processor MPROC may also include one or more of the following: a graphics processing unit MPROC-2 (GPU), a communication processor (CP) and an image signal processor (ISP). The main processor MPROC may also include a neural network processing device MPROC-3 (NPU). The neural network processing device MPROC-3 may be a processor dedicated to processing an artificial intelligence model, and an artificial intelligence model may be generated by machine learning. The artificial intelligence model may include an artificial neural network layer. The artificial neural network may be one of the following combinations: a deep neural network (DNN), a convolutional neural network (CNN), a recursive neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recursive deep neural network (BRDNN) and a deep Q network, or any combination of two or more of the above, but the embodiment is not limited thereto. In addition to or instead of a hardware structure, the artificial intelligence model may also include a software structure. The mentioned processing units and processors may be implemented as a single integrated construction (eg, a single chip) or as separate constructions (eg, multiple chips).

[0196] The auxiliary processor SPROC may include a controller SPROC-1. The controller SPROC-1 may include an interface conversion circuit and a timing control circuit. The controller SPROC-1 may receive a video signal from the main processor MPROC, and may output video data by converting the data format of the video signal according to the interface specification with the display module MD2. The controller SPROC-1 may output various control signals required for driving the display module MD2. The auxiliary processor SPROC may include additional circuits such as a data conversion circuit SPROC-2, a gamma correction circuit SPROC-3, a rendering circuit SPROC-4, etc. The data conversion circuit SPROC-2 may receive video data from the controller SPROC-1, and may compensate the video data to display the desired brightness according to the characteristics of the electronic device 1 or user settings. The data conversion circuit SPROC-2 may convert video data for power consumption reduction or residual compensation. The gamma correction circuit SPROC-3 may convert image data or a gamma reference voltage so that the image displayed on the electronic device 1 may have a desired gamma characteristic. Considering the pixel arrangement of the display panel MD21 applied to the electronic device 1, the rendering circuit SPROC-4 can receive video data from the controller SPROC-1 and render the video data. At least one of the data conversion circuit SPROC-2, the gamma correction circuit SPROC-3 and the rendering circuit SPROC-4 can be integrated into another component (e.g., the main processor MPROC or the controller SPROC-1). At least one of the data conversion circuit SPROC-2, the gamma correction circuit SPROC-3 and the rendering circuit SPROC-4 can be integrated into the mentioned data driving unit MD23.

[0197] The memory MM may store various data used by at least one component of the electronic device 1 (eg, the processor PROC or the sensor module MD41), and input data or output data related to related commands. The memory MM may include at least one of a volatile memory MM1 and a nonvolatile memory MM2.

[0198] The input module MD1 may receive commands or data to be used in components of the electronic device 1 (eg, the processor PROC, the sensor module MD41 or the sound output module MD43 ) from outside the electronic device 1 (eg, from a user or an external electronic device 2 ).

[0199] The input module MD1 may include a first input module MD11 for inputting a command or data from a user and a second input module MD12 for inputting a command or data from the external electronic device 2. The first input module MD11 may include a microphone, a mouse, a keyboard, a key (e.g., a button), or a pen (e.g., a passive pen or an active pen).

[0200] The second input module MD12 may support a specified protocol so that the external electronic device 2 can be connected to the electronic device 1 by wire or wirelessly. According to an embodiment, the second input module MD12 may include an HDMI (High Definition Multimedia Interface), a USB (Universal Serial Bus) interface, an SD card interface, or an audio interface. The second input module MD12 may include a connector (such as an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector)) that is physically connected to the external electronic device 2.

[0201] The display module MD2 may visually provide information to the user. The display module MD2 may include a display panel MD21, a scan driving unit MD22, and a data driving unit MD23. The display module MD2 may include a window, a base, and a bracket for protecting the display panel MD21.

[0202] The display panel MD21 may include a liquid crystal display panel, an organic light emitting display panel or an inorganic light emitting display panel, and the type of the display panel MD21 is not limited. The display panel MD21 may be rigid, or may be flexible and can be rolled or folded. The display module MD2 may also include a supporter, a bracket or a heat dissipation component that supports the display panel MD21.

[0203] The scan driving unit MD22 may be mounted on the display panel MD21 as a driving chip. For example, the scan driving unit MD22 may be integrated into the display panel MD21. For example, the scan driving unit MD22 may include amorphous silicon (ASG; TFT gate driving unit circuit), low temperature polysilicon (LTPS; TFT gate driving unit circuit), or oxide semiconductor (OSG; TFT gate driving unit circuit) integrated into the display panel MD21. The scan driving unit MD22 may receive a control signal from the controller SPROC-1, and may output a scan signal to the display panel MD21 in response to the control signal.

[0204] The display panel MD21 may further include a light emitting driving unit. The light emitting driving unit may output a light emitting control signal to the display panel MD21 in response to a control signal received from the controller SPROC-1. The light emitting driving unit may be formed separately from the scanning driving unit MD22 or integrated into the scanning driving unit MD22.

[0205] The data driving unit MD23 may receive a control signal from the controller SPROC-1, and may respond to the control signal by converting the video data into an analog voltage (e.g., a data voltage) and output the data voltage to the display panel MD21. The data driving unit MD23 may be integrated into other components (e.g., the controller SPROC-1). The functions of the interface conversion circuit and the timing control circuit of the controller SPROC-1 mentioned above may also be integrated into the data driving unit MD23.

[0206] The display module MD2 may include additional components such as a light-emitting drive unit and a voltage generating circuit. The voltage generating circuit may output various voltages required to drive the display panel MD21. The power module MD3 may supply power to the components of the electronic device 1. The power module MD3 may include a battery for charging the power voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0207] The power module MD3 may include a power management integrated circuit (PMIC) The PMIC supplies optimized power to each of the above-mentioned modules and modules described later.

[0208] The power module MD3 may include a wireless power transmission / reception unit electrically connected to a battery. The wireless power transmission / reception unit may include an antenna radiator in the form of a coil. The electronic device 1 may include both an embedded module MD4 and an external module MD5. The embedded module MD4 may include a sensor module MD41, an antenna module MD42, and a sound output module MD43. The external module MD5 may include a camera module MD51, an optical module MD52, and a communication module MD53.

[0209] The sensor module MD41 may sense input from the user's body or input from a pen on the first input module MD11, and may generate a corresponding electrical signal or data value for the input. The sensor module MD41 may include at least one of a fingerprint sensor MD41-1, an input sensor MD41-2, and a digitizer MD41-3.

[0210] The fingerprint sensor MD41-1 may generate a data value corresponding to the user's fingerprint. The fingerprint sensor MD41-1 may include an optical fingerprint sensor or a capacitive fingerprint sensor.

[0211] The input sensor MD41-2 can generate a data value corresponding to the coordinate information of the user's body input or pen input. The input sensor MD41-2 can generate the change in capacitance caused by the input as a data value. The input sensor MD41-2 can detect the input through the passive pen, or send data to / receive data from the active pen. The input sensor MD41-2 can measure biological signals such as blood pressure, moisture, or body fat. For example, in the case where the user touches a part of his or her body to the sensor layer or sensing panel and does not move within a certain period of time, the input sensor MD41-2 can detect the biological signal based on the change in the electric field caused by the body part, and can output the user's desired information to the display module MD2.

[0212] The digitizer MD41-3 can generate data values ​​corresponding to the coordinate information input by the active pen. The digitizer MD41-3 can generate data values ​​based on the change of the amount of electrons input by the active pen. The digitizer MD41-3 can detect input from a passive pen, or send and receive data with an active pen.

[0213] At least one of the fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 may be implemented as a sensor layer formed on the display panel MD21 through a continuous process. The fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 may be placed on the upper side of the display panel MD21, and one of the fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 (e.g., the digitizer MD41-3) may be placed on the lower side of the display panel MD21.

[0214] At least two of the fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 may be integrated into a single sensing panel by the same process. In the case where they are integrated into a single sensing panel, the sensing panel may be placed between the display panel MD21 and a window placed on the upper side of the display panel MD21. According to an embodiment, the sensing panel may be provided on the window, and the position of the sensing panel is not limited.

[0215] At least one of the fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 may be integrated into the display panel MD21. For example, at least one of the fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 may be simultaneously formed by a process of forming components (e.g., light emitting devices or transistors) included in the display panel MD21.

[0216] For example, the sensor module MD41 may generate an electrical signal or a data value corresponding to an internal or external condition of the electronic device 1. The sensor module MD41 may be, for example, a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor, and may also include other sensors.

[0217] The antenna module MD42 may include one or more antennas for transmitting or receiving signals or power to or from the outside. According to an embodiment, the communication module MD53 may transmit or receive signals to or from the external electronic device 2 through an antenna suitable for the communication method. The antenna pattern of the antenna module MD42 may be integrated into a component of the display module MD2 (e.g., the display panel MD21) or the input sensor MD41-2.

[0218] The sound output module MD43 may be a device for outputting an audio signal to the outside of the electronic device 1. For example, the sound output module MD43 may include a speaker for general purposes such as multimedia playback or recording playback, and a receiver specifically for telephone reception. According to an embodiment, the receiver may be integrated or separated from the speaker. The sound output pattern of the sound output module MD43 may also be integrated into the display module MD2.

[0219] The camera module MD51 can capture still images and moving images. According to an embodiment, the camera module MD51 may include one or more lenses, image sensors, or image signal processors. The camera module MD51 may also include an infrared camera capable of measuring the presence or absence of a user, the position of the user, and the user's line of sight.

[0220] The light module MD52 may provide light. The light module MD52 may include a light emitting diode or a xenon lamp. The light module MD52 may operate together with the camera module MD51 or independently.

[0221] The communication module MD53 can support the establishment of a wired or wireless communication channel between the electronic device 1 and the external electronic device 2, as well as the communication performance through the established communication channel. The communication module MD53 may include one or all of a wireless communication module (such as a cellular communication module, a short-range wireless communication module or a global navigation satellite system (GNSS) communication module) and a wired communication module (such as a local area network (LAN) communication module or a power line communication module). The communication module MD53 can communicate with the external electronic device 2 through a short-range communication network such as Bluetooth, WiFi Direct or Infrared Data Association (IrDA) or through a long-range communication network such as a cellular network, the Internet or a computer network (e.g., LAN or WAN). The above-mentioned various types of communication modules MD53 can be implemented as a single chip or a separate chip. The input module MD1, the sensor module MD41, the camera module MD51, etc. can be used to control the operation of the display module MD2 by connecting to the processor PROC.

[0222] The processor PROC may output commands or data to the display module MD2, the sound output module MD43, the camera module MD51, or the optical module MD52 based on the input data received from the input module MD1. For example, the processor PROC may generate video data in response to input data generated by a mouse or an active pen and output the video data to the display module MD2, or the processor PROC may generate command data in response to input data and output the command data to the camera module MD51 or the optical module MD52. In the case where the processor PROC does not receive input data from the input module MD1 for a specific period of time, the operation mode of the electronic device 1 may be changed to a low power mode or a sleep mode, thereby reducing the power consumption of the electronic device 1.

[0223] The processor PROC can output commands or data to the display module MD2, the sound output module MD43, the camera module MD51 or the optical module MD52 based on the sensing data received from the sensor module MD41. For example, the processor PROC can execute an application based on the comparison result between the authorized authentication data authorized by the fingerprint sensor MD41-1 and the authentication data stored in the memory MM. The processor PROC can execute commands or display video data in response to the sensing data detected by the input sensor MD41-2 or the digitizer MD41-3 on the display module MD2. In the case where a temperature sensor is included in the sensor module MD41, the processor PROC can receive temperature data for the measured temperature from the sensor module MD41, and perform brightness correction on the image data based on the temperature data.

[0224] The processor PROC may receive measurement data about the user's presence, the user's position, and the user's gaze from the camera module MD51. The processor PROC may perform brightness correction and other adjustments to the image data based on the measurement data. For example, the processor PROC that determines the user's presence through input from the camera module MD51 may output brightness-corrected image data to the display module MD2 through the data conversion circuit SPROC-2 or the gamma correction circuit SPROC-3.

[0225] Some of the above components can be connected to each other through a communication method between peripheral devices (such as a bus, a general purpose input / output (GPIO), a serial peripheral interface (SPI), a mobile industrial processor interface (MIPI) or an ultra-path interconnect (UPI) link) to exchange signals (e.g., commands or data) between each other. The processor PROC can communicate with the display module MD2 through a mutual recognition interface, and for example, any of the mentioned communication methods can be utilized, without being limited to the mentioned communication methods.

[0226] The electronic device 1 according to various embodiments disclosed herein may be various types of devices. The electronic device 1 may include, for example, at least one of a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, and a home appliance. The electronic device 1 according to the embodiments of this document is not limited to the aforementioned devices.

[0227] In summarizing the detailed description, it will be appreciated by those skilled in the art that many changes and modifications may be made to the embodiments without departing substantially from the principles, spirit and scope of the disclosure. Therefore, the disclosed embodiments are used in a general and descriptive sense only and not for the purpose of limitation.

Claims

1. A light-emitting display device, the light-emitting display device include: A unit pixel group includes a first unit pixel, a second unit pixel, a third unit pixel, and a fourth unit pixel arranged in a 2×2 matrix shape in a first direction and a second direction perpendicular to each other, wherein: Each of the first unit pixel, the second unit pixel, the third unit pixel and the fourth unit pixel includes a first light emitting region, a second light emitting region and a third light emitting region that emit three primary color lights respectively, The first light emitting region, the second light emitting region, and the third light emitting region of the first unit pixel are sequentially arranged in a first inclined direction inclined with respect to the first direction and the second direction, The first light emitting region, the second light emitting region, and the third light emitting region of the second unit pixel are sequentially arranged in a second oblique direction, The first light emitting region, the second light emitting region, and the third light emitting region of the third unit pixel are sequentially arranged in a third oblique direction, The first light emitting region, the second light emitting region, and the third light emitting region of the fourth unit pixel are sequentially arranged in a fourth oblique direction, The first oblique direction, the second oblique direction, the third oblique direction, and the fourth oblique direction form a rhombus shape, and The position where the laser drilling process is performed is the central portion of the unit pixel group.

2. The light-emitting display device according to claim 1, in: The second inclined direction is symmetrical to the first inclined direction with respect to the second direction, The third inclined direction is symmetrical to the first inclined direction with respect to the first direction, and The fourth inclined direction is parallel to the first inclined direction and opposite to the first inclined direction.

3. The light-emitting display device according to claim 2, in: A first virtual line extends in the first oblique direction and obliquely connects corners of the first unit pixel, A second virtual line extends in the second oblique direction and obliquely connects corners of the second unit pixel, A third virtual line extends in the third oblique direction and obliquely connects corners of the third unit pixel. A fourth virtual line extends in the fourth oblique direction and obliquely connects corners of the fourth unit pixel, and The first virtual line, the second virtual line, the third virtual line, and the fourth virtual line form the diamond shape.

4. The light-emitting display device according to claim 3, in, The first light emitting region of the first unit pixel is adjacent to the third light emitting region of the second unit pixel, The third light emitting region of the first unit pixel is adjacent to the first light emitting region of the third unit pixel, The third light emitting region of the third unit pixel is adjacent to the first light emitting region of the fourth unit pixel, and The third light emitting region of the fourth unit pixel is adjacent to the first light emitting region of the second unit pixel.

5. The light-emitting display device according to claim 2, in, The second unit pixel is adjacent to the first unit pixel along the second direction, The third unit pixel is adjacent to the first unit pixel along the first direction, and The fourth unit pixel is adjacent to the first unit pixel in an oblique direction.

6. The light-emitting display device according to claim 1, in, A connection electrode is disposed at the central portion of the unit pixel group.

7. The light-emitting display device according to claim 6, wherein the light-emitting display device further comprises: include: a pixel defining layer having openings corresponding to the first light emitting area, the second light emitting area, and the third light emitting area; an anode overlapping a portion of the opening of the pixel defining layer in a plan view; a light emitting layer, on the anode and disposed in the opening of the pixel defining layer; as well as A cathode is disposed on the pixel defining layer and the light emitting layer, wherein: The connecting electrode is electrically connected to the cathode through the laser drilling process.

8. The light-emitting display device according to claim 7, in, The connection electrode and the anode are formed of the same material and are provided on the same layer.

9. The light-emitting display device according to claim 7, wherein the light-emitting display device further comprises: include: The low driving voltage line and the auxiliary low driving voltage line are arranged on different insulating layers and have different extending directions, wherein: The low driving voltage line and the auxiliary low driving voltage line transmit a low driving voltage transmitted to the cathode, and The connection electrode is electrically connected to the auxiliary low driving voltage line.

10. A light-emitting display device, the light-emitting display device include: The first unit pixel group, the second unit pixel group, the third unit pixel group and the fourth unit pixel group are arranged in a 2×2 matrix shape in a first direction and a second direction perpendicular to each other, wherein: Each of the first unit pixel group, the second unit pixel group, the third unit pixel group, and the fourth unit pixel group includes first unit pixels, second unit pixels, third unit pixels, and fourth unit pixels arranged in a 2×2 matrix shape, Each of the first unit pixel, the second unit pixel, the third unit pixel and the fourth unit pixel includes a first light emitting region, a second light emitting region and a third light emitting region that emit three primary color lights respectively, The position where the laser drilling process is performed corresponds to the position where the corners of the first unit pixel group, the second unit pixel group, the third unit pixel group, and the fourth unit pixel group meet, and An area where the laser drilling process is performed is set in all of the first unit pixel group, the second unit pixel group, the third unit pixel group, and the fourth unit pixel group.

11. The light emitting display device according to claim 10, in, The first light emitting region, the second light emitting region, and the third light emitting region of each of the first unit pixel, the second unit pixel, the third unit pixel, and the fourth unit pixel performing the laser drilling process are arranged in a diamond shape.

12. The light-emitting display device according to claim 11, in: The first light emitting region, the second light emitting region, and the third light emitting region of the first unit pixel are sequentially arranged in a first inclined direction inclined with respect to the first direction and the second direction, The first light emitting region, the second light emitting region, and the third light emitting region of the second unit pixel are sequentially arranged in a second oblique direction, The first light emitting region, the second light emitting region, and the third light emitting region of the third unit pixel are sequentially arranged in a third oblique direction, The first light emitting region, the second light emitting region, and the third light emitting region of the fourth unit pixel are sequentially arranged in a fourth oblique direction, and The first oblique direction, the second oblique direction, the third oblique direction, and the fourth oblique direction form the rhombus shape.

13. The light emitting display device according to claim 12, in: The second inclined direction is symmetrical to the first inclined direction with respect to the second direction, The third inclined direction is symmetrical to the first inclined direction with respect to the first direction, and The fourth inclined direction is parallel to the first inclined direction and opposite to the first inclined direction.

14. The light-emitting display device according to claim 13, in: A first virtual line extends in the first oblique direction and obliquely connects corners of the first unit pixel, A second virtual line extends in the second oblique direction and obliquely connects corners of the second unit pixel, A third virtual line extends in the third oblique direction and obliquely connects corners of the third unit pixel. A fourth virtual line extends in the fourth oblique direction and obliquely connects corners of the fourth unit pixel, and The first virtual line, the second virtual line, the third virtual line, and the fourth virtual line form the diamond shape.

15. The light emitting display device according to claim 14, in: The first light emitting region of the first unit pixel is adjacent to the third light emitting region of the second unit pixel, The third light emitting region of the first unit pixel is adjacent to the first light emitting region of the third unit pixel, The third light emitting region of the third unit pixel is adjacent to the first light emitting region of the fourth unit pixel, and The third light emitting region of the fourth unit pixel is adjacent to the first light emitting region of the second unit pixel.

16. The light emitting display device according to claim 13, in: The second unit pixel is adjacent to the first unit pixel along the second direction, The third unit pixel is adjacent to the first unit pixel along the first direction, and The fourth unit pixel is adjacent to the first unit pixel in an oblique direction.

17. The light emitting display device according to claim 10, in, The connection electrode is disposed at a position where corners of the first unit pixel group, the second unit pixel group, the third unit pixel group, and the fourth unit pixel group meet.

18. The light-emitting display device according to claim 17, wherein the light-emitting display device further comprises: include: a pixel defining layer having openings corresponding to the first light emitting area, the second light emitting area, and the third light emitting area; an anode overlapping a portion of the opening of the pixel defining layer in a plan view; a light emitting layer, on the anode and disposed in the opening of the pixel defining layer; as well as A cathode is disposed on the pixel defining layer and the light emitting layer, wherein: The connecting electrode is electrically connected to the cathode through the laser drilling process, and The connection electrode and the anode are made of the same material and are arranged on the same layer.

19. The light-emitting display device according to claim 18, wherein the light-emitting display device further comprises: include: The low driving voltage line and the auxiliary low driving voltage line are arranged on different insulating layers and have different extending directions, wherein: The low driving voltage line and the auxiliary low driving voltage line transmit a low driving voltage transmitted to the cathode, and The connection electrode is electrically connected to the auxiliary low driving voltage line.

20. The light emitting display device according to claim 18, in: An additional connection electrode is provided at a central portion of the unit pixel group, and The additional connection electrode and the anode are made of the same material and are arranged on the same layer.

Images