Substrate processing system

Abstract

In a substrate processing system of the present invention, a stacker device, a single-chip processing device, an interface device, and a batch processing device are linearly arranged in order in a single row. A first transport robot of the stacker device transports a carrier placed at a loading port to a stacker device side position. The carrier transport mechanism transports the carrier from the stacker device side position to the interface device side position. A second transport robot of the interface device transports the carrier from the interface device side position to the carriage. The batch processing apparatus takes out a plurality of substrates from a carrier conveyed to a bracket, and performs predetermined batch processing on the taken-out plurality of substrates. The single-sheet processing apparatus processes a plurality of substrates (W) one by one.

Description

Technical Field

[0001] The present invention relates to a substrate processing system for processing a substrate. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, mask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like. Background Art

[0002] In a conventional substrate processing system, a loading and unloading device, a single-wafer processing device, an interface device, and a batch processing device are sequentially arranged (for example, refer to Japanese Patent Publication No. 2021-064652).

[0003] The loading and unloading device includes a loading table for mounting a cassette, a first transfer device, and a first transition device for temporarily storing a substrate. The single-wafer processing device includes a second transfer device and a second transition device for temporarily storing a substrate. The interface device includes a transfer robot and a batch forming unit.

[0004] The first transport device takes out the five substrates in the cassette and transports the five substrates to the first transfer device. In addition, the five substrates are held horizontally inside the cassette. Then, the second transport device receives the five substrates from the first transistor device and transports the five substrates to the second transfer device. Then, the transport robot receives the five substrates from the second transfer device and transports the five substrates to the batch forming unit. In the batch forming unit, the five substrates are held vertically.

[0005] In addition, in the substrate processing system of Japanese Patent Publication No. 2022-057884, a loading device, a batch processing device, an interface device, a single-wafer processing device, and a loading device are sequentially arranged. A carrier transport area is arranged on these devices. A carrier transport mechanism is arranged in the carrier transport area. The carrier transport mechanism transports the carrier between the loading device and the loading device.

[0006] In addition, in the substrate processing apparatus disclosed in Japanese Patent Laid-Open No. 2020-109786, a first carrier block, a first processing block, a second carrier block, and a second processing block are sequentially arranged. The carrier transport mechanism transports the carrier between the mounting table of the first carrier block and the mounting table of the second carrier block. Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] However, the following problems may arise. For example, in the substrate processing system of Japanese Patent Publication No. 2021-064652, in order to uniformly process multiple substrates by the processing tank of the batch processing device, the transport robot of the interface device arranges multiple substrates in a vertical posture in the batch forming part. Therefore, the substrate must be transported from the loading and unloading device to the interface device through the single-wafer processing device. Here, the processing capacity of the substrate processing system may be reduced because the substrate passes through the single-wafer processing device.

[0009] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing system that prevents a reduction in processing capacity.

[0010] [Technical means to solve the problem]

[0011] In order to achieve this purpose, the present invention adopts the following structure. That is, the substrate processing system of the present invention is characterized in that it is a substrate processing system for processing substrates, and comprises: a stacker device, which has a loading port for carrying in and out a carrier for storing multiple substrates, a first carrier carrier for carrying the carrier, and a first transport robot for transporting the carrier; a batch processing device for processing multiple substrates in a unified manner; a single-wafer processing device for processing the multiple substrates one by one; an interface device, which has a second carrier carrier for carrying the carrier, and a second transport robot for transporting the carrier; and a carrier transport mechanism on the stacker device side. The carrier is transported between a position on the stacker device side and a position on the interface device side of the interface device; and the stacker device, the single-wafer processing device, the interface device and the batch processing device are arranged in a single row and in a straight line in sequence, the first transport robot transports the carrier containing the substrate before processing placed on the loading port to the position on the stacker device side, the carrier transport mechanism transports the carrier containing the substrate before processing from the stacker device side position to the interface device side position, and the second transport robot transports the carrier containing the substrate before processing placed on the loading port to the position on the interface device side. The carrier is transported from the interface device side position to the second carrier loading rack, the batch processing device takes out the multiple substrates from the carrier that stores the substrates before processing and is transported to the second carrier loading rack, performs a predetermined batch processing on the taken-out multiple substrates, the batch processing device transports the multiple substrates after the batch processing to the interface device, the second transport robot transports the empty carrier from the second carrier loading rack to the interface device side position, and the carrier transport mechanism takes the empty carrier out of the carrier. The interface device side position is transported to the stacker device side position, the first transport robot transports the empty carrier from the stacker device side position to the first carrier loading rack, the single-wafer processing device performs specified single-wafer processing on the multiple substrates received from the interface device one by one, and transports the multiple substrates after the single-wafer processing to the empty carrier that has been transported to the first carrier loading rack, and the first transport robot transports the carrier accommodating the multiple substrates undergoing the single-wafer processing from the first carrier loading rack to the loading port.

[0012] In the substrate processing system of the present invention, a stacker device, a single-chip processing device, an interface device, and a batch processing device are arranged in a single row and in a straight line. In this structure, a carrier conveying mechanism conveys a carrier between a stacker device side position on the stacker device side and an interface device side position on the interface device side. Therefore, the substrate can be conveyed from the stacker device to the interface device in carrier units. Therefore, a reduction in processing capacity caused by the substrate passing through the interior of the single-chip processing device can be prevented. In addition, since the substrate is stored in the carrier, particles can be prevented from adhering to the substrate when the substrate is conveyed from the stacker device to the interface device.

[0013] In addition, in the substrate processing system, it is preferred that the batch processing device includes a first posture conversion unit for converting the plurality of substrates from a horizontal posture to a vertical posture, and the interface device includes a second posture conversion unit for converting the plurality of substrates after the batch processing from a vertical posture to a horizontal posture. The batch processing device takes out the plurality of substrates from the carrier transported to the second carrier mounting rack, uses the first posture conversion unit to convert the taken-out plurality of substrates from a horizontal posture to a vertical posture, and performs prescribed batch processing on the plurality of substrates converted to a vertical posture.

[0014] Thus, the batch processing device can perform predetermined batch processing on the plurality of substrates converted to the vertical posture. In addition, the single-wafer processing device can perform predetermined single-wafer processing on the plurality of substrates converted to the horizontal posture by the interface device one by one.

[0015] In addition, in the substrate processing system, it is preferred that the batch processing device comprises: a transfer block adjacent to the second carrier mounting rack; a processing block adjacent to the transfer block in the first direction from the stocker device toward the interface device; and a batch substrate transfer area, which is arranged in a manner that one end extends to the inside of the interface device and the other end extends in the first direction; and the transfer block comprises: a substrate processing mechanism that takes out the plurality of substrates from the carrier mounted on the second carrier mounting rack and transports the taken-out plurality of substrates; and a vertical holding portion arranged on the substrate The plurality of substrates received from the substrate processing mechanism are held in a vertical posture between the processing mechanism and the batch substrate conveying area; the processing block includes a batch processing tank for storing a processing liquid for immersing the plurality of substrates; the interface device includes a posture conversion mechanism for converting the plurality of substrates after the batch processing in the batch processing tank from a vertical posture to a horizontal posture; the batch processing conveying area includes a batch conveying mechanism for conveying the plurality of substrates in a vertical posture parallel to the first direction between the batch processing tank, the vertical holding portion and the posture conversion mechanism.

[0016] The batch processing apparatus includes a transfer block adjacent to the second carrier mounting rack, and a processing block adjacent to the transfer block. This configuration is the same as that of a general batch substrate processing apparatus. In addition, in a general batch substrate processing apparatus, posture conversion is generally performed by a transfer block having a substrate processing mechanism. According to the present invention, one end of the batch substrate transfer area extends to the inside of the interface device, and the other end of the batch substrate transfer area extends in the first direction. Moreover, the batch transfer mechanism of the batch substrate transfer area transfers a plurality of substrates from the batch processing tank (processing block) to the posture conversion mechanism (interface device) in a vertical posture while exceeding the vertical holding portion (transfer block). Therefore, a plurality of substrates can be efficiently transferred.

[0017] In addition, in the substrate processing system, it is preferred that the interface device includes a carrier moving area and a posture conversion area arranged in a horizontal direction orthogonal to the first direction, that is, a second direction, the second transfer robot is arranged in the carrier moving area, the posture conversion mechanism is arranged in the posture conversion area, and the posture conversion area includes a housing that cuts off the atmosphere relative to the carrier moving area and accommodates the posture conversion mechanism. Thus, the interface device includes two areas with different atmospheres. The posture conversion area can ensure a higher degree of cleanliness than the carrier moving area.

[0018] In addition, in the substrate processing system, it is preferred that the single-wafer processing device comprises: a carrier conveying area, which is equipped with the carrier conveying mechanism; a single-wafer substrate conveying area, which is equipped with a horizontal substrate conveying mechanism for conveying at least one substrate in a horizontal posture; and a single-wafer substrate processing area, which is equipped with a single-wafer processing chamber for performing prescribed processing on one substrate; and each of the carrier conveying area, the single-wafer substrate conveying area and the single-wafer substrate processing area is arranged in a manner extending in the first direction, and the carrier conveying area, the single-wafer substrate conveying area and the single-wafer substrate processing area are sequentially arranged in a horizontal direction orthogonal to the first direction, that is, a second direction, and the horizontal substrate conveying mechanism conveys the at least one substrate between the interface device, the single-wafer processing chamber, and the carrier conveyed to the first carrier mounting rack.

[0019] When assembling a substrate processing system, if a carrier transport mechanism is arranged above a single-wafer processing device, the carrier transport mechanism needs to be transported to the top of the single-wafer processing device. According to the present invention, a carrier transport area having a carrier transport mechanism is arranged on the side of a single-wafer substrate transport area and a single-wafer substrate processing area. Therefore, the burden of transporting the carrier transport mechanism can be reduced, thereby making it relatively easy to assemble the substrate processing system.

[0020] In addition, each of the first transfer robot and the second transfer robot does not need to transfer the carrier to a position higher than the ceiling of the single-wafer processing device. Therefore, the carrier can be efficiently transferred between the stocker device and the interface device. In addition, since the carrier transfer area, the single-wafer substrate transfer area, and the single-wafer substrate processing area are arranged in the horizontal direction, the substrate processing system can be prevented from becoming longer in the width direction.

[0021] Furthermore, in the substrate processing system, it is preferable that the carrier transport mechanism is provided above the single-wafer processing apparatus and overlaps with the single-wafer processing apparatus in a plan view.

[0022] As a result, the area for performing single-wafer processing in the single-wafer processing device can be increased. In other words, the single-wafer processing device can be equipped with more single-wafer processing chambers, thereby improving the processing capacity.

[0023] Furthermore, the substrate processing system preferably further includes a second carrier transport mechanism that transports the carrier between a second stocker apparatus side position on the stocker apparatus side and a second interface apparatus side position on the interface apparatus side.

[0024] Since the number of carrier transport mechanisms increases, carrier transport between the stocker device and the interface device can be performed efficiently.

[0025] In addition, in the substrate processing system, it is preferred that the first transfer robot has a movable first holding portion for holding the carrier, or a movable first supporting portion for supporting the lower surface of the carrier, the second transfer robot has a movable second holding portion for holding the carrier, or a movable second supporting portion for supporting the lower surface of the carrier, and the carrier transfer mechanism has a movable third holding portion for holding the carrier, or a movable loading table for placing the carrier.

[0026] [Effects of the Invention]

[0027] According to the substrate processing system of the present invention, it is possible to prevent the processing capacity from being reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to illustrate the invention, several embodiments currently considered to be suitable are shown in the drawings, but it should be understood that the invention is not limited to the configurations and schemes shown in the drawings.

[0029] Figure 1 1 is a top view of the substrate processing system of Example 1.

[0030] Figure 2 It is a left side view of the substrate processing system of Example 1.

[0031] Figure 3A to Figure 3CIt is a side view for explaining the substrate processing mechanism and the first posture conversion mechanism.

[0032] Figure 4 It is a top view used to illustrate the interface device.

[0033] Figure 5 Observed from the direction of arrow AA Figure 4 A longitudinal sectional view of the interface device shown.

[0034] Figure 6A to Figure 6C It is a diagram for explaining the second posture conversion mechanism.

[0035] Figure 7A to Figure 7C It is a diagram for explaining the second posture conversion mechanism.

[0036] Fig. 8A , Figure 8B It is a diagram for explaining the second posture conversion mechanism.

[0037] Fig. 9 This is a flowchart for explaining the operation of the substrate processing system.

[0038] Fig.10 This is a top view of the substrate processing system of Example 2.

[0039] Fig.11 It is a top view of the substrate processing system of Example 3.

[0040] Fig.12 Observed from the direction of arrow BB Fig.11 A longitudinal sectional view of a single-wafer processing device is shown.

[0041] Fig.13 This is a top view of the substrate processing system of Example 4.

[0042] Fig.14A is a top view showing a support portion of a first transfer robot and a mounting table of a carrier transfer mechanism according to a modified example, Fig. 14B It is a plan view showing a supporting portion of a second transfer robot and a mounting table of a carrier transfer mechanism according to a modified example. DETAILED DESCRIPTION

[0043] [Example 1]

[0044] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 1 is a top view of the substrate processing system 1 according to the first embodiment. Figure 2 It is a left side view of the substrate processing system 1 of Example 1.

[0045] <1. Overall composition>

[0046] The substrate processing apparatus 1 includes a stocker device 2, a wafer processing apparatus 3, an interface device 5, a batch processing apparatus 7, and a carrier transfer mechanism 9. The stocker device 2, the wafer processing apparatus 3, the interface device 5, and the batch processing apparatus 7 are sequentially arranged in a single row and in a straight line.

[0047] refer to Figure 1 The substrate processing system 1 processes the substrate W. The substrate processing system 1 performs, for example, liquid treatment, cleaning treatment, drying treatment, etc. on the substrate W. The substrate processing system 1 adopts a processing method that combines batch processing and single-wafer processing (so-called hybrid method). The batch method is a method in which multiple substrates W are uniformly processed in a vertical posture. The single-wafer method is a method in which substrates W are processed one by one in a horizontal posture.

[0048] In this specification, for convenience, the direction in which the stacker device 2, the single-wafer processing device 3, the interface device 5, and the batch processing device 7 are arranged is referred to as the "front-to-back direction X". The front-to-back direction X is horizontal. The direction in the front-to-back direction X, for example, from the batch processing device 7 toward the stacker device 2 is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction orthogonal to the front-to-back direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, the front, back, right, left, top, and bottom are appropriately shown for reference.

[0049] <2. Stacker device>

[0050] The stocker device 2 accommodates at least one carrier C. The carrier C accommodates a plurality of (e.g., 25) substrates W arranged horizontally at predetermined intervals (e.g., 10 mm) in a vertical direction Z. As the carrier C, for example, a FOPU (Front Opening Unified Pod) is used, but the present invention is not limited thereto.

[0051] The stacker device 2 includes a plurality of (e.g., two) loading ports 11 and a stacker body 13. The two loading ports 11 are disposed adjacent to the front of the stacker body 13. Each of the two loading ports 11 is used to carry in and out the carrier C. The stacker body 13 includes a plurality of brackets 15A, 15B and a first transfer robot 17. The bracket 15A is a bracket for storing the substrate W on the carrier C. The bracket 15B is a bracket for storage. The bracket 15A is disposed adjacent to the front of the single-wafer processing device 3. In addition, the bracket 15A corresponds to the first carrier loading rack of the present invention.

[0052] The first transfer robot 17 transfers the carrier C between the two loading ports 11, the bracket 15A, the bracket 15B, and the stage 23 moved to a predetermined position on the side of the stocker 2. The first transfer robot 17 includes a holding portion 19 and a moving portion 21. There is a protrusion on the upper surface of the carrier C. The holding portion 19 holds the protrusion of the carrier C. The moving portion 21 moves the holding portion 19 in the vertical direction Z and the horizontal direction (front-rear direction X and width direction Y). Each of the holding portion 19 and the moving portion 21 is driven by one or more electric motors.

[0053] <3. Carrier transport mechanism>

[0054] refer to Figure 1 , Figure 2 The carrier transport mechanism 9 is disposed above the wafer processing device 3 and overlaps a part or all of the wafer processing device 3 when viewed from above. The carrier transport mechanism 9 transports the carrier C between the stacker device side position PT1 on the stacker device 2 side and the interface device side position PT2 on the interface device 5 side. The stacker device side position PT1 is a position where the carrier C is transferred between the first transfer robot 17 and the carrier transport robot 9. The interface device side position PT2 is a position where the carrier C is transferred between the carrier transport mechanism 9 and the second transfer robot 31 (described later).

[0055] The carrier transport mechanism 9 includes a mounting table 23 and a table moving unit 25. The carrier C is mounted on the mounting table 23. The table moving unit 25 moves the mounting table 23 on which the carrier C is mounted in parallel to the rear. The table moving unit 25 is provided, for example, on a side wall 27 provided on the wafer processing device 3 and extending in the front-rear direction X (see FIG. 2 ). Figure 5 ). The stage moving part 25 includes, for example, an electric motor, a guide rail, and a slider. In addition, the stage moving part 25 includes a screw shaft or a rack and a pinion.

[0056] <4. Interface device (carrier movement area)>

[0057] The interface device 5 is disposed adjacent to the rear of the single-wafer processing device 3. The interface device 5 includes a carrier moving region R1 and a posture conversion region R2. The carrier moving region R1 and the posture conversion region R2 are arranged along the width direction Y. The carrier moving region R1 is arranged to the right of the posture conversion region R2.

[0058] The carrier moving region R1 includes a carriage 29 and a second transfer robot 31 . The carriage 29 is provided adjacent to the front of the batch processing device 7 and the transfer block 37 . The carrier C is placed on the carriage 29 .

[0059] The second transfer robot 31 transfers the carrier C between the mounting table 23 moved to a predetermined position on the interface device 5 side and the bracket 29. The second transfer robot 31 includes a holding portion 33 and a moving portion 35. The holding portion 33 is, for example, a protrusion that holds the upper surface of the carrier C. The moving portion 35 moves the holding portion 33 in the vertical direction Z and the horizontal direction (at least the front-rear direction X). The moving portion 35 is driven by an electric motor.

[0060] <5. Batch processing device>

[0061] The batch processing device 7 processes a plurality of (for example, 25 or 50) substrates W at once. To be specific, the batch processing device 7 takes out a plurality of (for example, 25) substrates W from the carrier C conveyed to the holder 29. The batch processing device 7 uses the first posture conversion mechanism 41 to convert the taken-out plurality of (for example, 25 or 50) substrates W from a horizontal posture to a vertical posture. The batch processing device 7 performs a predetermined batch processing on the plurality of (for example, 25 or 50) substrates W converted to the vertical posture. The batch processing device 7 conveys the plurality of substrates W after the batch processing to the interface device 5.

[0062] Batch processing device 7 Figure 1 As shown, there are a transfer block 37 and a processing block 39. The transfer block 37 is disposed adjacent to the rear of the interface device 5. In addition, the transfer block 37 is disposed adjacent to the rear of the bracket 29. The processing block 39 is adjacent to the rear of the transfer block 37. In other words, the processing block 39 is disposed adjacent to the rear of the transfer block 37.

[0063] <5-1. Transfer Block>

[0064] The transfer block 37 includes a substrate processing mechanism (robot) HTR and a first posture conversion mechanism 41. The substrate processing mechanism HTR is disposed behind the carriage 29. The substrate processing mechanism HTR collectively takes out a plurality of (e.g., 25) substrates W from the carrier C placed on the carriage 29, and transports the taken-out substrates W to the first posture conversion mechanism 41 in a horizontal posture.

[0065] Figure 3A to Figure 3C Each of the above is a side view for explaining the substrate processing mechanism HTR and the first posture conversion mechanism 41. The substrate processing mechanism HTR includes a plurality of (eg, 25) hands 43. Each hand 43 holds one substrate W.

[0066] in addition, Figure 3A to Figure 3C In the figure, for convenience of illustration, the substrate processing mechanism HTR includes three hands 43. In addition, a pair of horizontal holding portions 51B and a pair of vertical holding portions 51C described later hold three substrates W. In addition, a push rod 53A described later supports six substrates W.

[0067] The substrate processing mechanism HTR includes a hand support part 45, an advance and retreat part 47, and an elevating and rotating part 49. The hand support part 45 supports a plurality of hands 43. The advance and retreat part 47 advances and retreats the plurality of hands 43 via the hand support part 45. The elevating and rotating part 49 elevates the plurality of hands 43 and the advance and retreat part 47. The elevating and rotating part 49 rotates the advance and retreat part 47 around the vertical axis AX1 in order to change the orientation of the hand 43. The elevating and rotating part 49 is fixed to the bottom surface and does not move in the horizontal direction (front and rear direction X and width direction Y). In addition, the advance and retreat part 47 and the elevating and rotating part 49 each include an electric motor. In addition, the substrate processing mechanism HTR may also include a hand (not shown) that is separate from the hand 43 and is used only to transport one substrate W.

[0068] The first posture conversion mechanism 41 converts a plurality of substrates W (e.g., 25 substrates) transported by the substrate processing mechanism HTR from a horizontal posture to a vertical posture. The first posture conversion mechanism 41 includes a posture conversion unit 51 and a push rod mechanism 53. The substrate processing mechanism HTR, the posture conversion unit 51, and the push rod mechanism 53 are arranged on the left in sequence. Figure 1 As shown, the first posture conversion mechanism 41 (including a push rod 53A described later) is provided between the substrate processing mechanism HTR and the batch substrate transfer region R4 (described later).

[0069] like Figure 3A As shown in FIG. 1 , the posture conversion unit 51 includes a support table 51A, a pair of horizontal holding units 51B, a pair of vertical holding units 51C, and a rotation drive unit 51D. The pair of horizontal holding units 51B and the pair of vertical holding units 51C are provided on the support table 51A. When the substrate W is in a horizontal posture, the pair of horizontal holding units 51B contacts the lower surface of each substrate W and supports the substrate W from below. In addition, when the substrate W is in a vertical posture, the pair of vertical holding units 51C holds the substrate W. The rotation drive unit 51D rotates the support table 51A around the horizontal axis AX2.

[0070] like Figure 3C As shown in FIG. 1 , the push rod mechanism 53 includes a push rod 53A, a lifting and rotating unit 53B, a horizontal moving unit 53C, and a rail 53D. The push rod 53A holds the lower part of each of the plurality of substrates W (e.g., 25 or 50) in a vertical posture. In addition, the push rod 53A holds the plurality of substrates W received from the substrate processing mechanism HTR in a vertical posture via the posture conversion unit 51. The lifting and rotating unit 53B lifts the push rod 53A in the vertical direction Z. In addition, the lifting and rotating unit 53B rotates the push rod 53A around the vertical axis AX3. Thus, the device surface of the substrate W indicated by the arrow AR1 can be oriented in any direction.

[0071] The horizontal moving part 53C moves the push rod 53A and the lifting and rotating part 53B horizontally along the track 53D. The track 53D extends in the width direction Y. In addition, the rotation drive part 51D, the lifting and rotating part 53B and the horizontal moving part 53C each have an electric motor. In addition, the posture conversion part 51 is equivalent to the first posture conversion part of the present invention. In addition, the push rod 53A is equivalent to the vertical holding part of the present invention.

[0072] Here, the operation of the first posture conversion mechanism 41 is described. For example, each of the four batch processing tanks BT1 to BT4 described later in the processing block 39 processes 50 substrates W corresponding to two amounts of carriers C at once. Therefore, while the posture conversion of 50 substrates W (W1, W2) is performed every 25 substrates, the push rod 53A holds the 50 substrates W. The 25 substrates W1 are appropriately referred to as the first substrate group. The 25 substrates W2 are appropriately referred to as the second substrate group. When the substrates W1 and W2 are not distinguished, the substrates W1 and W2 are recorded as substrates W.

[0073] refer to Figure 3A . The posture conversion unit 51 receives 25 substrates W1 from the substrate processing mechanism HTR. At this time, the 25 substrates W1 are in a horizontal posture and are neatly arranged at a full pitch (for example, 10 mm intervals). In addition, the full pitch is also called a standard pitch. In addition, the device surface of each substrate W1 faces upward. In addition, the device surface of the substrate W is the surface on which the electronic circuit is formed, which is called the "front side". In addition, the back side of the substrate W refers to the surface on which the electronic circuit is not formed. The surface on the opposite side of the device surface is the back side.

[0074] refer to Figure 3B The rotation drive unit 51D of the posture conversion unit 51 rotates the pair of horizontal holding units 51B and the like by 90 degrees around the horizontal axis AX2, and converts the 25 substrates W1 from the horizontal posture to the vertical posture. Thereafter, the push rod mechanism 53 raises the push rod 53A to receive the 25 substrates W1 from the posture conversion unit 51. Thereafter, the push rod mechanism 53 rotates the push rod 53A by 180 degrees around the vertical axis AX3. Thus, the orientation of the 25 substrates W1 is changed from the left to the right.

[0075] Then, the posture conversion unit 51 receives 25 substrates W2 from the substrate processing mechanism HTR and converts the 25 substrates W2 from the horizontal posture to the vertical posture. Then, the pusher mechanism 53 raises the pusher 53A holding the 25 substrates W1. Thus, the pusher 53A further receives 25 substrates W2.

[0076] refer to Figure 3CThe push rod 53A holds 50 substrates W (W1, W2). The 50 substrates W are arranged neatly at a half pitch (e.g., 5 mm pitch). In addition, the half pitch is a pitch that is half of the full pitch. Then, the push rod mechanism 53 moves the push rod 53A holding the 50 substrates W along the track 53D to the substrate transfer position PP below a pair of chucks 61, 62 of the batch transport mechanism WTR1 (described later).

[0077] <5-2. Processing Block>

[0078] The processing block 39 includes a batch processing area R3. The batch processing area R3 is adjacent to the rear of the transfer block 37. The batch processing area R3 includes, for example, four batch processing tanks BT1 to BT4. The four batch processing tanks BT1 to BT4 are arranged in a row in the direction in which the batch processing area R3 extends (front-rear direction X). Each of the four batch processing tanks BT1 to BT4 performs a collective immersion treatment (batch treatment) on a plurality of substrates W (for example, 25 or 50 substrates). Each of the four batch processing tanks BT1 to BT4 stores a treatment liquid (for example, a chemical solution or pure water) for immersing the plurality of substrates W.

[0079] The four batch processing tanks BT1 to BT4 are composed of, for example, two chemical processing tanks BT1 and BT3 and two water washing processing tanks BT2 and BT4. The chemical processing tank BT1 and the water washing processing tank BT2 are set as one group, and the chemical processing tank BT3 and the water washing processing tank BT4 are set as another group. In addition, the combination of the chemical processing tank and the water washing processing tank is not limited to the above example. In addition, the number of batch processing tanks is not limited to 4, as long as it is 1 or 2 or more.

[0080] Each of the two chemical liquid treatment tanks BT1 and BT3 performs a chemical liquid etching process. As the chemical liquid, phosphoric acid is used, for example. Each of the chemical liquid treatment tanks BT1 and BT3 stores a chemical liquid supplied from a chemical liquid supply pipe not shown. Each of the two water washing treatment tanks BT2 and BT4 performs a pure water cleaning process of washing the chemical liquid attached to the plurality of substrates W with pure water. As the pure water, for example, deionized water (DIW) is used. Each of the water washing treatment tanks BT2 and BT4 stores pure water supplied from a pure water ejection pipe not shown.

[0081] Four lifts LF1 to LF4 are provided in the four batch processing tanks BT1 to BT4, respectively. For example, lift F1 holds the substrates W arranged in a vertical position at a predetermined interval, that is, half a pitch (e.g., 5 mm interval). Lift LF1 lifts and lowers a plurality of substrates W between a processing position inside the batch processing tank BT1 and a transfer position above the batch processing tank BT1. The other three lifts LF2 to LF4 are also configured similarly to lift LF1.

[0082] <5-3. Batch substrate transfer area>

[0083] The batch processing device 7 further includes a batch substrate transfer area R4. The batch substrate transfer area R4 is adjacent to the left of the batch processing area R3. One end of the batch substrate transfer area R4 extends to the inside of the interface device 5. In addition, the other end of the batch substrate transfer area R4 extends to the rear. The batch substrate transfer area R4 includes a batch transfer mechanism (robot) WTR1.

[0084] The batch transport mechanism WTR1 transports a plurality of substrates W between the four batch processing tanks BT1 to BT4, the substrate delivery position PP of the first posture conversion mechanism 41, and the waiting tank 69 (described later) of the second posture conversion mechanism 67. The four batch processing tanks BT1 to BT4, the substrate delivery position PP, the waiting tank 69 (described later), and the underwater posture conversion unit 71 (described later) are arranged in a row along the front-rear direction X. Therefore, the batch transport mechanism WTR1 transports the plurality of substrates W in a vertical posture in parallel with the rear or front-rear direction X.

[0085] The batch transport mechanism WTR1 includes a pair of chucks 61 and 62 and a guide rail 63. Each of the chucks 61 and 62 includes 50 holding grooves for holding 50 substrates W, for example. Each of the two chucks 61 and 62 is oriented in the width direction Y ( Figure 1 ) extend in parallel. The batch transport mechanism WTR1 opens or closes the two chucks 61, 62. The batch transport mechanism WTR1 moves a pair of chucks 61, 62 along the guide rail 63. The batch transport mechanism WTR1 is driven by an electric motor.

[0086] <6. Interface device (posture conversion area)>

[0087] Figure 4 It is a top view for explaining the interface device 5. Figure 5 Observed from the direction of arrow AA Figure 4 A longitudinal section through the interface device 5 is shown. Figure 6A to Figure 6C , Figure 7A to Figure 7C , Fig. 8A , Figure 8B 67. The posture conversion area R2 includes a housing 65 that cuts off the atmosphere from the carrier moving area R1 and the outside of the substrate processing system 1. Thus, the interface device 5 includes two areas (the carrier moving area R1 and the posture conversion area R2) with different atmospheres. The posture conversion area R2 can ensure a higher cleanliness than the carrier moving area R1.

[0088] The housing 65 includes two openings 65A and 65B that communicate with the transfer block 37 and the single substrate transfer region R5 (described later). The posture conversion region R2 includes a second posture conversion mechanism 67 and a direction conversion conveyor 68. The housing 65 accommodates the second posture conversion mechanism 67 and the direction conversion conveyor 68. The second posture conversion mechanism 67 converts a plurality of substrates W (for example, 25 or 50 substrates) batch-processed in any one of the four batch processing tanks BT1 to BT4 from a vertical posture to a horizontal posture.

[0089] The direction-changing conveyor 68 receives a substrate W and transports the substrate W to the single-wafer processing device 3. The direction-changing conveyor 68 includes two pulleys 68A, two belts 68B, and an elevating and rotating unit 68C. The two belts 68B are mounted on the two pulleys 68A. At least one of the two pulleys 68A is driven to rotate by an electric motor. The elevating and rotating unit 68C elevates the two pulleys 68A and the two belts 68B, and further rotates the two pulleys 68A and the two belts 68B around the vertical axis AX4.

[0090] In addition, in order to change the conveying direction of a substrate W on the two belts 68B, the lifting and rotating unit 68C, for example, lifts the two pulleys 68A to a height position that does not interfere with the underwater posture conversion unit 71 (described later) and the conveyor belt 101 (described later), and then rotates the two pulleys 68A around the vertical axis AX4.

[0091] <6-1. Configuration of the Second Posture Conversion Mechanism>

[0092] The second posture conversion mechanism 67 includes a waiting tank 69, a selection transport mechanism (robot) WTR2, and an underwater posture conversion unit 71. The waiting tank 69 is provided in front of the substrate delivery position PP. The lifter LF7 is provided in the waiting tank 69. The lifter LF7 is configured similarly to the lifter LF1. The waiting tank 69 stores pure water (e.g., DIW) supplied from a pure water discharge pipe (not shown).

[0093] The selective transport mechanism WTR2 includes a pair of chucks 73, 74 and a guide rail 75. The pair of chucks 73, 74 opens and closes. Each of the chucks 73, 74 includes, for example, 25 holding grooves and 25 passing grooves that are alternately arranged. Therefore, the selective transport mechanism WTR2 can extract a group of 25 substrates W1 and 25 substrates W2 from 50 substrates W in which 25 substrates W1 and 25 substrates W2 are alternately arranged.

[0094] The selective transport mechanism WTR2 transports a plurality of (e.g., 25) substrates W that are selectively taken out between the waiting tank 69 and the underwater posture conversion unit 71. A pair of chucks 73 and 74 moves along a guide rail 75 that extends linearly in the front-rear direction X. In addition, the selective transport mechanism WTR2 can move the pair of chucks 73 and 74 in the width direction Y, for example, in order to selectively take out a group of substrates among the 25 substrates W1 and the 25 substrates W2.

[0095] refer to Fig. 6A The underwater posture conversion unit 71 is provided in front of the waiting tank 69. The underwater posture conversion unit 71 includes a tank carrier 77, a lift LF8, a posture conversion tank 79, a rotation mechanism 81, a push rod mechanism 83 and a horizontal push mechanism 85 (refer to Figure 8B ).

[0096] The in-tank carrier 77 can accommodate multiple (e.g., 25) substrates W. The in-tank carrier 77 includes an inlet and outlet 77A and a back opening 77B. The inlet and outlet 77A is an opening for allowing the substrates W to enter and exit. The back opening 77B is opposite to the inlet and outlet 77A. In addition, the back opening 77B is formed with a width smaller than the diameter of the substrate W in the radial direction of the accommodated substrate W. Therefore, multiple substrates W cannot pass through the back opening 77B.

[0097] The lift LF8 includes two carrier support parts 87 for supporting the in-tank carrier 77. The lift LF8 raises and lowers the two carrier support parts 87. The posture conversion tank 79 accommodates the in-tank carrier 77, the two carrier support parts 87 of the lift LF8, and a push rod 83A (described later). The posture conversion tank 79 stores pure water (e.g., DIW) supplied from a pure water spray pipe (not shown). Thus, the in-tank carrier 77 can be immersed in the pure water in the posture conversion tank 79.

[0098] In addition, the second posture conversion mechanism 67 is equivalent to the posture conversion mechanism of the present invention. The underwater posture conversion unit 71 is equivalent to the second posture conversion unit of the present invention. In addition, the second posture conversion unit may be a multi-joint robot that converts the substrate W from the vertical posture to the horizontal posture instead of the horizontal posture conversion unit 71. The multi-joint robot has a movable hand (not shown) that holds one substrate W.

[0099] The rotating mechanism 81 includes two opposing shafts 81A. Each of the two shafts 81A penetrates the posture conversion groove 79. The rotating mechanism 81 sandwiches the in-groove carrier 77 with the two shafts 81A to hold the in-groove carrier 77. Furthermore, the rotating mechanism 81 can rotate the in-groove carrier 77 held by the two shafts 81A around the horizontal axis AX5 of the shafts 81A.

[0100] The push rod mechanism 83 includes a push rod 83A for holding a plurality of (e.g., 25) substrates W in a vertical position. The push rod mechanism 83 can move the push rod 83A up and down and rotate it around a vertical axis AX6 (see FIG. Figure 6B The horizontal push-out mechanism 85 includes a push-out member 85A for pushing out a substrate W in a horizontal posture (see Figure 8B ). When the inlet and outlet 77A of the carrier 77 in the tank faces rightward, the push member 85A moves rightward while passing through the back opening 77B and the inlet and outlet 77A. Each of the lifter LF8, the rotating mechanism 81, the push rod mechanism 83 and the horizontal push mechanism 85 is driven by at least one of an electric motor and an air cylinder.

[0101] <6-2. Operation of the Second Posture Conversion Mechanism>

[0102] Here, the operation of the second posture conversion mechanism 67 will be described. Fig. 6A In the pure water in the waiting tank 69, 50 substrates W are immersed in a vertical position by the lift LF7. Figure 3C As shown, 25 substrates W1 and 25 substrates W2 are alternately arranged.

[0103] The selective transport mechanism WTR2 moves to the top of the waiting tank 69. In addition, the lifter LF7 lifts the 50 substrates W from the pure water in the waiting tank 69. After that, the selective transport mechanism WTR2 receives 25 substrates W1 from the lifter LF7 among the 50 substrates W using a pair of chucks 73 and 74. Therefore, the 25 substrates W2 remain on the lifter LF7. The lifter LF7 immerses the 25 substrates W2 in the pure water in the waiting tank 69. The selective transport mechanism WTR2 transports the 25 substrates W1 to the top of the posture conversion tank 79 and the push rod 83A.

[0104] refer to Figure 6B . The push rod mechanism 83 raises the push rod 83A while passing the push rod 83A between the two carrier support parts 87 and the back opening 77B and the entrance 77A of the carrier 77 in the groove with the entrance 77A facing upward. As a result, the push rod 83A holds the lower part of the 25 substrates W1 held by a pair of chucks 73 and 74. Thereafter, the selective transport mechanism WTR2 opens a pair of chucks 73 and 74. As a result, the push rod 83A receives the 25 substrates W1 from the selective transport mechanism WTR2. Thereafter, the selective transport mechanism WTR2 moves from above the push rod 83A. Thereafter, in order to make the device surface of the 25 substrates W1 face upward when the 25 substrates W1 are converted to a horizontal posture, the push rod mechanism 83 adjusts the orientation of the 25 substrates W1 by rotating the 25 substrates W1 around the vertical axis AX6.

[0105] refer to Figure 6CThe lifter LF8 raises the two carrier support parts 87 supporting the in-tank carrier 77 with the inlet and outlet 77A facing upward from the position P1 to the position P2. Thus, the 25 substrates W1 held by the push rods 83A are stored in the in-tank carrier 77. The position P2 is a position where the substrates are lifted from the pure water in the in-tank carrier 77.

[0106] refer to Fig. 7A Then, the push rod mechanism 83 lowers the push rod 83A to the bottom surface of the in-tank carrier 77. Furthermore, the lifter LF8 lowers the two carrier support parts 87 from the position P2 to the position P1. Thus, the 25 substrates W1 stored in the in-tank carrier 77 are immersed in the pure water in the posture conversion tank 79.

[0107] refer to Figure 7B After that, the rotating mechanism 81 holds the carrier 77 in the groove with two shafts 81A. Figure 7C . Then, the lift LF8 lowers the two carrier support parts 87 from position P1 to position P3. Thus, the in-slot carrier 77 is held only by the two shafts 81A. In addition, position P3 is a position near the bottom surface of the in-slot carrier 77. Then, the rotating mechanism 81 rotates the in-slot carrier 77 90 degrees around the horizontal axis AX5. Thus, the 25 substrates W1 in the in-slot carrier 77 are converted from a vertical posture to a horizontal posture. At this time, the device surface of each substrate W1 faces upward.

[0108] refer to Fig. 8A Then, the lifter LF8 raises the two carrier supports 87 from the position P3 to the position P4. Thus, the two carrier supports 87 come into contact with the lower surface of the in-slot carrier 77. Then, the rotating mechanism 81 separates the two shafts 81A from the in-slot carrier 77. Thus, the in-slot carrier 77 is held only by the two carrier supports 87.

[0109] refer to Figure 8B . Then, in order to make the substrate W1 come out of the pure water in the posture conversion tank 79, the lifter LF8 raises the two carrier support parts 87. Then, the horizontal push-out mechanism 85 pushes the substrate W1 taken out from the pure water to the right with the push-out part 85A. The pushed-out substrate W1 is conveyed to the two belts 68B of the direction conversion conveyor 68. The direction conversion conveyor 68 converts the conveying direction of the substrate W1 from the right to the front. Then, the direction conversion conveyor 68 conveys the substrate W1 to the conveyor 101 (described later) of the single-wafer processing device 3.

[0110] After that, after 25 substrates W1 are unloaded from the in-tank carrier 77, the remaining 25 substrates W2 immersed in the pure water in the waiting tank 69 are switched to a horizontal posture. The posture switching of the 25 substrates W2 is performed in the same manner as the posture switching of the 25 substrates W1 (see FIG. 25 ). Figures 6A to 8B ).

[0111] <7. Single chip processing device>

[0112] Back to Figure 1 The single-wafer processing device 3 performs predetermined single-wafer processing on the multiple (e.g., 25 or 50) substrates W received from the interface device 5 one by one. The single-wafer processing device 3 transfers the multiple substrates W after the single-wafer processing to the carrier C, and the carrier C is transferred to the bracket 15A. The single-wafer processing device 3 is adjacent to the rear of the stocker device 2 and adjacent to the front of the interface device 5. The single-wafer processing device 3 includes a single-wafer substrate transfer area R5, a first single-wafer substrate processing area R6, and a second single-wafer substrate processing area R7.

[0113] Each of the three regions R5, R6, and R7 is arranged in a manner extending in the rear or front-rear direction X. The second single-chip substrate processing region R7, the single-chip substrate transfer region R5, and the first single-chip substrate processing region R6 are arranged in sequence in a horizontal direction orthogonal to the rear, that is, in the left direction. That is, the first single-chip substrate processing region R6 is adjacent to the left of the single-chip substrate transfer region R5. The second single-chip substrate processing region R7 is adjacent to the right of the single-chip substrate transfer region R5. In addition, the rear corresponds to the first direction of the present invention. The left corresponds to the second direction of the present invention.

[0114] First, two substrate processing areas R6 and R7 are described. The first substrate processing area R6 includes a rear tower TW1, a front tower TW2, and a substrate transfer robot CR1. The front tower TW2, the substrate transfer robot CR1, and the rear tower TW1 are arranged in this order along the substrate transfer area R5.

[0115] The rear tower TW1 is arranged behind the substrate transport robot CR1. The front tower TW2 is arranged in front of the substrate transport robot CR1. Figure 2 As shown, the first single-wafer processing region R6 includes one first single-wafer processing chamber SW1 and two second single-wafer processing chambers SW2 stacked in the vertical direction Z. The front tower TW2 includes three second single-wafer processing chambers SW2 stacked in the vertical direction Z. That is, the first single-wafer substrate processing region R6 includes a total of six single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2).

[0116] The substrate transport robot CR1 includes a hand 91, an advance / retract unit 92, and an elevating / rotating unit 93. The hand 91 holds one substrate W. The advance / retract unit 92 moves the hand 91 forward and backward. The elevating / rotating unit 93 elevates the hand 91 and the advance / retract unit 92. In addition, the elevating / rotating unit 93 rotates the hand 91 and the advance / retract unit 92 around a vertical axis AX7 in order to change the orientation of the hand 91. The elevating / rotating unit 93 is fixed to the bottom surface, and the elevating / rotating unit 93 does not move in the horizontal direction. The substrate transport robot CR1 transports substrates W between the three single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2) of the rear tower TW1 and the three second single-wafer processing chambers SW2 of the front tower TW2.

[0117] In addition, the second single-wafer substrate processing area R7 is provided with a rear tower TW1, a front tower TW2, and a substrate transfer robot CR2, similarly to the first single-wafer substrate processing area R6. That is, the second single-wafer substrate processing area R7 is provided with six single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2). The substrate transfer robot CR2 is configured similarly to the substrate transfer robot CR1. In addition, the types and numbers of single-wafer processing chambers provided in the rear tower TW1 and the front tower TW2 are appropriately set.

[0118] The first single-wafer processing chamber SW1 includes, for example, a holding and rotating unit 94 and a nozzle 95. The holding and rotating unit 94 includes a spin chuck that holds a substrate W in a horizontal position and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The nozzle 95 supplies a processing liquid onto the substrate W held by the holding and rotating unit 94. As the processing liquid, for example, pure water (for example, DIW) and IPA (isopropyl alcohol) are used. After the first single-wafer processing chamber SW1 performs a cleaning process on the substrate W with pure water, for example, an IPA liquid film is formed on the upper surface of the substrate W.

[0119] Each of the second single-wafer processing chambers SW2 performs a drying process of a supercritical fluid, for example. As the fluid, for example, carbon dioxide is used. When the fluid is carbon dioxide, a supercritical state can be obtained when the critical temperature is 31° C. and the critical pressure is 7.38 MPa. By performing the drying process of the supercritical fluid, it is less likely that the pattern on the substrate W will collapse.

[0120] The second single-wafer processing chamber SW2 includes a chamber body (container) 96, a support tray 97, and a cover. The chamber body 96 includes a processing space provided inside, an opening for placing a substrate W into the processing space, a supply port, and an exhaust port. The substrate W is supported by the support tray 97 and accommodated in the processing space. The cover seals the opening of the chamber body 96. For example, each second single-wafer processing chamber SW2 sets the fluid to a supercritical state, and supplies the supercritical fluid to the processing space in the chamber body 96 from the supply port. One substrate W is dried by the supercritical fluid supplied to the processing space.

[0121] Next, the substrate transfer region R5 is described. Figure 1 As shown, the conveyor 101, four substrate transfer robots CR3, CR4, CR5, CR6, and three substrate placement units PS1, PS2, PS3 are provided. The conveyor 101 and the four substrate transfer robots CR3, CR4, CR5, CR6 each correspond to the horizontal substrate transfer mechanism of the present invention.

[0122] The conveyor 101 includes two pulleys 103, two belts 105, and a pin lifting unit 107 (see Figure 4 ). Two belts 105 are mounted on two pulleys 103. A pin lifting unit 107 is provided at the front of the conveyor belt 101. The pin lifting unit 107 has three lifting pins PN, and one substrate W on the two belts 105 is lifted by the three lifting pins PN. At least one of the two pulleys 103 and each of the pin lifting unit 107 are driven by an electric motor.

[0123] Each of the four substrate transport robots CR3 to CR6 is configured similarly to the substrate transport robot CR1. In addition, it is preferred that the substrate transport robot CR4 has two hands 91. In this case, the first hand 91 is used to transport a wet substrate W, and the second hand 91 is used to transport a substrate W dried in the second single-wafer processing chamber SW2. Each of the three substrate placement units PS1 to PS3 is configured to be able to place one or more substrates W.

[0124] The conveyor belt 101, the substrate transport robot CR3, the substrate transport robot CR4, the substrate transport robot CR5, and the substrate transport robot CR6 are arranged in this order so as to face forward. The substrate placement unit PS1 is arranged between the two substrate transport robots CR3 and CR4. The substrate placement unit PS2 is arranged between the two substrate transport robots CR4 and CR5. The substrate placement unit PS3 is arranged between the two substrate transport robots CR5 and CR6.

[0125] The conveyor 101 extends backward to the direction-changing conveyor 68 of the interface device 5. The conveyor 101 receives the substrate W from the second posture conversion mechanism 67 via the direction-changing conveyor 68. The conveyor 101 moves the substrate W to the top of the pin lifting part 107 by belt conveyance. The substrate transport robot CR3 transports the substrate W between the pin lifting part 107 of the conveyor 101 and the substrate placement part PS1.

[0126] The substrate transport robot CR4 transports substrates W between the two substrate mounting parts PS1 and PS2 and the six second single-wafer processing chambers (first single-wafer processing chamber SW1 and second single-wafer processing chamber SW2) of the two rear towers TW1. In addition, the substrate transport robot CR5 transports substrates W between the two substrate mounting parts PS2 and PS3 and the six second single-wafer processing chambers SW2 of the two front towers TW2. The substrate transport robot CR6 transports substrates W between the substrate mounting part PS3 and the carrier C mounted on the bracket 15A.

[0127] <8. Control Unit>

[0128] The substrate processing system 1 includes a control unit 110 (see Figure 1 ) and a storage unit (not shown). The control unit 110 controls each component of the substrate processing system 1. The control unit 110 has, for example, one or more processors such as a central processing unit (CPU). The storage unit has, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing system 1.

[0129] <9. Operation of substrate processing system>

[0130] Next, refer to Fig. 9 The operation of the substrate processing system 1 will be described with reference to the flowchart of FIG. Figure 1 An external transfer robot (not shown) transfers the two carriers C to the load port 11 .

[0131] [Step S01] Carrier transport (stocker device)

[0132] The first transfer robot 17 of the stocker device 2 does not transfer the first carrier C to the tray 15A accessible to the substrate transfer robot CR6 of the single-wafer processing device 3. This is because the processing capacity of the substrate processing system 1 may be reduced due to the substrate W passing through the inside of the single-wafer processing device 3. Instead, the carrier C is transferred from the stocker device 2 to the interface device 5 adjacent to the batch processing device 7 while the substrate W before processing (unprocessed) is stored.

[0133] The first transfer robot 17 of the stocker device 2 transfers the first carrier C placed on the load port 11 to the stocker device side position PT1. The carrier transfer mechanism 9 receives the first carrier C transferred to the stocker device side position PT1 from the first transfer robot 17 using the placement table 23.

[0134] [Step S02] Carrier transport (carrier transport mechanism)

[0135] The carrier transport mechanism 9 transports the first carrier C from the stocker device side position PT1 to the interface device side position PT2 by moving the mounting table 23 rearward.

[0136] [Step S03] Carrier transport (interface device)

[0137] The second transfer robot 31 of the interface device 5 transfers the first carrier C from the interface device side position PT2 to the tray 29 . That is, the second transfer robot 31 holds the first carrier C on the mounting table 23 and transfers the held first carrier C to the tray 29 .

[0138] [Step S04] Removing the substrate from the carrier

[0139] The substrate processing mechanism HTR of the transfer block 37 of the batch processing apparatus 7 takes out 25 substrates W1 (a first substrate group) from the first carrier C conveyed to the holder 29 , and conveys the 25 substrates W1 to the posture conversion section 51 .

[0140] After that, the second transfer robot 31 of the interface device 5 transfers the first carrier C (empty carrier) after taking out 25 substrates from the bracket 29 to the interface device side position PT2. The carrier transfer mechanism 9 receives the first carrier C using the stage 23. After that, the carrier transfer mechanism 9 transfers the first carrier C (empty carrier) from the interface device side position PT2 to the stocker device side position PT1 by moving the stage 23 forward. After that, the first transfer robot 17 of the stocker device 2 transfers the first carrier C (empty carrier) from the stocker device side position PT1 to the bracket 15A. That is, the first transfer robot 17 holds the first carrier C on the stage 23 and transfers the held first carrier C to the bracket 15A.

[0141] Then, the operations of steps S01 to S04 are performed on the second carrier C. That is, the first transfer robot 17 transfers the second carrier C placed on the load port 11 to the stocker device side position PT1. The carrier transfer mechanism 9 receives the second carrier C using the loading table 23. The carrier transfer mechanism 9 transfers the second carrier C from the stocker device side position PT1 to the interface device side position PT2 by moving the carrier table 23 backward.

[0142] After that, the second transfer robot 31 holds the second carrier C on the mounting table 23, and transfers the held second carrier C from the interface device side position PT2 to the bracket 29. The substrate processing mechanism HTR of the batch processing device 7 takes out 25 substrates W2 (second substrate group) from the second carrier C transferred to the bracket 29, and transfers the 25 substrates W2 to the posture conversion unit 51.

[0143] After that, the second transfer robot 31 transfers the second carrier C (empty carrier) after taking out 25 substrates W2 from the tray 29 to the interface device side position PT2. The carrier transfer mechanism 9 receives the second carrier C (empty carrier) from the second transfer robot 31 using the stage 23. The carrier transfer mechanism 9 transfers the second carrier C (empty carrier) from the interface device side position PT2 to the stocker device side position PT1 by moving the stage 23 forward. The first transfer robot 17 holds the second carrier C on the stage 23 and transfers the held second carrier C from the stocker device side position PT1 to the storage tray 15B. The second carrier C (empty carrier) is stored on the tray 15B until it can be transferred to the tray 15A.

[0144] [Step S05] Posture transition to vertical posture

[0145] like Figure 3A to Figure 3C As shown, the posture conversion unit 51 converts the 25 substrates W1 and the 25 substrates W2 from the horizontal posture to the vertical posture. In addition, the push rod 53A of the push rod mechanism 53 holds the 50 substrates W (substrates W1, W2) in which the 25 substrates W1 and the 25 substrates W2 are alternately arranged in the vertical posture. Thereafter, the push rod mechanism 53 transports the 50 substrates W to the substrate transfer position PP.

[0146] [Step S06] Chemical solution treatment

[0147] The batch transfer mechanism WTR1 receives 50 substrates W in a vertical posture from the pusher mechanism 53 at the substrate delivery position PP, and transfers the 50 substrates W to one of the two lifts LF1 and LF3 of the two chemical processing tanks BT1 and BT3.

[0148] For example, the batch transport mechanism WTR1 transports 50 substrates W to the elevator LF1 of the chemical liquid treatment tank BT1. The elevator LF1 receives the 50 substrates W at a position above the chemical liquid treatment tank BT1. The elevator LF1 immerses the 50 substrates W in the chemical liquid (e.g., phosphoric acid) in the chemical liquid treatment tank BT1. Thus, etching treatment (batch treatment) is performed. After the etching treatment, the elevator LF1 lifts the 50 substrates W from the phosphoric acid in the chemical liquid treatment tank BT1. In addition, when the 50 substrates W are transported to the elevator LF3 of another chemical liquid treatment tank BT3, the same treatment as that of the chemical liquid treatment tank BT1 is also performed.

[0149] [Step S07] Pure water cleaning treatment

[0150] The batch transport mechanism WTR1 receives, for example, 50 substrates W in a vertical position from the lift LF1, and transports the 50 substrates W to the lift LF2 of the water washing treatment tank BT2. The lift LF2 receives the 50 substrates W at a position above the water washing treatment tank BT2. The lift LF2 immerses the 50 substrates W in the pure water in the water washing treatment tank BT2. Thus, a cleaning process (batch process) is performed.

[0151] When the batch transport mechanism WTR1 receives 50 substrates W in a vertical position from the lift LF3, the batch transport mechanism WTR1 transports the 50 substrates W to the lift LF4 of the water washing treatment tank BT4. The lift LF4 immerses the 50 substrates W in the pure water in the water washing treatment tank BT4.

[0152] [Step S08] Posture transition to horizontal posture

[0153] The batch transport mechanism WTR1 receives 50 substrates W after the pure water cleaning process from one of the two elevators LF2 and LF4. When transporting the 50 substrates W, for example, the elevator LF2 lifts the 50 substrates W from the pure water in the water washing tank BT2. The batch transport mechanism WTR1 transports the received 50 substrates W to the elevator LF7 of the waiting tank 69 of the interface device 5 beyond the substrate delivery position PP of the first posture conversion mechanism 41. The elevator LF7 receives the 50 substrates W at a position above the waiting tank 69.

[0154] like Figures 6A to 8B As shown, the underwater posture conversion unit 71 converts the 25 substrates W1 and 25 substrates W2 from the vertical posture to the horizontal posture. The underwater posture conversion unit 71 transfers the 25 substrates W1 (25 substrates W2) converted to the horizontal posture one by one to the direction conversion conveyor 68. The direction conversion conveyor 68 converts the conveying direction of one substrate W from the right to the front, and transfers the conveyed one substrate W to the conveyor 101 of the single-wafer processing device 3.

[0155] [Step S09] First single-chip processing

[0156] The conveyor belt 101 transports one substrate W to the pin lifting unit 107. The pin lifting unit 107 lifts one substrate W from two belts 105. The substrate transport robot CR3 receives one substrate W from the pin lifting unit 107 and transports the one substrate W to the substrate mounting unit PS1 in a horizontal posture. Then, the substrate transport robot CR4 receives one wet substrate W from the substrate mounting unit PS1 using the first hand 91 of the two hands 91. Then, the substrate transport robot CR4 transports the substrate W received by the first hand 91 to one of the two first single wafer processing chambers SW1 of the two rear towers TW1.

[0157] Each first single-wafer processing chamber SW1 holds and rotates the substrate W with the device surface facing upward by the holding and rotating unit 94, and supplies pure water to the device surface from the nozzle 95. Then, each first single-wafer processing chamber SW1 supplies IPA from the nozzle 95 to the device surface (upper surface) of the substrate W, and replaces the pure water on the substrate W with IPA.

[0158] [Step S10] Second single-wafer processing (drying processing)

[0159] The substrate W is processed in the first single-wafer processing chamber SW1 of the first single-wafer processing area R6. In the above case, the substrate transfer robot CR1 transfers the substrate W replaced by IPA from the first single-wafer processing chamber SW1 of the first single-wafer processing area R6 to any one of the five second single-wafer processing chambers SW2 of the first single-wafer processing area R6. Similarly, the substrate W is processed in the first single-wafer processing chamber SW1 of the second single-wafer processing area R7. In the above case, the second substrate transfer robot CR2 transfers the substrate W replaced by IPA from the first single-wafer processing chamber SW1 of the second single-wafer processing area R7 to any one of the five second single-wafer processing chambers SW2 of the second single-wafer processing area R7.

[0160] Each second single-wafer processing chamber SW2 performs a drying process on one substrate W using carbon dioxide in a supercritical state (supercritical fluid). The drying process using the supercritical fluid suppresses pattern collapse on the pattern surface (device surface) of the substrate W.

[0161] [Step S11] Place the substrate on a carrier

[0162] Drying is performed in any of the six second processing chambers SW2 of the two front towers TW2 of the two substrate processing areas R6 and R7. In this case, the substrate transfer robot CR5 transfers a substrate W after drying from the second processing chamber SW2 to the substrate placement portion PS3.

[0163] In addition, a drying process is performed in any of the four second single-wafer processing chambers SW2 of the two rear towers TW1 of the two single-wafer processing areas R6 and R7. In this case, the substrate transport robot CR4 receives one substrate W from the second single-wafer processing chamber SW2 that is undergoing the drying process using the second hand 91 of the two hands 91. Then, the substrate transport robot CR4 transports the substrate W received by the second hand 91 to the substrate mounting portion PS2. Thereafter, the substrate transport robot CR5 transports the substrate W after the drying process from the substrate mounting portion PS2 to the substrate mounting portion PS3.

[0164] The substrate transport robot CR6 transports the substrate W1 from the substrate placement portion PS3 to the first carrier C placed on the holder 15A.

[0165] [Step S12] Carrier Conveyance (Stacker Device)

[0166] When 25 substrates W1 are stored in the first carrier C, the first transfer robot 17 transfers the first carrier C from the tray 15A to one of the two load ports 11. In addition, the first transfer robot 17 transfers the second carrier C (empty carrier) from the tray 15B to the tray 15A to which the first carrier C has been transferred.

[0167] After that, the operations of steps S11 and S12 are performed on the second carrier C. The substrate transport robot CR6 transports the substrate W2 from the substrate mounting portion PS3 to the second carrier C mounted on the holder 15A. When 25 substrates W2 are stored in the second carrier C, the first transport robot 17 transports the second carrier C from the holder 15A to one of the two loading ports 11. The external transport mechanism (not shown) transports the two carriers C from the loading ports 11 in sequence to the next destination.

[0168] According to the present embodiment, the stocker device 2, the single-wafer processing device 3, the interface device 5, and the batch processing device 7 are sequentially arranged in a single row and in a straight line. In this configuration, the carrier transport mechanism 9 transports the carrier C between the stocker device side position PT1 on the stocker device 2 side and the interface device side position PT2 on the interface device 5 side. Therefore, the substrate W can be transported from the stocker device 2 to the interface device 5 in carrier units. Therefore, the processing capacity can be prevented from being reduced due to the substrate W passing through the inside of the single-wafer processing device 3. In addition, since the substrate W is stored in the carrier C, it is possible to prevent particles from being attached to the substrate W when the substrate W is transported from the stocker device 2 to the interface device 5.

[0169] In addition, the batch processing apparatus 7 includes a posture conversion unit 51. The interface device 5 includes an underwater posture conversion unit 71. Thus, the batch processing apparatus 7 can perform a predetermined batch process on a plurality of substrates W converted to a vertical posture. In addition, the single-wafer processing apparatus 3 can perform a predetermined single-wafer process on a plurality of substrates W converted to a horizontal posture by the interface device 5 one by one.

[0170] In addition, the batch processing apparatus 7 includes a transfer block 37 adjacent to the tray 29 and a processing block 39 adjacent to the transfer block 37. This configuration is the same as that of a general batch type substrate processing apparatus. In addition, in a general batch type substrate processing apparatus, posture conversion is generally performed by the transfer block 37 including the substrate processing mechanism HTR. According to the present invention, one end of the batch substrate transfer region R4 extends to the inside of the interface device 5, and the other end of the batch substrate transfer region R4 extends to the rear. Moreover, the batch transfer mechanism WTR1 of the batch substrate transfer region R4 transfers a plurality of substrates W in a vertical posture, for example, from two batch processing tanks BT2 and BT4 (processing block 39), while exceeding the first posture conversion mechanism 41 (transfer block 37). Therefore, a plurality of substrates W can be efficiently transferred.

[0171] In addition, the carrier transport mechanism 9 is disposed above the single-wafer processing device 3 and overlaps with the single-wafer processing device 3 when viewed from above. As a result, the area for performing single-wafer processing can be increased in the single-wafer processing device 3. In other words, the single-wafer processing device 3 can be equipped with more single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2). Therefore, the processing capacity can be improved.

[0172] [Example 2]

[0173] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first embodiment will be omitted. Fig.10 2 is a top view of the substrate processing system 1 of Example 2. Fig.10 For example, the rear tower TW1 , the front tower TW2 , and the six substrate transfer robots CR1 to CR6 are hidden by the top wall 115 .

[0174] The substrate processing system 1 of the first embodiment includes a single carrier transport mechanism 9. In contrast, the substrate processing system 1 of the second embodiment may include a plurality of (eg, two) carrier transport mechanisms 9A and 9B.

[0175] The two carrier transport mechanisms 9A and 9B are arranged side by side in the width direction Y. Each of the two carrier transport mechanisms 9A and 9B is provided above the wafer processing device 3 and overlaps a part or all of the wafer processing device 3 in a plan view. Each of the two carrier transport mechanisms 9A and 9B is configured similarly to the carrier transport mechanism 9 of the first embodiment. That is, the first carrier transport mechanism 9A includes a mounting table 23A and a table moving unit 25A. Similarly, the second carrier transport mechanism 9B includes a mounting table 23B and a table moving unit 25B.

[0176] The first carrier transport mechanism 9A transports the carrier C between the stocker device side position PT1 on the stocker device 2 side and the interface device side position PT2 on the interface device 5 side. In addition, the second carrier transport mechanism 9B transports the carrier C between the stocker side position PT3 on the stocker device 2 side and the interface device side position PT4 on the interface device 5 side. In addition, the two carrier transport mechanisms 9A and 9B correspond to the carrier transport region and the second carrier transport mechanism of the present invention.

[0177] The first transfer robot 17 transfers the carrier C to the stage 23A moved to the predetermined position on the stocker device 2 side. Similarly, the first transfer robot 17 transfers the carrier C to the stage 23B moved to the predetermined position on the stocker device 2 side. In addition, the second transfer robot 31 transfers the carrier C to the stage 23A moved to the predetermined position on the interface device 5 side. Similarly, the second transfer robot 31 transfers the carrier C to the stage 23B moved to the predetermined position on the interface device 5 side.

[0178] For example, the first carrier transport mechanism 9A transports the first carrier W containing the substrate W before processing from the stocker device side position PT1 to the interface device side position PT2. In addition, the first carrier transport mechanism 9A transports an empty first carrier C from the interface device side position PT2 to the stocker device side position PT1. In addition, before processing means that no processing is performed in the substrate processing system 1.

[0179] The second carrier transport mechanism 9B transports the second carrier C storing the unprocessed substrate W from the stocker apparatus side position PT3 to the interface apparatus side position PT4. Also, the second carrier transport mechanism 9B transports an empty second carrier C from the interface apparatus side position PT4 to the stocker apparatus side position PT3.

[0180] As another example of transport, the first carrier transport mechanism 9A may transport only the carrier C storing the substrate W before processing. Also, the second carrier transport mechanism 9B may transport only the empty carrier C.

[0181] The substrate processing system 1 of this embodiment includes a plurality of (eg, two) carrier transport mechanisms 9A and 9B. Since the number of carrier transport mechanisms 9 increases, the carriers C can be efficiently transported between the stocker device 2 and the interface device 5.

[0182] [Example 3]

[0183] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first and second embodiments will be omitted. Fig.11 It is a top view of the substrate processing system 1 of Example 3. Fig.12 Observed from the direction of arrow BB Fig.11 A longitudinal sectional view of a single-wafer processing device 3 is shown.

[0184] The wafer processing apparatus 3 of the first embodiment includes the second substrate processing region R7, the substrate transfer region R5, and the first substrate processing region R6. In contrast, the wafer processing apparatus 3 of the third embodiment includes the carrier transfer region R11, the substrate transfer region R5, and the first substrate processing region R6.

[0185] Each of the carrier transport region R11, the substrate transport region R5, and the first substrate processing region R6 is arranged in a manner extending in the rear or front-rear direction X. The carrier transport region R11, the substrate transport region R5, and the first substrate processing region R6 are arranged in sequence in the horizontal direction orthogonal to the rear, that is, in the left direction. In other words, the carrier transport region R11 is arranged adjacent to the right side of the substrate transport region R5. In addition, the first substrate processing region R6 is arranged adjacent to the left side of the substrate transport region R5. In addition, the wall 121 is a wall that cuts off the atmosphere of the carrier transport region R11 and the substrate transport region R5.

[0186] The carrier transport region R11 includes a carrier transport mechanism 9. In addition, the carrier transport region R11 may include a plurality of carrier transport mechanisms 9. In this case, Fig.12 For example, two carrier transport mechanisms 9 are arranged in the vertical direction Z. Fig.12 In the embodiment, the second carrier transport mechanism 9 is arranged at a position indicated by a dotted line HA, for example. The substrate transport region R5 includes a substrate transport robot CR7 and a conveyor belt 101. The substrate transport robot CR7 and the conveyor belt 101 transport at least one substrate W between the interface device 5, the six wafer processing chambers (the first wafer processing chamber SW1 and the second wafer processing chamber SW2), and the carrier C transported to the carrier 15A.

[0187] The substrate transport robot CR7 includes a hand 91 , an advance / retract unit 92 , and an elevation / rotation unit 93 similarly to the substrate transport robot CR1 . The substrate transport robot CR7 further includes a guide rail 123 extending in the front-rear direction X. The substrate transport robot CR7 (elevation / rotation unit 93 ) can move along the guide rail 123 .

[0188] The substrate processing region R6 includes a rear tower TW1, a front tower TW2, and a substrate transfer robot CR1. The rear tower TW1 includes one first processing chamber SW1 and two second processing chambers SW2 arranged in the vertical direction Z. In addition, the front tower TW2 includes three second processing chambers SW2 arranged in the vertical direction Z.

[0189] The substrate transport robot CR7 has, for example, two hands 91. The substrate transport robot CR7 uses the first hand 91 to transport a wet substrate W from the pin lift 107 of the conveyor 101 to a first single-wafer processing chamber SW1 of the rear tower TW1. The substrate transport robot CR1 of the single-wafer processing area R6 transports a substrate W replaced with IPA from a first single-wafer processing chamber SW1 to any one of five second single-wafer processing chambers SW2. The substrate transport robot CR7 uses the second hand 91 to transport a substrate W after drying from the second single-wafer processing chamber SW2 subjected to drying to the carrier C mounted on the bracket 15A.

[0190] According to this embodiment, similarly to the substrate processing system 1 of the first embodiment, it is possible to prevent the processing capacity from being reduced due to the substrate W passing through the inside of the single-wafer processing device 3. In addition, when assembling the substrate processing system 1, when the carrier conveying mechanism 9 is arranged above the single-wafer processing device 3 (the case of the first and second embodiments), it is necessary to convey the carrier conveying mechanism 9 to the top of the single-wafer processing device 3. According to this embodiment, the carrier conveying area configuration R11 having the carrier conveying mechanism 9 is arranged on the side of the single-wafer substrate conveying area R5 and the single-wafer substrate conveying area R6. Therefore, the burden of conveying the carrier conveying mechanism 9 can be reduced, thereby making it relatively easy to assemble the substrate processing system 1.

[0191] In addition, each of the first transfer robot 17 and the second transfer robot 31 does not need to transfer the carrier C to a position higher than the top wall 115 of the single-wafer processing device 3. Therefore, the carrier C can be efficiently transferred between the stocker device 2 and the interface device 5. In addition, since the carrier transfer area R11, the single-wafer substrate transfer area R5, and the single-wafer substrate processing area R6 are arranged in the horizontal direction (width direction Y), the length of the substrate processing system 1 in the width direction can be suppressed from increasing. That is, since only Figure 1 Since the second single substrate processing region R7 shown is replaced by the carrier transfer region R11, the length in the width direction Y of the substrate processing system 1 is almost unchanged.

[0192] [Example 4]

[0193] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to third embodiments will be omitted. Fig.13 1 is a top view of the substrate processing system 1 of Example 4. Fig.13 In the longitudinal section of the single-chip processing device 3 viewed from the direction of arrow BB, Fig.12 Roughly the same picture.

[0194] In the third embodiment, the single-wafer processing region R6 includes six single-wafer processing chambers (first single-wafer processing chamber SW1 and second single-wafer processing chamber SW2). One first single-wafer processing chamber SW1 processes one substrate W with pure water and IPA, and each of the five second single-wafer processing chambers SW2 performs a supercritical fluid drying process on one substrate W. In the fourth embodiment, the single-wafer processing region R6 may include six first single-wafer processing chambers SW1, and each of the six first single-wafer processing chambers SW1 processes one substrate W with pure water and IPA, and then performs spin drying.

[0195] refer to Fig.13 The single-wafer processing apparatus 3 includes a carrier conveying region R11 , a single-wafer substrate conveying region R5 , and a single-wafer substrate processing region R6 .

[0196] Each of the carrier transfer region R11, the substrate transfer region R5 and the substrate processing region R6 is provided to extend in the rear or front-rear direction X. The carrier transfer region R11, the substrate transfer region R5 and the substrate processing region R6 are arranged in sequence in the horizontal direction perpendicular to the rear, that is, in the left direction.

[0197] The single-wafer substrate processing region R6 includes a rear tower TW1 and a front tower TW2. The rear tower TW1 and the front tower TW2 each include three first single-wafer processing chambers SW1 arranged in the vertical direction Z. Each of the six first single-wafer processing chambers SW1 of the rear tower TW1 and the front tower TW2 sequentially supplies pure water and IPA to the substrate W, for example, and then performs drying processing (spin drying) on ​​the substrate W.

[0198] The single-chip substrate transport region R5 includes, for example, a conveyor belt 101, two substrate transport robots CR8 and CR9, and a substrate loading unit PS4. The substrate transport robot CR8 is disposed in front of the conveyor belt 101. In addition, the substrate transport robot CR8 is disposed between the conveyor belt 101 and the substrate loading unit PS4. The substrate loading unit PS4 is disposed between the two substrate transport robots CR8 and CR9. The substrate loading unit PS4 is configured similarly to the substrate loading unit PS1. The substrate transport robot CR9 is disposed closer to the stocker device 2 than the substrate loading unit PS4.

[0199] The substrate transport robot CR8 includes a hand 91, an advance / retract portion 92, and a lifting / rotating portion 93, similarly to the substrate transport robot CR1 of the first embodiment. In addition, it is preferable that the substrate transport robot CR8 includes two hands 91.

[0200] The substrate transport robot CR8 receives one substrate W from the pin lift 107 of the conveyor 101 using the first hand 91, and transports the one substrate W received by the first hand 91 to any one of the six first single-wafer processing chambers SW1. In addition, the substrate transport robot CR8 receives one substrate W from the single-wafer processing chamber SW1 for drying using the second hand 91, and transports the one substrate W received by the second hand 91 to the substrate mounting portion PS4.

[0201] The substrate transport robot CR9 includes a hand 131, a multi-joint arm 133, and a lifting platform 135. The hand 131 holds one substrate W. The multi-joint arm 133 is, for example, a SCARA (selective compliance assembly robot arm) type robot arm. The base end of the multi-joint arm 133 is mounted on the lifting platform 135 so as to be rotatable around a vertical axis. The hand 131 is mounted on the front end of the multi-joint arm 133. Each of the multi-joint arm 133 and the lifting platform 135 is driven by an electric motor. The substrate transport robot CR9 transports the substrate W from the substrate mounting portion PS4 to the carrier C mounted on the bracket 15A.

[0202] According to this embodiment, similarly to the substrate processing system 1 of the first embodiment, it is possible to prevent the processing capacity from being reduced due to the substrate W passing through the interior of the single-wafer processing apparatus 3. Also, similarly to the substrate processing system 1 of the third embodiment, when assembling the substrate processing system 1, the burden on the carrier transport mechanism 9 can be reduced.

[0203] The present invention is not limited to the above-described embodiment, and can be implemented with modifications as described below.

[0204] (1) In each of the above embodiments, the carrier transport mechanism 9 (9A, 9B) includes a mounting table 23 (23A, 23B) for mounting the carrier C. In this regard, the carrier transport mechanism 9 may include, for example, a protruding holding portion for holding the upper surface of the carrier C. In this case, the table moving portion 25 moves the holding portion. For example, the carrier transport mechanism 9 may also deliver the carrier C to the holding portion 19 of the first transport robot 17 via a bracket.

[0205] (2) In each of the above-mentioned embodiments and variation (1), the first transfer robot 17 and the second transfer robot 31 each include a holding portion 19, 33. In this regard, at least one of the first transfer robot 17 and the second transfer robot 31 may include a support portion 141 for supporting the lower surface of the carrier C (see Fig.14A , Fig. 14B ). When the carrier C is transferred between the support portion 141 and the mounting table 23 , the mounting table 23 may include a notch portion 143 so that a part or all of the support portion 141 can pass through in the vertical direction Z.

[0206] In addition, in order to change the direction of the notch 143, the mounting table 23 may also be rotatable around the vertical axis AX8. For example, when the support portion 141 of the first transport robot 17 transports the carrier C to the mounting table 23, the notch 143 of the mounting table 23 faces forward (refer to Fig.14A ). In addition, when the support portion 141 of the second transfer robot 31 receives the carrier C from the mounting table 23, the notch portion 143 faces rearward (refer to Fig. 14B ).

[0207] Furthermore, the carrier transport mechanism 9 may include a holding portion, and at least one of the first transport robot 17 and the second transport robot 31 may include a supporting portion 141 .

[0208] (3) In the above-mentioned embodiments and variations, for example, the batch processing tank BT1 performs a collective immersion treatment on 50 substrates W in which 25 substrates W1 and 25 substrates W2 are alternately arranged one by one. The 50 substrates W (W1, W2) are arranged at a half pitch (e.g., 5 mm interval). In this regard, the batch processing tank BT1 may also perform a collective immersion treatment on 25 substrates W arranged at a full pitch (e.g., 10 mm).

[0209] In the above case, you may not set Figure 4 The selective transport mechanism WTR2 is shown. In addition, the batch transport mechanism WTR1 may be configured to transport a plurality of substrates (for example, 25 substrates) W between the four batch processing tanks BT1 to BT4, the substrate transfer position PP of the first posture conversion mechanism 41, the waiting tank 69, and the underwater posture conversion unit 71. In addition, when the selective transport mechanism WTR2 is not provided, the waiting tank 69 may not be provided.

[0210] (4) In each of the above-mentioned embodiments and variations, for example, the batch processing tank BT1 performs immersion processing on a processing substrate group, that is, 50 substrates W. Among the 50 substrates W (W1, W2), when the device surfaces of the 25 substrates W1 of the first substrate group face rightward, the device surfaces of the 25 substrates W2 of the second substrate group face leftward. In addition, when the device surfaces of the 25 substrates W1 of the first substrate group face rightward, the device surfaces of the 25 substrates W2 of the second substrate group face rightward.

[0211] (5) In the above-described embodiments and modifications, the stocker device 2 includes the bracket 15B for storing the carrier C. In this regard, when the bracket 15B is not necessary, the stocker device 2 may not include the bracket 15B.

[0212] (6) In the above-mentioned embodiments and variations, Figure 1 The arrangement of the components of the substrate processing system 1 shown may be reversed in the width direction Y. For example, in the interface device 5 , the carrier moving region R1 may be arranged to the left of the posture changing region R2 .

[0213] (7) In the above-described embodiments and modifications, the interface device 5 includes the direction-changing conveyor 68. The interface device 5 may include the substrate transport robot CR1 instead.

[0214] (8) In the above-mentioned embodiments and variations, Fig.11 or Fig.13 The substrate transfer area R5 shown may also include Figure 1 The four substrate transfer robots CR3 to CR6 and the three substrate placement units PS1 to PS3 are shown. Figure 1 or Fig.13 The substrate transfer area R5 shown may also include Fig.11 The substrate transport robot CR7 shown. Figure 1 or Fig.11 The substrate transfer area R5 shown may also include Fig.13 The substrate transfer robots CR8 and CR9 and the substrate placement unit PS4 are shown. In addition, the conveyor belt 101 may not be provided. In the above case, for example Fig.13 The substrate transport robot CR8 can also be used with Fig.11 The substrate transport robot CR7 shown is similarly configured to be movable in the front-rear direction X. Figure 1 , Fig.11 or Fig.13 The single substrate transfer region R5 shown only needs to include at least one substrate transfer robot CR7 (CR3).

[0215] (9) In each of the above-mentioned embodiments and variations, the transfer block 37 includes a substrate processing mechanism HTR and a posture conversion unit 51. In this regard, when the substrate processing mechanism HTR is configured as a multi-joint robot, the posture conversion unit 51 may be omitted. In the above-mentioned case, the substrate processing mechanism HTR (multi-joint robot) may include, for example, five hands 43, and convert the five substrates W taken out from the carrier C from a horizontal posture to a vertical posture. Furthermore, the substrate processing mechanism HTR (multi-joint robot) may arrange the five substrates W in a vertical posture on the push rod 53A of the push rod mechanism 53. The push rod 53A (vertical holding unit) holds the five substrates W directly transported from the substrate processing mechanism HTR in a vertical posture.

[0216] (10) In each of the above-mentioned embodiments and variations, the posture conversion unit 51 and the underwater posture conversion unit 71 each include a substrate storage unit for storing a plurality of substrates W, and the substrate storage unit can rotate around a horizontal axis parallel to the rear or front-rear direction X and parallel to each device surface of the plurality of substrates W.

[0217] The present invention may be embodied in other specific forms without departing from the spirit or essence thereof and, accordingly, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

[0218] [Explanation of symbols]

[0219] 1 Substrate processing system

[0220] 2 Stacker device

[0221] 3 Single-Chip Processing Device

[0222] 5 Interface device

[0223] 7 Batch Processing Device

[0224] 9,9A,9B Carrier transport mechanism

[0225] 11 Loading port

[0226] 15(15A) Bracket

[0227] 17 No.1 Transport Robot

[0228] 19 Holding part

[0229] PT1, PT3 Stacker side position

[0230] PT2, PT4 interface device side position

[0231] 23,23A,23B Loading table

[0232] 29 Bracket

[0233] 31 Second transport robot

[0234] 33. Holding part

[0235] 37 Transfer block

[0236] 39 Processing Block

[0237] HTR Substrate Handling Mechanism

[0238] 41 1st posture conversion mechanism

[0239] R4 Batch substrate transfer area

[0240] BT1~BT4 Batch Processing Tanks

[0241] WTR1 Batch transport mechanism

[0242] 67 Second posture conversion mechanism

[0243] R5 Single substrate transfer area

[0244] R6 1st single substrate processing area

[0245] R11 Carrier transport area

[0246] SW1, SW2 Single Wafer Processing Chamber

[0247] 101 Conveyor Belt

[0248] CR7 Substrate Transport Robot

[0249] C carrier

[0250] W(W1,W2) substrate.

Claims

1. A substrate processing system, characterized in that: It is a substrate processing system for processing a substrate and has: A stocker device including a loading port for carrying in and out a carrier for storing a plurality of substrates, a first carrier mounting rack for carrying the carrier, and a first transport robot for transporting the carrier; Batch processing device to process multiple substrates at once; A single-wafer processing device processes the plurality of substrates one by one; an interface device including a second carrier mounting rack for mounting the carrier, and a second transport robot for transporting the carrier; and a carrier transport mechanism for transporting the carrier between a position on the stocker device side and an interface device side position on the interface device side; and The stacker device, the single-chip processing device, the interface device and the batch processing device are arranged in a single row and in a straight line. The first transfer robot transfers the carrier containing the substrate before processing placed on the load port to a position on the stocker device side. The carrier transport mechanism transports the carrier storing the substrate before processing from the position on the stocker device side to the position on the interface device side. The second transfer robot transfers the carrier storing the substrate before processing from the interface device side position to the second carrier mounting rack, The batch processing device takes out the plurality of substrates from the carrier storing the substrates before processing which is transported to the second carrier mounting rack, and performs a predetermined batch process on the taken-out plurality of substrates. The batch processing device transports the plurality of substrates after the batch processing to the interface device, The second transfer robot transfers the carrier from which the plurality of substrates are taken out and becomes empty from the second carrier mounting rack to a position on the interface device side. The carrier transport mechanism transports the empty carrier from the interface device side position to the stocker device side position, The first transport robot transports the empty carrier from the stocker device side position to the first carrier loading rack, The single-wafer processing device performs predetermined single-wafer processing on the plurality of substrates received from the interface device one by one, and transports the plurality of substrates after the single-wafer processing to the empty carrier transported to the first carrier mounting rack. The first transfer robot transfers the carrier storing the plurality of substrates after the individual wafer processing from the first carrier mounting shelf to the load port.

2. The substrate processing system according to claim 1, characterized in that: The batch processing apparatus includes a first posture conversion unit for converting the plurality of substrates from a horizontal posture to a vertical posture. The interface device includes a second posture conversion unit for converting the plurality of substrates after the batch processing from a vertical posture to a horizontal posture. The batch processing device takes out the plurality of substrates from the carrier transported to the second carrier mounting rack, converts the taken-out plurality of substrates from a horizontal posture to a vertical posture using the first posture conversion unit, and performs a predetermined batch process on the plurality of substrates converted to the vertical posture.

3. The substrate processing system according to claim 1, characterized in that: The batch processing device comprises: a transfer block, adjacent to the second carrier loading rack; a processing block, relative to the transfer block, adjacent to the first direction from the stocker device toward the interface device; and The batch substrate transfer area is arranged in a manner that one end extends into the interior of the interface device and the other end extends in the first direction; and The transfer block has: A substrate processing mechanism that takes out the plurality of substrates from the carrier mounted on the second carrier mounting rack and transports the taken-out plurality of substrates; and A vertical holding unit is provided between the substrate processing mechanism and the batch substrate conveying area, and holds the plurality of substrates received from the substrate processing mechanism in a vertical posture; The processing block includes a batch processing tank storing a processing liquid for immersing the plurality of substrates. The interface device includes a posture conversion mechanism for converting the plurality of substrates after the batch processing in the batch processing tank from a vertical posture to a horizontal posture. The batch processing transfer area includes a batch transfer mechanism that transfers the plurality of substrates in a vertical posture in parallel with the first direction between the batch processing tank, the vertical holding portion, and the posture conversion mechanism.

4. The substrate processing system according to claim 3, characterized in that: The interface device includes a carrier moving area and a posture conversion area arranged in a horizontal direction orthogonal to the first direction, that is, a second direction. The second transfer robot is arranged in the carrier moving area. The posture conversion mechanism is arranged in the posture conversion area, The posture conversion area includes a housing that blocks the atmosphere from the carrier moving area and accommodates the posture conversion mechanism.

5. The substrate processing system according to claim 1, characterized in that: The single-chip processing device comprises: A carrier transport area, provided with the carrier transport mechanism; The single substrate transfer area is provided with a horizontal substrate transfer mechanism for transferring at least one substrate in a horizontal posture; and The single-wafer substrate processing area includes a single-wafer processing chamber for performing a predetermined process on one substrate; and Each of the carrier transfer region, the single substrate transfer region, and the single substrate processing region is provided so as to extend in the first direction, and The carrier transfer area, the single-wafer substrate transfer area, and the single-wafer substrate processing area are sequentially arranged in a horizontal direction orthogonal to the first direction, that is, a second direction. The horizontal substrate transfer mechanism transfers the at least one substrate between the interface device, the single wafer processing chamber, and the carrier transferred to the first carrier mounting rack.

6. The substrate processing system according to claim 1, characterized in that: The carrier transport mechanism is provided above the wafer processing device and overlaps with the wafer processing device in a plan view.

7. The substrate processing system according to any one of claims 1 to 6, characterized in that Also available: A second carrier transport mechanism transports the carrier between a second stocker device side position on the stocker device side and a second interface device side position on the interface device side.

8. The substrate processing system according to any one of claims 1 to 6, characterized in that: The first transfer robot includes a movable first holding portion for holding the carrier, or a movable first supporting portion for supporting the lower surface of the carrier. The second transfer robot includes a movable second holding portion for holding the carrier, or a movable second supporting portion for supporting the lower surface of the carrier. The carrier transport mechanism includes a movable third holding portion for holding the carrier, or a movable mounting table for mounting the carrier.

Images