Lead frame cutting device and cutting method
By detecting the lead frame thickness in the lead frame slitting device and adjusting the movement speed of the cutting knife, combined with the clamping and flattening mechanism of the gland and the cutting table, the cutting speed and accuracy problems are solved, extending the service life of the cutting knife and improving product quality.
Patent Information
- Application Number
- CN202411806605.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2044-12-10
AI Technical Summary
During the lead frame slitting process, the feed speed of the cutting device remains unchanged, resulting in rebound when cutting a thinner lead frame, affecting the cutting accuracy; when cutting a thicker lead frame, the wear of the cutting knife is increased, reducing service life and cutting speed.
A lead frame slitting device is designed, by detecting the lead frame thickness, adjusting the position of the first motor to change the transmission ratio between the cam and the transmission wheel, so that the movement speed of the cutting knife is adjustable. At the same time, use a gland to match the cutting table to clamp and flatten the lead frame to ensure flatness.
The adjustable cutting knife speed reduces the wear of the cutting knife and extends the service life; ensures the flatness of the lead frame after cutting, improves the cutting accuracy and speed, and improves the product quality after slicing.