High multilayer thick plate positive and negative Teflon pinnacle short nail staggered positioning method

Abstract

The invention discloses a high multilayer thick plate positive and negative Teflon pinnacle short nail staggered positioning method. The method comprises the steps of 1, preparing materials; 2, placing the materials; step 3, trepanning; step 4, preparing a Teflon pinnacle nail; 5, teflon pinnacle nails are placed in the positive direction and the negative direction; step 6, stacking the prepreg and the copper foil; step 7, placing a special mirror surface steel plate and a friction plate; step 8, performing fixed-program heating and pressurizing by a pressing machine; and step 9, milling off the board edge. According to the high multi-layer thick plate positive and negative Teflon pinnacle short nail staggered positioning method, in the typesetting process before pressing, Teflon pinnacle nails are driven, and force in the X direction and the Y direction is not applied to a core plate and a PP sheet, so that the multi-layer plate does not deviate in the X direction and the Y direction, the front section of pressing is formed, a prepreg is in a molten state, and before the glass transition temperature, the plate has an extension trend; static friction is formed between the sharp top ends of the Teflon nails and the mirror surface steel plate, and extension of the plate is limited.

Description

Technical Field

[0001] The invention relates to the technical field of staggered positioning of high-rise and multi-layer thick plates, and in particular to a method for staggered positioning of high-rise and multi-layer thick plates with positive and negative Teflon pointed short nails. Background Art

[0002] High-layer thick board refers to a multi-layer board with more layers and greater thickness. This type of board may have excellent stability and load-bearing capacity. It is suitable for application scenarios that need to bear large loads or require high durability. It is usually composed of three or more layers of boards and is widely used in the construction field. Prior art 1 (application number CN201811442908.2, Chinese patent application date 2018-11-29) In the multilayer board lamination method, the edge of the core board is used as the reference for pattern production to ensure the coincidence of the patterns of each core board, and connecting blocks that can be connected to each other are arranged on the edge of the core board to achieve fixed connection between the core boards, thereby ensuring the inter-layer alignment of the multilayer board; In the prior art 2 (Chinese patent application number CN201710911050.9, application date 2017-09-29), in the PCB drilling positioning method, the CNC drill punches three drilling positioning holes on the bakelite board according to the production drill belt, and the three fixing holes correspond to the three drilling positioning holes to fix the multilayer board or double-sided board on the CNC drill. The PCB drilling positioning method of the present invention can realize seamless switching between different types of boards and different material numbers on the same equipment, which is conducive to improving production efficiency; and the accuracy of the PCB board is not affected by external equipment; And in the method of improving the drilling deviation of multilayer boards in prior art 3 (Chinese patent with application number CN201710759780.1 and application date 2017-08-30), the drilling parameters are strictly controlled by X-RAY, and the accuracy of the drilling target machine is measured by using a standard plate every day to ensure that the accuracy of the drilling target machine is within a controllable range, thereby preventing the drilling target machine from being inaccurate and causing deviation in drilling holes; For existing high-layer and multi-layer thick plates with a thickness of more than 3.2mm, the fusion and riveting method is generally used before pressing. The rivet length needs to exceed the plate thickness to perform riveting at the tail of the rivet. During the riveting and fixing process of the riveting machine, it is inevitable that the interlayer force will cause a slight local interlayer displacement. This affects the interlayer alignment, resulting in a decrease in interlayer alignment and prone to short circuit and scrapping; Therefore, we proposed a method for staggered positioning of positive and negative Teflon pointed short nails in high-layer thick plates to solve the problems raised above. Summary of the invention

[0003] The purpose of the present invention is to provide a method for staggered positioning of positive and negative Teflon pointed short nails in high-layer thick plates to solve the problems in the current market raised by the above-mentioned background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a method for staggered positioning of positive and negative Teflon pointed short nails of high-layer thick plates, comprising the following steps; Step 1: Prepare materials; Step 2: Place the materials; Step 3: Drilling holes; Step 4: Prepare Teflon spikes; Step 5: Place Teflon spikes in both positive and negative directions; Step 6, stacking the prepreg and copper foil; Step 7: Place the special mirror steel plate and friction plate; Step 8: The press machine is programmed to heat and pressurize; Step 9: Remove the edge of the board.

[0005] Preferably, in step 1, a special mirror steel plate with a friction plate needs to be prepared before production, the position of the friction plate corresponds one-to-one with the position of the rivet hole of the plate, and a special Teflon pointed nail is required, one end of which is cylindrical and the other end is pointed.

[0006] Preferably, in step 2, a sheet of inner core board + prepreg is placed on a drilling machine table.

[0007] Preferably, in step 3, a drill with a diameter of 3.175 mm is used to drill 16 rivet holes at fixed positions, 5 mm away from the edge of the board, and the hole position distance is 3.175 mm. According to the above steps, the rivet holes of all core boards and prepregs are drilled.

[0008] Preferably, in step 4, according to the theoretical thickness of the PCB board after pressing, 16 Teflon pointed nails with a cylindrical end length of 75% of the board thickness are selected, wherein the diameter of the Teflon nails is 3.175 mm.

[0009] Preferably, in step 5, the whole set of inner core panels is pre-positioned, 8 forward Teflon pointed nails are installed at the rivet positions, and 8 reverse Teflon pointed nails are installed in the order of one forward and one reverse. The position distance between the forward and reverse Teflon nails is 3.175 mm, and the forward and reverse Teflon nails are 5 mm away from the edge of the plate.

[0010] Preferably, in step 6, prepreg and copper foil are stacked on the upper and lower surfaces of the stacked set of boards.

[0011] Preferably, in step 7, a special mirror steel plate is stacked on both sides of the copper foil of the stacked plates, and the mirror steel plate has a friction plate.

[0012] Preferably, in step 8, the board is sent to a press machine, and the press machine is heated and pressurized according to a fixed program. During the pressing process, the Teflon pointed nails pierce the semi-cured sheet and the copper foil, and come into contact with the mirror steel plate friction plate, thereby limiting the elongation and contraction of the PCB board through static friction.

[0013] Preferably, in step 9, after pressing, the next process is entered, and the edge of the board will eventually be gonged off by a CNC gong machine to obtain the required PCB board.

[0014] Compared with the prior art, the present invention has the following beneficial effects: (1) During the layout process before lamination, Teflon spikes were driven in, and no force in the X and Y directions was applied to the core board and the PP sheet, so that the multilayer board did not deviate in the X and Y directions; (2) In the front stage of lamination, the prepreg is in a molten state. Before the glass transition temperature, the plate tends to elongate. The tip of the Teflon nail forms static friction with the mirror steel plate, limiting the elongation of the plate. (3) After the lamination, the semi-cured sheet solidifies and shrinks, and the plate tends to shrink. The static friction between the Teflon spikes and the mirror steel plate limits the shrinkage of the plate. The ideal plate with unchanged size is achieved, and excellent graphic position accuracy is obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is the position diagram of the Teflon pointed top nail of the plate edge of the present invention; Figure 2 This is a schematic diagram of the positive and negative Teflon pointed nails of the present invention; Figure 3 This is a schematic diagram of the pressing process after adding the steel plate in the present invention; Figure 4 This is a schematic diagram of a Teflon pointed nail of the present invention; Figure 5 This is a schematic diagram of the mirror steel friction plate of the present invention; Figure 6 This is a schematic diagram of the plate of the present invention when it expands; Figure 7 It is a schematic diagram of the contraction of the plate of the present invention. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] The present invention provides the following technical solutions: The steps include: Step 1: Prepare materials; Step 2: Place the materials; Step 3: Drilling holes; Step 4: Prepare Teflon spikes; Step 5: Place Teflon spikes in both positive and negative directions; Step 6, stacking the prepreg and copper foil; Step 7: Place the special mirror steel plate and friction plate; Step 8: The press machine is programmed to heat and pressurize; Step 9: Remove the edge of the board.

[0018] In step 1, a special mirror steel plate with a friction plate needs to be prepared before production. The position of the friction plate corresponds to the position of the rivet hole of the plate one by one. A special Teflon pointed nail is required, with one end cylindrical and the other end pointed.

[0019] In step 2, place an inner core board + prepreg on the drilling machine table.

[0020] In step 3, use a drill with a diameter of 3.175 mm to drill 16 rivet holes at fixed positions, 5 mm from the edge of the board, and the hole position distance is 3.175 mm. Follow the above steps to drill the rivet holes of all core boards and prepregs.

[0021] In step 4, according to the theoretical thickness of the PCB board after pressing, 16 Teflon pointed nails with a cylindrical end length of 75% of the board thickness are selected, wherein the diameter of the Teflon nails is 3.175 mm.

[0022] In step 5, pre-position the entire set of inner core panels, install 8 forward Teflon pointed nails at the rivet positions, and install 8 reverse Teflon pointed nails in the order of one forward and one reverse. The distance between the forward and reverse Teflon nails is 3.175 mm, and the distance between the forward and reverse Teflon nails is 5 mm from the edge of the board.

[0023] In step 6, prepreg and copper foil are stacked on the upper and lower surfaces of the stacked whole set of boards.

[0024] In step 7, a special mirror steel plate with a friction plate is stacked on both sides of the copper foil of the stacked panels.

[0025] In step 8, the PCB is sent to a press machine, which heats and presses the PCB according to a fixed program. During the pressing process, the Teflon pointed nails pierce the prepreg and the copper foil and come into contact with the mirror steel friction plate. The static friction force limits the elongation and contraction of the PCB board.

[0026] In step 9, after pressing, the next process begins, and the edge of the board will eventually be gonged off by a CNC gong machine to obtain the required PCB board. Embodiment 1:

[0027] like Figure 1-Figure 7 As shown, special Teflon solid pointed top positioning pins are used. A special mirror steel plate with friction plates at the corresponding position is used in conjunction with the special one. This allows the PCB board to be accurately aligned between layers to prevent displacement between layers, and can also effectively control the elongation and shortening of the entire board during the pressing process; The 16 rivet holes involved are pre-drilled on each core board and prepreg using a drill; When pressing the laminated boards together, use Teflon nails with a length equal to 75% of the board thickness to drive into the high-layer boards; During the lamination process, the Teflon pointed nails pierce the outer prepreg and copper foil and come into contact with the friction plate of the mirror steel plate; The pointed top of the Teflon nail can form static friction with the mirror steel plate to prevent the expansion and contraction of the PCB board, thus controlling the expansion and contraction of the PCB board; the cylindrical end of the positive Teflon nail and the cylindrical end of the reverse Teflon nail can jointly limit the inter-layer displacement of the board and avoid layer deviation; In addition, friction plates are set at the corresponding positions of the mirror steel plates, and metal sandblasting is performed, with a 45-degree negative and 45-degree twill. During the heating and pressurization process of the plate, the plate expands first, driving the Teflon nails to expand. The tip of the nail contacts the friction plate of the steel plate and tends to move outward, giving the steel plate an outward force F. The Teflon nails are restricted by the 45-degree oblique friction force of the steel plate. The reaction force f limits the expansion of the plate, and these forces balance each other, thereby limiting the expansion of the plate size. In the post-pressing stage, the plates begin to shrink, and the reaction force of the steel friction plate will prevent the Teflon nails from sliding inwards, thus preventing the plates from shrinking.

[0028] Embodiment 2:

[0029] Special Teflon solid pointed top positioning pins are used. A special mirror steel plate with friction plates at the corresponding position is used to accurately align the PCB panels between layers to prevent displacement between layers, and to effectively control the elongation and shortening of the entire board during the pressing process. The 16 rivet holes involved are pre-drilled on each core board and prepreg using a drill; When pressing the laminated boards together, use Teflon nails with a length equal to 70% of the board thickness to drive into the high-layer boards; During the lamination process, the Teflon pointed nails pierce the outer prepreg and copper foil and come into contact with the friction plate of the mirror steel plate; The pointed top of the Teflon nail can form static friction with the mirror steel plate to prevent the expansion and contraction of the PCB board, thus controlling the expansion and contraction of the PCB board; the cylindrical end of the positive Teflon nail and the cylindrical end of the reverse Teflon nail can jointly limit the inter-layer displacement of the board and avoid layer deviation; In addition, friction plates are set at the corresponding positions of the mirror steel plates, and metal sandblasting is performed, with a 40-degree minus and 40-degree twill. During the heating and pressurization process of the plate, the plate expands first, driving the Teflon nails to expand. The tip of the nail contacts the friction plate of the steel plate and tends to move outward, giving the steel plate an outward force F. The Teflon nails are restricted by the 40-degree oblique friction of the steel plate. The reaction force f limits the expansion of the plate, and these forces balance each other, thereby limiting the expansion of the plate size. In the post-pressing stage, the plates begin to shrink, and the reaction force of the steel friction plate will prevent the Teflon nails from sliding inwards, thus preventing the plates from shrinking.

[0030] Embodiment three:

[0031] Special Teflon solid pointed top positioning pins are used. A special mirror steel plate with friction plates at the corresponding position is used to accurately align the PCB panels between layers to prevent displacement between layers, and to effectively control the elongation and shortening of the entire board during the pressing process. The 16 rivet holes involved are pre-drilled on each core board and prepreg using a drill; When pressing the laminated boards together, use Teflon nails with a length equal to 77% of the board thickness to drive into the high-layer boards; During the lamination process, the Teflon pointed nails pierce the outer prepreg and copper foil and come into contact with the friction plate of the mirror steel plate; The pointed top of the Teflon nail can form static friction with the mirror steel plate to prevent the expansion and contraction of the PCB board, thus controlling the expansion and contraction of the PCB board; the cylindrical end of the positive Teflon nail and the cylindrical end of the reverse Teflon nail can jointly limit the inter-layer displacement of the board and avoid layer deviation; In addition, friction plates are set at the corresponding positions of the mirror steel plates, and metal sandblasting is performed, with a 48-degree negative and 48-degree twill. During the heating and pressurization process of the plate, the plate expands first, driving the Teflon nails to expand. The tip of the nail contacts the friction plate of the steel plate and tends to move outward, giving the steel plate an outward force F. The Teflon nails are restricted by the 47-degree oblique friction of the steel plate. The reaction force f limits the expansion of the plate, and these forces balance each other, thereby limiting the expansion of the plate size. In the post-pressing stage, the plates begin to shrink, and the reaction force of the steel friction plate will prevent the Teflon nails from sliding inwards, thus preventing the plates from shrinking.

[0032] Embodiment 4:

[0033] Special Teflon solid pointed top positioning pins are used. A special mirror steel plate with friction plates at the corresponding position is used to accurately align the PCB panels between layers to prevent displacement between layers, and to effectively control the elongation and shortening of the entire board during the pressing process. The 16 rivet holes involved are pre-drilled on each core board and prepreg using a drill; When pressing the laminated boards together, use Teflon nails with a length equal to 78% of the board thickness to drive into the high-layer boards; During the lamination process, the Teflon pointed nails pierce the outer prepreg and copper foil and come into contact with the friction plate of the mirror steel plate; The pointed top of the Teflon nail can form static friction with the mirror steel plate to prevent the expansion and contraction of the PCB board, thus controlling the expansion and contraction of the PCB board; the cylindrical end of the positive Teflon nail and the cylindrical end of the reverse Teflon nail can jointly limit the inter-layer displacement of the board and avoid layer deviation; In addition, friction plates are set at the corresponding positions of the mirror steel plates, and metal sandblasting is performed, with a 47-degree negative and 47-degree twill. During the heating and pressurization process of the plate, the plate expands first, driving the Teflon nails to expand. The tip of the nail contacts the friction plate of the steel plate and tends to move outward, giving the steel plate an outward force F. The Teflon nails are restricted by the friction force of the steel plate at an oblique angle of 48 degrees. The reaction force f limits the expansion of the plate, and these forces balance each other, thereby limiting the expansion of the plate size. In the post-pressing stage, the plates begin to shrink, and the reaction force of the steel friction plate will prevent the Teflon nails from sliding inwards, thus preventing the plates from shrinking.

[0034] Embodiment five:

[0035] Special Teflon solid pointed top positioning pins are used. A special mirror steel plate with friction plates is used in the corresponding position. This allows the PCB board to be accurately aligned between layers to prevent displacement between layers, and can effectively control the elongation and shortening of the entire board during the pressing process. The 16 rivet holes involved are pre-drilled on each core board and prepreg using a drill; When pressing the laminated boards together, use Teflon nails with a length equal to 76% of the board thickness to drive into the high-layer boards; During the lamination process, the Teflon pointed nails pierce the outer prepreg and copper foil and come into contact with the friction plate of the mirror steel plate; The pointed top of the Teflon nail can form static friction with the mirror steel plate to prevent the expansion and contraction of the PCB board, thus controlling the expansion and contraction of the PCB board; the cylindrical end of the positive Teflon nail and the cylindrical end of the reverse Teflon nail can jointly limit the inter-layer displacement of the board and avoid layer deviation; In addition, friction plates are set at the corresponding positions of the mirror steel plates, and metal sandblasting is performed, with a 46-degree negative and 46-degree twill. During the heating and pressurization process of the plate, the plate expands first, driving the Teflon nails to expand. The tip of the nail contacts the friction plate of the steel plate and tends to move outward, giving the steel plate an outward force F. The Teflon nails are restricted by the 46-degree oblique friction of the steel plate. The reaction force f limits the expansion of the plate, and these forces balance each other, thereby limiting the expansion of the plate size. In the post-pressing stage, the plates begin to shrink, and the reaction force of the steel friction plate will prevent the Teflon nails from sliding inwards, thus preventing the plates from shrinking.

[0036] Embodiment six:

[0037] Special Teflon solid pointed top positioning pins are used. A special mirror steel plate with friction plates is used in the corresponding position. This allows the PCB board to be accurately aligned between layers to prevent displacement between layers, and can effectively control the elongation and shortening of the entire board during the pressing process. The 16 rivet holes involved are pre-drilled on each core board and prepreg using a drill; When pressing the laminated boards together, use Teflon nails with a length equal to 79% of the board thickness to drive into the high-layer boards; During the lamination process, the Teflon pointed nails pierce the outer prepreg and copper foil and come into contact with the friction plate of the mirror steel plate; The pointed top of the Teflon nail can form static friction with the mirror steel plate to prevent the expansion and contraction of the PCB board, thus controlling the expansion and contraction of the PCB board; the cylindrical end of the positive Teflon nail and the cylindrical end of the reverse Teflon nail can jointly limit the inter-layer displacement of the board and avoid layer deviation; In addition, friction plates are set at the corresponding positions of the mirror steel plates, and metal sandblasting is performed, with a 49-degree negative and 49-degree twill. During the heating and pressurization process of the plate, the plate expands first, driving the Teflon nails to expand. The tip of the nail contacts the friction plate of the steel plate and tends to move outward, giving the steel plate an outward force F. The Teflon nails are restricted by the 49-degree oblique friction of the steel plate. The reaction force f limits the expansion of the plate, and these forces balance each other, thereby limiting the expansion of the plate size. In the post-pressing stage, the plates begin to shrink, and the reaction force of the steel friction plate will prevent the Teflon nails from sliding inwards, thus preventing the plates from shrinking.

[0038] Embodiment seven:

[0039] Special Teflon solid pointed top positioning pins are used. A special mirror steel plate with friction plates is used in the corresponding position. This allows the PCB board to be accurately aligned between layers to prevent displacement between layers, and can effectively control the elongation and shortening of the entire board during the pressing process. The 16 rivet holes involved are pre-drilled on each core board and prepreg using a drill; When pressing the laminated boards together, use Teflon nails with a length equal to 80% of the thickness of the board to drive into the high-layer board; During the lamination process, the Teflon pointed nails pierce the outer prepreg and copper foil and come into contact with the friction plate of the mirror steel plate; The pointed top of the Teflon nail can form static friction with the mirror steel plate to prevent the expansion and contraction of the PCB board, thus controlling the expansion and contraction of the PCB board; the cylindrical end of the positive Teflon nail and the cylindrical end of the reverse Teflon nail can jointly limit the inter-layer displacement of the board and avoid layer deviation; In addition, friction plates are set at the corresponding positions of the mirror steel plates, and metal sandblasting is performed, with a twill of minus 50 degrees and plus 50 degrees. During the heating and pressurization process of the plate, the plate expands first, driving the Teflon nails to expand. The tip of the nail contacts the friction plate of the steel plate and tends to move outward, giving the steel plate an outward force F. The Teflon nails are restricted by the friction force of the steel plate at an oblique angle of 50 degrees. The reaction force f limits the expansion of the plate, and these forces balance each other, thereby limiting the expansion of the plate size. In the post-pressing stage, the plates begin to shrink, and the reaction force of the steel friction plate will prevent the Teflon nails from sliding inwards, thus preventing the plates from shrinking.

[0040] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for staggered positioning of positive and negative Teflon pointed short nails on high-layer thick plates, comprising the following steps; Step 1: Prepare materials; Step 2: Place the materials; Step 3: Drilling holes; Step 4: Prepare Teflon spikes; Step 5: Place Teflon spikes in both positive and negative directions; Step 6, stacking the prepreg and copper foil; Step 7: Place the special mirror steel plate and the friction plate. On both sides of the copper foil of the stacked panels, stack a special mirror steel plate. The mirror steel plate has a friction plate. The friction plate is set at the corresponding position of the mirror steel plate. Perform metal sandblasting process and present a twill of minus 45 degrees and plus 45 degrees. Step 8, the press machine is heated and pressurized in a fixed program, and sent into the press machine. The press machine is heated and pressurized in a fixed program. During the pressing process, the Teflon pointed nail pierces the semi-cured sheet and copper foil, and contacts the mirror steel plate friction plate. Through static friction, the elongation and contraction of the PCB board are limited. During the heating and pressurization process of the board, the board expands first, driving the Teflon nail to expand. The pointed part of the nail contacts the steel plate friction plate and tends to move outward, giving the steel plate an outward force F. The Teflon nail is restricted by the friction force of the steel plate at an oblique 45 degrees. The reaction force f limits the expansion of the board. These forces balance each other, thereby limiting the expansion of the board size. Step 9: Remove the edge of the board.

2. The method for staggered positioning of positive and negative Teflon pointed short nails of high-layer thick plates according to claim 1 is characterized by: In step 1, a special mirror steel plate with a friction plate needs to be prepared before production. The position of the friction plate corresponds to the position of the rivet hole of the plate. A special Teflon pointed nail is required, one end of which is cylindrical and the other end is pointed.

3. The method for staggered positioning of Teflon pointed short nails on both sides of a high-layer thick plate according to claim 1, characterized in that: In the step 2, a sheet of inner core board + prepreg is placed on the drilling machine table.

4. The method for staggered positioning of positive and negative Teflon pointed short nails of high-layer thick plates according to claim 1 is characterized by: In step 3, a drill with a diameter of 3.175 mm is used to drill 16 rivet holes at fixed positions, 5 mm away from the edge of the board, and the hole position distance is 3.175 mm. According to the above steps, the rivet holes of all core boards and prepregs are drilled.

5. The method for staggered positioning of positive and negative Teflon pointed short nails of high multi-layer thick plates according to claim 1, characterized in that: In the step 4, according to the theoretical thickness of the PCB board after pressing, 16 Teflon pointed nails with a cylindrical end length of 75% of the board thickness are selected, wherein the diameter of the Teflon nails is 3.175 mm.

6. The method for staggered positioning of positive and negative Teflon pointed short nails of high multi-layer thick plates according to claim 1, characterized in that: In step 5, the entire set of inner core panels is pre-positioned, and 8 forward Teflon pointed nails and 8 reverse Teflon pointed nails are installed at the rivet positions. The installation order is one forward and one reverse. The position distance between the forward and reverse Teflon nails is 3.175 mm, and the forward and reverse Teflon nails are 5 mm away from the edge of the board.

7. The method for staggered positioning of Teflon pointed short nails on both sides of a high-layer thick plate according to claim 1, characterized in that: In step 6, prepreg and copper foil are stacked on the upper and lower surfaces of the stacked whole set of boards.

8. The method for staggered positioning of Teflon pointed short nails on both sides of a high-layer thick plate according to claim 1, characterized in that: In step 9, after pressing, the next process is entered, and the edge of the board will eventually be gonged off by a CNC gong machine to obtain the required PCB board.

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