3DX medium-wave transmitter power amplifier test platform capable of displaying output power

Abstract

The invention relates to the technical field of medium-wave transmitters, in particular to a 3DX medium-wave transmitter power amplifier test platform capable of displaying output power, which comprises a test unit, a power amplifier test unit, a power amplifier test unit, a power amplifier test unit, a power amplifier test unit and a power amplifier test unit, and is characterized in that the test unit comprises a test mother board and a radio-frequency signal source connected with the test mother board by transmitting excitation signals; the power supply unit is connected with the test mother board and is used for providing power supplies with different voltage levels; and the power display unit is used for measuring the output power of the radio frequency signal source and comprises a display screen electrically connected with the power supply unit. According to the invention, through the mutual cooperation of the test unit, the power supply unit and the power display unit, the input power of the power supply can be calculated and converted into the output power for display, and the insertion and extraction between the module insertion block and the interface slot are assisted through the auxiliary assembly. The problems that in the prior art, a power amplifier module test platform does not have an output power display function, and a module insertion block is difficult to insert and pull out are solved.

Description

Technical Field

[0001] The invention relates to the technical field of medium wave transmitters, in particular to a 3DX medium wave transmitter power amplifier test platform capable of displaying output power. Background Art

[0002] 3DX medium wave transmitter has become the mainstream model used by grassroots stations in broadcasting systems around the world because of its modular power amplifier, high efficiency, excellent self-protection function, and clear status parameter indication. In order to determine whether the repaired power amplifier module is normal, a test platform dedicated to testing the power amplifier module is required for testing.

[0003] During testing, it is generally necessary to output power in different ranges to fully test the power amplifier module, but the existing power amplifier module testing platform does not have an output power display function; and during use, each power amplifier module needs to be plugged into a slot on the test motherboard, and generally in order to ensure stable electrical connectivity between the module and the test motherboard, the module plug-in and the slot need to be tightly plugged together, and the module plug-in and the slot are generally long strips, and the insertion depth is deep, which makes it relatively difficult and laborious to pull out the module plug-in each time, especially the module plug-in is prone to tilting and partial contact with the slot during the removal process, which will give the slot of the test motherboard a large local squeezing force, thereby affecting the service life of the test motherboard. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In view of the problems that the power amplifier module test platform in the above-mentioned prior art does not have the output power display function and the module plug-in is difficult to insert and remove, the present invention is proposed.

[0006] Therefore, one of the objects of the present invention is to provide a 3DX medium wave transmitter power amplifier test platform that can display output power.

[0007] In order to solve the technical problem, the present invention provides the following technical solution: a 3DX medium wave transmitter power amplifier test platform capable of displaying output power, comprising:

[0008] A test unit, including a test motherboard and a radio frequency signal source connected to the test motherboard by transmitting an excitation signal;

[0009] a power supply unit, the power supply unit being connected to the test motherboard and being used for providing power supplies of different voltage levels; and

[0010] A power display unit is used to measure the output power of a radio frequency signal source, and comprises a display screen electrically connected to a power supply unit.

[0011] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power described in the present invention, wherein: the test unit further comprises a dummy load subunit electrically connected to the test motherboard, which can be used for impedance matching and power consumption;

[0012] The dummy load subunit comprises a load impedance connected to the test motherboard, an adjustable inductor connected to the load impedance, and a cooling structure for heat dissipation and temperature reduction.

[0013] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power described in the present invention, the power display unit further comprises a DC power meter connected in series with the power supply unit, the voltage and current of the power supply unit are measured by the DC power meter, the input power is calculated as the output power of the RF signal source, and the result is displayed on the display screen;

[0014] Wherein, the power supply unit adopts a high-power adjustable switching power supply, and the radio frequency signal source is a signal generator.

[0015] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power of the present invention, the test motherboard includes a motherboard body connected to a power supply unit, an interface component arranged on one side of the motherboard body, and an auxiliary component connected between the motherboard body and the interface component;

[0016] The interface assembly includes an interface slot disposed on one side of the motherboard body, and a module plug-in block engaged with the interface slot, and the interface slot and the module plug-in block are also electrically connected;

[0017] The auxiliary component is detachably connected to one side of the motherboard body, and comprises an extrusion sleeve which can be nested and connected to the top of the module plug-in block.

[0018] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power described in the present invention, there are no less than two groups of force-bearing areas symmetrically arranged on one side of the module plug-in block close to the interface slot, and the force-bearing areas include active force-bearing points arranged on the outside of the outline of the module plug-in block, and passive force-bearing points arranged on the inside of the outline of the module plug-in block.

[0019] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power described in the present invention, an elastic member is arranged between the interface slot and the module plug-in block at a position close to the passive force point, and the elastic member comprises a telescopic rod arranged on one side of the interface slot, an extrusion block arranged at the end of the telescopic rod, and a first spring connected between the telescopic rod and the extrusion block.

[0020] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power described in the present invention, the auxiliary component further comprises a lifting portion arranged on one side of the extrusion sleeve, the lifting portion comprising a lifting groove opened on the side of the interface slot close to the active force point, a lifting rod slidably connected to one side of the extrusion sleeve and adapted to the lifting groove, and a storage groove arranged on the inner side of the extrusion sleeve and adapted to the lifting rod.

[0021] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power described in the present invention, wherein: the interface slots are arranged in multiple groups at intervals, the lifting part further comprises a sliding plate slidably connected to one side of the extrusion sleeve and arranged close to the interface slot, the lifting rod is arranged on the sliding plate, the number of the sliding plates is twice the number of the interface slots, and an extrusion piece is arranged between two adjacent groups of sliding plates;

[0022] The extrusion member includes an extrusion plate slidably connected to one side of the extrusion sleeve and adapted to the top of the module plug-in block, a second spring arranged between the extrusion plate and the extrusion sleeve, a first inclined surface arranged on one side of the extrusion plate and inclined downward, and a second inclined surface arranged on the top of the sliding plate and adapted to the first inclined surface.

[0023] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power described in the present invention, the auxiliary component further comprises a connecting portion connected to opposite sides of the extrusion sleeve, the connecting portion comprising a slide groove symmetrically arranged on both sides of the extrusion sleeve, a limit block slidably connected in the slide groove, a connecting rod connected between the limit blocks, a positioning piece slidably connected to one side of the limit block, and a positioning groove arranged on one side of the sliding plate and adapted to the positioning piece;

[0024] The positioning member includes a positioning block slidably connected to the limit block, a third spring connected between the positioning block and the connecting rod, a sloped opening arranged on the top of the positioning block toward one side of the sliding plate, and a pressing frame slidably connected to one side of the connecting rod and adapted to the sloped opening.

[0025] As a preferred solution of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power described in the present invention, the connecting portion further comprises an auxiliary part arranged at the top of the connecting rod and connected to the pressing frame, the auxiliary part comprising a cylindrical groove arranged at the center of the top of the connecting rod, a pressing column rotatably connected to one side of the pressing frame and slidably connected to the cylindrical groove, a rotating groove arranged at one side of the pressing column, strip grooves vertically arranged at both ends of the rotating groove, a limiting column arranged at one side of the cylindrical groove and adapted to the rotating groove and the strip groove, and an auxiliary pull rod symmetrically arranged at both sides of the pressing column and located between the connecting rod and the pressing frame;

[0026] The rotation angle of the rotation slot is 90°, and grooves adapted to the auxiliary pull rods are provided on both sides of the module plug-in block near the active force points.

[0027] The beneficial effects of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power of the present invention are as follows: the present invention can convert the input power calculation of the power supply into output power display through the cooperation between the set test unit, the power supply unit and the power display unit, and solves the problem in the prior art that the power amplifier module test platform does not have the output power display function and the module plug-in is difficult to plug and unplug through the plug-in and unplugging of the auxiliary module block of the auxiliary component and the interface slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0029] Figure 1 The present invention is a schematic diagram of the composition principles of each unit of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0030] Figure 2 The present invention is a schematic diagram of the principle of a dummy load subunit of a 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0031] Figure 3 The present invention is a schematic diagram of the heat dissipation structure of a 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0032] Figure 4 The present invention is a resistance power curve diagram of a 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0033] Figure 5 The present invention is a schematic diagram of the structure of a test motherboard of a 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0034] Figure 6 The present invention is a schematic diagram of the internal structure of the extruded sleeve of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0035] Figure 7 For the present invention Figure 6 An enlarged schematic diagram of the structure at point A is shown.

[0036] Figure 8 The present invention is a schematic diagram of the stress area structure of a 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0037] Fig. 9 The present invention is a schematic diagram of the structure of the elastic parts of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0038] Fig.10 For the present invention Fig. 9 An enlarged schematic diagram of the structure at point B is shown.

[0039] Fig.11 The present invention is a schematic structural diagram of the lifting part of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0040] Fig.12 For the present invention Fig.11 An enlarged schematic diagram of the structure at point C is shown.

[0041] Fig.13 The present invention is a schematic structural diagram of the connection part of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power.

[0042] Fig.14 The present invention is a schematic structural diagram of a 3DX medium wave transmitter power amplifier test platform capable of displaying output power, in which a pressing column is pressed down and a front connecting rod is pressed down.

[0043] Fig.15 For the present invention Fig.14 An enlarged schematic diagram of the structure at D is shown.

[0044] Fig.16 The present invention is a schematic structural diagram of the connecting rod after the pressing column of the 3DX medium wave transmitter power amplifier test platform capable of displaying output power is pressed down.

[0045] Fig.17 For the present invention Fig.16 An enlarged schematic diagram of the structure at E is shown. DETAILED DESCRIPTION

[0046] In order to make the objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0047] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0048] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0049] Example 1

[0050] Reference Figure 1-Figure 4 , which is the first embodiment of the present invention, provides a 3DX medium wave transmitter power amplifier test platform capable of displaying output power, which can achieve the effect of displaying output power, and includes: a test unit 100, a power supply unit 200 and a power display unit 300.

[0051] Specifically, the test unit 100 includes a test motherboard M, and a radio frequency signal source 101 connected to the test motherboard M by transmitting an excitation signal; a power supply unit 200, which is connected to the test motherboard M and is used to provide power supplies of different voltage levels; and a power display unit 300, which is used to measure the output power of the radio frequency signal source 101, including a display screen 301 electrically connected to the power supply unit 200. The function of the test motherboard M is to install various power amplifier modules and provide all input signal and output signal paths for the modules, including multiple groups of interface slots. The radio frequency input signal is two independent 585KHz square wave signals with a duty cycle of 41%, an amplitude of 6.2Vp-p, and opposite phases. This embodiment uses a dual-channel DDS function arbitrary waveform signal generator as the radio frequency signal source 101, and the radio frequency signal interface on the test platform uses a BNC radio frequency coaxial connector with an impedance of 50Ω, which matches the impedance of the signal generator.

[0052] Furthermore, the test unit 100 also includes a dummy load subunit 102 electrically connected to the test motherboard M, which can be used for impedance matching and power consumption. Impedance matching is to match the impedance of the dummy load with the impedance of the RF output end of the test platform motherboard, so that the high-frequency power output by the RF amplifier can be completely consumed by the load resistor. The design of the dummy load subsystem needs to consider multiple aspects such as resistance value, power capacity, cooling structure, impedance matching and state monitoring to ensure that the real working environment of the 3DX transmitter power amplifier module can be effectively simulated, and stability and functional tests can be performed.

[0053] Among them, the dummy load subunit 102 includes a load impedance 102a connected to the test motherboard M, an adjustable inductor 102b connected to the load impedance 102a, and a cooling structure 102c for heat dissipation and temperature reduction. The load impedance 102a of this embodiment is composed of 6 RM800-50 type microstrip resistors connected in series and parallel. The resistance of a single microstrip resistor is 50Ω, and the maximum power can reach 800W. After the 6 resistors are connected in series and parallel, the resistance is 33.3Ω, and the power capacity can reach 4800W, which meets the platform testing requirements. Since the power amplifier module outputs a large RF power and requires a long time of testing, it is necessary to use the cooling structure 102c to ensure effective heat dissipation during long-term high-power operation to prevent overheating damage. The 6 microstrip resistors are installed on a 30cm×13cm×10cm multi-fin aluminum radiator. Figure 3 As shown, two 220V21W12038 axial fans are used for forced heat dissipation, so that the thermal stability of the load meets the test requirements. In order to ensure that the load resistor can effectively absorb the RF energy output by the power amplifier module, an adjustable inductor 102b is added between the load resistor and the output transformer of the power amplifier motherboard. By adjusting the inductor tap position, the load impedance at the test frequency of 585kHz is close to 35+j51Ω, meeting the impedance matching requirements.

[0054] The power display unit 300 also includes a DC power meter connected in series with the power supply unit 200. The DC power meter measures the voltage and current of the power supply unit 200, calculates the input power as the output power of the RF signal source 101, and displays the result on the display screen 301. The power supply unit 200 adopts a high-power adjustable switching power supply, and the RF signal source 101 is a DSS signal generator.

[0055] Due to the impedance matching and power consumption of the dummy load subunit 102, this embodiment uses a DC power meter to directly measure the input power supply power. Since the efficiency of the Class D power amplifier is better than 80%, the input power can be used to approximately replace the RF output power. In actual use, you can also use an RF power meter to measure, connect the power sensor to the output port of the RF signal source, and then use a signal source with a known power to calibrate the power sensor to ensure that it accurately measures the RF power. Connect the signal output by the RF signal source to the power sensor, and then read the power value displayed by the power sensor. However, this type of RF power meter can generally only measure low-power signals, and the designed measurement frequency focuses on 100MHz-1GHz, which is very inaccurate for medium-wave frequency band power measurement; in addition, the RF voltage is sampled at a known impedance point, the power value is calculated through an operational circuit, and then the power is displayed through a pointer-type power meter. This method is a common power measurement method for transmitters and dummy loads.

[0056] like Figure 4As shown in the figure, it is the power consumption reduction curve of the microstrip resistor. It can be seen that when the surface temperature of the resistor is less than 100℃, the resistance value remains near the rated resistance and the power consumption is stable; when the temperature exceeds 100℃, the rated power drops significantly. In order to ensure the stability of the load resistor, a thermistor is installed on the load resistor heat sink to cut off the excitation signal of the power amplifier module and shut down the RF output of the power amplifier module when the temperature is higher than 90℃. Not only does it achieve the output power reality, but through the high-power RF microstrip resistor, compared with the traditional load resistor, the volume is reduced to 1 / 3, but the thermal stability is improved by 3 times.

[0057] Example 2

[0058] Reference Figure 5-Figure 10 , which is the second embodiment of the present invention. Different from the previous embodiment, this embodiment provides a motherboard body 400, an interface component 500 and an auxiliary component 600, which solves the problem that the power amplifier module plug-in is inconvenient to plug and unplug.

[0059] Specifically, the test motherboard M includes a motherboard body 400 connected to the power supply unit 200, an interface component 500 arranged on one side of the motherboard body 400, and an auxiliary component 600 connected between the motherboard body 400 and the interface component 500; the interface component 500 includes an interface slot 501 arranged on one side of the motherboard body 400, and a module plug-in block 502 engaged with the interface slot 501, and the interface slot 501 and the module plug-in block 502 are also electrically connected; after the module plug-in block 502 is fully docked with the interface slot 501, the circuit can be connected.

[0060] The auxiliary component 600 is detachably connected to one side of the motherboard body 400, and includes an extrusion sleeve 601 that can be nested and connected to the top of the module plug-in block 502. In this embodiment, the extrusion sleeve 601 is connected to the motherboard body 400 by small bolts, and when the extrusion sleeve 601 is connected and fixed to the motherboard body 400, the module plug-in block 502 covered by the extrusion sleeve 601 is completely connected with the interface slot 501.

[0061] Furthermore, at least two groups of force-bearing areas 502a are symmetrically arranged on one side of the module plug-in 502 close to the interface slot 501, and the force-bearing areas 502a include active force-bearing points 502a-1 arranged on the outside of the outline of the module plug-in 502, and passive force-bearing points 502a-2 arranged on the inside of the outline of the module plug-in 502. The active force-bearing points 502a-1 are arranged on the outside of the module plug-in 502, generally in thicker areas or areas corresponding to the reinforcing ribs, and can withstand greater pulling forces; the passive force-bearing points 502a-2 are arranged on the inside of the outline, which is a position where it is generally inconvenient to apply force from the outside. The setting areas of the active force-bearing points 502a-1 and the passive force-bearing points 502a-2 can be adapted to the shape of the module plug-in 502, thereby providing uniform pulling forces and facilitating the separation of the module plug-in 502 and the interface slot 501.

[0062] Among them, an elastic member 503 is arranged between the interface slot 501 and the module plug-in block 502 at a position close to the passive force point 502a-2, and the elastic member 503 includes a telescopic rod 503a arranged on one side of the interface slot 501, an extrusion block 503b arranged at the end of the telescopic rod 503a, and a first spring 503c connected between the telescopic rod 503a and the extrusion block 503b. By arranging the first spring 503c to connect the extrusion block 503b, the module plug-in block 502 will squeeze the extrusion block 503b after docking with the interface slot 501, and the extrusion block 503b will compress the first spring 503c when it is stressed, so that when the module plug-in block 502 needs to be separated from the interface slot 501, the module plug-in block 502 can be automatically pushed from the inside.

[0063] Preferably, the auxiliary component 600 further includes a lifting portion 602 disposed on one side of the extrusion sleeve 601, and the lifting portion 602 includes a lifting groove 602a provided on one side of the interface slot 501 near the active force point 502a-1, a lifting rod 602b slidably connected to one side of the extrusion sleeve 601 and adapted to the lifting groove 602a, and a receiving groove 602c disposed on the inner side of the extrusion sleeve 601 and adapted to the lifting rod 602b. After the lifting rod 602b slides into the receiving groove 602c, interference with the module plug-in block 502 during the covering process can be avoided, and after the lifting rod 602b is pushed into the lifting groove 602a located at the active force point 502a-1, the lifting rod 602b can be lifted up to ensure that a pulling force is applied to the module plug-in block 502 at a relatively effective force point, so that the force contact point is more uniform.

[0064] The rest of the structure is the same as that of Example 1.

[0065] Insertion process: when the module plug-in block 502 is aligned with the interface slot 501 and inserted, the extrusion block 503b will be squeezed by the module plug-in block 502, thereby driving the telescopic rod 503a and the first spring 503c to contract, and then the lifting rod 602b is pulled into the storage groove 602c, so that the extrusion sleeve 601 can cover the module plug-in block 502 without interference and press down, so that the module plug-in block 502 and the interface slot 501 are fully connected. At this time, the first spring 503c gathers the elastic force on the module plug-in block 502 outward due to compression, and is connected and fixed between the extrusion sleeve 601 and the motherboard body 400, so that the first spring 503c remains in a compressed state, and the module plug-in block 502 will not be moved out by the elastic force and disconnected from the interface slot 501;

[0066] Pulling out process: When it is necessary to pull out the module plug-in block 502, first push the lifting rod 602b so that the lifting rod 602b is docked with the lifting groove 602a, then remove the extrusion sleeve 601 connected to the motherboard body 400, and then pull the extrusion sleeve 601 outward. The extrusion sleeve 601 applies a pulling force to the active force point 502a-1 on the outside of the module plug-in block 502 through the lifting rod 602b and the lifting groove 602a, and the extrusion block 503b applies a pushing force to the inside of the module plug-in block 502 through the elastic force of the first spring 503c, so that each force point of the module plug-in block 502 is stressed at the same time, reducing the risk caused by local force and facilitating the module plug-in block 502 to be pulled out of the interface slot 501.

[0067] In summary, by setting up the motherboard body 400, the interface component 500 and the auxiliary component 600 for use in conjunction, each force point can be evenly stressed when pulling out the module plug-in block 502, reducing the risk of local force on the motherboard body 400, making it convenient to pull the module plug-in block 502 out of the interface slot 501, and solving the problem of the inconvenience of plugging and unplugging the power amplifier module plug-in block.

[0068] Example 3

[0069] Reference Figure 11-Figure 12 , which is the third embodiment of the present invention. Different from the previous embodiment, this embodiment provides multiple groups of interface slots 501 and extrusion pieces 602e arranged at intervals, thereby solving the problem that the module plug-in blocks are inconvenient to plug in and out when there are multiple groups of interface slots 501.

[0070] Specifically, the interface slots 501 are arranged in multiple groups at intervals, and the lifting part 602 further includes a sliding plate 602d slidably connected to one side of the extrusion sleeve 601 and arranged near the interface slot 501, and the lifting rod 602b is arranged on the sliding plate 602d. The number of sliding plates 602d is twice the number of the interface slots 501, and an extrusion piece 602e is arranged between two adjacent groups of sliding plates 602d. The lifting rod 602b is spaced apart from the lifting slot 602a in the vertical direction until the sliding plate 602d pushes the extrusion plate 602e-1 away, and the pull rod 602b just docks with the lifting slot 602a.

[0071] Furthermore, the extrusion member 602e includes an extrusion plate 602e-1 slidably connected to one side of the extrusion sleeve 601 and adapted to the top of the module plug-in block 502, a second spring 602e-2 arranged between the extrusion plate 602e-1 and the extrusion sleeve 601, a first inclined surface 602e-3 arranged on one side of the extrusion plate 602e-1 and inclined downward, and a second inclined surface 602e-4 arranged on the top of the sliding plate 602d and adapted to the first inclined surface 602e-3. The first inclined surface 602e-3 and the second inclined surface 602e-4 are adapted to each other. In the initial state, the extrusion plate 602e-1 pushes the sliding plate 602d under the action of the second spring 602e-2, and the sliding plate 602d is located at the bottom with the help of its own gravity; when it is necessary to unplug one of the multiple groups of module plugs 502, it is only necessary to pull the sliding plates 602d on both sides of the corresponding module plug 502 to separate the group of module plugs 502 separately, eliminating the trouble of repeatedly disassembling the extrusion sleeve 601.

[0072] The rest of the structure is the same as that of Example 2.

[0073] Insertion process: The sliding plate 602d is initially located at the bottom. After all the module plug-ins 502 to be inserted are inserted into the corresponding interface slots 501, the lifting rod 602b is first pulled into the storage groove 602c, and then the module plug-in block 502 is covered by the extrusion sleeve 601, and the extrusion sleeve 601 is connected and fixed to the motherboard body 400. The difference is that in this embodiment, the extrusion sleeve 601 covers the module plug-in block 502 through the extrusion plate 602e-1;

[0074] Pulling out process: When it is necessary to pull out the module plug-in block 502, first push the lifting rod 602b on both sides of the extrusion sleeve 601 where the corresponding module plug-in block 502 is located, so that the lifting rod 602b enters the lifting groove 602a, and then directly pull up the lifting rod 602b on both sides. The upward movement of the lifting rod 602b will drive the sliding plate 602d to move upward. The upward movement of the sliding plate 602d will squeeze the first inclined surface 602e-3 of the extrusion plate 602e-1 through the second inclined surface 602e-4, so that the extrusion plate 602e-1 is forced to compress the second spring 602e-2 to slide and push away. When the extrusion plate 602e-1 is pushed away and no longer covers the group of module plug-ins 502, the lifting rod 602b will abut against the lifting groove 602a, and then pulling up the lifting rods 602b on both sides will apply pulling force to the outside of the module plug-in block 502, thereby assisting in pulling out the module plug-in block 502.

[0075] In summary, by setting up multiple groups of spaced-apart interface slots 501 for use in conjunction with the extrusion piece 602e, when it is necessary to unplug one of the multiple groups of module plugs 502, it is only necessary to pull the sliding plates 602d on both sides of the corresponding module plug 502 to separate the group of module plugs 502 individually, thereby eliminating the trouble of repeatedly disassembling the extrusion sleeve 601.

[0076] Example 4

[0077] Reference Figure 13-Figure 17 , which is the fourth embodiment of the present invention. Different from the previous embodiment, this embodiment provides a connecting portion 603, which solves the problem that the module plug-in block 502 is prone to tilt when being pulled up, and is prone to suddenly pop open under the elastic force of the first spring 503c.

[0078] Specifically, the auxiliary component 600 further includes a connection part 603 connected to the two opposite sides of the extrusion sleeve 601, and the connection part 603 includes a slide groove 603a symmetrically arranged on both sides of the extrusion sleeve 601, a limit block 603b slidably connected in the slide groove 603a, a connecting rod 603c connected between the limit blocks 603b, a positioning piece 603d slidably connected to one side of the limit block 603b, and a positioning groove 603e arranged on one side of the sliding plate 602d and adapted to the positioning piece 603d. In this embodiment, the limit block 603b is cylindrical, and its size is adapted to the slide groove 603a, so that the connecting rod 603c can be rotated to be stored, and the module plug-in block 502 can be conveniently rotated to take out.

[0079] Furthermore, the positioning member 603d includes a positioning block 603d-1 slidably connected to the limit block 603b, a third spring 603d-2 connected between the positioning block 603d-1 and the connecting rod 603c, a sloped opening 603d-3 arranged at the top of the positioning block 603d-1 toward the sliding plate 602d, and a pressing frame 603d-4 slidably connected to one side of the connecting rod 603c and adapted to the sloped opening 603d-3. The sloped opening 603d-3 at the top of the positioning block 603d-1 is a "T"-shaped structure, which ensures the connection between the pressing frame 603d-4 and the positioning block 603d-1, so that when the pressing frame 603d-4 is pressed down, the positioning block 603d-1 will be driven to slide out of the positioning groove 603e through the sloped opening 603d-3; and when the positioning block 603d-1 slides out of the positioning groove 603e and is continuously blocked by the sliding groove 603a, the pressing frame 603d-4 will maintain a downward posture.

[0080] Among them, the connecting part 603 also includes an auxiliary part 603f arranged on the top of the connecting rod 603c and connected to the pressing frame 603d-4, and the auxiliary part 603f includes a cylindrical groove 603f-1 arranged at the center position of the top of the connecting rod 603c, a pressing column 603f-2 rotatably connected to one side of the pressing frame 603d-4 and slidingly connected to the cylindrical groove 603f-1, a rotating groove 603f-6 arranged on one side of the pressing column 603f-2, strip grooves 603f-3 vertically arranged at both ends of the rotating groove 603f-6, a limiting column 603f-4 arranged on one side of the cylindrical groove 603f-1 and adapted to the rotating groove 603f-6 and the strip groove 603f-3, and an auxiliary pull rod 603f-5 symmetrically arranged on both sides of the pressing column 603f-2 and located between the connecting rod 603c and the pressing frame 603d-4. When the pressing column 603f-2 is pressed down or moved up, the limiting column 603f-4 slides relative to the strip groove 603f-3 and the rotating groove 603f-6 respectively, and the limiting column 603f-4 moves relatively vertically in the strip groove 603f-3. When the limiting column 603f-4 is located in the rotating groove 603f-6, it drives the pressing column 603f-2 to rotate through squeezing.

[0081] Preferably, the rotation angle of the rotation slot 603f-6 is 90°, and grooves 603f-6 adapted to the auxiliary pull rod 603f-5 are provided near the active force point 502a-1 on both sides of the module plug 502. In this embodiment, the auxiliary pull rod 603f-5 is divided into three sections through a 90-degree rotation structure, namely, a first pull rod 603f-5a connected to the pressing column 603f-2, a second pull rod 603f-5b rotatably connected to the first pull rod 603f-5a, and a third pull rod 603f-5c connected to the second pull rod 603f-5b and matched with the groove 603f-6.

[0082] The rest of the structure is the same as that of Example 3.

[0083] Working principle: The pressing column 603f-2 presses the pressing frame 603d-4 to squeeze the inclined opening 603d-3 of the positioning block 603d-1, thereby compressing the third spring 603d-2 to move out of the positioning groove 603e, and then drives the connecting rod 603c to move to the sliding plate 602d on the side of the module plug-in block 502 that needs to be pulled out, releases the pressing pressing column 603f-2, so that the positioning block 603d-1 re-matches with the group of positioning grooves 603e, and then pulls up the connecting rod 603c from the middle part, so that the two sides of the module plug-in block 502 are evenly stressed and can keep moving up in the vertical direction;

[0084] When the pressing column 603f-2 remains in the pressing state, the auxiliary pull rod 603f-5 is between the connecting rod 603c and the pressing frame 603d-4, which is in the storage state. After the pressing column 603f-2 is released, the pressing column 603f-2 will reset upward and rotate 90° through the rotating groove 603f-6 and the limiting column 603f-4, so that the auxiliary pull rod 603f-5 connected to it rotates 90° and moves out. After the auxiliary pull rod 603f-5 is rotated out, it cooperates with the grooves 603f-6 on the other two sides of the module plug-in block 502. When the connecting rod 603c is pulled up, the auxiliary pull rod 603f-5 will apply a pulling force at the same time; and when the module plug-in block 502 is about to be separated from the interface slot 501, the module plug-in block 502 will be blocked by the connecting rod 603c and the auxiliary pull rod 603f-5 due to the pop-up of the first spring 503c, preventing the module plug-in block 502 from flying out due to excessive elastic force, and then by pressing the pressing column 603f-2, the auxiliary pull rod 603f-5 is stored, and the connecting rod 603c is rotated through the positioning block 603d-1, so that the module plug-in block 502 can be easily removed.

[0085] In summary, by providing a connecting rod 603c and an auxiliary pull rod 603f-5, the module plug 502 can be prevented from popping out. By pulling up the connecting rod 603c from the middle part, the force on both sides of the module plug 502 is evenly applied, and the module plug 502 can keep moving up in the vertical direction, thereby solving the problem that the module plug 502 is prone to tilting when being pulled up, and is prone to suddenly popping open under the elastic force of the first spring 503c.

[0086] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), installation arrangement, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other replacements, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the invention is not limited to a specific embodiment, but extends to numerous modifications still falling within the scope of the appended claims.

[0087] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0088] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0089] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A 3DX medium wave transmitter power amplifier test platform capable of displaying output power, characterized in that: include, A test unit (100) comprises a test motherboard (M), and a radio frequency signal source (101) connected to the test motherboard (M) by transmitting an excitation signal; a power supply unit (200), the power supply unit (200) being connected to the test motherboard (M) and being used for providing power supplies of different voltage levels; and A power display unit (300) is used to measure the output power of a radio frequency signal source (101), and comprises a display screen (301) electrically connected to a power supply unit (200).

2. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 1, characterized in that: The test unit (100) also includes a dummy load subunit (102) electrically connected to the test motherboard (M) and can be used for impedance matching and power consumption; The dummy load subunit (102) comprises a load impedance (102a) connected to a test motherboard (M), an adjustable inductor (102b) connected to the load impedance (102a), and a cooling structure (102c) for heat dissipation and temperature reduction.

3. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 1 or 2, characterized in that: The power display unit (300) further comprises a DC power meter connected in series with the power supply unit (200), and measures the voltage and current of the power supply unit (200) through the DC power meter, calculates the input power as the output power of the radio frequency signal source (101), and displays the result on the display screen (301); The power supply unit (200) is a high-power adjustable switching power supply, and the radio frequency signal source (101) is a DSS signal generator.

4. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 1 or 2, characterized in that: The test motherboard (M) comprises a motherboard body (400) connected to a power supply unit (200), an interface component (500) arranged on one side of the motherboard body (400), and an auxiliary component (600) connected between the motherboard body (400) and the interface component (500); The interface assembly (500) comprises an interface slot (501) arranged on one side of the motherboard body (400), and a module plug-in block (502) engaged with the interface slot (501), and the interface slot (501) and the module plug-in block (502) are also electrically connected; The auxiliary component (600) is detachably connected to one side of the motherboard body (400), and comprises an extrusion sleeve (601) which can be nested and connected to the top of the module plug-in block (502).

5. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 4, characterized in that: The module plug-in block (502) has at least two groups of force-bearing areas (502a) symmetrically arranged on one side close to the interface slot (501), and the force-bearing areas (502a) include active force-bearing points (502a-1) arranged on the outside of the outline of the module plug-in block (502), and passive force-bearing points (502a-2) arranged on the inside of the outline of the module plug-in block (502).

6. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 5, characterized in that: An elastic member (503) is arranged between the interface slot (501) and the module plug-in block (502) at a position close to the passive force point (502a-2), and the elastic member (503) comprises a telescopic rod (503a) arranged on one side of the interface slot (501), an extrusion block (503b) arranged at the end of the telescopic rod (503a), and a first spring (503c) connected between the telescopic rod (503a) and the extrusion block (503b).

7. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 5 or 6, characterized in that: The auxiliary component (600) also includes a lifting portion (602) arranged on one side of the extrusion sleeve (601), and the lifting portion (602) includes a lifting groove (602a) opened on the side of the interface slot (501) close to the active force point (502a-1), a lifting rod (602b) slidably connected to one side of the extrusion sleeve (601) and adapted to the lifting groove (602a), and a storage groove (602c) arranged on the inner side of the extrusion sleeve (601) and adapted to the lifting rod (602b).

8. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 7, characterized in that: The interface slots (501) are arranged in multiple groups at intervals, the lifting portion (602) further comprises a sliding plate (602d) slidably connected to one side of the extrusion sleeve (601) and arranged close to the interface slot (501), the lifting rod (602b) is arranged on the sliding plate (602d), the number of the sliding plates (602d) is twice the number of the interface slots (501), and an extrusion piece (602e) is arranged between two adjacent groups of sliding plates (602d); The extrusion member (602e) includes an extrusion plate (602e-1) slidably connected to one side of the extrusion sleeve (601) and adapted to the top of the module plug-in block (502), a second spring (602e-2) arranged between the extrusion plate (602e-1) and the extrusion sleeve (601), a first inclined surface (602e-3) arranged on one side of the extrusion plate (602e-1) and inclined downward, and a second inclined surface (602e-4) arranged on the top of the sliding plate (602d) and adapted to the first inclined surface (602e-3).

9. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 8, characterized in that: The auxiliary component (600) further comprises a connecting portion (603) connected to two opposite sides of the extrusion sleeve (601), wherein the connecting portion (603) comprises sliding grooves (603a) symmetrically arranged on two sides of the extrusion sleeve (601), limit blocks (603b) slidably connected in the sliding grooves (603a), a connecting rod (603c) connected between the limit blocks (603b), a positioning member (603d) slidably connected to one side of the limit blocks (603b), and a positioning groove (603e) arranged on one side of the sliding plate (602d) and adapted to the positioning member (603d); The positioning member (603d) comprises a positioning block (603d-1) slidably connected to the limit block (603b), a third spring (603d-2) connected between the positioning block (603d-1) and the connecting rod (603c), an inclined groove (603d-3) arranged on the top of the positioning block (603d-1) and facing the sliding plate (602d), and a pressing frame (603d-4) slidably connected to one side of the connecting rod (603c) and adapted to the inclined groove (603d-3).

10. The 3DX medium wave transmitter power amplifier test platform capable of displaying output power as claimed in claim 9, characterized in that: The connecting portion (603) further comprises an auxiliary member (603f) arranged at the top of the connecting rod (603c) and connected to the pressing frame (603d-4), wherein the auxiliary member (603f) comprises a cylindrical groove (603f-1) arranged at the center of the top of the connecting rod (603c), a pressing column (603f-2) rotatably connected to one side of the pressing frame (603d-4) and slidably connected to the cylindrical groove (603f-1), and a pressing column (603f-2) arranged at one side of the pressing column (603f-2). The invention also comprises a rotating groove (603f-6) on the side thereof, a strip groove (603f-3) vertically arranged at both ends of the rotating groove (603f-6), a limiting column (603f-4) arranged on one side of the column groove (603f-1) and adapted to the rotating groove (603f-6) and the strip groove (603f-3), and an auxiliary pull rod (603f-5) symmetrically arranged on both sides of the pressing column (603f-2) and located between the connecting rod (603c) and the pressing frame (603d-4); The rotation angle of the rotation slot (603f-6) is 90°, and grooves (603f-6) adapted to the auxiliary pull rod (603f-5) are provided on both sides of the module plug-in block (502) near the active force point (502a-1).

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