Preparation method of LED patch support, LED patch support and LED

Abstract

The invention provides a preparation method of an LED patch support. The preparation method comprises the following steps of S1, obtaining a long-strip-shaped conductive metal sheet through stamping treatment; s2, the conductive metal sheet is galvanized; s3, silver plating is carried out on the conductive metal sheet; s4, the multiple conductive metal sheets are sealed in an injection mold at intervals, a liquid thermoplastic plastic material is injected into the injection mold, and the injection mold is heated so that the thermoplastic plastic material can be cured and formed on the conductive metal sheets to obtain multiple insulating plastic materials arranged at intervals; and spraying high-temperature-resistant high-reflection white glue on the insulating plastic material. By spraying the high-temperature-resistant high-reflection white glue, the luminous flux maintenance rate of the LED patch support and the initial brightness during use can be improved, the service life of an LED product is greatly prolonged, the stability of the LED product is greatly improved, and the effects of energy conservation and emission reduction are achieved.

Description

Technical Field

[0001] The invention relates to the field of LED production technology, and in particular to a method for preparing an LED patch bracket, an LED patch bracket and an LED. Background Art

[0002] LED (Light Emitting Diode) is a common light-emitting device. Its working principle is to release energy and emit light through the recombination of electrons and holes. It is widely used in the field of lighting. LED can efficiently convert electrical energy into light energy. It has a wide range of uses in modern society, such as lighting, display screens, medical devices, or various light indicator tools. At present, in the field of lighting, LED chips are generally installed on LED patch brackets to form LED lamps.

[0003] Among them, the main materials of the insulating plastic materials used in the LED patch bracket are divided into four types of plastic materials: PPA, PCT, EMC and SMC. PPA is commonly used for the packaging of low-power (0.06-0.3W) products. PCT is suitable for the packaging of medium and small power (0.2-1W) products. EMC is suitable for the packaging of medium and high power (0.5W-3W) products. SMC is suitable for the packaging of high-power (1W-5W) products.

[0004] At present, the most widely used products on the market are small and medium power (0.2W-1W) LED products, so PPA and PCT have become commonly used plastic materials due to their high cost performance. However, PPA and PCT plastic materials are prone to yellowing, cracking, carbonization and blackening after long-term (3000 hours) operation, which will cause the LED light flux maintenance rate to drop sharply, and the relative decrease in initial brightness may exceed 40%. Therefore, the present invention provides a method for preparing an LED patch bracket, an LED patch bracket, and an LED to solve the above problems. Summary of the invention

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a method for preparing an LED patch bracket, an LED patch bracket, and an LED to solve the problems mentioned in the above background technology section.

[0006] The present invention is achieved through the following technical solutions:

[0007] A method for preparing an LED patch bracket comprises the following steps:

[0008] S1, obtaining a long strip of conductive metal sheet by stamping;

[0009] S2, galvanizing the conductive metal sheet;

[0010] S3, silver-plating the conductive metal sheet;

[0011] S4, sealing a plurality of conductive metal sheets at intervals in an injection mold, injecting a liquid thermoplastic material into the injection mold, and heating the injection mold so that the thermoplastic material is solidified on the conductive metal sheets to obtain a plurality of insulating plastic materials arranged at intervals;

[0012] S5, punching, bending and cutting the conductive metal sheet at the connection between the two insulating plastic materials to obtain an LED patch bracket unit;

[0013] S6, spraying high-temperature resistant and highly reflective white glue on the inner and outer peripheral surfaces of the insulating plastic material in the LED patch bracket unit;

[0014] S7, drying the insulating plastic material in step S6.

[0015] The beneficial effects of the present invention are as follows: by spraying high-temperature resistant and highly reflective white glue, the light flux maintenance rate of the LED patch bracket and the initial brightness during use can be improved, the service life and stability of the LED product can be greatly improved, and the effect of energy saving and emission reduction can be achieved. Moreover, through the preparation steps in step S4, one mold can be used to simultaneously produce multiple LED patch bracket units, thereby increasing production efficiency. In the process of large-scale production, the number of molds used can be reduced, thereby reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a flow chart of the method for preparing the LED patch bracket unit of the present invention;

[0017] Figure 2 This is a connection diagram of producing multiple LED patch bracket units using the same mold of the present invention.

[0018] Figure 3 It is a three-dimensional diagram of the LED patch bracket unit of the present invention.

[0019] Figure 4 Centered cutaway view of the LED patch bracket unit of the present invention.

[0020] Figure 5 This is a central cutaway view of another embodiment of the LED patch bracket unit of the present invention.

[0021] Figure 6 for Figure 5 A partial enlarged view of part A in the middle.

[0022] Figure 7 This is a three-dimensional diagram of a SMD LED.

[0023] Figure 8 This is an exploded view of a SMD LED.

[0024] The above drawings include the following reference numerals:

[0025] A. LED patch bracket unit; 1. First metal sheet; 11. Notch step; 2. Second metal sheet; 3. Insulating plastic material; 31. Glue injection hole; 32. Cavity; 321. First side surface; 322. Second side surface; 323. First step surface; 33. Support bar; 4. High temperature resistant and highly reflective white glue layer; 5. Fluorescent layer; 6. Potting glue layer; 7. LED chip. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0027] Reference Figures 1 to 8 As shown, a method for preparing an LED patch bracket includes the following steps:

[0028] S1, obtaining a long strip of conductive metal sheet by stamping;

[0029] S2, galvanizing the conductive metal sheet;

[0030] S3, silver-plating the conductive metal sheet;

[0031] S4, sealing a plurality of conductive metal sheets at intervals in an injection mold, injecting a liquid thermoplastic material into the injection mold, and heating the injection mold so that the thermoplastic material is solidified on the conductive metal sheets to obtain a plurality of insulating plastic materials 3 arranged at intervals;

[0032] S5, punching, bending and cutting the conductive metal sheet at the connection between the two insulating plastic materials 3 to obtain an LED patch bracket unit A;

[0033] S6, spraying high-temperature resistant and highly reflective white glue on the inner and outer peripheral surfaces of the insulating plastic material 3 in the LED patch bracket unit A;

[0034] S7, drying the insulating plastic material 3 in step S6.

[0035] The conductivity and oxidation resistance of the conductive metal sheet are improved by zinc plating and silver plating. The conductive metal sheet is made of a metal material suitable for stamping and having good conductivity, such as copper or copper alloy.

[0036] By spraying high-temperature resistant and highly reflective white glue, the LED product can still have a high light flux maintenance rate after working for a long time (over 3000 hours), that is, the light flux maintenance rate can be increased by more than 30% compared with the unsprayed high-temperature resistant and highly reflective white glue. On the other hand, it can effectively improve the initial brightness of the LED product, which can increase the initial brightness by more than 1% compared with the unsprayed high-temperature resistant and highly reflective white glue. This can greatly improve the service life and stability of LED products and play a role in energy conservation and emission reduction.

[0037] Reference Figure 2 As shown, through the preparation steps in step S4, a mold can be used to simultaneously produce multiple LED patch bracket units A, thereby increasing production efficiency. In the process of large-scale production, the number of molds used can be reduced, thereby reducing production costs. Then, the conductive metal sheet at the connection between the two insulating plastic materials 3 is punched, bent, and cut to obtain the LED patch bracket unit A.

[0038] Hollow glass beads are evenly mixed in the high temperature resistant and highly reflective white glue. By adding hollow glass beads to the high temperature resistant and highly reflective white glue, the reflectivity of light is increased, which is conducive to further improving the luminous flux maintenance rate and initial brightness. Specifically, compared with LED products that do not add hollow glass beads but are sprayed with high temperature resistant and highly reflective white glue, after using for more than 3000 hours, the luminous flux maintenance rate can be increased by more than 15%, and the initial brightness can be increased by more than 0.5%.

[0039] Preferably, the diameter of the hollow glass beads is 0.035mm-0.2mm. This ensures that the LED product has a light flux maintenance rate while having a frosted outer surface. The frosted outer surface not only provides a beautiful visual effect, but also reduces direct reflection of light, making the light softer and reducing glare. The high melting point characteristics of the hollow glass beads can improve the temperature resistance of the coating, so that the LED product can maintain stable performance even in high temperature environments. The hollow glass beads have a good reflective effect on ultraviolet rays, which helps to reduce the yellowing and aging of the coating caused by ultraviolet rays and maintain the long-term appearance stability of the product.

[0040] Preferably, the thickness of the high temperature resistant and highly reflective white glue is 30um-80um.

[0041] The mass ratio of the hollow glass beads to the high temperature resistant and highly reflective white glue is 1:5 to 1:10, ensuring that the spacing arrangement of the hollow glass beads after spraying is reasonable.

[0042] In step S7, the drying condition is 150°C for 30 minutes, so as to ensure that the high temperature resistant and highly reflective white glue can be firmly attached to the insulating plastic material 3.

[0043] The thermoplastic plastic material is PPA plastic material or PCT plastic material.

[0044] An LED patch bracket is manufactured by the above-mentioned method for manufacturing the LED patch bracket. The method for manufacturing the LED patch bracket provided by the present invention and the LED patch bracket can greatly improve the service life and stability of LED products, thereby achieving the effect of energy saving and emission reduction.

[0045] Specifically, the LED patch bracket unit A includes a first metal sheet 1 and a second metal sheet 2, which are obtained by cutting a conductive metal sheet. The first metal sheet 1 and the second metal sheet 2 are connected by an insulating plastic material 3, and the inner and outer end surfaces of the insulating plastic material 3 are sprayed with a high-temperature resistant and highly reflective white glue layer 4.

[0046] Reference Figure 6 As shown, in order to prevent thermal expansion and contraction during the use of the LED, which may cause the high-temperature resistant and highly reflective white glue layer 4 to separate from the insulating plastic material 3, the insulating plastic material 3 is provided with a glue injection hole 31 connected to the outside, and the high-temperature resistant and highly reflective white glue layer 4 fills the glue injection hole 31.

[0047] There is no limit to the number of the glue injection holes 31. The contact area between the high temperature resistant and highly reflective white glue layer 4 and the insulating plastic material 3 can be further increased through the glue injection holes 31. Preferably, the glue injection holes 31 are inverted trapezoids. After the glue injection is completed, the high temperature resistant and highly reflective white glue layer 4 can be prevented from separating from the insulating plastic material 3 through the mutual locking relationship.

[0048] Specifically, the size specifications of the injection hole 31 are as follows: the depth of the injection hole 31 is 0.1-0.45mm, the diameter of the injection hole 31 is 0.08-0.2mm, and the bottom diameter of the injection hole 31 is 0.1-0.35mm. This can avoid reducing the amount of high-temperature resistant and highly reflective white glue used, while ensuring the connection strength between the high-temperature resistant and highly reflective white glue and the insulating plastic material 3.

[0049] Reference Figure 7 and Figure 8 As shown, during the processing, the LED chip 7 needs to be placed in the cavity 32 of the insulating plastic material 3, and then the LED chip 7 is respectively connected to the first metal sheet 1 and the second metal sheet 2 through bonding wires, and the first metal sheet 1 and the second metal sheet 2 respectively form the positive and negative electrodes, and then the fluorescent layer 5 and the potting glue layer 6 are filled, or only the potting glue layer 6 is filled.

[0050] Therefore, refer to Figure 6As shown, the inner end surface of the insulating plastic material 3 includes a first side surface 321 close to the opening end and a second side surface 322 close to the bottom, and a first step surface 323 is formed between the first side surface 321 and the second side surface 322. The first side surface 321 and the second side surface 322 surround and form the cavity 32 for placing the LED chip 7. The first step surface 323 can prevent the potting glue layer 6 from separating from the insulating plastic material 3.

[0051] The second side surface 322 is sprayed with the high temperature resistant and highly reflective white glue layer 4. After the light passes through the fluorescent layer 5, the high temperature resistant and highly reflective white glue layer 4 arranged at this position can increase the efficiency of light reflection, thereby improving the luminous flux of the product.

[0052] When the cavity 32 is filled with the fluorescent layer 5 and the potting glue layer 6, the insulating plastic material 3 is filled with the fluorescent layer 5 and the potting glue layer 6 in sequence, and the fluorescent layer 5 is filled to a height lower than the first step surface 323. At this time, when the potting glue layer 6 cannot be separated from the insulating plastic material 3, the fluorescent layer 5 cannot be separated from the insulating plastic material 3, thereby ensuring the connection strength between the fluorescent layer 5 and the potting glue layer 6 and the insulating plastic material 3.

[0053] A notch step 11 is provided at the bottom of the adjacent ends of the first metal sheet 1 and the second metal sheet 2, and a support bar 33 is provided on the insulating plastic material 3 for supporting and sealing the notch step 11, thereby ensuring the connection strength between the first metal sheet 1 and the second metal sheet 2 and the insulating plastic material 3, so that when the first metal sheet 1 and the second metal sheet 2 are subjected to external pressure, the support bar 33 provides a certain supporting force.

[0054] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0055] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for preparing an LED patch bracket, characterized in that: The steps include: S1, obtaining a long strip of conductive metal sheet by stamping; S2, galvanizing the conductive metal sheet; S3, silver-plating the conductive metal sheet; S4, sealing a plurality of conductive metal sheets at intervals in an injection mold, injecting a liquid thermoplastic material into the injection mold, and heating the injection mold so that the thermoplastic material is solidified on the conductive metal sheets to obtain a plurality of insulating plastic materials arranged at intervals; S5, punching, bending and cutting the conductive metal sheet at the connection between the two insulating plastic materials to obtain an LED patch bracket unit; S6, spraying high-temperature resistant and highly reflective white glue on the inner and outer peripheral surfaces of the insulating plastic material in the LED patch bracket unit; S7, drying the insulating plastic material in step S6.

2. The method for preparing an LED patch bracket according to claim 1, characterized in that: Hollow glass beads are uniformly mixed in the high temperature resistant and highly reflective white glue.

3. The method for preparing an LED patch bracket according to claim 2, characterized in that: The diameter of the hollow glass beads is 0.035mm-0.2mm.

4. The method for preparing an LED patch bracket according to claim 2, characterized in that: The thickness of the high temperature resistant and highly reflective white glue is 30um-80um.

5. The method for preparing an LED patch bracket according to claim 2, characterized in that: The mass ratio of the hollow glass beads to the high temperature resistant and highly reflective white glue is 1:5 to 1:

10.

6. The method for preparing an LED patch bracket according to claim 1, characterized in that: In step S7, the drying condition is at 150° for 30 minutes.

7. The method for preparing an LED patch bracket according to claim 1, characterized in that: The thermoplastic plastic material is PPA plastic material or PCT plastic material.

8. An LED patch bracket, characterized in that: The LED patch bracket is manufactured by the preparation method of any one of claims 1 to 7.

9. An LED, characterized in that: It comprises the LED patch bracket as claimed in claim 8.

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