Method and device for curing microcracks in component

Abstract

The invention discloses a method and device for curing microcracks in a component, and belongs to the technical field of material processing.The method comprises the steps that the form of the to-be-cured microcracks in the to-be-cured component is obtained; selecting a maximum crack as a target microcrack according to the form; determining current input energy capable of healing the target microcrack according to the size of the target microcrack; establishing a finite element model of the target microcrack according to the attribute of the to-be-cured component, and determining multiple groups of pulse current parameters according to the current input energy, so as to respectively perform electroplastification treatment on the finite element model by utilizing the multiple groups of pulse current parameters to obtain an electroplastification treatment result; and determining a target pulse current parameter which enables the healing effect of the target micro-crack to be the best by utilizing the electroplastification treatment result, and carrying out electroplastification treatment on the to-be-cured component by utilizing the target pulse current parameter to cure the micro-crack in the component. According to the scheme, healing of microcracks in the component can be achieved.

Description

Technical Field

[0001] The invention relates to the technical field of material processing, and in particular to a method and a device for healing microcracks inside a component. Background Art

[0002] During the forming and service process of metal components, micro defects such as micro cracks may be generated inside the components. Under cyclic loads, micro defects such as micro cracks in the material will cause fatigue failure of mechanical parts during use. The presence of micro cracks will greatly reduce the service life and reliability of metal components. Therefore, repairing the micro cracks that have already occurred in metal components can effectively increase their service life and meet the requirements of sustainable development of the manufacturing industry.

[0003] In the related art, the micro cracks inside the component are not treated. Therefore, it is necessary to provide a method for curing the micro cracks inside the component. Summary of the invention

[0004] The present invention provides a method and device for healing microcracks inside a component. The technical solution is as follows:

[0005] On the one hand, a method for healing microcracks inside a component is provided, comprising:

[0006] Obtaining the morphology of microcracks to be cured inside the component to be cured;

[0007] selecting the largest crack as the target microcrack according to the morphology;

[0008] Determining the current input energy that can heal the target microcrack according to the size of the target microcrack;

[0009] A finite element model of the target microcrack is established according to the properties of the component to be cured, and a plurality of groups of pulse current parameters are determined according to the current input energy, so as to perform electroplasticization treatment on the finite element model respectively using the plurality of groups of pulse current parameters to obtain electroplasticization treatment results;

[0010] The target pulse current parameters that achieve the best healing effect of the target microcracks are determined using the electroplasticization treatment results, so as to perform electroplasticization treatment on the component to be cured using the target pulse current parameters to cure the microcracks inside the component.

[0011] On the other hand, a device for healing microcracks inside a component is provided, the device comprising:

[0012] A morphology acquisition unit, used to acquire the morphology of microcracks to be cured inside the component to be cured;

[0013] a selection unit, for selecting a maximum crack as a target microcrack according to the morphology;

[0014] An energy determination unit, used for determining the current input energy that can heal the target microcrack according to the size of the target microcrack;

[0015] A result determination unit, used for establishing a finite element model of the target microcrack according to the properties of the component to be cured, and determining a plurality of groups of pulse current parameters according to the current input energy, so as to perform electroplasticization treatment on the finite element model respectively using the plurality of groups of pulse current parameters to obtain an electroplasticization treatment result;

[0016] The parameter determination unit is used to determine the target pulse current parameter that achieves the best healing effect of the target microcracks by using the electroplasticization treatment result, so as to perform electroplasticization treatment on the component to be cured by using the target pulse current parameter to cure the microcracks inside the component.

[0017] On the other hand, a computer device is provided, which includes a memory and a processor, wherein the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory to implement the steps of the method for healing microcracks inside a component as described above.

[0018] On the other hand, a computer-readable storage medium is provided, wherein a computer program is stored in the storage medium, and when the computer program is executed by a processor, the steps of the method for healing microcracks inside a component are implemented.

[0019] On the other hand, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the steps of the method for healing microcracks inside a component as described above.

[0020] The technical solution provided by the present invention can at least bring the following beneficial effects:

[0021] Since the crack position is empty, after the pulse current is passed through the component, the crack position is short-circuited, so the current intensity around the crack increases, causing the temperature around the crack to rise, and then heat collision is generated under the action of high temperature to make the two sides of the crack contact. In addition, compressive stress will be generated at the microcrack, and this compressive stress can produce plastic deformation, so that the two sides of the crack will not recover after contact, thereby achieving the purpose of healing the microcrack. In this scheme, the largest crack inside the component to be cured is taken as the target microcrack, and the current input energy that can heal the target microcrack is determined. Then, the finite element model is used to determine the target pulse current parameters that meet the current input energy and have the best healing effect on the target microcrack. As long as the target microcrack can be healed, other cracks smaller than the target microcrack can also be healed. It can be seen that this scheme is able to achieve the healing of microcracks inside the component. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a flow chart of a method for curing microcracks inside a component provided by one embodiment of the present invention;

[0024] Figure 2 It is a schematic structural diagram of a device for healing microcracks inside a component provided by one embodiment of the present invention;

[0025] Figure 3 It is a hardware architecture diagram of a computing device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0027] The specific implementation of the above concept is described below.

[0028] Please refer to Figure 1 , a method for curing microcracks inside a component provided by an embodiment of the present invention comprises:

[0029] Step 100, obtaining the morphology of microcracks to be cured inside the component to be cured;

[0030] Step 102, selecting the largest crack as the target microcrack according to the morphology;

[0031] Step 104, determining the current input energy that can heal the target microcrack according to the size of the target microcrack;

[0032] Step 106, establishing a finite element model of the target microcrack according to the properties of the component to be cured, and determining multiple sets of pulse current parameters according to the current input energy, so as to perform electroplasticization treatment on the finite element model respectively using the multiple sets of pulse current parameters to obtain electroplasticization treatment results;

[0033] Step 108, using the electroplasticization treatment result to determine the target pulse current parameter that achieves the best healing effect of the target microcracks, so as to perform electroplasticization treatment on the component to be cured using the target pulse current parameter to cure the microcracks inside the component.

[0034] In the embodiment of the present invention, since the crack position is empty, after the pulse current is passed through the component, the crack position is short-circuited, so that the current intensity around the crack increases, causing the temperature around the crack to rise, and then generating heat collision under the action of high temperature to make the two sides of the crack contact. In addition, compressive stress will be generated at the microcrack, and the compressive stress can produce plastic deformation, so that the two sides of the crack will not recover after contact, thereby achieving the purpose of healing the microcrack. In this scheme, the largest size crack inside the component to be cured is used as the target microcrack, and the current input energy that can heal the target microcrack is determined, and then the target pulse current parameters that meet the current input energy and have the best healing effect on the target microcrack are determined using the finite element model. As long as the target microcrack can be healed, other cracks smaller than the target microcrack can also be healed. It can be seen that this scheme is able to achieve the healing of microcracks inside the component.

[0035] Described below Figure 1 How the various steps are performed.

[0036] First, step 100 of "obtaining the morphology of the microcracks to be cured inside the component to be cured" and step 102 of "selecting the largest crack as the target microcrack according to the morphology" are explained simultaneously.

[0037] In the embodiment of the present invention, the component to be cured can be a newly formed component (e.g., formed by 3D printing, cold rolling, etc.), or a component in service. The component is a conductive metal part, such as titanium alloy, aluminum alloy, steel, high-temperature alloy, etc. If the microcracks inside the component are not cured, under the action of cyclic loads, the microcracks in the material will cause fatigue failure of the mechanical parts during use. Therefore, it is necessary to cure the microcracks.

[0038] In the embodiment of the present invention, in order to be able to heal the microcracks, it is considered to use the method of electroplasticization to pass a pulse current through the component so that the cracks contact and produce plastic deformation to achieve microcrack healing. The difficulty of pulse current healing of microcracks lies in the selection of pulse current parameters. The key to microcrack healing is to form a high temperature gradient near the cracks, thereby generating sufficiently large thermal compression stress, and the thermal compression stress value is controlled by the pulse current parameters. The influence of pulse parameters on microcrack healing is essentially that the input of pulse current provides the necessary energy for microcrack healing. Therefore, the pulse current input energy is an important basis for selecting appropriate pulse parameters.

[0039] In order to determine the appropriate current input energy, in an embodiment of the present invention, it is first necessary to determine the morphology of the microcracks to be cured inside the component to be cured. In one embodiment of the present invention, the size of the microcracks is 0.5 to 200 μm. Since the size of the microcracks is small and belongs to the um level, the morphology of the microcracks needs to be obtained by high-resolution industrial CT scanning with a scanning accuracy of 0.1 to 50 μm to ensure that microcracks with a size of 0.5 to 200 μm can be scanned.

[0040] In the embodiment of the present invention, after obtaining the morphology of the microcracks to be cured inside the component to be cured, the microcrack morphology can be statistically analyzed using data processing software, and the data processing software can be Matlab, Python, origin, etc. The microcrack morphology includes the size (length, width and depth) of the microcracks and the volume density corresponding to microcracks of different lengths.

[0041] In the process of healing microcracks, if the current input energy of the pulse current is too small, the microcracks will not be completely healed. If the current input energy of the pulse current is too large, it will cause the inside of the component to completely melt, affecting the life of the component. Based on this, it is necessary to select a suitable current input energy. In the embodiment of the present invention, considering that if the microcracks of the largest size can be healed, microcracks of other sizes in the component can also be healed, and since the size of the microcracks is 0.5 to 200 μm, the current input energy that can heal the microcracks of the largest size allows small-sized microcracks to form a whole with the component after healing, and there is no temperature difference. Therefore, not only can small-sized microcracks be healed, but also the quality of the component can be guaranteed not to be damaged.

[0042] In one embodiment of the present invention, the maximum crack is selected as the target microcrack according to the morphology, and the target microcrack can be selected in any of the following ways:

[0043] The first method: based on the morphology of each microcrack inside the component to be cured, the size of each microcrack is counted using data processing software, and the microcrack with the largest size is taken as the target microcrack;

[0044] The second method is to use data processing software to count the volume densities corresponding to microcracks of different sizes based on the morphology of each microcrack inside the component to be cured, and use the microcrack of the size corresponding to the highest volume density as the target microcrack.

[0045] The volume density refers to the number of microcracks per unit volume. The highest volume density refers to the microcrack size with the largest number of microcracks per unit volume.

[0046] Then, step 104 "determining the current input energy that can heal the target microcracks according to the size of the target microcracks" and step 106 "establishing a finite element model of the target microcracks according to the properties of the component to be cured, and determining multiple groups of pulse current parameters according to the current input energy, so as to use the multiple groups of pulse current parameters to perform electroplasticization treatment on the finite element model respectively to obtain electroplasticization treatment results" are explained at the same time.

[0047] In the embodiment of the present invention, when the properties of the metal component are determined, the current input energy used for healing of microcracks of the same size is approximately equal. In step 104, when determining the current input energy that can heal the target microcrack according to the size of the target microcrack, it can be determined specifically through experimental data.

[0048] In one implementation, step 104 may be implemented as follows:

[0049] S1: Based on the properties of the component to be cured, determine whether there is experimental data of a component sample with the same properties; the experimental data includes the current input energy required for healing of microcracks of different sizes in the component sample; wherein the current input energy required for healing of microcracks of the sample size is obtained by: for microcracks of the sample size in the component sample, current input energy is passed through the component sample in a small amount for multiple times to observe the healing process of the microcracks in the component sample, and the total current input energy used to completely heal the microcracks of the sample size is obtained;

[0050] S2: If yes, then according to the size of the target microcrack, the current input energy that can heal the crack is directly obtained by using the experimental data of the component sample with the same property;

[0051] S3: If not, determine the current input energy according to the size of the target microcracks and using experimental data of component samples with other properties similar to the properties of the component to be cured.

[0052] The properties of the component include metal material, stiffness, strength, etc.

[0053] During the experiment, if the component sample with the same properties as the component to be cured has been used for the experiment, the current input energy corresponding to the size of the target microcrack can be obtained using the experimental data. During the experiment, when the healing experiment is performed on the target microcrack of the sample size in the component sample, the standard current input energy passed into the component sample is determined, and the standard current input energy includes: the standard amount and standard duration of the input current energy; after each time the standard current input energy is passed, the average value is: the healing of the microcracks of the component sample is observed by CT, the average healing size of this time is determined, and whether the current target microcrack is healed, if not, the next standard current input energy is passed, if it is healed, the total energy of the standard current input energy that has been passed is counted, and the total energy is used as the current input energy that can heal the sample size of the component sample.

[0054] It can be seen that the current input energy corresponding to different component sizes can be obtained through the experimental process.

[0055] However, due to the small amount of experimental data on component samples, it is impossible to conduct experiments on all components with different properties. Based on this, the experimental data of component samples with similar properties can be used to roughly determine the current input energy. The similar properties can be the same metal material with different stiffness or strength; or the similar properties can be different metal materials but the same or similar stiffness and strength.

[0056] It should be noted that the similar attributes can be determined by those skilled in the art based on actual similar situations. If there is neither experimental data of the same attribute nor experimental data of similar attributes, then it is possible to consider using the component to be cured as a component sample for experimentation to obtain experimental data, and provide experimental data for subsequent components with the same attributes, so as to facilitate the subsequent healing of components with the same attributes.

[0057] Since the difficulty of the embodiment of the present invention lies in how to determine appropriate pulse current parameters, once the current input energy is determined, multiple groups of pulse current parameters corresponding to the current input energy can be determined through the operational relationship between the pulse current parameters and the current input energy.

[0058] The operation relationship is as follows:

[0059]

[0060] Where q is the current input energy, ρ i t i The resistivity of the component material at the temperature corresponding to the moment, j(t) is the expression of the current density, and m is the total number of pulse currents;

[0061] The expressions of current density corresponding to different pulse waveforms are different; the expression of current density is related to the pulse period, pulse interval time, pulse current type, and current density amplitude.

[0062] Specifically, the pulse waveform may include at least: a damped attenuation wave, a square wave, a sine wave, a triangle wave and a sawtooth wave.

[0063] When the pulse waveform is a damped decay wave, the expression of current density is:

[0064]

[0065]

[0066] Among them, j m is the current density amplitude, in A / mm 2 , t p is the pulse period, α is the pulse current attenuation coefficient (dimensionless), I 1m and I 2m They are the first peak and the second peak of the pulse current respectively.

[0067] When the pulse waveform is a square wave, the expression of current density is:

[0068] j(t)=j m (t<t p / 2);

[0069] j(t)=-j m (t p / 2<t<t p )

[0070] When the pulse waveform is a sine wave, the expression of current density is:

[0071]

[0072] When the pulse waveform is a triangular wave, the expression of current density is:

[0073] j(t)=kt(t <tp / 4)

[0074]

[0075]

[0076] When the pulse waveform is a sawtooth wave, the expression of current density is:

[0077] j(t)=kt(t<tp / 2);

[0078]

[0079] According to the above expression of current density and the above operation relationship, several groups of pulse current parameters corresponding to different pulse waveforms can be obtained.

[0080] In order to simulate the healing effect of each set of pulse current parameters on the component to be cured, it can be simulated by means of a finite element model of the component. Among them, the finite element model only includes one microcrack, namely the target microcrack, and it is only necessary to observe the healing effect of the pulse current parameters on the target microcrack. It should be noted that the finite element model is constructed based on the properties of the component to be cured, thereby being able to accurately characterize the changes in the internal structure of the metal component after the pulse current is passed through it. The construction method of the finite element model can be achieved by existing technology, which will not be repeated in this embodiment.

[0081] In the embodiment of the present invention, the electroplasticization results of the finite element model by using multiple sets of pulse current parameters are the morphology of the target microcracks in the finite element model.

[0082] Finally, for step 108, the target pulse current parameters that achieve the best healing effect of the target microcracks are determined using the electroplasticization treatment results, so as to perform electroplasticization treatment on the component to be cured using the target pulse current parameters to cure the microcracks inside the component.

[0083] Among them, if the target microcracks in multiple sets of electroplasticization results are not completely healed, the pulse current parameter corresponding to the smallest size is selected as the target pulse current parameter with the best healing effect; if there are completely healed target microcracks in multiple sets of electroplasticization results, the pulse current parameter closest to the healing state is used as the target pulse current parameter with the best healing effect.

[0084] After the target pulse current parameters are determined, the target pulse current parameters are directly used to perform electroplasticization treatment on the component to be cured to cure the micro cracks inside the component.

[0085] Furthermore, if the current input energy is roughly determined based on similar properties in step 104, then after this step 108, it may also include: obtaining the healing result obtained after the component to be cured is subjected to electroplasticization treatment using the target pulse current parameter; comparing the microcrack morphology in the healing result with the microcrack morphology to be cured to obtain the healing effect; using the healing effect to determine whether the current input energy is accurate, and if it is inaccurate, using the healing effect to adjust the current input energy. In this way, the healing effect is used as a sample to achieve the subsequent healing of components with the same properties as the component to be cured, and the adjusted current input energy can be used to improve the healing effect of other components to be cured.

[0086] In the embodiment of the present invention, the healing result obtained after the target pulse current parameter is used to perform electroplasticization treatment on the component to be cured is also obtained based on industrial CT scanning. If the volume density and size (length, width and depth) of the microcracks inside the component change, the volume density of the microcracks decreases by 50% to 80%, and the size of the microcracks decreases by 20% to 80%, it is determined that the healing effect is achieved.

[0087] Please refer to Figure 2 The embodiment of the present invention further provides a device for healing microcracks inside a component, the device comprising:

[0088] A morphology acquisition unit 200 is used to acquire the morphology of microcracks to be cured inside the component to be cured;

[0089] A selection unit 202, configured to select a maximum crack as a target microcrack according to the morphology;

[0090] An energy determination unit 204, configured to determine the current input energy that can heal the target microcrack according to the size of the target microcrack;

[0091] A result determination unit 206 is used to establish a finite element model of the target microcrack according to the properties of the component to be cured, and determine multiple sets of pulse current parameters according to the current input energy, so as to perform electroplasticization treatment on the finite element model respectively using the multiple sets of pulse current parameters to obtain electroplasticization treatment results;

[0092] The parameter determination unit 208 is used to determine the target pulse current parameter that achieves the best healing effect of the target microcracks using the electroplasticization treatment result, so as to perform electroplasticization treatment on the component to be cured using the target pulse current parameter to cure the microcracks inside the component.

[0093] In one embodiment of the present invention, the selection unit is specifically used to: based on the morphology of each microcrack inside the component to be cured, use data processing software to count the size of each microcrack, and use the microcrack with the largest size as the target microcrack; or, based on the morphology of each microcrack inside the component to be cured, use data processing software to count the volume density corresponding to microcracks of different sizes, and use the microcrack with the size corresponding to the highest volume density as the target microcrack.

[0094] In one embodiment of the present invention, the pulse current parameters include: pulse period, pulse interval time, pulse current type, pulse waveform, current density amplitude and total pulse current treatment time;

[0095] When the result determination unit determines a plurality of groups of pulse current parameters according to the current input energy, the result determination unit specifically includes:

[0096] The following calculation relationship is used to determine multiple groups of pulse current parameters corresponding to the current input energy:

[0097]

[0098] Where q is the current input energy, ρ i t i The resistivity of the component material at the temperature corresponding to the moment, j(t) is the expression of the current density, and m is the total number of pulse currents;

[0099] The expressions of current density corresponding to different pulse waveforms are different; the expression of current density is related to the pulse period, pulse interval time, pulse current type, and current density amplitude.

[0100] In one embodiment of the present invention, the microcrack morphology is obtained by high-resolution industrial CT scanning;

[0101] The size of the microcracks is 0.5-200um.

[0102] In one embodiment of the present invention, the energy determination unit is specifically used to determine whether there is experimental data of a component sample with the same attribute based on the attribute of the component to be cured; the experimental data includes the current input energy required for the healing of microcracks of different sizes corresponding to the component sample; wherein, the current input energy required for the healing of microcracks of the sample size is obtained in the following manner: for microcracks of the sample size in the component sample, current input energy is passed through the component sample in a small amount multiple times to observe the healing process of the microcracks in the component sample, and the total current input energy used to completely heal the microcracks of the sample size is obtained; if there is, then according to the size of the target microcrack, the experimental data of the component sample with the same attribute is used to directly obtain the current input energy that can make it heal; if not, according to the size of the target microcrack, the current input energy is determined using the experimental data of component samples with other attributes similar to the attribute of the component to be cured.

[0103] In one embodiment of the present invention, the device may also include: a comparison and adjustment unit, which is used to obtain the healing result obtained after the component to be cured is subjected to electroplasticization treatment using the target pulse current parameters after determining the current input energy using experimental data of component samples with other properties similar to the properties of the component to be cured; compare the microcrack morphology in the healing result with the microcrack morphology to be cured to obtain the healing effect; use the healing effect to determine whether the current input energy is accurate, and if inaccurate, use the healing effect to adjust the current input energy.

[0104] It should be noted that the device for healing microcracks inside a component provided in the above embodiment is only illustrated by the division of the above functional modules. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the device for healing microcracks inside a component provided in the above embodiment and the method for healing microcracks inside a component are of the same concept. The specific implementation process is detailed in the method embodiment and will not be repeated here.

[0105] The embodiment of the present application also provides a computer device, please refer to Figure 3 The computer device includes a processor and a memory, in which at least one instruction, at least one program, a code set or an instruction set is stored, and the at least one instruction, at least one program, a code set or an instruction set is loaded and executed by the processor to implement the method for healing microcracks inside a component provided by the above-mentioned method embodiments.

[0106] An embodiment of the present application also provides a computer-readable storage medium, on which is stored at least one instruction, at least one program, code set or instruction set, and the at least one instruction, at least one program, code set or instruction set is loaded and executed by a processor to implement the method for healing microcracks inside a component provided by the above-mentioned method embodiments.

[0107] An embodiment of the present application also provides a computer program product, which includes a computer program. A processor of a computer device reads the computer program from a computer-readable storage medium, and the processor executes the computer program, so that the computer device executes the method for healing microcracks inside a component described in any of the above embodiments.

[0108] For the convenience of description, the above system or device is described by dividing it into various modules or units according to its functions. Of course, when implementing the present application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0109] It can be known from the description of the above implementation methods that those skilled in the art can clearly understand that the present application can be implemented by means of software plus a necessary general hardware platform. Based on such an understanding, the technical solution of the present application can be essentially or partly contributed to the prior art in the form of a software product, which can be stored in a storage medium such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in the various embodiments of the present application or certain parts of the embodiments.

[0110] Finally, it should be noted that, in this article, relational terms such as first, second, third and fourth are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0111] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A method for curing microcracks inside a component, characterized in that: include: Obtaining the morphology of microcracks to be cured inside the component to be cured; selecting the largest crack as the target microcrack according to the morphology; Determining the current input energy that can heal the target microcracks according to the size of the target microcracks; A finite element model of the target microcrack is established according to the properties of the component to be cured, and a plurality of groups of pulse current parameters are determined according to the current input energy, so as to perform electroplasticization treatment on the finite element model respectively using the plurality of groups of pulse current parameters to obtain electroplasticization treatment results; The target pulse current parameters that achieve the best healing effect of the target microcracks are determined using the electroplasticization treatment results, so as to perform electroplasticization treatment on the component to be cured using the target pulse current parameters to cure the microcracks inside the component.

2. The method according to claim 1, characterized in that: The selecting the maximum crack as the target microcrack according to the morphology comprises: Based on the morphology of each microcrack inside the component to be cured, the size of each microcrack is counted using data processing software, and the microcrack with the largest size is taken as the target microcrack; or, Based on the morphology of each microcrack inside the component to be cured, the volume density corresponding to microcracks of different sizes is counted using data processing software, and the microcrack of the size corresponding to the highest volume density is used as the target microcrack.

3. The method according to claim 1, characterized in that The pulse current parameters include: pulse period, pulse interval time, pulse current type, pulse waveform, current density amplitude and total pulse current processing time; The step of determining a plurality of groups of pulse current parameters according to the current input energy comprises: The following calculation relationship is used to determine multiple groups of pulse current parameters corresponding to the current input energy: Where q is the current input energy, ρ i t i The resistivity of the component material at the temperature corresponding to the moment, j(t) is the expression of the current density, and m is the total number of pulse currents; The expressions of current density corresponding to different pulse waveforms are different; the expression of current density is related to the pulse period, pulse interval time, pulse current type, and current density amplitude.

4. The method according to claims 1-3, characterized in that: The microcrack morphology is obtained by high-resolution industrial CT scanning; The size of the microcracks is 0.5-200um.

5. The method according to claim 1, characterized in that The step of determining the current input energy that can heal the target microcracks according to the size of the target microcracks comprises: Based on the property of the component to be cured, determine whether there is experimental data of a component sample with the same property; the experimental data includes the current input energy required for healing of microcracks of different sizes in the component sample; wherein the current input energy required for healing of microcracks of the sample size is obtained by: for microcracks of the sample size in the component sample, current input energy is passed through the component sample in a small amount for multiple times to observe the healing process of the microcracks in the component sample, and the total current input energy used to completely heal the microcracks of the sample size is obtained; If yes, then according to the size of the target microcrack, the current input energy that can heal it is directly obtained by using the experimental data of the component sample with the same property; If not, the current input energy is determined according to the size of the target microcracks and by using experimental data of component samples with other properties similar to the properties of the component to be cured.

6. The method according to claim 5, characterized in that After determining the current input energy by using experimental data of component samples with other properties similar to the properties of the component to be cured, the method further includes: Obtaining a healing result obtained after performing an electroplasticization treatment on the component to be cured using the target pulse current parameter; Comparing the microcrack morphology in the healing result with the microcrack morphology to be cured to obtain the healing effect; The healing effect is used to determine whether the current input energy is accurate. If it is inaccurate, the healing effect is used to adjust the current input energy.

7. A device for healing microcracks inside a component, characterized in that: The device comprises: A morphology acquisition unit, used to acquire the morphology of microcracks to be cured inside the component to be cured; a selection unit, for selecting a maximum crack as a target microcrack according to the morphology; An energy determination unit, used for determining the current input energy that can heal the target microcrack according to the size of the target microcrack; A result determination unit, used for establishing a finite element model of the target microcrack according to the properties of the component to be cured, and determining a plurality of groups of pulse current parameters according to the current input energy, so as to perform electroplasticization treatment on the finite element model respectively using the plurality of groups of pulse current parameters to obtain an electroplasticization treatment result; The parameter determination unit is used to determine the target pulse current parameter that achieves the best healing effect of the target microcracks by using the electroplasticization treatment result, so as to perform electroplasticization treatment on the component to be cured by using the target pulse current parameter to cure the microcracks inside the component.

8. A computer device, characterized in that: The computer device includes a memory and a processor, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory to implement the steps of any one of the methods described in claims 1-6.

9. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method described in any one of claims 1 to 6 are implemented.

10. A computer program product, characterized in that The method comprises a computer program, wherein when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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