Piezoelectric pump heat dissipation device

Abstract

The invention relates to the technical field of electronic equipment, and discloses a piezoelectric pump heat dissipation device which comprises a piezoelectric fluid pump and a heat conductor, the piezoelectric fluid pump is provided with a piezoelectric driving assembly, an air inlet and an air outlet, the air inlet and the air outlet are communicated with each other, the heat conductor is provided with an air inlet and a heat dissipation channel, and the heat conductor is connected with the piezoelectric fluid pump. The air inlet, the heat dissipation channel, the air inlet and the air outlet are sequentially communicated, the piezoelectric driving assembly can drive fluid to flow from the air inlet to the air outlet, and a heat conduction part used for being connected with a heat source is arranged on the outer wall of the heat conductor. The piezoelectric pump cooling device can prevent discharged heat from returning to the piezoelectric pump cooling device again, the good heat exchange effect is guaranteed, and the cooling effect on equipment is remarkable.

Description

Technical Field

[0001] The invention relates to the technical field of electronic equipment, and in particular to a piezoelectric pump heat dissipation device. Background Art

[0002] As the operating speed and computing power of electronic devices and integrated circuit chips continue to increase, the accompanying heat generation problem is becoming increasingly serious. In order to solve this problem, the industry has proposed a variety of heat dissipation mechanisms, among which mechanical fans are one of the most common solutions. However, as electronic devices develop towards miniaturization and high integration, the heat dissipation effect and applicability of traditional mechanical fans are gradually limited.

[0003] In recent years, piezoelectric fluid pumps have been proposed as an emerging heat dissipation technology, aiming to provide effective heat dissipation solutions for small electronic devices. However, current piezoelectric fluid pumps are usually integrated with electronic devices or integrated circuit chips, blowing air directly at heat sources such as electronic devices or integrated circuit chips. During long-term use, dust and moisture in the external air can easily be brought into the device, causing blockage in the air inlet. In severe cases, it may also damage the internal components of the device and affect the normal operation of the device. Summary of the invention

[0004] The purpose of the present invention is to design a piezoelectric pump heat dissipation device with better heat dissipation effect and simpler maintenance.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a piezoelectric pump heat dissipation device, comprising: a piezoelectric fluid pump and a heat conductor, the piezoelectric fluid pump has a piezoelectric drive component and an air inlet and an air outlet that are interconnected, the heat conductor is provided with an air inlet and a heat dissipation channel, the heat conductor is connected to the piezoelectric fluid pump, the air inlet, the heat dissipation channel, the air inlet and the air outlet are connected in sequence, and the piezoelectric drive component can drive the fluid to flow from the air inlet to the air outlet, and the outer wall of the heat conductor is provided with a heat conducting portion for connecting to a heat source.

[0006] Furthermore, the air outlet is arranged at one side of the piezoelectric fluid pump in the first direction, and the extension direction of the air inlet is arranged perpendicular to the extension direction of the air outlet.

[0007] Furthermore, the piezoelectric fluid pump is disposed in the heat conductor, the heat conductor is provided with an air outlet on one side of the heat conductor facing the air outlet in the first direction, and the air outlet is communicated with the air outlet.

[0008] Furthermore, the heat conductor is wound around the piezoelectric fluid pump, and the inner wall of the heat conductor and a portion of the outer wall of the piezoelectric fluid pump are surrounded and defined to form the heat dissipation channel.

[0009] Further, the piezoelectric fluid pump has a first side plate and a second side plate arranged opposite to each other along a second direction, the air inlet is opened on the first side plate, the air inlet is arranged toward the second side plate, and the heat dissipation channel is arranged around the piezoelectric fluid pump;

[0010] The second direction is perpendicular to the first direction.

[0011] Furthermore, a plurality of partition walls are provided in the heat dissipation channel, and the partition walls are arranged in sequence and spaced apart to separate the heat dissipation channel into a plurality of air ducts, and each of the air ducts is connected to the air inlet and the air inlet respectively.

[0012] Furthermore, the partition wall has an air inlet end arranged close to the air inlet, and the air inlet end is arranged parallel to the axial direction of the air inlet, or the air inlet end is arranged perpendicular to the circumferential direction of the air inlet.

[0013] Further, the air outlet is located on one side of the piezoelectric fluid pump in the second direction, the piezoelectric fluid pump also has two side walls arranged opposite to each other along the third direction, the air inlet includes a first sub-air outlet and a second sub-air outlet, the first sub-air outlet and the second sub-air outlet are respectively arranged toward the two side walls, the heat dissipation channel includes a first sub-channel and a second sub-channel, the first sub-air outlet is connected to the air inlet through the first sub-channel, and the second sub-air outlet is connected to the air inlet through the second sub-channel;

[0014] Wherein, any two of the first direction, the second direction and the third direction are perpendicular to each other.

[0015] Further, a plurality of first partition walls are provided in the first sub-channel, and the first partition walls are sequentially arranged to separate the first sub-channel into a plurality of first air ducts, and each of the first air ducts is connected to the first sub-air port and the air inlet respectively; and / or

[0016] A plurality of second partition walls are provided in the second sub-channel, and each of the second partition walls is sequentially arranged to separate the second sub-channel into a plurality of second air ducts, and each of the second air ducts is connected to the second sub-air port and the air inlet, respectively.

[0017] Furthermore, the heat conductor has a heat conducting plate arranged on one side of the first direction, the heat conducting plate is limited to form a portion of the peripheral wall of the heat dissipation channel, the heat conducting portion is arranged on the side of the heat conducting plate away from the heat dissipation channel, and the heat conducting portion is arranged in contact with the heat dissipation channel through the heat conducting plate.

[0018] Compared with the prior art, the piezoelectric pump heat dissipation device according to the embodiment of the present invention has the following beneficial effects:

[0019] The piezoelectric pump heat dissipation device of the embodiment of the present invention can directly adhere its heat source to the heat conducting part, transfer the heat to the heat dissipation channel through the heat conductor, use the piezoelectric fluid pump to extract the heat from the heat dissipation channel, and also suck the external cold air through the air inlet to exchange heat with the gas in the heat dissipation channel, and finally discharge the heat to the outside of the device through the air outlet. This design can prevent the discharged heat from passing through the heat dissipation channel again, so that the heat exchange effect is better and the cooling effect is significant; at the same time, the piezoelectric pump heat dissipation device of the present application is separated from heat sources such as electronic equipment or integrated circuit chips, and can also ensure dust and moisture resistance inside the heat source such as electronic equipment, reducing the risk of damage to its internal components. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The axonometric view of the piezoelectric pump heat sink of the first embodiment of the present invention Figure 1 ;

[0021] Figure 2 The axonometric view of the piezoelectric pump heat sink of the first embodiment of the present invention Figure 2 ;

[0022] Figure 3 is a schematic structural diagram of a piezoelectric pump heat dissipation device according to a second embodiment of the present invention;

[0023] Figure 4 is a schematic structural diagram of a piezoelectric pump heat dissipation device according to a third embodiment of the present invention;

[0024] Figure 5 is a schematic structural diagram of a piezoelectric pump heat dissipation device according to a fourth embodiment of the present invention;

[0025] Figure 6 is a schematic structural diagram of a piezoelectric pump heat dissipation device according to a fifth embodiment of the present invention;

[0026] Figure 7 Schematic diagram of the structure of a piezoelectric pump heat dissipation device according to a sixth embodiment of the present invention.

[0027] In the figure, 1, piezoelectric fluid pump; 111, air outlet; 121, air inlet; 122, first side plate; 123, second side plate; 124, side wall;

[0028] 9, heat conductor; 90, heat dissipation channel; 901, first sub-channel; 902, second sub-channel; 900, air duct; 9001, first air duct; 9002, second air duct; 91, air inlet; 911, first sub-air duct; 912, second sub-air duct; 92, heat conduction part; 93, air outlet; 94, partition wall; 941, air inlet end; 942, first partition wall; 943, second partition wall; 95, heat conduction plate;

[0029] x, first direction; y, second direction; z, third direction. DETAILED DESCRIPTION

[0030] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0031] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In the description of the present invention, it should be understood that the terms "connected", "connected", "fixed" and the like used in the present invention should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or a welding connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] The present invention uses the terms "first", "second", etc. to describe various information, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0034] In the description of the present invention, any two of the first direction, the second direction and the third direction are perpendicular or approximately perpendicular to each other.

[0035] Reference Figure 1 and Figure 2 , a piezoelectric pump heat dissipation device according to an embodiment of the present invention comprises:

[0036] A piezoelectric fluid pump 1 and a heat conductor 9, wherein the piezoelectric fluid pump 1 has a piezoelectric drive component and an air inlet 121 and an air outlet 111 that are interconnected, the heat conductor 9 is provided with an air inlet 91 and a heat dissipation channel 90, the heat conductor 9 is connected to the piezoelectric fluid pump 1, the air inlet 91, the heat dissipation channel 90, the air inlet 121 and the air outlet 111 are sequentially connected, and the piezoelectric drive component can drive the fluid to flow from the air inlet 91 to the air outlet 111, and the outer wall of the heat conductor 9 is provided with a heat conducting portion 92 for connecting to a heat source.

[0037] The heat source is directly bonded to the heat conducting part 92, so that the heat of the heat source is transferred to the heat dissipation channel 90 through the heat conductor 9. At this time, the temperature of the area of ​​the heat dissipation channel 90 is higher, while the temperature of the area of ​​the piezoelectric fluid pump 1 is lower. A temperature difference is formed between the two areas, and the heat is transferred from the heat dissipation channel 90 to the air inlet 121 of the piezoelectric fluid pump 1. Since one end of the heat dissipation channel 90 is connected to the air inlet 91, when the heat of the heat source is transferred to the heat dissipation channel 90, the heat in the heat dissipation channel 90 can be sucked by the piezoelectric fluid pump 1, and the cold air outside the air inlet 91 is also sucked into the heat dissipation channel 90. Part of the cold air first exchanges heat with the heat in the heat dissipation channel 90, and finally part of the air that has undergone heat exchange and the air that has not undergone heat exchange are taken to the outside through the air outlet 111 of the piezoelectric fluid pump 1. Through this cold and heat exchange process, the heat transferred from the heat source to the heat dissipation channel 90 is continuously taken away by the piezoelectric fluid pump 1, thereby cooling the heat source.

[0038] The operating principle of the piezoelectric fluid pump 1 is: when a driving voltage is given to the piezoelectric element in the piezoelectric fluid pump 1, the piezoelectric element can continuously switch between expanding or squeezing the volume of the pump chamber with high-frequency vibration: when expanding the pump chamber, the outside air flows into the pump chamber from the air inlet 121 in sequence; when squeezing the pump chamber, the air entering the pump chamber is discharged through the air outlet 111, thereby driving the fluid to flow from the air inlet 121 to the air outlet 111.

[0039] The technical solution of the present application is to attach the heat source to the heat conductor 9, and the piezoelectric fluid pump 1 sucks the heat inside the heat conductor 9, and finally discharges the heat outside the device. Compared with the existing technology of blowing air directly to the heat source, the heat of the heat source is taken away, that is, the heat inside the device is discharged to the outside. The piezoelectric fluid pump heat dissipation device is separated from the heat source such as the electronic device or the integrated circuit chip, which can ensure the dust and moisture inside the heat source such as the electronic device, and reduce the risk of damage to its internal components.

[0040] Secondly, the area where the heat source is located is the hot end, and the area where the piezoelectric fluid pump 1 is located belongs to the cold end. The heat at the hot end is transferred to the heat dissipation channel 90 through the heat conductor 9, and finally the heat is sucked away by the piezoelectric fluid pump 1 at the cold end to form cooling. The sucked away heat is directly discharged to the outside of the electronic device or integrated circuit chip and will no longer flow into the inside of the electronic device or integrated circuit chip, which can further prevent the discharged heat from passing through the heat dissipation channel 90 again. The setting of the hot and cold ends can enhance the heat exchange effect, and the cooling effect is more significant.

[0041] In some embodiments of the present application, the air outlet 111 is arranged on one side of the piezoelectric fluid pump (1) in the first direction x, and the extension direction of the air inlet 121 is arranged perpendicular to the extension direction of the air outlet 111. The air inlet 121 and the air outlet 111 are arranged on both sides of the piezoelectric fluid pump 1 and are arranged relatively vertically, which can prevent the heat sucked away from flowing back into the heat dissipation device, thereby ensuring the heat dissipation effect.

[0042] In some embodiments of the present application, the piezoelectric fluid pump 1 is arranged in the heat conductor 9, and the heat conductor 9 is provided with an air outlet 93 on one side facing the air outlet 111 in the first direction x, and the air outlet 93 is connected to the air outlet 111. By directly integrating the piezoelectric fluid pump 1 into the heat conductor 9, the resistance of the fluid during transmission can be reduced, the flow efficiency of the airflow can be improved, and the heat dissipation device can be made more compact as a whole, saving internal space of the equipment, and facilitating integration and installation. The air outlet 93 is provided to ensure that the air outlet 111 can output airflow quickly and evenly. Specifically, the inner diameter of the air outlet 93 can be set to be larger than the inner diameter of the air outlet 111, and it can be coaxially arranged with the air outlet 111.

[0043] In some embodiments of the present application, the heat conductor 9 is wound around the piezoelectric fluid pump 1, and the inner wall of the heat conductor 9 and a portion of the outer wall of the piezoelectric fluid pump 1 are bounded to form the heat dissipation channel 90, so that the inner wall of the heat conductor 9 and the piezoelectric fluid pump 1 are more closely matched, which facilitates the full utilization of the heat conductor 9 and can more effectively transfer heat from the heat source to the heat dissipation channel 90.

[0044] Reference Figure 3 In some embodiments of the present application, the piezoelectric fluid pump 1 has a first side plate 122 and a second side plate 123 that are arranged opposite to each other along the second direction y, the air inlet 121 is opened on the first side plate 122, the air inlet 91 is arranged toward the second side plate 123, and the heat dissipation channel 90 is arranged around the piezoelectric fluid pump 1. By arranging the heat dissipation channel 90 around the piezoelectric fluid pump 1, the contact area between the heat source and the heat dissipation channel 90, and between the fluid and the heat dissipation channel 90 can be maximized, thereby improving the heat dissipation effect.

[0045] In scenarios where large heat dissipation is required, the heat dissipation effect of the existing piezoelectric fluid pump 1 is still insufficient and cannot meet the heat dissipation requirements of high-power electronic devices and integrated circuit chips. Figure 4 In some embodiments of the present application, a plurality of partition walls 94 are arranged in the heat dissipation channel 90, and each of the partition walls 94 is arranged in sequence to separate the heat dissipation channel 90 into a plurality of air ducts 900, and each of the air ducts 900 is connected to the air inlet 91 and the air inlet 121 respectively.

[0046] The heat dissipation channel 90 is partitioned by partition walls 94 to form a labyrinth heat dissipation channel 90. When the heat source on the heat conductor 9 transfers heat to the heat dissipation channel 90 through the air duct 900, and then transfers heat from the air duct 900 to the air inlet 121 of the piezoelectric fluid pump 1, the cold air from the outside can fully and evenly exchange heat with the heat in the air duct 900. By providing the air duct 900, the contact area and contact time between the cold air from the outside and the heat in the heat dissipation channel 90 are increased, and the heat transfer area is increased without changing the volume, so that the heat exchange is more sufficient and the heat dissipation efficiency is higher.

[0047] Reference Figure 5 In some embodiments of the present application, the partition wall 94 has an air inlet end 941 disposed near the air inlet 91, and the air inlet end 941 is disposed parallel to the axial direction of the air inlet 91, or the air inlet end 941 is disposed perpendicular to the circumference of the air inlet 91. A reasonable design of the partition wall 94 can optimize the airflow path, reduce airflow turbulence, make the heat dissipation device more efficient during operation, and reduce noise during operation, improve user experience, and have significant advantages in application scenarios with strict noise requirements.

[0048] Reference Figure 6 In some embodiments of the present application, the air outlet 111 is located on one side of the piezoelectric fluid pump 1 in the second direction y, and the piezoelectric fluid pump 1 also has two side walls 124 arranged relatively along the third direction z, and the air inlet 91 includes a first sub-air outlet 911 and a second sub-air outlet 912, and the first sub-air outlet 911 and the second sub-air outlet 912 are respectively arranged toward the two side walls 124, and the heat dissipation channel 90 includes a first sub-channel 901 and a second sub-channel 902, and the first sub-air outlet 911 is connected to the air inlet 121 through the first sub-channel 901, and the second sub-air outlet 912 is connected to the air inlet 121 through the second sub-channel 902.

[0049] The heat source is directly bonded to the heat conducting part 92 on the heat conductor 9, and the heat of the heat source is transferred to the heat dissipation channel 90 through the heat conductor 9. At this time, the temperature of the heat dissipation channel 90 is higher, and the temperature of the piezoelectric fluid pump 1 is lower. The two parts form a temperature difference, and the heat is transferred from the heat dissipation channel 90 to the air inlet 121 of the piezoelectric fluid pump 1. Since the first sub-air vent 911 of the heat dissipation channel 90 is connected to the air inlet 121 through the first sub-channel 901, and the second sub-air vent 912 is connected to the air inlet 121 through the second sub-channel 902, the heat of the heat source is transferred to the heat dissipation channel 90. When the heat channel 90 is connected, the heat of the heat dissipation channel 90 can be sucked by the piezoelectric fluid pump 1, and the cold air outside the first sub-air outlet 911 and the second sub-air outlet 912 is also sucked into the heat dissipation channel 90, and part of the cold air first exchanges heat with the heat in the heat dissipation channel 90, and finally part of the air that has undergone heat exchange and the air that has not undergone heat exchange are brought to the outside through the air outlet 111 of the piezoelectric fluid pump 1. After this exchange of hot and cold processes, the heat transferred from the heat source to the heat dissipation channel 90 is continuously taken away by the piezoelectric fluid pump 1, thereby forming a cooling of the heat source.

[0050] Reference Figure 7 In some embodiments of the present application, a plurality of first partition walls 942 are provided in the first sub-channel 901, and each of the first partition walls 942 is arranged in sequence to separate the first sub-channel 901 into a plurality of first air ducts 9001, and each of the first air ducts 9001 is respectively connected to the first sub-air port 911 and the air inlet 121; a plurality of second partition walls 943 are provided in the second sub-channel 902, and each of the second partition walls 943 is arranged in sequence to separate the second sub-channel 902 into a plurality of second air ducts 9002, and each of the second air ducts 9002 is respectively connected to the second sub-air port 912 and the air inlet 121.

[0051] By setting up multiple first air ducts 9001 and multiple second air ducts 9002, the contact area and contact time of heat with cold air in the first sub-channel 901 and the second sub-channel 902 are increased, so that the heat of the heat source can be fully exchanged inside the first air duct 9001 and the second air duct 9002, thereby greatly improving the heat dissipation efficiency, so that the heat dissipation device can maintain a good heat dissipation effect even in an environment with extremely high heat dissipation requirements.

[0052] In some embodiments of the present application, the heat conductor 9 has a heat conducting plate 95 disposed on one side of the first direction x, the heat conducting plate 95 is limited to form a part of the peripheral wall of the heat dissipation channel 90, the heat conducting portion 92 is disposed on the side of the heat conducting plate 95 away from the heat dissipation channel 90, and the heat conducting portion 92 is arranged in close contact with the heat dissipation channel 90 through the heat conducting plate 95, so as to ensure that heat can be quickly transferred from the heat conducting portion 92 to the heat dissipation channel 90, thereby significantly improving the overall heat dissipation efficiency. Specifically, the heat conducting plate 95 can be made of a material with high thermal conductivity, such as copper, aluminum or graphite.

[0053] In summary, the embodiment of the present invention provides a piezoelectric pump heat dissipation device, which has the following advantages:

[0054] 1. The heat source can be directly attached to the heat conducting part 92, and the heat is transferred to the heat dissipation channel 90 through the heat conductor 9. The piezoelectric fluid pump 1 is used to extract the heat from the heat dissipation channel 90, and the external cold air is sucked through the air inlet 91 to exchange heat with the gas in the heat dissipation channel 90, and finally the heat is discharged from the outside of the device through the air outlet 111. This design can prevent the discharged heat from passing through the heat dissipation channel 90 again, so that the heat exchange effect is better and the cooling effect is significant;

[0055] 2. The piezoelectric pump heat dissipation device of the present application is separated from heat sources such as electronic equipment or integrated circuit chips, which can ensure dust and moisture resistance inside heat sources such as electronic equipment, and reduce the risk of damage to its internal components;

[0056] 3. By arranging a plurality of air ducts 900 in the heat dissipation channel 90, the heat of the heat source can be fully exchanged inside the air duct 900, which greatly improves the heat dissipation efficiency and can still maintain a good heat dissipation effect under high heat dissipation requirements.

[0057] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A piezoelectric pump heat dissipation device, characterized in that: include: A piezoelectric fluid pump (1) and a heat conductor (9), wherein the piezoelectric fluid pump (1) comprises a piezoelectric drive component and an air inlet (121) and an air outlet (111) which are interconnected, the heat conductor (9) is provided with an air inlet (91) and a heat dissipation channel (90), the heat conductor (9) is connected to the piezoelectric fluid pump (1), the air inlet (91), the heat dissipation channel (90), the air inlet (121) and the air outlet (111) are sequentially connected, and the piezoelectric drive component can drive a fluid to flow from the air inlet (91) to the air outlet (111), and the outer wall of the heat conductor (9) is provided with a heat conducting portion (92) for connecting to a heat source.

2. The piezoelectric pump heat dissipation device according to claim 1, characterized in that: The air outlet (111) is arranged on one side of the piezoelectric fluid pump (1) in the first direction (x), and the extension direction of the air inlet (121) is arranged perpendicular to the extension direction of the air outlet (111).

3. The piezoelectric pump heat dissipation device according to claim 2, characterized in that: The piezoelectric fluid pump (1) is arranged in the heat conductor (9); the heat conductor (9) is provided with an air outlet (93) on one side facing the air outlet (111) in the first direction (x), and the air outlet (93) is connected to the air outlet (111).

4. The piezoelectric pump heat dissipation device according to claim 2, characterized in that: The heat conductor (9) is wound around the piezoelectric fluid pump (1), and the inner wall of the heat conductor (9) and a portion of the outer wall of the piezoelectric fluid pump (1) are surrounded to define the heat dissipation channel (90).

5. The piezoelectric pump heat sink device according to claim 3 or 4, characterized in that: The piezoelectric fluid pump (1) comprises a first side plate (122) and a second side plate (123) which are arranged opposite to each other along a second direction (y); the air inlet (121) is opened on the first side plate (122); the air inlet (91) is arranged toward the second side plate (123); and the heat dissipation channel (90) is arranged around the piezoelectric fluid pump (1); The second direction (y) and the first direction (x) are perpendicular to each other.

6. The piezoelectric pump heat sink device according to claim 5, characterized in that: A plurality of partition walls (94) are provided in the heat dissipation channel (90), and the partition walls (94) are arranged in sequence and at intervals to separate the heat dissipation channel (90) into a plurality of air ducts (900), and each of the air ducts (900) is connected to the air inlet (91) and the air inlet (121) respectively.

7. The piezoelectric pump heat sink device according to claim 6, characterized in that: The partition wall (94) has an air inlet end (941) arranged close to the air inlet (91), and the air inlet end (941) is arranged parallel to the axial direction of the air inlet (91), or the air inlet end (941) is arranged perpendicular to the circumference of the air inlet (91).

8. The piezoelectric pump heat sink device according to claim 3 or 4, characterized in that: The air outlet (111) is located on one side of the piezoelectric fluid pump (1) in the second direction (y); the piezoelectric fluid pump (1) further comprises two side walls (124) arranged opposite to each other in the third direction (z); the air inlet (91) comprises a first sub-air outlet (911) and a second sub-air outlet (912); the first sub-air outlet (911) and the second sub-air outlet (912) are arranged towards the two side walls (124) respectively; the heat dissipation channel (90) comprises a first sub-channel (901) and a second sub-channel (902); the first sub-air outlet (911) is connected to the air inlet (121) via the first sub-channel (901); and the second sub-air outlet (912) is connected to the air inlet (121) via the second sub-channel (902); Wherein, any two of the first direction (x), the second direction (y) and the third direction (z) are perpendicular to each other.

9. The piezoelectric pump heat sink device according to claim 8, characterized in that: A plurality of first partition walls (942) are provided in the first sub-channel (901), and the first partition walls (942) are arranged in sequence and at intervals to separate the first sub-channel (901) into a plurality of first air ducts (9001), and each of the first air ducts (9001) is connected to the first sub-air port (911) and the air inlet (121), respectively; and / or A plurality of second partition walls (943) are provided in the second sub-channel (902), and the second partition walls (943) are arranged in sequence at intervals to separate the second sub-channel (902) into a plurality of second air ducts (9002), and each of the second air ducts (9002) is connected to the second sub-air port (912) and the air inlet (121), respectively.

10. The piezoelectric pump heat sink according to any one of claims 2 to 4, characterized in that: The heat conductor (9) has a heat conducting plate (95) arranged on one side of the first direction (x), the heat conducting plate (95) being limited to form a part of the peripheral wall of the heat dissipation channel (90), the heat conducting portion (92) being arranged on a side of the heat conducting plate (95) away from the heat dissipation channel (90), and the heat conducting portion (92) being arranged in contact with the heat dissipation channel (90) via the heat conducting plate (95).

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