Test device

Abstract

Signal transmission and reception between a device under test and a semiconductor test apparatus are accelerated. The test device includes: a driver electrically connected to a subject to be tested and providing a test signal to the subject to be tested; a comparator electrically connected to the subject to be tested and comparing a response signal from the subject to be tested with a predetermined threshold value; a test signal imparting unit for imparting a test signal to the driver; and a test signal receiving unit that receives the output of the comparator. The driver is disposed at a position closer to the test signal application unit when viewed from the subject, the comparator is disposed at a position closer to the test signal reception unit when viewed from the subject, and the bandwidth of communication between the driver and the test signal application unit is wider than the bandwidth of communication between the driver and the subject. The bandwidth of the communication between the comparator and the test signal receiving unit is wider than the bandwidth of the communication between the comparator and the test object.

Description

Technical Field

[0001] The present invention relates to transmission and reception of signals between a device under test and a semiconductor test apparatus. Background Art

[0002] The device under test and the semiconductor test apparatus are connected via a transmission path for transmitting electrical signals. In particular, when high-speed signals are transmitted and received between the device under test and the semiconductor test apparatus, the transmission bandwidth of the transmission path needs to be designed to be wide.

[0003] Furthermore, there is known a technique for performing optical transmission between a semiconductor testing apparatus and a device under test (for example, refer to Patent Documents 1 to 3).

[0004] Prior art literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-181251

[0006] Patent Document 2: Japanese Patent Application Publication No. 2009-128358

[0007] Patent Document 3: Japanese Patent Application Publication No. 2008-116420 Summary of the invention

[0008] Problems to be solved by the invention

[0009] However, in the above-mentioned prior art, in the high-speed signal connection path between the device under test and the semiconductor test equipment, the transmission line on the printed circuit board, the connector and the cable are used for electrical signal transmission. Generally speaking, in the mechanical structure of the semiconductor test equipment, the physical length of the transmission path is often tens of centimeters to 1 meter or more, so the frequency band is limited by the transmission path, making it difficult to send and receive high-speed signals.

[0010] Therefore, an object of the present invention is to increase the speed of signal transmission and reception between a device under test and a semiconductor test apparatus.

[0011] Means for solving problems

[0012] The first test device of the present invention is constructed as follows: a driver, which is electrically connected to a test object and provides a test signal to the test object; a test signal imparting unit, which provides the test signal to the driver, and when observed from the test object, the driver is arranged at a position closer to the test signal imparting unit, and the bandwidth of communication between the driver and the test signal imparting unit is wider than the bandwidth of communication between the driver and the test object.

[0013] According to the first test device of the present invention, the driver is electrically connected to the test object and provides a test signal to the test object. The test signal providing unit provides the test signal to the driver. The driver is arranged at a position closer to the test signal providing unit as viewed from the test object. The bandwidth of communication between the driver and the test signal providing unit is wider than the bandwidth of communication between the driver and the test object.

[0014] Furthermore, in the first test device of the present invention, the driver and the test signal providing section may perform optical transmission.

[0015] Furthermore, in the first test device of the present invention, the driver and the test signal applying section may be connected via an optical transmission path.

[0016] Furthermore, in the first test device of the present invention, the driver may perform wireless communication with the test signal providing unit.

[0017] Furthermore, the first test device of the present invention may include a switch for switching whether the test object and the driver are connected, wherein the switch is arranged closer to the test signal applying unit as viewed from the test object.

[0018] Furthermore, in the first test device of the present invention, the switch may connect the test object and a DC measuring unit for performing a DC test on the test object.

[0019] In addition, the first test device of the present invention may also include: a receiver, which receives an output signal from the test object and performs an output based on the output signal, wherein the driver is configured at a position closer to the receiver as viewed from the test object, and a bandwidth for communication between the receiver and the test object is wider than a bandwidth for communication between the driver and the test object.

[0020] Furthermore, in the first test device of the present invention, the test object and the driver may be arranged on the same substrate.

[0021] Furthermore, in the first test device of the present invention, the test object and the driver may be arranged on different substrates.

[0022] Furthermore, in the first test apparatus of the present invention, the substrate on which the test object is arranged may be arranged above the substrate on which the driver is arranged.

[0023] The second test device of the present invention is constructed as follows: a receiver, which is electrically connected to the test object, receives an output signal from the test object, and performs an output based on the output signal; a test signal receiving unit, which receives the output of the receiver, and when observed from the test object, the receiver is configured at a position closer to the test signal receiving unit, and the bandwidth of communication between the receiver and the test signal receiving unit is wider than the bandwidth of communication between the receiver and the test object.

[0024] According to the second test device of the present invention, the receiver is electrically connected to the test object, receives an output signal from the test object, and performs an output based on the output signal. The test signal receiving unit receives the output of the receiver. From the test object, the receiver is arranged at a position closer than the test signal receiving unit. The bandwidth of the communication between the receiver and the test signal receiving unit is wider than the bandwidth of the communication between the receiver and the test object.

[0025] Furthermore, in the second test device of the present invention, the receiver and the test signal receiving unit may perform optical transmission.

[0026] Furthermore, in the second test device of the present invention, the receiver and the test signal receiving unit may be connected via an optical transmission path.

[0027] Furthermore, in the second test device of the present invention, the receiver may perform wireless communication with the test signal receiving unit.

[0028] Furthermore, the second test device of the present invention may include a switch for switching whether the test object is connected to the receiver, wherein the switch is arranged closer to the test signal receiving unit as viewed from the test object.

[0029] Furthermore, in the second test device of the present invention, the switch may connect the test object and a DC measurement unit for performing a DC test on the test object.

[0030] In addition, the second test device of the present invention may also include: a driver, which provides a test signal to the test object, the receiver is configured at a position closer to the driver as observed from the test object, and the bandwidth of communication between the driver and the test object is wider than the bandwidth of communication between the receiver and the test object.

[0031] Furthermore, in the second test device of the present invention, the test object and the receiver may be arranged on the same substrate.

[0032] Furthermore, in the second test device of the present invention, the test object and the receiver may be arranged on different substrates.

[0033] Furthermore, in the second test apparatus of the present invention, the substrate on which the test object is arranged may be arranged above the substrate on which the receptor is arranged.

[0034] The third test device of the present invention is configured to include: a driver, which is electrically connected to a test object and provides a test signal to the test object; a receiver, which is electrically connected to the test object, receives an output signal from the test object, and performs an output based on the output signal; a test signal imparting unit, which provides the test signal to the driver; and a test signal receiving unit, which receives the output of the receiver, wherein the driver is configured at a position closer to the test signal imparting unit than the test signal imparting unit when viewed from the test object, and the receiver is configured at a position closer to the test signal receiving unit when viewed from the test object, a bandwidth of communication between the driver and the test signal imparting unit is wider than a bandwidth of communication between the driver and the test object, and a bandwidth of communication between the receiver and the test signal receiving unit is wider than a bandwidth of communication between the receiver and the test object.

[0035] According to the third test device of the present invention, the driver is electrically connected to the test object and provides a test signal to the test object. The receiver is electrically connected to the test object, receives an output signal from the test object, and performs an output based on the output signal. The test signal imparting unit provides the test signal to the driver. The test signal receiving unit receives the output of the receiver. As viewed from the test object, the driver is configured at a position closer to the test signal imparting unit. As viewed from the test object, the receiver is configured at a position closer to the test signal receiving unit. The bandwidth of communication between the driver and the test signal imparting unit is wider than the bandwidth of communication between the driver and the test object. The bandwidth of communication between the receiver and the test signal receiving unit is wider than the bandwidth of communication between the receiver and the test object.

[0036] Furthermore, the third test device of the present invention may include: a switch that connects the driver or the receiver to the test object.

[0037] Furthermore, in the first and third test devices of the present invention, the test signal providing section may include: a pattern generator that generates a pattern of the test signal; and a timing generator that generates an output timing of the test signal.

[0038] In addition, the second and third test devices of the present invention may also be that the test signal receiving unit comprises: an expected value pattern generating unit, which generates an expected value pattern; an expected value comparison timing generating unit, whose output provides a timing signal for comparing the expected value pattern; and an expected value comparison unit, which compares the output signal from the receiver with the expected value pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a functional block diagram showing the structure of the test apparatus 1 according to the embodiment of the present invention.

[0040] Figure 2 This is a functional block diagram showing the configuration of a test apparatus 1 according to a first modified example of the embodiment of the present invention.

[0041] Figure 3 It is a functional block diagram showing the configuration of a test apparatus 1 according to a second modified example of the embodiment of the present invention.

[0042] Figure 4 : is a functional block diagram showing the structure of the test signal applying unit 12 .

[0043] Figure 5 It is a functional block diagram showing the configuration of a test apparatus 1 according to a fifth modified example of the embodiment of the present invention.

[0044] Figure 6 This is a diagram showing an example of a connection form between the socket board 6 and the sub-board 7 in the test device 1 according to the fifth modified example of the embodiment of the present invention.

[0045] Figure 7 It is a functional block diagram showing the configuration of a test apparatus 1 (wherein a DC measuring unit 8 is connected to a test object 2 ) according to a fourth modified example of the embodiment of the present invention.

[0046] Figure 8 This is a functional block diagram showing the configuration of a test apparatus 1 (wherein a driver 22 and a comparator 24 are connected to a test object 2 ) according to a fourth modified example of the embodiment of the present invention.

[0047] Fig. 9 : is a functional block diagram showing the structure of the test signal receiving unit 14 .

[0048] Fig.10 It is a functional block diagram showing the configuration of a test apparatus 1 (wherein a driver 22 is connected to a test object 2) according to a third modified example of the embodiment of the present invention.

[0049] Fig.11 It is a functional block diagram showing the configuration of a test apparatus 1 (wherein a comparator 24 is connected to a test object 2 ) according to a third modified example of the embodiment of the present invention. DETAILED DESCRIPTION

[0050] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0051] Figure 1 The functional block diagram shows the structure of the test device 1 according to the embodiment of the present invention. The test device 1 according to the embodiment of the present invention includes a test head 10 , a driver 22 , a comparator 24 , an optical transmission path 30 , an O / E conversion element 42 , and an E / O conversion element 44 .

[0052] The test device 1 is connected to a test object (DUT: Device Under Test) 2. In addition, the test head 10 has: a test signal giving unit 12, a test signal receiving unit 14, an E / O conversion element 13, and an O / E conversion element 15. In addition, the test object 2, a driver (Dr: Driver) 22, a comparator (Cp: Comparator) 24, an O / E conversion element 42, and an E / O conversion element 44 are arranged on a socket board 6. And, the driver 22 and the comparator 24 are collectively referred to as pin electronics 20. In addition, it is preferred to install the driver 22, the comparator 24, the O / E conversion element 42, and the E / O conversion element 44 by SiP (System in Package), but it is also possible to install them by SoC (System on Chip) using Si photonics' process.

[0053] The driver 22 is electrically connected to the test object 2 and provides a test signal to the test object 2. The comparator 24 is electrically connected to the test object 2 and receives an output signal from the test object 2 (i.e., a signal output by the test object 2 to the semiconductor test device) or compares it with a specified threshold. The driver 22 can also provide a binary signal of 0 or 1, or a multi-value signal of three or more values ​​of 0, 1, 2, ... as a test signal. The comparator 24 receives a binary signal of 0 or 1, or a multi-value signal of three or more values ​​of 0, 1, 2, ..., for the output signal, or compares it with a specified multi-value threshold.

[0054] The test signal providing unit 12 provides the test signal to the driver 22 via the E / O conversion element 13, the optical transmission path 30, and the O / E conversion element 42. That is, if the test signal providing unit 12 outputs the test signal (which is an electrical signal), the test signal is converted from an electrical signal to an optical signal by the E / O conversion element 13. Then, the output of the E / O conversion element 13 is provided to the O / E conversion element 42 via the optical transmission path 30. Thus, the test signal is converted from an optical signal to an electrical signal by the O / E conversion element 42 and provided to the driver 22.

[0055] The test signal receiving unit 14 receives the output of the comparator 24 via the E / O conversion element 44, the optical transmission path 30, and the O / E conversion element 15. That is, the output of the comparator 24 (which is an electrical signal) is converted into an optical signal by the E / O conversion element 44. Then, the output of the E / O conversion element 44 is provided to the O / E conversion element 15 via the optical transmission path 30. Then, the output of the comparator 24 is converted from an optical signal to an electrical signal by the O / E conversion element 15, and provided to the test signal receiving unit 14.

[0056] The driver 22 is arranged at a position closer to the test signal applying section 12 as viewed from the test object 2. The comparator 24 is arranged at a position closer to the test signal receiving section 14 as viewed from the test object 2.

[0057] As an example, the distance between the test object 2 and the pin electronics 20 is about 1 cm, and the length of the optical transmission path 30 , such as an optical fiber, is about 1 m or longer, but these distances and lengths are not limited to the above values.

[0058] The bandwidth of the communication between the driver 22 and the test signal applying section 12 is wider than the bandwidth of the communication between the driver 22 and the test object 2. That is, the driver 22 and the test signal applying section 12 are connected by the optical transmission path 30 via the E / O conversion element 13 and the O / E conversion element 42. The driver 22 and the test signal applying section 12 perform optical transmission via the optical transmission path 30 via the E / O conversion element 13 and the O / E conversion element 42. The bandwidth of the optical transmission based on the optical transmission path 30 is the bandwidth of the communication between the driver 22 and the test signal applying section 12, and is wider than the bandwidth of the communication (based on the electrical connection) between the driver 22 and the test object 2. In addition, the test signal applying section 12 and the E / O conversion element 13 are extremely close, and the driver 22 and the O / E conversion element 42 are also extremely close, so the presence of the E / O conversion element 13 and the O / E conversion element 42 does not limit the frequency band of the communication between the driver 22 and the test signal applying section 12.

[0059] In addition, it is also possible to wirelessly communicate between the driver 22 and the test signal providing unit 12. In this case, the E / O conversion element 13, the O / E conversion element 42, and the optical transmission path 30 are not required. However, the premise is that the bandwidth of the communication between the driver 22 and the test signal providing unit 12 is wider than the bandwidth of the communication between the driver 22 and the test object 2.

[0060] The bandwidth of the communication between the comparator 24 and the test signal receiving unit 14 is wider than the bandwidth of the communication between the comparator 24 and the test object 2. That is, the comparator 24 and the test signal receiving unit 14 are connected by the optical transmission path 30 via the E / O conversion element 44 and the O / E conversion element 15. The comparator 24 and the test signal receiving unit 14 perform optical transmission via the optical transmission path 30 via the E / O conversion element 44 and the O / E conversion element 15. The bandwidth of the optical transmission based on the optical transmission path 30 is the bandwidth of the communication between the comparator 24 and the test signal receiving unit 14, and is wider than the bandwidth of the communication (based on the electrical connection) between the comparator 24 and the test object 2. In addition, the test signal receiving unit 14 and the O / E conversion element 15 are extremely close, and the comparator 24 and the E / O conversion element 44 are also extremely close, so the presence of the E / O conversion element 44 and the O / E conversion element 15 does not limit the frequency band of the communication between the comparator 24 and the test signal receiving unit 14.

[0061] In addition, it is also possible to wirelessly communicate between the comparator 24 and the test signal receiving unit 14. In this case, the E / O conversion element 44, the O / E conversion element 15, and the optical transmission path 30 are not required. However, the premise is that the bandwidth of the communication between the comparator 24 and the test signal receiving unit 14 is wider than the bandwidth of the communication between the comparator 24 and the test object 2.

[0062] Figure 4 2 is a functional block diagram showing the configuration of the test signal applying section 12. The test signal applying section 12 includes a pattern generator 122, a timing generator 124, and a pulse output section 126.

[0063] The pattern generator 122 generates a pattern of a test signal. The pattern of the test signal is, for example, a sequence of binary data of 0 or 1 such as 01001... (may also be a sequence of data of three or more values).

[0064] The timing generator 124 generates the output timing of the test signal (eg, the output start time and period of the test signal).

[0065] The pulse output unit 126 outputs a pulse according to the outputs of the pattern generator 122 and the timing generator 124 as a test signal.

[0066] Fig. 9 2 is a functional block diagram showing the structure of the test signal receiving unit 14. The test signal receiving unit 14 includes an expected value pattern generating unit 142, an expected value comparison timing generating unit 144, and an expected value comparing unit 146.

[0067] The expected value pattern generation unit 142 generates an expected value pattern used in the expected value comparison unit 146 .

[0068] The expected value comparison timing generating unit 144 outputs a timing signal for providing a timing for comparing the expected value pattern. The expected value comparison timing generating unit 144 latches the output signal from the comparator 24 provided to the test signal receiving unit 14 via the E / O conversion element 44, the optical transmission path 30, and the O / E conversion element 15.

[0069] The expected value comparison unit 146 compares the logical value of the signal output from the comparator 24 supplied to the test signal receiving unit 14 via the E / O conversion element 44, the optical transmission path 30 and the O / E conversion element 15 with the expected value pattern, and outputs the comparison result.

[0070] In addition, the test object 2 is often intentionally placed in a high or low temperature environment during the test. Therefore, if the test signal imparting unit 12 and the test signal receiving unit 14 (especially the timing generator 124) are arranged near the test object 2, the test signal imparting unit 12 and the test signal receiving unit 14 are affected by the high or low temperature and cannot maintain the desired accuracy.

[0071] Furthermore, since the circuit scale and power consumption of the test signal applying section 12 and the test signal receiving section 14 are large, it is difficult to ensure space near the test object 2 in terms of power supply and cooling structures.

[0072] Next, the operation of the embodiment of the present invention will be described.

[0073] First, when the test signal imparting unit 12 outputs a test signal (an electrical signal), the test signal is converted from an electrical signal to an optical signal by the E / O conversion element 13. Next, the output of the E / O conversion element 13 is transmitted via the optical transmission path 30 of a relatively wide communication frequency band and provided to the O / E conversion element 42. Thus, the test signal is converted from an optical signal to an electrical signal by the O / E conversion element 42 and provided to the driver 22.

[0074] Then, the driver 22 provides the test signal to the test object 2. On the other hand, the test signal is output from the test object 2 and provided to the comparator 24. The comparator 24 temporarily receives the test signal and outputs it to the test signal receiving unit that performs a logic judgment on the test signal. The comparator 24 compares it with a predetermined threshold value (level threshold value) and outputs a result according to the logic of the comparison result.

[0075] The output of the comparator 24 (which is an electrical signal) is converted into an optical signal by the E / O conversion element 44. Then, the output of the E / O conversion element 44 is provided to the O / E conversion element 15 via the optical transmission path 30 of a relatively wide communication frequency band. Thus, the output of the comparator 24 is converted from an optical signal to an electrical signal by the O / E conversion element 15 and provided to the signal receiving unit 14 under test.

[0076] The test signal receiving unit 14 receives the output of the comparator 24 and compares it with the pattern of the test signal to perform a test (for example, a functional test) on the test object 2 .

[0077] According to the test device 1 of the embodiment of the present invention, it is possible to increase the speed of transmission and reception of signals between the test object 2 and the test device 1 .

[0078] That is, since the pin electronics 20 is close to the test object 2 , the transmission and reception of signals between the pin electronics 20 and the test object 2 can be performed at a high speed.

[0079] However, as described above, it is difficult to arrange the test signal providing unit 12 and the test signal receiving unit 14 near the test object 2, so they have to be arranged far away. However, by connecting the test signal providing unit 12 and the test signal receiving unit 14 to the pin electronics 20 through the optical transmission path 30 with a wide communication frequency band to perform optical transmission, it is possible to transmit and receive signals at a high speed.

[0080] Furthermore, since the pin electronics 20 are close to the test object 2 , the power of waveform equalization for compensating for distortion in the transmission path of the high-speed electric signal can be significantly reduced, and the power of the entire test device 1 can be reduced.

[0081] Furthermore, by using the optical transmission path 30 , the transmission distance of electrical transmission (transmission of signals between the pin electronics 20 and the test object 2 ) can be shortened, and thus inter-symbol interference due to waveform distortion occurring in the electrical transmission path can be suppressed.

[0082] In addition, instead of comparator 24, a structure that compares the output signal from the test object 2 with a specified threshold value (for example, a circuit that uses a differential amplifier, an operational amplifier, a logic gate, a photocoupler, or a relay to perform a comparison operation) (hereinafter referred to as a "comparison circuit") may be used.

[0083] In addition, a repeater that receives a signal and linearly amplifies and repeats it may be used instead of the comparator 24. However, the output of the repeater is compared with a predetermined threshold value before being supplied to the expected value comparison unit 146, and the result is supplied to the expected value comparison unit 146.

[0084] Furthermore, the comparator 24 and the comparator circuit and the repeater used instead thereof can be said to be receivers that receive the output signal from the test object 2 and perform output based on the output signal.

[0085] In addition, in the embodiment of the present invention, the following modified examples are conceivable.

[0086] First Modification

[0087] The first modified example is an example corresponding to the case where the response signal output by the test object 2 is an optical signal.

[0088] Figure 2 This is a functional block diagram showing the configuration of a test apparatus 1 according to a first modified example of the embodiment of the present invention.

[0089] The comparator 24 is disposed in the test head 10. Therefore, the driver 22 is disposed closer to the comparator 24 as viewed from the test object 2. The comparator 24 receives the output of the O / E conversion element 15, and the output of the comparator 24 is provided to the test signal receiving unit 14.

[0090] In addition, the bandwidth of the communication between the comparator 24 and the test object 2 is wider than the bandwidth of the communication between the driver 22 and the test object 2. That is, the comparator 24 and the test object 2 are connected via the optical transmission path 30. The bandwidth of the optical transmission based on the optical transmission path 30 is the bandwidth of the communication between the comparator 24 and the test object 2, and is wider than the bandwidth of the communication (based on the electrical connection) between the driver 22 and the test object 2.

[0091] Second Modification

[0092] The second modification example is an example corresponding to the case where the test signal provided to the test object 2 is an optical signal.

[0093] Figure 3 It is a functional block diagram showing the configuration of a test apparatus 1 according to a second modified example of the embodiment of the present invention.

[0094] The driver 22 is disposed in the test head 10 . Therefore, the comparator 24 is disposed closer to the driver 22 as viewed from the test object 2 . The driver 22 receives the output of the test signal applying section 12 , and supplies the output of the driver 22 to the E / O conversion element 13 .

[0095] In addition, the bandwidth of communication between the driver 22 and the test object 2 is wider than the bandwidth of communication between the comparator 24 and the test object 2. That is, the driver 22 and the test object 2 are connected via the optical transmission path 30. The bandwidth of optical transmission based on the optical transmission path 30 is the bandwidth of communication between the driver 22 and the test object 2, and is wider than the bandwidth of communication (based on electrical connection) between the comparator 24 and the test object 2.

[0096] Third Comparative Example

[0097] Regarding the third modification, when the pin electronics 20 has both the driver and comparator functions, the connection between the pin electronics 20 and the test object 2 is common for input and output.

[0098] Fig.10It is a functional block diagram showing the configuration of a test apparatus 1 (wherein a driver 22 is connected to a test object 2) according to a third modified example of the embodiment of the present invention. Fig.11 It is a functional block diagram showing the configuration of a test apparatus 1 (wherein a comparator 24 is connected to a test object 2 ) according to a third modified example of the embodiment of the present invention.

[0099] The pin electronics 20 further includes a switch, through which the driver 22 is connected to the test object 2 (for example, the input and output pins of the test object 2) (see Fig.10 ), or the comparator 24 is connected to the test object 2 (for example, the input and output pins of the test object 2) to switch (refer to Fig.11 ).

[0100] Fourth Modification

[0101] The test device 1 according to the fourth modified example further includes a switch 50 .

[0102] Figure 7 It is a functional block diagram showing the configuration of a test apparatus 1 (wherein a DC measuring unit 8 is connected to a test object 2 ) according to a fourth modified example of the embodiment of the present invention. Figure 8 This is a functional block diagram showing the configuration of a test apparatus 1 (wherein a driver 22 and a comparator 24 are connected to a test object 2 ) according to a fourth modified example of the embodiment of the present invention.

[0103] The switch 50 connects the DC measuring unit 8 to the test object 2 (reference Figure 7 ) or connect the driver 22 and the comparator 24 to the test object 2 (reference Figure 8 ) is connected and switched. The DC measuring unit 8 is a circuit used for DC testing.

[0104] Fifth Modification

[0105] The test device 1 of the fifth modified example further includes an auxiliary plate 7 .

[0106] Figure 5 1 is a functional block diagram showing the structure of a test device 1 according to a fifth modification of the embodiment of the present invention. In the test device 1 according to the fifth modification, a driver 22, a comparator 24, an O / E conversion element 42, and an E / O conversion element 44 are mounted on an auxiliary board 7 different from the socket board 6. The auxiliary board 7 is connected to the socket board 6 at a very close distance. Thus, in the fifth modification, the auxiliary board 7 on which the driver 22 and the comparator 24 are arranged is different from the socket board 6 on which the test object 2 is arranged. This is different from the embodiment of the present invention in which the driver 22, the comparator 24, and the test object 2 are all arranged on the same socket board 6.

[0107] Figure 61 is a diagram showing an example of a connection method of the socket board 6 and the auxiliary board 7 in the test device 1 of the fifth modified example of the embodiment of the present invention. The connector 6c of the socket board 6 is directly connected to the connector 7c of the auxiliary board 7. In addition, the auxiliary board 7 is arranged below the socket board 6. In addition, the E / O conversion element 44 has a connector 44op for optical transmission (connected to the optical transmission path 30). In this way, in the fifth modified example, the socket board 6 on which the test object 2 is arranged is arranged above the auxiliary board 7 on which the driver 22 and the comparator 24 are arranged.

[0108] Description of Reference Numerals

[0109] 1. Test equipment

[0110] 2DUT: Device Under Test

[0111] 6 Socket Strip

[0112] 10 Test Head

[0113] 12 Test signal giving unit

[0114] 13E / O conversion element

[0115] 14 Test signal receiving unit

[0116] 15O / E conversion element

[0117] 20-pin electronics

[0118] 22 Driver (Dr)

[0119] 24 Comparator (Cp)

[0120] 30 optical transmission paths

[0121] 42O / E conversion element

[0122] 44E / O conversion element

[0123] 50 switches.

Claims

1. A test device, characterized in that: have: A driver, which is electrically connected to the test object and provides a test signal to the test object; a test signal providing unit that provides the test signal to the driver, When viewed from the test object, the driver is arranged at a position closer to the test signal imparting unit. A bandwidth of communication between the driver and the test signal applying unit is wider than a bandwidth of communication between the driver and the test object.

2. The test device according to claim 1, characterized in that: The driver performs optical communication with the test signal providing unit.

3. The test device according to claim 2, characterized in that: The driver and the test signal applying section are connected via an optical transmission path.

4. The test device according to claim 1, characterized in that: The driver performs wireless communication with the test signal providing unit.

5. The test device according to claim 1, characterized in that: The test device comprises: a switch for switching whether the test object is connected to the driver; The switch is arranged at a position closer to the test signal applying section as viewed from the test object.

6. The test device according to claim 5, characterized in that: The switch connects the test object and a DC measuring unit for performing a DC test on the test object.

7. The test device according to claim 1, characterized in that: The test device comprises: a receiver for receiving an output signal from the test object and performing an output based on the output signal; The driver is arranged at a position closer to the receiver than the receiver when viewed from the test object. The receiver communicates with the object under test at a bandwidth wider than the driver communicates with the object under test.

8. The test device according to claim 1, characterized in that: The test object and the driver are arranged on the same substrate.

9. The test device according to claim 1, characterized in that: The test object and the driver are arranged on different substrates.

10. The test device according to claim 9, characterized in that The substrate on which the test object is arranged is arranged above the substrate on which the driver is arranged.

11. A test device, characterized in that: have: A receiver electrically connected to the test object, receiving an output signal from the test object and performing an output based on the output signal; a test signal receiving unit, which receives the output of the receiver, When viewed from the test object, the receiver is arranged at a position closer to the test signal receiving unit. A bandwidth of communication between the receiver and the test signal receiving unit is wider than a bandwidth of communication between the receiver and the test object.

12. The test device according to claim 11, characterized in that The receiver and the test signal receiving unit perform optical transmission.

13. The test device according to claim 12, characterized in that The receiver is connected to the test signal receiving unit via an optical transmission path.

14. The test device according to claim 11, characterized in that The receiver performs wireless communication with the test signal receiving unit.

15. The test device according to claim 11, characterized in that: The test device comprises: a switch for switching whether the test object is connected to the receiver; The switch is arranged at a position closer to the test signal receiving unit when viewed from the test object.

16. The test device according to claim 15, characterized in that The switch connects the test object and a DC measuring unit for performing a DC test on the test object.

17. The test device according to claim 11, characterized in that The test device comprises: a driver, which provides a test signal to the test object; The receiver is arranged at a position closer to the driver than the driver when viewed from the test object. The driver communicates with the object under test at a bandwidth wider than the receiver communicates with the object under test.

18. The test device according to claim 11, characterized in that The test object and the receiver are arranged on the same substrate.

19. The test device according to claim 11, characterized in that: The test object and the receiver are arranged on different substrates.

20. The test device according to claim 19, characterized in that The substrate on which the test object is arranged is arranged above the substrate on which the receiver is arranged.

21. A test device, characterized in that: have: A driver, which is electrically connected to the test object and provides a test signal to the test object; A receiver, which is electrically connected to the test object, receives an output signal from the test object, and performs output based on the output signal; a test signal providing unit which provides the test signal to the driver; a test signal receiving unit, which receives the output of the receiver, When viewed from the test object, the driver is arranged at a position closer to the test signal imparting unit. When viewed from the test object, the receiver is arranged at a position closer to the test signal receiving unit. The bandwidth of communication between the driver and the test signal providing unit is wider than the bandwidth of communication between the driver and the test object. A bandwidth of communication between the receiver and the test signal receiving unit is wider than a bandwidth of communication between the receiver and the test object.

22. The test device according to claim 21, characterized in that The test device includes a switch for connecting the driver or the receiver to the test object.

23. The test device according to any one of claims 1 to 10, 21 and 22, characterized in that: The test signal imparting unit comprises: a pattern generator that generates a pattern of the test signal; A timing generator generates an output timing of the test signal.

24. The test device according to any one of claims 11 to 22, characterized in that: The tested signal receiving unit comprises: an expected value pattern generating unit, which generates an expected value pattern; an expected value comparison timing generating section, the output of which provides a timing signal for comparing the expected value pattern; An expected value comparison section compares an output signal from the receiver with the expected value pattern.

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