Automatic splitting and particle-removing device

Abstract

The invention discloses an automatic splitting and grain disassembling device which comprises a grain disassembling connecting base and a grain disassembling swing block installed in the grain disassembling connecting base through a swing shaft, a swing base plate is connected to the lower portion of the grain disassembling swing block, and a grain disassembling movable block is arranged on the swing base plate. A grain disassembling reset spring is arranged between the grain disassembling movable block and the grain disassembling connecting seat, and the movable pressing block and the grain disassembling swing block are combined or separated through a push block air cylinder; a ceramic substrate enters the limiting and pressing groove from the conveying device and reaches the grain disassembling station groove, the ceramic substrate is fixed to the limiting and pressing groove through a grain disassembling and pressing swing arm, the swing base plate is hit by a swing air cylinder and drives the grain disassembling swing block to swing downwards, and the ceramic substrate cracks along a scratch part to form a resistor disc. The wafer splitting device has the advantages that the wafer splitting swing block is matched with the wafer splitting connecting seat, wafer splitting is performed in a breaking manner, the structure is compact, the action range is small, the defect of large occupied space of double-roller wafer splitting is overcome, and meanwhile, the defect that ceramic substrates are easily broken due to wafer splitting in a punching manner is overcome.

Description

Technical Field

[0001] The invention relates to the technical field of resistor production and manufacturing, and in particular to an automatic chip splitting and particle disassembling device. Background Art

[0002] Chip resistors, also known as surface mount resistors, are a new generation of leadless or short-lead microelectronic components suitable for surface mount technology (SMT). The soldering surfaces of the lead-out ends are on the same plane. There are many types of chip resistors, such as thick film chip resistors, thin film chip resistors, metal plate chip resistors, etc. Chip resistors have many functions in circuits, such as voltage division, current shunting, impedance matching and filtering. Generally, the structure of a chip resistor includes a substrate, a resistor film, a protective film, and an electrode. The substrate material of a chip resistor is generally 96% alumina ceramic. This ceramic not only has good electrical insulation, but also has excellent thermal conductivity and high-temperature mechanical strength. The resistor film, protective film, and electrode are usually printed and sintered on the substrate, and then the substrate is split to form a resistor chip, and then the resistor chip is further welded with pins or packaged to form a chip resistor. Therefore, the splitting of the substrate is one of the key processes.

[0003] Existing chip splitting machines usually use double rollers to extrude the chips, but the larger the size of the resistor, the larger the roller diameter is required, which takes up a lot of table space and makes it difficult to arrange and install other mechanisms. In addition, since the substrate is made of a hard and brittle material such as ceramic, chipping by punching is prone to cracking and incomplete cross-sections. The chip splitting method of manual clamping followed by semi-automatic breaking and knocking has low production efficiency, and the scattered resistor chips are not conducive to the positioning and transfer of subsequent processes. Summary of the invention

[0004] The invention provides an automatic chip splitting and particle disassembling device, which can automatically chip and particle disassemble a substrate on which a resistor film, a protective film and an electrode are formed, and can accurately position the substrate, thereby achieving high production efficiency.

[0005] In order to solve the above technical problems, the technical solution of the present invention is as follows: The granulating device is characterized in that: first, a granulating device is provided with a granulating connection seat, and second, a granulating swing block is installed in the granulating connection seat through a swing shaft, and a swing seat plate is connected to the lower part of the granulating swing block, and a granulating movable block is arranged on the swing seat plate; a limited pressing groove is arranged on the granulating connection seat, and a granulating work station groove corresponding to the granulating work station groove is arranged on the granulating swing block, and a movable pressing block is arranged on the granulating movable block corresponding to the granulating work station groove; a granulating reset spring is arranged between the granulating movable block and the granulating connection seat, and the movable pressing block is combined with or separated from the granulating work station groove by a pushing cylinder; a ceramic substrate enters the limited pressing groove from a conveying device and reaches the granulating work station groove, and is fixed in the limited pressing groove by a granulating pressing swing arm, and the swing seat plate is struck by a swing cylinder and drives the granulating swing block to swing downward, and the ceramic substrate is cracked along the scratch portion to form a resistor.

[0006] Specifically, the limiting and clamping groove is arranged on the upper side of the grain stripping connecting seat, grain stripping limiting blocks are arranged on both sides of the limiting and clamping groove, a swing installation station groove is arranged below the limiting and clamping groove, and the grain stripping swing block is installed in the swing installation station groove through the swing shaft.

[0007] Specifically, along the conveying direction of the ceramic substrate, one side of the pelletizing station slot of the pelletizing swing block corresponds to the limiting pressing slot, and the other side is provided with a pelletizing stopper, and a chip removal slot is formed between the pelletizing stoppers. The chip removal slot is located at the front end of the ceramic substrate, and along with the conveying action, the debris generated by the pelletizing falls from the chip removal slot into the bottom of the device.

[0008] Furthermore, a movable mounting groove is provided between the grain-demolition swing block and the swing seat plate, the spring accommodating movable part of the grain-demolition movable block cooperates with the movable mounting groove, and a grain-demolition reset spring station is provided in the spring accommodating movable part for installing the grain-demolition reset spring.

[0009] Furthermore, the pushing block cylinder is set at the rear end of the swing seat plate through a pushing block cylinder mounting block, and the pushing block cylinder extends to push the grain-splitting movable block to combine with the grain-splitting swing block. After the pushing block cylinder contracts, the grain-splitting return spring separates the grain-splitting movable block from the grain-splitting swing block.

[0010] Specifically, the particle demolition movable block is provided with a particle demolition positioning platform portion corresponding to the particle demolition work station groove, and the movable pressing block is arranged on the upper part of the particle demolition positioning platform portion. When the particle demolition movable block is combined with the particle demolition swing block, the movable pressing block limits the front end of the ceramic substrate between the particle demolition work station groove and the particle demolition positioning platform portion.

[0011] Optionally, the pelletizing positioning platform is respectively provided with pelletizing position sensors corresponding to the pelletizing station slots.

[0012] Furthermore, along the conveying direction of the ceramic substrate, an extension portion is provided between the particle demolition station groove and the side of the particle demolition stop block. When the particle demolition movable block is combined with the particle demolition swing block, the movable pressure block restricts the front end of the ceramic substrate between the particle demolition station groove and the particle demolition positioning platform, and a gap is formed between the front end of the ceramic substrate and the particle demolition stop block.

[0013] Furthermore, the swing cylinder is fixed to the lower side of the grain-detaching connecting seat through a swing cylinder mounting seat, and a swing action arm is extended from the lower side of the swing seat plate. The swing cylinder hits the swing action arm to drive the grain-detaching swing block to swing downward, so that the grain-detaching station groove of the grain-detaching swing block is separated from the limiting clamping groove of the grain-detaching connecting seat and the ceramic substrate is cracked along the scratch portion at the separation position.

[0014] Furthermore, one end of the grain-decapsulating and pressing swing arm is hinged on a swing arm mounting block, and the swing arm mounting block is fixed on a pressing support. A pressing cylinder is arranged on the upper side corresponding to the grain-decapsulating and pressing swing arm, and the pressing cylinder is fixed to the pressing support through a pressing cylinder mounting block. A pressing return spring station is arranged between the pressing cylinder mounting block and the grain-decapsulating and pressing swing arm for installing a pressing return spring.

[0015] Beneficial effects of the technical solution of the present invention: The automatic chipping and pelletizing device of the embodiment of the present invention cooperates with the chipping swing block and the chipping connecting seat, and adopts the breaking form to perform chipping. It has a compact structure and a small movement amplitude, which overcomes the defect that the double-roller chipping occupies a large space, and at the same time overcomes the defect that the chipping in the punching method easily breaks the ceramic substrate. Through the combination or separation of the chipping movable block, the movable pressure block and the chipping swing block, it is possible to fix the ceramic substrate during chipping and position the resistor in the chipping station slot after resetting after chipping is completed, thereby facilitating subsequent automatic unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 The three-dimensional structure of the automatic chip splitting and particle disassembling device according to the embodiment of the present invention Figure 1 ; Figure 2 The three-dimensional structure of the automatic chip splitting and particle disassembling device according to the embodiment of the present invention Figure 2 ; Figure 3 The three-dimensional decomposition structure of the automatic fragmentation and particle disassembly device according to the embodiment of the present invention Figure 1 ; Figure 4 The three-dimensional decomposition structure of the automatic fragmentation and particle disassembly device according to the embodiment of the present invention Figure 2 ; Figure 5 The three-dimensional structure diagram of the automatic chip splitting and granulation device according to the embodiment of the present invention is partially omitted; Figure 6 This is a partially omitted cross-sectional structural diagram of the automatic chip splitting and pelletizing device according to an embodiment of the present invention; Figure 7 Schematic diagram of the ceramic substrate splitting action according to an embodiment of the present invention.

[0018] In the figure, 10-automatic splitting and disassembling device, 11-disassembling connecting seat, 1101-limiting pressing groove, 1102-swinging installation station groove; 12-grain disassembling swing block, 121-grain disassembling station slot, 122-grain disassembling stopper, 123-movable mounting slot, 124-swinging clearance block, 125-chip removal slot; 13-swing seat plate, 131-swing action arm, 14-swing shaft, 15-grain disassembling movable block, 151-spring accommodating movable part, 152-grain disassembling positioning platform; 16-movable pressing block, 17-pushing cylinder, 18-pushing cylinder mounting block, 19-grain removal reset spring station, 110-swinging cylinder, 111-swinging cylinder mounting seat, 112-grain removal limit block, 113-swinging adjustment screw, 114-grain removal in place sensor; 115-pressing support, 116-stripping pressing swing arm, 117-swing arm mounting block, 118-swing arm limit screw, 119-pressing cylinder, 1110-pressing cylinder mounting block, 1111-pressing return spring station; 20-transmission device, 21-transmission seat plate, 22-conveyor belt assembly, 23-transmission limit baffle; 30-ceramic substrate, 31-resistance sheet, 32-scratched portion. DETAILED DESCRIPTION

[0019] The specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Example 1

[0021] like Figure 1-4As shown, an embodiment of the present invention provides an automatic chipping and graining device 10, comprising: a graining connection seat 11, a graining swing block 12 installed in the graining connection seat 11 through a swing shaft 14, a swing seat plate 13 is connected to the lower part of the graining swing block 12, and a graining movable block 15 is arranged on the swing seat plate 13; a limited pressing groove 1101 is arranged on the graining connection seat 11, a graining station groove 121 corresponding to the limited pressing groove 1101 is arranged on the graining swing block 12, and a movable pressing block 16 is arranged on the graining movable block 15 corresponding to the graining station groove 121. A pelletizing reset spring (not shown) is arranged between the pelletizing movable block 15 and the pelletizing connecting seat 11, and the movable pressing block 16 is combined with or separated from the pelletizing station slot 121 through a pushing cylinder 17; the ceramic substrate 30 enters the limiting pressing slot 1101 from the conveying device 20 and reaches the pelletizing station slot 121, and is fixed in the limiting pressing slot 1101 through a pelletizing pressing swing arm 116, and the swing seat plate 13 is struck by a swing cylinder 110 and drives the pelletizing swing block 12 to swing downward, and the ceramic substrate 30 cracks along the scratch portion to form a resistor.

[0022] When using, Figure 7 As shown, a ceramic substrate 30 is pre-printed with a resistor film, a protective film, and an electrode, and a scratch portion 32 is processed and set on the ceramic substrate 30 according to the specifications of the resistor sheet; the ceramic substrate 30 enters the limiting and pressing groove 1101 of the grain disassembling connection seat 11 through the conveying device 20, and the front end of the ceramic substrate 30 reaches the grain disassembling station groove 121 on the grain disassembling swing block 12, and the ceramic substrate 30 is pressed in the limiting and pressing groove 1101. As the grain disassembling swing block 12 swings downward, the ceramic substrate 30 is cracked along the scratch portion 32 to form resistor sheets 31, which is similar to the action of breaking open a thin sheet, with a small movement amplitude and a compact structure.

[0023] Specifically, the limiting and clamping groove 1101 is arranged on the upper side of the grain-stripping connecting seat 11, and the grain-stripping limiting blocks 112 are arranged on both sides of the limiting and clamping groove 1101 respectively, and a swing installation station groove 1102 is arranged below the limiting and clamping groove 1101, and the grain-stripping swing block 12 is installed in the swing installation station groove 1102 through the swing shaft 14.

[0024] Specifically, along the conveying direction of the ceramic substrate 30, one side of the disassembling station slot 121 of the disassembling swing block 12 corresponds to the limiting pressing slot 1101, and the other side is provided with a disassembling stopper 122, and a chip removal slot 125 is formed between the disassembling stoppers 122. The chip removal slot 125 is located at the front end of the ceramic substrate 30, and along with the conveying action, the debris generated by disassembling falls from the chip removal slot 125 to the bottom of the device.

[0025] Optionally, the disassembling swing block 12 is provided with swing blocks 124 at both ends perpendicular to the conveying direction of the ceramic substrate 30. The swing blocks 124 are used to avoid mutual interference with the disassembling connection seat 11 when the disassembling swing block 12 swings downward.

[0026] like Figure 5-6 As shown, a movable mounting groove 123 is arranged between the grain-demolition swing block 12 and the swing seat plate 13, the spring accommodating movable part 151 of the grain-demolition movable block 15 cooperates with the movable mounting groove 123, and a grain-demolition reset spring station 19 is arranged in the spring accommodating movable part 151 for installing the grain-demolition reset spring.

[0027] like Figure 3 , 4 As shown, the pushing block cylinder 17 is set at the rear end of the swing seat plate 13 through the pushing block cylinder mounting block 18. The pushing block cylinder 17 extends to push the grain-splitting movable block 15 to combine with the grain-splitting swing block 12. After the pushing block cylinder 17 contracts, the grain-splitting return spring separates the grain-splitting movable block 15 from the grain-splitting swing block 12.

[0028] Specifically, the grain-detaching movable block 15 is provided with a grain-detaching positioning platform 152 corresponding to the grain-detaching station groove 121, and the movable pressing block 16 is arranged on the upper part of the grain-detaching positioning platform 152. When the grain-detaching movable block 15 is combined with the grain-detaching swing block 12, the movable pressing block 16 covers the front end of the scratched part of the ceramic substrate 30 and confines it within the grain-detaching station groove 121.

[0029] Optionally, the disassembling positioning platform 152 is respectively provided with a disassembling position sensor 114 corresponding to the disassembling station slot 121. The disassembling position sensor 114 is a proximity switch or an induction optical fiber.

[0030] like Figure 3-5 As shown, along the conveying direction of the ceramic substrate 30, an extension portion is provided between the grain demolition station groove 121 and the side of the grain demolition stop block 122. When the grain demolition movable block 15 is combined with the grain demolition swing block 12, the movable pressing block 16 covers the front end of the scratched portion of the ceramic substrate 30 and confines it within the grain demolition station groove 121, and a gap is formed between the front end of the ceramic substrate 30 and the grain demolition stop block 122.

[0031] like Figure 3 , 4As shown, the swing cylinder 110 is fixed to the lower side of the grain-detaching connecting seat 11 through a swing cylinder mounting seat 111, and a swing action arm 131 is extended from the lower side of the swing seat plate 13. The swing cylinder 110 hits the swing action arm 131 to drive the grain-detaching swing block 12 to swing, so that the grain-detaching station groove 121 of the grain-detaching swing block 12 swings downward and separates from the limiting clamping groove 1101 of the grain-detaching connecting seat 11, and causes the ceramic substrate 30 to crack along the scratch portion at the grain-detaching position.

[0032] When in use, the swing cylinder 110 hits the swing arm 131 to drive the grain-detaching swing block 12 to swing, and at the same time squeezes the grain-detaching reset spring. When the swing cylinder 110 contracts, the grain-detaching reset spring reconnects the grain-detaching station slot 121 of the grain-detaching swing block 12 with the limiting clamping slot 1101 of the grain-detaching connecting seat 11.

[0033] Optionally, the grain-splitting connecting seat 11 is provided with a swing adjustment screw 113 corresponding to the grain-splitting swing block 12 or the swing seat plate 13 in the swing installation station groove 1102, which is used to adjust the swing amplitude; the bottom of the swing seat plate 13 cooperates with the upper end of the swing cylinder mounting seat 111 to form the maximum swing amplitude of the grain-splitting swing block 12.

[0034] like Figure 1-4 As shown, one end of the grain-cutting and pressing swing arm 116 is hinged on the swing arm mounting block 117, and the swing arm mounting block 117 is fixed on the pressing support 115. A pressing cylinder 119 is arranged on the upper side corresponding to the grain-cutting and pressing swing arm 116. The pressing cylinder 119 is fixed to the pressing support 115 through a pressing cylinder mounting block 1110. A pressing return spring station 1111 is arranged between the pressing cylinder mounting block 1110 and the grain-cutting and pressing swing arm 116 for installing a pressing return spring (not shown).

[0035] Initially, under the action of the clamping reset spring, the pelletizing clamping swing arm moves away from the limited clamping groove of the pelletizing connecting seat. During pelletizing, the clamping cylinder drives the pelletizing clamping swing arm to swing downward and clamps and fixes the ceramic substrate in the limited clamping groove.

[0036] Optionally, the pressing support can be fixed to the table panel, the pelletizing connection seat or the end of the conveying device.

[0037] like Figure 1 , 2 As shown, the conveying device 20 generally includes a conveying seat plate 21, a conveying belt assembly 22 arranged on the conveying seat plate 21, conveying limit baffles 23 arranged on both sides of the conveying direction of the conveying belt assembly 22, and the end of the conveying belt assembly 22 corresponds to the pelletizing connection seat 11.

[0038] Initially, under the action of the grain-demolition reset spring, the grain-demolition station slot of the grain-demolition swing block is connected and combined with the limiting pressing slot of the grain-demolition connecting seat, the pushing block cylinder is in a contracted state, and under the action of the grain-demolition reset spring, the grain-demolition movable block and the grain-demolition swing block are in a separated state, and the movable pressing block deviates from the grain-demolition station slot and is exposed directly above the grain-demolition station slot.

[0039] First, the push block cylinder extends out and compresses the grain dismantling return spring, the grain dismantling movable block is combined with the grain dismantling swing block, and the movable pressing block covers the top of the grain dismantling station slot.

[0040] Secondly, when the ceramic substrate reaches the grain demolition station slot, the movable pressing block blocks the front end of the ceramic substrate, and the front end of the ceramic substrate is restricted in the grain demolition station slot, and a gap is formed between the front end of the ceramic substrate and the grain demolition stop block. After sensing that the front end of the ceramic substrate is in place, the clamping cylinder drives the grain demolition clamping swing arm to fix the ceramic substrate in the limited clamping slot, triggering the swinging cylinder to hit the swinging action arm of the swinging seat plate, so that the swinging seat plate, the grain demolition swing block, and the grain demolition movable block swing downward along the swing axis at the same time, and the ceramic substrate cracks along the scratch part at the connecting position of the grain demolition station slot and the limited clamping slot to form a resistor.

[0041] Then, under the action of the grain-demolition reset spring, the grain-demolition station slot of the grain-demolition swing block and the limiting pressing slot of the grain-demolition connecting seat are restored to connection, the pushing cylinder contracts, and the grain-demolition movable block is separated from the grain-demolition swing block under the action of the grain-demolition reset spring again. The movable pressing block deviates from the grain-demolition station slot, exposing the resistor sheet on the grain-demolition station slot, which is convenient for subsequent unloading and transfer of the resistor sheet.

[0042] Finally, after the resistor is unloaded, the pressing cylinder is reset to perform the next splitting and disassembling action. Due to the gap between the front end of the ceramic substrate and the disassembling block, the resistor after splitting will not be clamped in the disassembling station slot, and the chip removal slot is conducive to the falling of debris.

[0043] The automatic chipping and pelletizing device of the embodiment of the present invention cooperates with the chipping swing block and the chipping connecting seat, and adopts the breaking form to perform chipping. It has a compact structure and a small movement amplitude, which overcomes the defect that the double-roller chipping occupies a large space, and at the same time overcomes the defect that the chipping in the punching method easily breaks the ceramic substrate. Through the combination or separation of the chipping movable block, the movable pressure block and the chipping swing block, it is possible to fix the ceramic substrate during chipping and position the resistor in the chipping station slot after resetting after chipping is completed, thereby facilitating subsequent automatic unloading.

[0044] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic chipping and granulation device, characterized in that: The device comprises: a grain-demolition connecting seat, a grain-demolition swing block installed in the grain-demolition connecting seat through a swing shaft, a swing seat plate connected to the lower part of the grain-demolition swing block, and a grain-demolition movable block arranged on the swing seat plate; a limited pressing groove is arranged on the grain-demolition connecting seat, and a grain-demolition working station groove corresponding to the limited pressing groove is arranged on the grain-demolition swing block; a grain-demolition movable block is provided with a movable pressing block corresponding to the grain-demolition working station groove; a grain-demolition reset spring is arranged between the grain-demolition movable block and the grain-demolition connecting seat, and the movable pressing block is combined with or separated from the grain-demolition working station groove by a pushing cylinder; the ceramic substrate enters the limited pressing groove from the conveying device and reaches the grain-demolition working station groove, and is fixed in the limited pressing groove by a grain-demolition pressing swing arm, and the swing seat plate is struck by a swing cylinder and drives the grain-demolition swing block to swing downward, and the ceramic substrate is cracked along the scratch portion to form a resistor.

2. The automatic chip splitting and granulation device according to claim 1 is characterized in that: The limiting and clamping groove is arranged on the upper side of the grain stripping connecting seat, and grain stripping limiting blocks are arranged on both sides of the limiting and clamping groove respectively, and a swing installation station groove is arranged below the limiting and clamping groove, and the grain stripping swing block is installed in the swing installation station groove through the swing shaft.

3. The automatic chipping and granulation device according to claim 1, characterized in that: Along the conveying direction of the ceramic substrate, one side of the particle disassembling station groove of the particle disassembling swing block corresponds to the limiting pressing groove, and the other side is provided with a particle disassembling stopper, and a chip removal groove is formed between the particle disassembling stoppers.

4. The automatic chip splitting and granulation device according to claim 1, characterized in that: A movable mounting groove is arranged between the grain-demolition swing block and the swing seat plate, the spring accommodating movable part of the grain-demolition movable block cooperates with the movable mounting groove, and a grain-demolition reset spring station is arranged in the spring accommodating movable part for installing the grain-demolition reset spring.

5. The automatic chip splitting and granulation device according to claim 1, characterized in that: The pushing block cylinder is set at the rear end of the swing seat plate through the pushing block cylinder mounting block. The pushing block cylinder extends out to push the grain-splitting movable block to combine with the grain-splitting swing block. After the pushing block cylinder contracts, the grain-splitting return spring separates the grain-splitting movable block from the grain-splitting swing block.

6. The automatic chip splitting and granulation device according to claim 3, characterized in that: The particle demolition movable block is provided with a particle demolition positioning platform corresponding to the particle demolition station groove, and the movable pressing block is arranged on the upper part of the particle demolition positioning platform. When the particle demolition movable block is combined with the particle demolition swing block, the movable pressing block limits the front end of the ceramic substrate between the particle demolition station groove and the particle demolition positioning platform.

7. The automatic chip splitting and granulation device according to claim 6, characterized in that: The grain disassembling positioning platform is respectively provided with grain disassembling position sensors corresponding to the grain disassembling station slots.

8. The automatic chip splitting and particle disassembling device according to claim 6, characterized in that: Along the conveying direction of the ceramic substrate, an extension portion is provided between the particle demolition station groove and the side of the particle demolition stop block. When the particle demolition movable block is combined with the particle demolition swing block, the movable pressure block restricts the front end of the ceramic substrate between the particle demolition station groove and the particle demolition positioning platform, and a gap is formed between the front end of the ceramic substrate and the particle demolition stop block.

9. The automatic chip splitting and granulation device according to claim 1, characterized in that: The swing cylinder is fixed to the lower side of the grain-detaching connecting seat through a swing cylinder mounting seat, and a swing action arm is extended from the lower side of the swing seat plate. The swing cylinder hits the swing action arm to drive the grain-detaching swing block to swing downward, so that the grain-detaching station groove of the grain-detaching swing block is separated from the limiting pressing groove of the grain-detaching connecting seat and the ceramic substrate is cracked along the scratch portion at the separation position.

10. The automatic chip splitting and granulation device according to claim 1, characterized in that: One end of the grain-decapsulating and pressing swing arm is hinged on a swing arm mounting block, and the swing arm mounting block is fixed on a pressing support. A pressing cylinder is arranged on the upper side corresponding to the grain-decapsulating and pressing swing arm, and the pressing cylinder is fixed to the pressing support through a pressing cylinder mounting block. A pressing return spring station is arranged between the pressing cylinder mounting block and the grain-decapsulating and pressing swing arm for installing a pressing return spring.

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