Automatic splitting and particle-removing device

CN119650225AActive Publication Date: 2025-03-18GANZHOU SANDAS ELECTRONICS CO LTD
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Patent Information

Application Number
CN202510181217.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-19
Publication Date
2025-03-18
Estimated Expiration
2045-02-19

AI Technical Summary

Technical Problem

When handling large-sized resistor sheets, existing lobsters occupy too much space and have low production efficiency, and ceramic substrates are prone to cracking or incomplete cross-sections under punching.

Method used

An automatic lobe-removing device is designed. The lobe is carried out in a break form through the decapitation swing block and the particle-removing connection seat. The movable block and reset spring are used to achieve the fixing and positioning of the ceramic substrate to ensure the integrity and efficient production of the resistor sheet.

Benefits of technology

Automatic de-partition of the ceramic substrate is achieved, and the problems of large space occupation and low production efficiency in traditional methods are overcome. At the same time, the breakage of the ceramic substrate is avoided, ensuring the integrity and efficient production of resistor sheets.

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Abstract

The invention discloses an automatic splitting and grain disassembling device which comprises a grain disassembling connecting base and a grain disassembling swing block installed in the grain disassembling connecting base through a swing shaft, a swing base plate is connected to the lower portion of the grain disassembling swing block, and a grain disassembling movable block is arranged on the swing base plate. A grain disassembling reset spring is arranged between the grain disassembling movable block and the grain disassembling connecting seat, and the movable pressing block and the grain disassembling swing block are combined or separated through a push block air cylinder; a ceramic substrate enters the limiting and pressing groove from the conveying device and reaches the grain disassembling station groove, the ceramic substrate is fixed to the limiting and pressing groove through a grain disassembling and pressing swing arm, the swing base plate is hit by a swing air cylinder and drives the grain disassembling swing block to swing downwards, and the ceramic substrate cracks along a scratch part to form a resistor disc. The wafer splitting device has the advantages that the wafer splitting swing block is matched with the wafer splitting connecting seat, wafer splitting is performed in a breaking manner, the structure is compact, the action range is small, the defect of large occupied space of double-roller wafer splitting is overcome, and meanwhile, the defect that ceramic substrates are easily broken due to wafer splitting in a punching manner is overcome.
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