Magnetic field wire and preparation method thereof, magnetic field coil and chip
By using composite wires including a non-magnetic metal layer and a magnetic metal layer in the chip to form a magnetic field wire of a predetermined shape, the problem of insufficient magnetic field size in the chip in the prior art is solved, and the effect of larger magnetic field generation and power consumption reduction is achieved.
Patent Information
- Application Number
- CN202411844280.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-03-21
AI Technical Summary
Due to material limitations, existing coils used to generate magnetic fields in chips cannot generate a large magnetic field under the same conditions, making it difficult to meet the magnetic field size requirements of some magnetoresistive sensor chips.
Using composite wires including a non-magnetic metal layer and a magnetic metal layer located on the side of the non-magnetic metal layer away from the target area, a predetermined shape of magnetic field wire is formed by thin film preparation technology and photolithography technology in the integrated circuit process to form a magnetic field coil.
Under the same conditions, the composite conductor can generate a larger magnetic field than the traditional conductor, solving the problem that the magnetic field required for magnetization of the magnetic layer or the magnetic moment reset in the magnetoresistive sensor chip is insufficient, and the power consumption of the chip can be reduced by reducing the current.