Method for stabilizing adhesive connection of optical component, optical component and projection exposure apparatus for semiconductor lithography
By heat treatment of the adhesive connection part of the optical component, the problem of undesirable effects in the glass transition range of the adhesive connection part is solved, and higher robustness and better imaging characteristics are achieved.
Patent Information
- Application Number
- CN202380058386.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-08-08
- Filing Date
- 2023-07-26
- Publication Date
- 2025-03-21
AI Technical Summary
Prior Art In the production and operation of optical components, the bonding connection may experience undesirable effects when reaching the temperature of the glass transition range, resulting in mechanical drift and imaging aberrations.
By heat treatment of the cured adhesive, the curing degree and temperature of the glass transition range are increased, thereby improving the robustness of the bonding joint and preventing mechanical drift when external forces are applied.
During further processing of the optical assembly, the adhesive connections exhibit increased robustness to heating and avoid mechanical drift when external forces are applied, improving the thermal stability and imaging characteristics of the optical assembly.