Glued product and table board gluing method

By using negative photoresist and traditional spin-coating methods, combined with multiple glue coating and development steps, the problem of uneven photoresist coverage on the table height and table top is solved, and the correct transfer of photolithographic patterns and the improvement of device reliability is achieved.

CN119689783APending Publication Date: 2025-03-25BEIJING MICROELECTRONICS TECH INST +1
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Patent Information

Application Number
CN202411821375.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

During the semiconductor wafer manufacturing process, it is difficult to uniformly coat the photoresist using conventional spin coating methods for silicon substrates above 50 microns, resulting in incomplete transfer of photolithographic patterns, affecting the reliability and mechanical properties of the device.

Method used

Negative photoresist and traditional spin-coating methods are used to adjust the rotation speed and adhesion coefficient, and combine multiple glue coating and development steps to ensure that the photoresist is evenly covered on the table.

Benefits of technology

A uniform coverage of photoresist on 50-80 micron countertops is achieved, ensuring the correct transfer of lithographic patterns, improving device reliability and mechanical properties, while maintaining equipment cost compatibility.

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Abstract

The invention relates to a gluing product and a table top gluing method, which mainly emphasizes the full coverage of table top photoresist, and mainly comprises the following steps: (1) adopting negative photoresist with strong adhesion; (2) selecting a proper rotation speed, and coating photoresist by using a rotary gluing method; and (3) performing gluing, exposure and development by selecting high-adhesion negative photoresist at a proper rotation speed, then repeating gluing, exposure and development again, and determining the number of times of repetition according to the height of the table top and a result after development. Through the steps, the table top can be fully covered at the height of 50-80 microns.
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