Multi-input and multi-output power divider chip and radio frequency device
By using the metal interconnect layer and anti-interference crossover area in the power splitter chip of multiple input and multiple output, the problem of difficulty in miniaturizing and integrating traditional PCBs when implementing multiple power split networks is solved, and efficient signal distribution and system stability are achieved.
Patent Information
- Application Number
- CN202411863251.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-03-25
AI Technical Summary
In multi-channel systems, when traditional board-level PCBs implement multi-channel power distribution networks, it is difficult to achieve miniaturization and chip-level integration, resulting in signal crosstalk and affect system performance.
A power splitter chip with multiple input and multiple outputs is designed, using multiple metal interconnection layers, input ports, output ports, main circuits, feeders and anti-interference cross-sections. By setting an anti-interference cross-section in the metal interconnection layer, signal cross-talk is avoided.
It realizes chip-level multi-input and multiple output power division network integration, reduces the difficulty and cost of manufacturing processes, and ensures the independence and integrity of each signal, improving the stability and reliability of the system.