IGZO-FET device with suspended nanowire structure and preparation method thereof
By using a combination of suspended nanowire structure and IGZO channel layer in IGZO thin film transistors, the problem of short channel effect is solved, and the effect of high integration density and driving current is achieved, which is suitable for high-performance displays and integrated circuits.
Patent Information
- Application Number
- CN202510194397.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2045-02-21
AI Technical Summary
The existing IGZO thin film transistors are prone to severe short-channel effects when the channel length is reduced, resulting in increased leakage current and deterioration of switching characteristics. The device scaling and integration density are limited, making it difficult to meet the needs of high-resolution displays or high-performance integrated circuits.
Using a suspended nanowire structure, by alternately depositing silicon oxide and silicon nitride stacks on the substrate, vertically parallel nanowires are grown, and IGZO channel layer and other electrode layers are deposited on their surface to form a CAA or GAA IGZO-FET device.
It effectively avoids the short channel effect, improves the device's integration density and driving current, enhances gate control capabilities and electrical stability, and is suitable for high-definition displays and high-density integrated circuits.