Packaging product, manufacturing method of packaging product and electronic equipment

By designing a packaging product that integrates LED chips and integrated circuit chips, using the combination of reflectors and plastic sealing layers, the problem that LED chip packaging products are difficult to meet small-volume application scenarios is solved, and the reliability of signal transmission and the light efficiency of LEDs are improved.

CN119698152APending Publication Date: 2025-03-25RONGCHENG GOERTEK MICROELECTRONICS CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202411914745.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

Existing LED chip packaging products are difficult to meet the needs of small-volume application scenarios, and there are problems of signal interference and transmission distance limitations in long-distance lighting control scenarios.

Method used

A packaging product is designed, including a substrate, a plastic sealing layer and a reflector. The integrated circuit chip and the LED chip are respectively connected to the substrate signal. The reflector separates the plastic sealing layer into two layers and surrounds the substrate to form an accommodation space. The LED chip and the second plastic sealing layer are arranged in the accommodation space, and the integrated circuit chip and the first plastic sealing layer are arranged outside the accommodation space.

Benefits of technology

The packaged product reduces the volume of electronic devices, simplifies external circuit design, is suitable for long-distance signal transmission, reduces the possibility of signal interference, and improves the light efficiency of LED chips.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention provides a packaging product, a manufacturing method of the packaging product and electronic equipment, the packaging product comprises a substrate, a plastic packaging layer and a light reflecting part, and the substrate is provided with an LED chip and an integrated circuit chip which are in signal connection with the substrate; the plastic packaging layer is arranged on the substrate; the plastic package layer is divided into a first plastic package layer and a second plastic package layer by the light reflecting part, an accommodating space with an opening is defined by the light reflecting part and the substrate, the LED chip and the second plastic package layer are arranged in the accommodating space, the integrated circuit chip and the first plastic package layer are arranged outside the accommodating space, and the second plastic package layer is a transparent layer. The packaging product has the advantage that the size of the electronic equipment can be reduced.
Need to check novelty before this filing date? Find Prior Art