Negative pressure glue injection device and method
By designing a negative pressure glue injection device, the connection between the negative pressure structure and the raw material storage structure is used to eliminate and remove bubbles in the potting glue, solving the problem that bubbles affect product quality during the glue injection process, and achieving high-quality glue injection effect.
Patent Information
- Application Number
- CN202510073984.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-03-28
AI Technical Summary
Potting adhesive is prone to bubbles during the glue injection process, affecting product quality, resulting in a decrease in material strength, uneven appearance, and affecting subsequent process and functional performance.
A negative pressure glue injection device is designed, including a glue coating head, a metering pump group and a negative pressure bubble removal assembly. Through the connection between the negative pressure structure and the raw material storage structure, bubbles in the raw material storage structure are eliminated, and bubbles are removed through negative pressure circulation to ensure the quality of the glue.
Effectively remove bubbles in the glue, ensure product quality during the glue injection process, and avoid material strength drops, appearance unevenness and functional performance caused by bubbles.