Dynamic distribution method of three-dimensional scanning lines for filling gaps with different depths

Abstract

The invention discloses a three-dimensional scanning line dynamic distribution method for filling gaps with different depths, which relates to the technical field of mobile phones, and comprises the following steps: step 1, scanning the depth of a gap and the three-dimensional coordinates of the center of the gap by using a three-dimensional camera, and sending the scanned result to a computer; 2, the computer calculates the volume of needed glue according to the depth data, and coordinates of the three-dimensional camera are converted into movement coordinates of a glue dispensing shaft; 3, according to the movement coordinates of the dispensing shaft, the moving board card is used for driving the dispensing shaft to move downwards to prepare for dispensing; step 4, controlling a dispensing needle head to dispense glue by utilizing a dispensing controller according to a dispensing calculation formula; according to the glue amount required by a customer, the volume of the required glue is calculated, the glue outlet time is finally calculated, and the corresponding glue amount is given, so that different gaps are completely filled with the glue, the glue cannot protrude out of the surface, and the process control is facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of mobile phones, and in particular to a three-dimensional scanning line dynamic allocation method for filling gaps of different depths. Background Art

[0002] In the dispensing mode, different gap values ​​of different segments give different glue amounts. The advantage is that compared with fixed glue amount, this dispensing method can effectively reduce the risk of small gaps exceeding the specification and reduce the risk of large gaps with insufficient glue. The disadvantages are that, first, all gaps cannot be effectively covered; second, when the gap is near the boundary of the segment, the glue bulge is large, which is not conducive to process control. Summary of the invention

[0003] In order to solve the defects in the prior art, the present invention provides a three-dimensional scanning line dynamic allocation method for filling gaps of different depths.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] The present invention provides a three-dimensional scanning line dynamic allocation method for filling gaps of different depths, comprising the following steps:

[0006] Step 1: Use a 3D camera to scan the depth of the gap and the 3D coordinates of the gap center, and send the scanned results to a computer;

[0007] Step 2: The computer calculates the required glue volume based on the depth data and converts the three-dimensional camera coordinates into the motion coordinates of the glue dispensing axis;

[0008] Step 3: According to the motion coordinates of the dispensing axis, use the motion board to drive the dispensing axis to move downward to prepare for dispensing;

[0009] Step 4: Use the dispensing controller to control the dispensing needle to dispense glue according to the dispensing calculation formula.

[0010] As a preferred technical solution of the present invention, the total volume of glue required in step 2 = total area of ​​glue coverage area * required glue coverage ratio * (gap depth - steel sheet thickness) + hole area * steel sheet thickness.

[0011] As a preferred technical solution of the present invention, the correlation between the dispensing time of the dispensing controller and the dispensing weight of the glue in step 4 is Y=0.03363+0.006043*T.

[0012] As a preferred technical solution of the present invention, the dispensing calculation formula is as follows: glue weight = volume * density.

[0013] As a preferred technical solution of the present invention, the calculation formula for the distribution weight is as follows: glue dispensing weight = (total area of ​​glue coverage area * required glue coverage ratio * (gap depth - steel sheet thickness) + hole area * steel sheet thickness) * density * glue distribution ratio.

[0014] As a preferred technical solution of the present invention, the calculation formula for the distribution time is as follows: Glue discharge time = (total area of ​​glue coverage area * required glue coverage ratio * (gap depth - steel sheet thickness) + hole area * steel sheet thickness) * density * glue distribution ratio / set glue weight * set time.

[0015] As a preferred technical solution of the present invention, the set glue weight is the standard glue weight when the gap = the design value; the set time is adjusted according to different air pressure requirements; the glue distribution ratio refers to the ratio of the total glue weight distributed in hole 1 and hole 2.

[0016] As a preferred technical solution of the present invention, the weight formula of the dynamic epoxy resin in the gap 1 / 2 is:

[0017] Hole 1 = (32.25*37.5%*(Gap 1-0.185)+0.97*2*0.185)*1.2*(1 / 2) Hole 2 = (32.25*37.5%*(Gap 2-0.185)+0.97*2*0.185)*1.2*(1 / 2).

[0018] As a preferred technical solution of the present invention, the formula for the dynamic epoxy resin dispensing time of the gap 1 / 2 is:

[0019] Hole 1 = (32.25*37.5%*(Gap 1-0.185)+0.97*2*0.185)*1.2*(1 / 2)*400 / 1.3 Hole 2 = (32.25*37.5%*(Gap 2-0.185)+0.97*2*0.185)*1.2*(1 / 2)*400 / 1.3.

[0020] As a preferred technical solution of the present invention, the volume of the required glue is calculated according to the required glue amount, and finally the glue dispensing time is calculated to give the corresponding glue amount.

[0021] The beneficial effects of the present invention are:

[0022] This three-dimensional scanning line dynamic allocation method for filling gaps of different depths calculates the volume of glue required according to the amount of glue required by the customer, and finally calculates the glue output time and gives the corresponding amount of glue to achieve complete filling of different gaps with glue without protruding on the surface, which is beneficial to process control. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 It is a block diagram of a method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to the present invention;

[0025] Figure 2 It is a structural block diagram of a three-dimensional scan line dynamic allocation method for filling gaps of different depths according to the present invention. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0027] Example: Figure 1 and Figure 2 As shown, the present invention provides a three-dimensional scanning line dynamic allocation method for filling gaps of different depths, comprising the following steps:

[0028] Step 1: Use a 3D camera to scan the depth of the gap and the 3D coordinates of the gap center, and send the scanned results to a computer;

[0029] Step 2: The computer calculates the required glue volume based on the depth data and converts the three-dimensional camera coordinates into the motion coordinates of the glue dispensing axis;

[0030] Step 3: According to the motion coordinates of the dispensing axis, use the motion board to drive the dispensing axis to move downward to prepare for dispensing;

[0031] Step 4: Use the dispensing controller to control the dispensing needle to dispense glue according to the dispensing calculation formula.

[0032] The total volume of glue required in step 2 = the total area of ​​the glue coverage area * the required glue coverage ratio * (gap depth - steel sheet thickness) + the area of ​​the hole * the steel sheet thickness.

[0033] Among them, the correlation between the dispensing time of the dispensing controller and the dispensing weight of the glue in step 4 is Y=0.03363+0.006043*T.

[0034] The calculation formula for glue dispensing is as follows: glue weight = volume * density.

[0035] The calculation formula for the distribution weight is as follows: glue weight = (total glue coverage area * required glue coverage ratio * (gap depth - steel sheet thickness) + hole area * steel sheet thickness) * density * glue distribution ratio.

[0036] Among them, the calculation formula of the distribution time is as follows: glue discharge time = (total area of ​​glue coverage area * required glue coverage ratio * (gap depth-steel sheet thickness) + hole area * steel sheet thickness) * density * glue distribution ratio / set glue weight * set time.

[0037] The set glue weight is the standard glue weight when the gap = the design value; the set time is adjusted according to different air pressure requirements; and the glue distribution ratio refers to the ratio of the total glue weight distributed between hole 1 and hole 2.

[0038] Among them, the formula for the dynamic epoxy resin weight of the gap 1 / 2 is:

[0039] Hole 1 = (32.25*37.5%*(Gap 1-0.185)+0.97*2*0.185)*1.2*(1 / 2) Hole 2 = (32.25*37.5%*(Gap 2-0.185)+0.97*2*0.185)*1.2*(1 / 2).

[0040] Among them, the formula for the dynamic epoxy resin dispensing time of the gap 1 / 2 is:

[0041] Hole 1 = (32.25*37.5%*(gap 1-0.185)+0.97*2*0.185)*1.2*(1 / 2)*400 / 1.3

[0042] Hole 2 = (32.25*37.5%*(Gap 2-0.185)+0.97*2*0.185)*1.2*(1 / 2)*400 / 1.3.

[0043] The required glue volume is calculated according to the required glue quantity, and finally the glue dispensing time is calculated to give the corresponding glue quantity.

[0044] When working, use a 3D camera to scan the depth of the gap and the 3D coordinates of the gap center, and send the scanned results to the computer; the computer calculates the required glue volume based on the depth data, and converts the 3D camera coordinates into the motion coordinates of the dispensing axis; according to the motion coordinates of the dispensing axis, use the motion board to drive the dispensing axis downward to prepare for dispensing; according to the dispensing calculation formula, use the dispensing controller to control the dispensing needle for dispensing. According to the glue volume required by the customer, calculate the required glue volume, and finally calculate the dispensing time, and give the corresponding glue volume to achieve complete filling of different gaps with glue, and it will not protrude on the surface, which is conducive to process control.

[0045] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A three-dimensional scanning line dynamic allocation method for filling gaps of different depths, characterized in that: The following steps are involved: Step 1: Use a 3D camera to scan the depth of the gap and the 3D coordinates of the gap center, and send the scanned results to a computer; Step 2: The computer calculates the required glue volume based on the depth data and converts the three-dimensional camera coordinates into the motion coordinates of the glue dispensing axis; Step 3: According to the motion coordinates of the dispensing axis, use the motion board to drive the dispensing axis to move downward to prepare for dispensing; Step 4: Use the dispensing controller to control the dispensing needle to dispense glue according to the dispensing calculation formula.

2. A three-dimensional scanning line dynamic allocation method for filling gaps of different depths according to claim 1, characterized in that: The total volume of glue required in step 2 = total area of ​​glue coverage area * required glue coverage ratio * (gap depth - steel sheet thickness) + hole area * steel sheet thickness.

3. The method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to claim 2, characterized in that: The correlation between the dispensing time of the dispensing controller and the dispensing weight of the dispensing glue in step 4 is Y=0.03363+0.006043*T.

4. The method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to claim 3, characterized in that: The dispensing calculation formula is as follows: Glue weight = volume * density.

5. The method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to claim 4, characterized in that: The calculation formula of the distribution weight is as follows: Glue weight = (total glue coverage area * required glue coverage ratio * (gap depth - steel sheet thickness) + hole area * steel sheet thickness) * density * glue distribution ratio.

6. The method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to claim 5, characterized in that: The calculation formula of the distribution time is as follows: Glue dispensing time = (total glue coverage area * required glue coverage ratio * (gap depth - steel sheet thickness) + hole area * steel sheet thickness) * density * glue distribution ratio / set glue weight * set time.

7. The method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to claim 6, characterized in that: The set glue weight is the standard glue weight when the gap = the design value; the setting time is adjusted according to different air pressure requirements; the glue distribution ratio refers to the ratio of the total glue weight distributed between hole 1 and hole 2.

8. The method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to claim 7, characterized in that: The dynamic epoxy resin weight formula for the gap 1 / 2 is: Hole 1 = (32.25*37.5%*(Gap 1-0.185)+0.97*2*0.185)*1.2*(1 / 2) Hole 2 = (32.25*37.5%*(Gap 2-0.185)+0.97*2*0.185)*1.2*(1 / 2).

9. The method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to claim 8, characterized in that: The formula for the dynamic epoxy resin dispensing time of the gap 1 / 2 is: Hole 1 = (32.25*37.5%*(gap 1-0.185)+0.97*2*0.185)*1.2*(1 / 2)*400 / 1.3 Hole 2 = (32.25*37.5%*(Gap 2-0.185)+0.97*2*0.185)*1.2*(1 / 2)*400 / 1.

3.

10. The method for dynamically allocating three-dimensional scan lines for filling gaps of different depths according to claim 9, characterized in that: According to the required glue amount, the volume of glue required is calculated, and finally the glue dispensing time is calculated to give the corresponding glue amount.

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