Splash-proof device and wafer cleaning device
By installing an inclined guide plate splash-proof device above the drain outlet of the bottom plate of the wafer cleaning device, the problem of pollution after dripping of residual liquid on the wafer surface is solved, the effect of effectively preventing sputtering contamination is achieved, and the wafer cleaning effect is improved.
CN119702629APending Publication Date: 2025-03-28HWATSING TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202411879307.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-03-28
AI Technical Summary
Technical Problem
After the remaining liquid drips off the wafer surface, it can easily lead to environmental pollution in the box and reduce the wafer cleaning effect.
Method used
A splash-proof device is designed to be located above the bottom plate drain of the wafer cleaning device, including a fixing block and a guide plate. The guide plate is arranged inclined to catch and guide the droplets to the drain, avoiding sputtering.
Benefits of technology
It effectively prevents liquid from dripping directly onto the bottom plate of the wafer cleaning device, prevents sputtering and contaminates the structure of the chuck, ensures the surface of the wafer clean and improves the cleaning effect.
✦ Generated by Eureka AI based on patent content.
Abstract
The embodiment of the invention provides a liquid splashing prevention device and a wafer cleaning device. A liquid splashing prevention device is located above a water outlet of a bottom plate of a wafer cleaning device, the liquid splashing prevention device covers the water outlet, the wafer cleaning device is used for vertically cleaning a wafer, and the liquid splashing prevention device comprises two fixing blocks which are parallel to each other; the at least one guide plate is arranged between the two fixing blocks and is vertically connected with the inner wall surfaces of the two fixing blocks, and a first included angle is formed between the plane where the guide plate is located and the vertical plane so as to receive and guide liquid drops dripping from a wafer to the water outlet. The embodiment of the invention provides a liquid splashing prevention device and a wafer cleaning device. The liquid splashing prevention device and the wafer cleaning device can effectively prevent residual liquid on the surface of a wafer from being adhered to the surface of the wafer after dropping.
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