Brazing method for connecting stainless steel and red copper
By using high silver solder for vacuum brazing, the problem of excessive solder accumulation in stainless steel and copper welding is solved, and the high strength and toughness of the solder joints are achieved, which is suitable for a variety of application environments.
Patent Information
- Application Number
- CN202411952682.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-03-28
AI Technical Summary
In the prior art, during the welding process of stainless steel and copper, solder accumulation is too high, resulting in insufficient strength of the solder joint and is not suitable for frequent vibration and low temperature environments.
Vacuum brazing is performed using high-silver solder (silver accounts for 40% to 60% of the solder weight percentage and copper accounts for 40% to 60% of the solder weight percentage) to ensure that the solder stacking height is within 1 mm and cool in an argon or nitrogen environment.
It effectively reduces solder accumulation, improves the strength and toughness of solder joints, and is suitable for use in frequent vibration and low temperature environments, expanding application scenarios.