Process method for diffusion bonding of titanium / copper dissimilar materials and improvement of strength and plasticity of joint
By filling the joint surface of the titanium/copper heterogeneous material with short carbon fibers and friction stir treatment, combined with vacuum diffusion connection and low temperature tempering treatment, the problems of low strength and poor plasticity of the joints are solved, and the strong plasticity of the joints are achieved synergistic improvement.
Patent Information
- Application Number
- CN202510041592.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2045-01-10
AI Technical Summary
The current direct diffusion connection joints of titanium/copper heterogeneous materials have low strength and poor plasticity, resulting in brittle fracture failure in the joint under high temperature conditions.
By processing grooves on the to-welded surfaces of copper and titanium workpieces and filling them with short carbon fibers, combined with friction stir surface treatment, a composite fibrotic surface is formed, followed by vacuum diffusion connections, and multiple low-temperature tempering treatments are performed to improve the strong plasticity of the joints.
The synergistic improvement of the strength and plasticity of the diffusion connection joint of titanium/copper heterogeneous materials is achieved, reducing the generation of hard and brittle Ti-Cu intermetallic compounds, extending the crack transmission path of joint failure, and improving the overall performance of the joint.