Silicon wafer speed measuring device and single wafer cleaning machine

By designing a silicon wafer speed measurement device including rollers and speed measurement mechanisms, the problem that a single-chip cleaning machine cannot accurately measure the speed of the silicon wafer, the accurate measurement of the actual speed of the silicon wafer and the timely adjustment of the cleaning parameters are achieved, and the cleaning efficiency and effect are improved.

CN119716128APending Publication Date: 2025-03-28XIAN ESWIN MATERIAL TECHNOLOGY CO LTD +1
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Patent Information

Application Number
CN202411826414.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

Existing single-chip cleaning machines cannot accurately measure the actual speed of the silicon wafer, which affects the cleaning efficiency.

Method used

A silicon wafer speed measurement device is designed, including a roller and a speed measurement mechanism. The outer peripheral surface of the roller faces the edge of the silicon wafer, and the rotation of the silicon wafer drives the roller to rotate. The speed measuring mechanism calculates the rotation angular velocity of the roller through the signal transmitting component and the signal receiving component, thereby determining the actual rotation linear velocity of the silicon wafer.

Benefits of technology

Accurate measurement of the actual rotation speed of the silicon wafer is achieved, and the spraying speed of the liquid, the brush brushing speed and the liquid discharge efficiency can be adjusted in time, thereby improving the cleaning efficiency and effect.

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Abstract

The invention provides a silicon wafer speed measuring device and a single wafer cleaning machine, and relates to the technical field of semiconductors, the silicon wafer speed measuring device comprises a roller, the peripheral surface of the roller abuts against the edge of a silicon wafer, and the silicon wafer rotates to drive the roller to rotate; the speed measuring mechanism comprises a covering disc, a signal transmitting assembly and a signal receiving assembly; the covering disc and the roller keep rotating synchronously; in the vertical direction, the signal transmitting assembly and the signal receiving assembly are oppositely arranged; in the synchronous rotation process of the covering disc and the rolling wheel, the projections of the signal transmitting assemblies in the vertical direction are located on the covering disc at intervals; when the projection of the signal transmitting assembly in the vertical direction is located on the covering disc, the signal transmitting assembly transmits a signal to the signal receiving assembly. The rotating speed of the covering disc can be determined through the speed measuring mechanism, the rotating speed of the roller can be obtained according to the rotating speed of the covering disc, and the actual rotating speed of the silicon wafer can be calculated according to the rotating speed of the roller and the radius of the silicon wafer.
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