Electronic device

Abstract

The embodiment of the invention provides an electronic device. The electronic device comprises a substrate, a plurality of circuit layers, a light shielding layer and an opening, the multilayer circuit layer is disposed on the substrate. The multi-layer circuit layer comprises at least one data line, at least one scanning line, a plurality of main bonding pads and a plurality of backup bonding pads. The plurality of main bonding pads are used for bonding an electronic component, and the plurality of backup bonding pads are used for bonding a repair or backup electronic component. The light shielding layer is disposed on the substrate and overlaps the plurality of circuit layers. The shading layer is made of metal. The opening is surrounded by the shading layer and is used for allowing ambient light to penetrate through. The openings do not overlap with the plurality of main bonding pads and the plurality of backup bonding pads.

Description

[0001] This disclosure is a divisional application of the invention patent application with application number 202111162837.2 filed on September 30, 2021 and invention name “Electronic Device”. Technical Field

[0002] The present disclosure relates to an electronic device. Background Art

[0003] Electronic devices have been widely used in electronic devices such as mobile phones, televisions, monitors, tablet computers, car displays, wearable devices, and desktop computers. With the rapid development of electronic products, the requirements for display quality on electronic products are getting higher and higher, making electronic devices continue to improve in the direction of light, thin, short, small, frameless, and larger or higher resolution display effects. In high-penetration or high-resolution electronic devices, due to the continuous reduction in the size of the electronic devices, there will be a problem of insufficient wiring space or reserved repair space. Summary of the invention

[0004] According to an embodiment of the present disclosure, an electronic device includes a substrate, a multi-layer circuit layer, a light shielding layer and an opening. The multi-layer circuit layer is disposed on the substrate. The multi-layer circuit layer includes at least one data line, at least one scan line, a plurality of main bonding pads and a plurality of backup bonding pads. The plurality of main bonding pads are used to bond electronic components, and the plurality of backup bonding pads are used to bond repair or backup electronic components. The light shielding layer is disposed on the substrate and overlaps the multi-layer circuit layer. The material of the light shielding layer includes metal. The opening is surrounded and enclosed by the light shielding layer, and the opening is used to allow ambient light to penetrate. The opening does not overlap with the plurality of main bonding pads and the plurality of backup bonding pads. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 A schematic top view of a unit of an electronic device according to an embodiment of the present disclosure;

[0006] Figure 2 A partial top view of an electronic device according to another embodiment of the present disclosure;

[0007] Figure 3 for Figure 2 a schematic circuit diagram of the unit shown;

[0008] Figure 4 A partial top view of an electronic device according to another embodiment of the present disclosure;

[0009] Figure 5 for Figure 4 a schematic circuit diagram of the unit shown;

[0010] Figure 6 It is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0011] The present disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that in order to make it easier for readers to understand and for the simplicity of the drawings, the multiple drawings in the present disclosure only depict a portion of the electronic device, and the specific components in the drawings are not drawn according to the actual scale. In addition, the number and size of each component in the figure are only for illustration and are not intended to limit the scope of the present disclosure.

[0012] Certain words are used throughout the disclosure and in the claims that follow to refer to specific components. It will be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following description and claims, the words "include", "contain", "have" and the like are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present disclosure, they specify the presence of corresponding features, regions, steps, operations and / or components, but do not exclude the presence of one or more corresponding features, regions, steps, operations and / or components.

[0013] Directional terms mentioned herein, such as "up", "down", "front", "back", "left", "right", etc., are only with reference to the directions of the accompanying drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. In the accompanying drawings, each figure shows the general characteristics of the methods, structures and / or materials used in a particular embodiment. However, these drawings should not be interpreted as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative size, thickness and position of each film layer, region and / or structure may be reduced or enlarged.

[0014] It should be understood that when a component or film layer is referred to as being "connected to" another component or film layer, it can be directly connected to the other component or film layer, or there are intervening components or film layers between the two. When a component is referred to as being "directly connected to" another component or film layer, there are no intervening components or film layers between the two. The terms "approximately," "equal to," "equal to," or "same as," "substantially," or "approximately" are generally interpreted as being within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0015] A structure (or layer, component, substrate) described in the present disclosure is located on another structure (or layer, component, substrate), which may mean that the two structures are adjacent and directly connected, or may mean that the two structures are adjacent but not directly connected, and the indirect connection means that there is at least one intermediate structure (or intermediate layer, intermediate component, intermediate substrate, intermediate interval) between the two structures, the lower surface of one structure is adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure is adjacent to or directly connected to the lower surface of the intermediate structure, and the intermediate structure can be composed of a single-layer or multi-layer physical structure or a non-physical structure, without limitation. In the present disclosure, when a certain structure is arranged "on" another structure, it may mean that the certain structure is "directly" on the other structure, or that the certain structure is "indirectly" on the other structure, that is, at least one structure is sandwiched between the certain structure and the other structure.

[0016] The "first", "second" ... etc. in this disclosure specification can be used in this article to describe various components, parts, regions, layers and / or parts, but these components, parts, regions, and / or parts should not be limited by these terms. These terms are only used to distinguish one component, component, region, layer or part from another component, component, region, layer or part. Therefore, the "first component", "component", "region", "layer" or "part" discussed below is used to distinguish from the "second component", "component", "region", "layer" or "part", rather than to limit the order or specific components, parts, regions, layers and / or parts.

[0017] The electronic device disclosed herein may include a display device, a backlight device, an antenna device, a sensing device or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode or a photodiode. The light emitting diode may, for example, include an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro light emitting diode (micro LED) or a quantum dot light emitting diode (quantum dot LED), but is not limited thereto. The splicing device may, for example, be a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. The following description will use a display device as an electronic device or a splicing device to illustrate the present disclosure, but the present disclosure is not limited thereto.

[0018] In the present disclosure, the various embodiments described below may be mixed and matched without departing from the spirit and scope of the present disclosure. For example, some features of one embodiment may be combined with some features of another embodiment to form another embodiment.

[0019] Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0020] Figure 1 1 is a top view of a unit of an electronic device according to an embodiment of the present disclosure. For the sake of clarity and convenience of description, Figure 1 Some components are omitted from the illustration. Figure 1 , the electronic device 10 includes a plurality of units PX. Each unit PX includes a plurality of main bonding areas 210 and at least one backup bonding area 220. In some embodiments, the electronic device 10 further includes an opening area 11 and a non-opening area 13 surrounding the opening area 11. The main bonding area 210 and the backup bonding area 220 overlap the non-opening area 13 correspondingly. The main bonding area 210 is used to bond electronic components, and the backup bonding area 220 includes an electronic component reserved space 320 for bonding electronic components. In this embodiment, the backup bonding area 220 is connected to the main bonding area 210, and the number of the backup bonding areas 220 is less than the number of the main bonding areas 210. Under the above-mentioned setting, the unit PX can reserve space for circuit layout to realize a patch design, or be applied as a unit with a through-display function.

[0021] Please continue to refer to Figure 1 , the electronic device 10 includes a substrate 100. A plurality of units PX are disposed on the substrate 100. The substrate 100 may be a hard substrate or a flexible substrate. The material of the substrate 100 may include, for example, glass, quartz, ceramic, sapphire or plastic, but the present disclosure is not limited thereto. In some embodiments, when the substrate 100 is a flexible substrate, it may include a suitable flexible material, such as polycarbonate (PC), polyimide (PI), polypropylene (PP) or polyethylene terephthalate (PET), other suitable materials or a combination of the foregoing materials, but is not limited thereto. In addition, the transmittance of the substrate 100 is not limited, that is, the substrate 100 may be a translucent substrate, a semi-translucent substrate or an opaque substrate. In the present embodiment, the electronic device 10 may be an electronic device that is applied with a transmissive display technology having a high transmittance, but is not limited thereto.

[0022] In some embodiments, in the top-view direction (also referred to as the Z axis), the multiple units PX of the electronic device 10 can be arranged into multiple rows and multiple columns on the X axis and the Y axis, so that the multiple units PX are arranged in an array. In this embodiment, the X axis and the Y axis are substantially perpendicular to each other, and the X axis and the Y axis are substantially perpendicular to the Z axis. In some embodiments, the electronic device 10 also includes multiple signal lines and multiple thin film transistors (not shown) disposed on the substrate 100. Multiple units PX can be electrically connected to multiple signal lines and multiple thin film transistors. For example, multiple signal lines include, for example, scan lines, data lines or other wires. Part of the signal lines can be electrically connected to thin film transistors (TFT). In this embodiment, the thin film transistor can be electrically connected to the scan line SL or the data line DL. The thin film transistor includes, for example, a semiconductor channel layer, a gate (electrically connected to the scan line), and a source and a drain electrically connected to the semiconductor channel layer. The material of the semiconductor channel layer includes, for example, amorphous silicon, low temperature polysilicon (LTPS) or metal oxide, or a combination of the above materials, but the present disclosure is not limited thereto. In some embodiments, different thin film transistors may have the above different semiconductor materials. In addition, the thin film transistor may include a top gate transistor, a bottom gate transistor, a dual gate transistor and a double gate transistor as needed, but is not limited thereto.

[0023] In this embodiment, the gate electrode may be electrically connected to the scan line, and the source electrode may be electrically connected to the data line. The material of the gate electrode may include molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co), zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), other suitable metals, or alloys or combinations of the above materials, but not limited thereto. The material of the source electrode and the drain electrode may include a transparent conductive material or a non-transparent conductive material, such as indium tin oxide, indium zinc oxide, indium oxide, zinc oxide, tin oxide, metal materials (such as aluminum, molybdenum, copper, silver, etc.), other suitable materials or combinations of the above materials, but not limited thereto.

[0024] In the present embodiment, the electronic device 10 may include multiple insulating layers (not shown) and multiple circuit layers disposed on the insulating layers or between the multiple insulating layers. The insulating layer may be a single-layer or multi-layer structure, and may, for example, include an organic material, an inorganic material, or a combination thereof, but is not limited thereto. The organic material may include polyethylene terephthalate (PET), polyethylene (PE), polyethersulfone (PES), polycarbonate (PC), polymethylmethacrylate (PMMA), polyimide (PI), photosensitive polyimide (PSPI), or a combination thereof, and the inorganic material may include silicon nitride, silicon oxide, silicon oxynitride, or a combination thereof, but is not limited thereto.

[0025] In this embodiment, the multi-layer circuit layer ML can be applied as the above-mentioned signal line, including a scan line, a data line or other conductive line. The material of the multi-layer circuit layer ML may include a transparent conductive material or a non-transparent conductive material, such as indium tin oxide, indium zinc oxide, indium oxide, zinc oxide, tin oxide, metal material (such as aluminum, molybdenum, copper, silver, etc.), other suitable materials or the above combination, but not limited thereto. Figure 1 As shown, the multi-layer circuit layer ML may include a first circuit layer M1. The first circuit layer M1 may include, for example, a plurality of scan lines SL, SL', and portions of the plurality of scan lines SL, SL' substantially extend along the X axis, but the present invention is not limited thereto.

[0026] In this embodiment, the multi-layer circuit layer ML may further include a second circuit layer M2. On the Z axis, the second circuit layer M2 is disposed above the first circuit layer M1, and the second circuit layer M2 partially overlaps the first circuit layer M1. The second circuit layer M2 may, for example, include a plurality of data lines DL, DL', and portions of the plurality of data lines DL, DL' extend substantially along the Y axis, but are not limited thereto. From another perspective, the first circuit layer M1 and the second circuit layer M2 may be arranged alternately.

[0027] The multilayer circuit layer ML may further include a third circuit layer M3 and a fourth circuit layer M4. On the Z axis, the third circuit layer M3 is disposed above the second circuit layer M2, and the fourth circuit layer M4 is disposed above the third circuit layer M3. The third circuit layer M3 partially overlaps the second circuit layer M2, and the fourth circuit layer M4 partially overlaps the third circuit layer M3. The third circuit layer M3, for example, includes a circuit line or a bridge line 130, and a portion thereof extends approximately along the X axis, and another portion thereof extends approximately along the Y axis. The fourth circuit layer M4, for example, includes a bonding pad 140 (pad) or a shared circuit line 142, and a portion thereof extends approximately along the X axis, and another portion thereof extends approximately along the Y axis, but is not limited thereto. In the present embodiment, a portion of the third circuit layer M3 may be electrically connected to a portion of the second circuit layer M2 through a through hole (not shown) on an insulating layer, and a portion of the fourth circuit layer M4 may be electrically connected to a portion of the third circuit layer M3 through a through hole (not shown) on another insulating layer. Under the above setting, the fourth circuit layer M4 includes multiple bonding pads 140, a portion of the bonding pads 140 can be connected to the shared circuit line 142 (which can be located in the fourth circuit layer M4), and another portion of the bonding pads 140 can be electrically connected to the data line DL of the second circuit layer M2 through the bridge line 130, but is not limited to this.

[0028] In this embodiment, the opening area 11 is defined as an area substantially surrounded by two adjacent data lines DL and data line DL' of two adjacent units PX and units PX', respectively. Figure 1 As shown). For example, the opening area 11 can be an area that allows ambient light to penetrate. In other embodiments, the opening area 11 can be defined by the area surrounded by two adjacent data lines DL, DL' and two adjacent scan lines SL, SL'. In other words, the opening area 11 does not substantially overlap the circuit layer ML (including the first circuit layer M1, the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4). In some embodiments, the opening area 11 is, for example, an octagon, but is not limited thereto. In other embodiments, the opening area 11 can also be a triangle, a rectangle, a polygon, a star, a circle or an irregular shape, and the present disclosure is not limited thereto.

[0029] In this embodiment, the opening area 11 may be surrounded by the non-opening area 13. At least a portion of the circuit layer ML (including the first circuit layer M1, the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4) may overlap the non-opening area 13. In other words, at least a portion of the scan line SL, the data line DL, the bridge line 130, the bonding pad 140 or the shared circuit line 142 may overlap the non-opening area 13, but is not limited thereto.

[0030] In some embodiments, the main bonding area 210 and the backup bonding area 220 of the unit PX can be set corresponding to the non-opening area 13. In other words, the main bonding area 210 and at least one backup bonding area 220 overlap the non-opening area 13 accordingly. For example, multiple main bonding areas 210 can overlap the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4. The backup bonding area 220 can overlap the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4. Each main bonding area 210 includes two bonding pads 140. Each backup bonding area 220 includes two bonding pads 140. In the present embodiment, the bonding pads 140 can be used as electrodes for connecting electronic components. The electronic component may, for example, include a blue light-emitting diode 300B, a green light-emitting diode 300G or a red light-emitting diode 300R, but is not limited thereto. That is, each main bonding area 210 can be used to bond a blue LED 300B, a green LED 300G, or a red LED 300R, and in the top view direction, at least a portion of the main bonding area 210 overlaps with the electronic component (for example: a blue LED 300B, a green LED 300G, or a red LED 300R). Each backup bonding area 220 can be used to bond a blue LED 300B, a green LED 300G, or a red LED 300R, but is not limited thereto. In this embodiment, the number of backup bonding areas 220 is less than the number of main bonding areas 210. For example, Figure 1 It is shown that three main bonding areas 210 can be arranged in sequence along the Y axis and overlap the non-opening area 13, and two backup bonding areas 220 can be arranged along the Y axis following the main bonding areas 210 and overlap the non-opening area 13, but the present disclosure is not limited to this. That is, the main bonding area 210 and the backup bonding area 220 are connected or arranged adjacent to each other. In other embodiments, the backup bonding area 220 can be staggered with the main bonding area 210, or the backup bonding area 220 can be arranged at opposite ends of the main bonding area 210, but it is not limited to this. In addition, it should be noted that Figure 1 The number of the main joint area 210 and the number of the backup joint area 220 shown are only for illustration and are not used to specifically limit the present disclosure. In other embodiments, the number of the main joint area 210 can be two, four or more, and the number of the backup joint area 220 can be one, three or more, and the present disclosure is not limited thereto.

[0031] In the present embodiment, the definition of the unit PX is, for example, the area between the center lines L and L' of the opening areas 11 and 11' on the opposite sides of the main joint area 210 and the backup joint area 220 on the X-axis in the non-opening area 13. For example, the opening area 11 on the left side of the main joint area 210 and the backup joint area 220 is separated into two halves of equal area by the center line L. The opening area 11' on the right side of the main joint area 210 and the backup joint area 220 is separated into two halves of equal area by the center line L'. The area between the center line L of the opening area 11 and the center line L' of the opening area 11' can be called a unit PX. That is, the unit PX includes the main joint area 210 and the backup joint area 220 overlapping the non-opening area 13 and half of the two opening areas 11 and 11' on the opposite sides thereof, but is not limited thereto.

[0032] In this embodiment, the electronic device 10 may further include a light shielding layer BM ( Figure 1 (not shown). At least a portion of the light shielding layer BM corresponds to the overlapping non-opening area 13. For example, the light shielding layer BM can be disposed on the substrate 100 and disposed below the circuit layer ML on the Z axis. That is, at least a portion of the first circuit layer M1, the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4 is disposed above the light shielding layer BM and overlaps the light shielding layer BM. From another perspective, the light shielding layer BM does not overlap the opening area 11, but surrounds the opening area 11 corresponding to the non-opening area 13. Therefore, in some embodiments, when the multi-layer circuit layer cannot clearly present the data line and / or the scanning line, the area surrounded by the light shielding layer BM can be defined as the opening area 11. In addition, the main bonding area 210 and the backup bonding area 220 can correspond to the overlapping light shielding layer BM. In this embodiment, the light shielding layer BM is, for example, a black matrix, and its material may include metal or a light-proof resin doped with a colorant, or other suitable materials or a combination of the above materials, but is not limited thereto. The above metal example may be chromium (Chromium, Cr), but is not limited thereto. The resin may be epoxy resin or acrylic resin, or other suitable materials or a combination of the above materials, but is not limited thereto. Under the above configuration, the contrast of the electronic device 10 may be increased.

[0033] It is worth noting that the circuit layer ML, the main bonding area 210 and the backup bonding area 220 of the electronic device 10 of an embodiment of the present disclosure can overlap the light shielding layer BM and be arranged in the non-opening area 13 outside the opening area 11, so that the unit PX of the electronic device 10 can have a high transmittance through the opening area 11. Therefore, the unit PX can be applied as a unit with a penetrating display function. In this way, the electronic device 10 has a good visual effect or display quality. In addition, the main bonding area 210 is used to bond electronic components, and the backup bonding area 220 includes an electronic component reserved space 320 for bonding repair or backup electronic components. Therefore, the unit PX of the electronic device 10 can reserve space and have a design for realizing a repair unit. In this way, the electronic device 10 has good electrical quality.

[0034] The following will be Figure 2 and Figure 3 The simple schematic diagram and simple circuit diagram shown are used to illustrate the steps and methods of unit repair.

[0035] Figure 2 It is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure. Figure 3 for Figure 2 For the sake of clarity and convenience of explanation, Figure 2 and Figure 3 Some components are omitted from the illustration. Figure 2 , the electronic device 10A includes a unit PX. In some embodiments, the electronic device 10A further includes an opening area 11 and a non-opening area 13 surrounding the opening area 11. The light shielding layer BM overlaps the non-opening area 13 and surrounds the opening area 11. The unit PX includes a plurality of main bonding areas 210, 210', 210'' and at least one backup bonding area 220. The plurality of main bonding areas 210, 210', 210'' are arranged along the Y axis and overlap the non-opening area 13. At least one backup bonding area 220 is correspondingly disposed at one end of one of the main bonding areas (ex: the main bonding area 210) and overlaps the non-opening area 13. The main bonding area (ex: the main bonding area 210) and the backup bonding area 220 are respectively used to bond electronic components.

[0036] For example, the LED 300R is bonded to the main bonding area 210, the LED 300B is bonded to the main bonding area 210', and the LED 300G is bonded to the main bonding area 210". That is, in the top view direction (Z-axis direction), at least parts of the main bonding areas 210, 210', and 210" overlap with the LEDs 300R, 300G, and 300R, respectively. In addition, the backup bonding area 220 is adjacent to the main bonding area 210" where the LED 300G is disposed.

[0037] In this embodiment, the main junction area 210 is connected to the backup junction area 220. For example, please refer to Figure 2 and Figure 3 The LED 300R, the LED 300G and the LED 300B are connected to the backup bonding area 220 through wires or bridge circuits. The electronic device 10A has pre-welding points WP, WP', WP'' ( Figure 2 Only one pre-solder point WP is indicated) located between the backup joint area 220 and the main joint area 210, 210', 210'' connected to the backup joint area 220. For example, there is a pre-solder point WP between the main joint area 210 and the light-emitting diode 300R connected thereto and the backup joint area 220. There is a pre-solder point WP' between the main joint area 210' and the light-emitting diode 300G connected thereto and the backup joint area 220. There is a pre-solder point WP'' between the main joint area 210'' and the light-emitting diode 300B connected thereto and the backup joint area 220. In addition, the electronic device 10A also includes pre-cut points CP, CP', CP'' located between the pre-solder points WP, WP', WP'' and the main joint areas 210, 210', 210''. For example, there is a pre-cut point CP between the main joint area 210 and the light-emitting diode 300R connected thereto and the pre-solder point WP. There is a pre-cutting point CP' between the main bonding area 210' and the LED 300G bonded thereto and the pre-welding point WP'. There is a pre-cutting point CP'' between the main bonding area 210'' and the LED 300B bonded thereto and the pre-welding point WP''. Taking the LED 300R as an example, under the above-mentioned setting, when the LED 300R does not meet the inspection specifications (for example, including: dark spots, bright spots or appearance damage), the electronic device 10A can be repaired. The above-mentioned repairing process includes: bonding the electronic component for repair (for example, a red LED) to the bonding pad of the electronic component reserved space 320 in the backup bonding area 220; then performing a laser cutting process on the wire or bridge line at the pre-cutting point CP; and then performing a laser welding process on the pre-welding point WP. After completing the above-mentioned repairing process, after a voltage is provided to the electronic device 10A, the LED 300R bonded in the main bonding area 210 will not receive the voltage and will not emit light. The repair electronic component joined in the backup joint area 220 can receive the voltage and emit light. In this way, the electronic device 10A can complete the repair of the electronic component through the repair process, so the electronic device 10A can have good electrical quality.

[0038] It is worth noting that the number of the backup bonding areas 220 in the unit PX of the electronic device 10A of the present disclosure is less than the number of the main bonding areas 210, 210', 210". For example, Figure 2 and Figure 3The number of main bonding areas 210 shown is three, corresponding to the blue light-emitting diode 300B, the green light-emitting diode 300G and the red light-emitting diode 300R. The number of backup bonding areas 220 is one, that is, the backup bonding area 220 can be correspondingly bonded to a repair electronic component (for example: a blue light-emitting diode, a green light-emitting diode, and a red light-emitting diode arranged in the reserved space 320 of the electronic component), but the above-mentioned quantitative relationship is not used to limit the present disclosure. Under the above-mentioned setting, in the process of repairing the electronic device 10A, the repair electronic component can be selectively arranged in the reserved space. In this way, costs can be saved. In addition, since the reserved space can be reduced, the space for circuit setting can be increased, the requirements of high circuit density design can be met, or the transmittance of the opening area 11 can be improved. As a result, the electronic device 10A can have good electrical quality.

[0039] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the previous embodiments, and the following embodiments will not be repeated.

[0040] Figure 4 It is a partial top view schematic diagram of an electronic device according to yet another embodiment of the present disclosure. Figure 5 for Figure 4 For the sake of clarity and convenience of explanation, Figure 4 and Figure 5 Several components are omitted from the illustration. The electronic device 10B of this embodiment is substantially similar to Figure 2 and Figure 3The electronic device 10A of the present invention is described above, and therefore, the same and similar components in the two embodiments will not be repeated here. The main difference between the present embodiment and the electronic device 10A is that the electronic device 10B includes a unit PX, an opening area 11, and a non-opening area 13 surrounding the opening area 11. The unit PX includes three main bonding areas 210, 210', 210'', and two backup bonding areas 220, 220'. For example, the backup bonding area 220 can be arranged adjacent to the main bonding area 210, and the backup bonding area 220' can be arranged adjacent to the main bonding area 210'. The pre-welding point WP is arranged corresponding to the backup bonding area 220. The pre-welding point WP is arranged corresponding to the backup bonding area 220'. The electronic component reserved space 320 in the backup bonding area 220 can be joined to an electronic component for repair. The electronic component reserved space 320' in the backup bonding area 220' can be joined to another electronic component for repair, but the above-mentioned quantitative relationship is not used to limit the present disclosure. In this embodiment, the number of the backup bonding areas 220, 220' is less than the number of the main bonding areas 210, 210', 210". Since the reserved space can be reduced, the space for circuit arrangement can be increased, the requirements of high circuit density design can be met, or the penetration rate of the opening area 11 can be improved. Therefore, the electronic device 10B can also be repaired and have good electrical quality.

[0041] The following Figure 5 The circuit diagram shown briefly explains the steps and methods of unit repair.

[0042] Please refer to Figure 5 , the light-emitting diode 300R, the light-emitting diode 300G and the light-emitting diode 300B are connected to the backup bonding areas 220 and 220' respectively through wires or bridge lines. The electronic device 10B has pre-soldering points WP1, WP2, and WP3 located between the backup bonding area 220 or the backup bonding area 220' and the main bonding areas 210, 210', and 210''. For example, the main bonding area 210 and the light-emitting diode 300R bonded thereto and the backup bonding area 220 or the backup bonding area 220' have a pre-soldering point WP1. The main bonding area 210' and the light-emitting diode 300G bonded thereto and the backup bonding area 220 or the backup bonding area 220' have a pre-soldering point WP2. The main bonding area 210'' and the light-emitting diode 300B bonded thereto and the backup bonding area 220 or the backup bonding area 220' have a pre-soldering point WP3. In addition, the electronic device 10B further includes pre-cut points CP1, CP2, CP3 located between the pre-welding points WP1, WP2, WP3 and the main bonding areas 210, 210', 210". For example, the main bonding area 210 and the light emitting diode 300R bonded thereto have a pre-cut point CP1 (between the pre-welding point WP1 and the pre-welding point WP2). Figure 4The pre-cut point CP1 is disposed adjacent to the main bonding area 210). There is a pre-cut point CP2 (at Figure 4 The pre-cut point CP2 is disposed adjacent to the main bonding area 210'). There is a pre-cut point CP3 (at Figure 4 In the embodiment, the pre-cut point CP3 is disposed adjacent to the main bonding area 210 ″). Taking the LED 300R and the LED 300G as an example, under the above configuration, when the LED 300R and the LED 300G do not meet the inspection specifications (for example, including: dark spots, bright spots or appearance damage), the electronic device 10B can be repaired. The above repair process includes: bonding the electronic component for repair (e.g., a red light emitting diode) to the bonding pad of the electronic component reserved space 320 in the backup bonding area 220; then bonding the electronic component for repair (e.g., a green light emitting diode) to the bonding pad of the electronic component reserved space 320' in the backup bonding area 220'; then performing a laser cutting process on the wire or bridge circuit at the pre-cut point CP1; then performing a laser cutting process on the wire or bridge circuit at the pre-cut point CP2; then performing a laser cutting process on the wire or bridge circuit at the pre-cut points CP5, CP7, and CP8; then performing a laser welding process on the pre-welding point WP1 and the pre-welding point WP2. After completing the above repair process, after providing a voltage to the electronic device 10B, the light emitting diode 300R bonded in the main bonding area 210 and the light emitting diode 300G bonded in the main bonding area 210' will not receive the voltage and will not emit light. The repair electronic components respectively bonded in the backup bonding area 220 and the backup bonding area 220 ′ can receive the above voltage and emit light.

[0043] In some embodiments, please refer to Figure 5When the light emitting diode 300B does not meet the inspection specifications (for example, including: dark spots, bright spots or appearance damage), and still does not meet the inspection specifications after the first repair, the electronic device 10B can be repaired for the second time. For example, the electronic component for the first repair (for example, a blue light emitting diode) is bonded to the bonding pad of the electronic component reserved space 320 in the backup bonding area 220; then the wire or bridge circuit is laser cut at the pre-cut point CP3; then the laser welding process is performed at the pre-welding point WP3, and then a voltage is provided to the electronic device 10B to test the light quality of the electronic component for the first repair. If it still does not meet the inspection specifications, a second repair process is performed, and the electronic component for the second repair (for example, a blue light emitting diode) is bonded to the bonding pad of another electronic component reserved space 320' in another backup bonding area 220'; then the wire or bridge circuit is laser cut at the pre-cut points CP7, CP8, and CP9. After the above repair process is completed, a voltage is provided to the electronic device 10B again, and the LED 300B connected to the main bonding area 210 ″ will not receive the voltage and will not emit light, while the repair electronic component connected to the backup bonding area 220 ′ can receive the above voltage and emit light.

[0044] As a result, the electronic device 10B can complete the repair of the electronic components through the repair process, so the electronic device 10B can have good electrical quality.

[0045] It should be noted here that the above-mentioned repair process is only illustrated by taking LED 300R and LED 300G as electronic components that do not meet the inspection specifications. The definition of not meeting the inspection specifications may include: the electronic component emits light exceeding the preset average brightness (i.e., too bright), emits light below the preset average brightness (i.e., too dark), or does not emit light (i.e., not bright). Alternatively, the electronic component may be damaged, resulting in a defective appearance. In addition, the size of the electronic component is larger than the preset average size or smaller than the preset average size can also be determined to be non-compliant with the inspection specifications, but the present embodiment is not limited to the above examples. In addition, LED 300R and LED 300B may also be electronic components that do not meet the inspection specifications. Alternatively, any one of LED 300R, LED 300G, or LED 300B is an electronic component that does not meet the inspection specifications, and the present disclosure is not limited to this.

[0046] Figure 6 This is a partial top view of an electronic device according to another embodiment of the present disclosure. For the sake of clarity and convenience of description, Figure 6 Some components are omitted from the illustration. The electronic device 10C of this embodiment is substantially similar to Figure 4The electronic device 10B, therefore, the same and similar components in the two embodiments are not repeated here. The difference between this embodiment and the electronic device 10B is mainly that the electronic device 10C includes a unit PX, an opening area 11, and a non-opening area 13 surrounding the opening area 11. The electronic components respectively bonded to the main bonding areas 210, 210', and 210'' in the unit PX are blue light-emitting diodes 300B. The electronic device 10C also includes a light conversion layer 340R or a light conversion layer 340G. The light conversion layer 340R overlaps the blue light-emitting diode 300B in the main bonding area 210. The light conversion layer 340G overlaps the blue light-emitting diode 300B in the main bonding area 210'.

[0047] For example, the light conversion layer 340R includes a quantum dot (QD) material that emits red light. The light conversion layer 340G includes a quantum dot material that emits green light. Under the above configuration, the blue light emitted by the blue light emitting diode 300B can be converted into red light by the light conversion layer 340R. Similarly, the blue light emitted by the blue light emitting diode 300B can be converted into green light by the light conversion layer 340G. In this way, the electronic device 10C can achieve the need to generate light of different colors by setting a blue light emitting diode 300B and matching quantum dot materials of different colors. In addition, the electronic device 10C can also achieve excellent technical effects similar to the above embodiments.

[0048] In summary, in an electronic device of an embodiment of the present disclosure, since the circuit layer, the main bonding area and the backup bonding area can overlap the light shielding layer and be arranged in a non-opening area outside the opening area, the unit of the electronic device can be a unit with a high transmittance through the opening area. In this way, the electronic device can be applied as a penetrating electronic device, or have a good visual effect or display quality. In addition, the main bonding area is connected to the backup bonding area to connect the electronic components for repair or backup through the backup bonding area. Therefore, the unit of the electronic device has a space reserved for setting the electronic components, and has a design for realizing the repair unit. In this way, the electronic device has good electrical quality. In addition, since the number of backup bonding areas can be less than the number of main bonding areas, the reserved space can be reduced to increase the layout of high-density circuits or improve the transmittance of the opening area, and the electronic components for repair can be selectively arranged in the reserved space. In this way, the electronic device can save costs, increase the space for circuit setting, meet the needs of high circuit density design or improve the transmittance of the opening area. Thus, the electronic device can have good electrical quality.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic device, characterized in that: include: substrate; A multi-layer circuit layer is disposed on the substrate, the multi-layer circuit layer includes at least one data line, at least one scan line, a plurality of main bonding pads and a plurality of backup bonding pads, wherein the plurality of main bonding pads are used to bond electronic components, and the plurality of backup bonding pads are used to bond repair or backup electronic components; a light shielding layer, disposed on the substrate and overlapping the multi-layer circuit layer, wherein the material of the light shielding layer comprises metal; and An opening is surrounded and enclosed by the light shielding layer, and the opening is used to allow ambient light to penetrate, wherein the opening does not overlap with the plurality of main bonding pads and the plurality of backup bonding pads.

2. The electronic device according to claim 1, characterized in that: The electronic component includes at least one of a passive component and an active component.

3. The electronic device according to claim 2, characterized in that: The at least one of the passive component and the active component includes a capacitor, a resistor, an inductor, a diode or a transistor.

4. The electronic device according to claim 1, characterized in that: The at least one data line and the at least one scan line are arranged in different layers.

5. The electronic device according to claim 4, characterized in that: The plurality of main bonding pads, the at least one data line and the at least one scan line are disposed in different layers, and the plurality of backup bonding pads, the at least one data line and the at least one scan line are disposed in different layers.

6. The electronic device according to claim 1, characterized in that: The electronic component includes a blue light emitting diode, a green light emitting diode or a red light emitting diode.

7. The electronic device according to claim 1, characterized in that: The electronic assembly includes a plurality of blue light emitting diodes, and the electronic device further includes: The light conversion layer overlaps one of the plurality of blue light emitting diodes.

8. The electronic device according to claim 7, characterized in that: The light conversion layer includes quantum dot material.

9. The electronic device according to claim 8, characterized in that: The quantum dot material emits red light or green light.

10. The electronic device according to claim 1, characterized in that: The number of the main bonding pads is different from the number of the backup bonding pads.

Images