Hot press for circuit board processing
By introducing the automatic positioning and clamping clamping assembly and the cooling function of the air cooler in the hot press, the problem of manual alignment difficulty and scalding after hot pressing in the existing hot press is solved, achieving more efficient loading and safer operation.
Patent Information
- Application Number
- CN202411928987.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-03-28
AI Technical Summary
During the processing of multi-layer printed circuit boards, the design of existing hot presses makes it difficult to manually align the boards, which reduces the loading efficiency, and the board temperature is high after hot pressing, making scalds easily occur when taken out.
A hot press for circuit board processing is designed, using multiple clamping components and a cooler. The clamping components automatically position and clamp the circuit board through the motor-driven screw and positioning seat structure, and the cooler dissipates heat through the air outlet hole.
It improves the feeding efficiency of circuit boards, reduces the need for manual alignment, and improves operating safety through the cooling function of the air cooler and reduces the risk of scalding.