Flip light emitting diode chip and preparation method thereof
By designing a bonding layer with a refractive index higher than or equal to the substrate in a flip-mounted light emitting diode chip, the problem of color casting caused by a small luminous angle is solved, and a wider luminous angle and more accurate color display is achieved.
CN119730505APending Publication Date: 2025-03-28HC SEMITEK (SUZHOU) CO LTD
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Patent Information
- Application Number
- CN202411566588.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-03-28
AI Technical Summary
Technical Problem
The light emitting angle of the flip-mounted light emitting diode chip is small, which leads to prone to color casts in display applications.
Method used
By designing a bonding layer in a flip-up light emitting diode chip, its refractive index is greater than or equal to the refractive index of the substrate, thereby controlling the transmission direction of light and increasing the light emitting angle.
Benefits of technology
Effectively improve the light emission angle of the flip-mounted light-emitting diode chip, avoiding color casting in display applications.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides a flip light-emitting diode chip and a preparation method thereof, and belongs to the technical field of semiconductors. The light-emitting diode chip comprises a substrate, a bonding layer and an epitaxial layer which are stacked in sequence. The refractive index of the bonding layer is larger than or equal to that of the substrate. According to the invention, the light-emitting angle of the flip light-emitting diode chip can be improved.
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