Composition for temporary fixing, method for manufacturing bonded structure, and use of composition for temporary fixing

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By using a temporary fixation composition containing a specific organic component, the two bonded materials are quickly cured and bonded after coating, and the problems of long curing time and insufficient viscosity in the prior art are solved, and an efficient bonding process is achieved.

CN119731789APending Publication Date: 2025-03-28MITSUI MINING & SMELTING CO LTD

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Patent Information

Application Number: CN202380059505.2
Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner
Priority Date: 2022-08-31
Filing Date: 2023-07-26
Publication Date: 2025-03-28

Application Information

Patent Timeline

31 Aug 2022

Priority

26 Jul 2023

Application

CN202380059505.2

28 Mar 2025

Publication

CN119731789A

IPC: H01L25/07; B22F1/10; B22F7/08; H01L25/18

CPC: B22F7/064; B22F1/107; B22F1/052; H10W72/07331; H10W72/30; B22F7/08; B22F1/10; B23K35/3612

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Application Domain

Transportation and packaging Solid-state devices

Technology Topics

Nitrogen gas Mechanical engineering

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AI Technical Summary

Technical Problem

The liquid temporary fixative used in the prior art cures for a long time after coating and is easily penetrated into the dry film of the paste, resulting in insufficient viscosity.

Method used

A temporary fixation composition is provided, which contains the first organic component as a solid at 25°C in a ratio of 42% by mass or more and 95% by mass or less, and the weight loss temperature in nitrogen is 300°C or less. The composition is used for temporary fixation before joining the two bonded materials and bonding through a firing process.

Benefits of technology

The composition can cure in a short time, shorten the process time, while ensuring the viscosity of the joint and avoiding the penetration of temporary fixatives.

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Abstract

This temporary fixing composition contains an organic component in a ratio of 42-95 mass%, said organic component being a solid at 25 DEG C and having a mass 95% weight loss temperature in nitrogen of 300 DEG C or less. And a temporary fixing composition for temporarily fixing the first material to be joined and the second material to be joined before joining the first material to be joined and the second material to be joined. A method for producing a bonded structure according to the present invention comprises a step for temporarily fixing a first material to be bonded and a second material to be bonded by interposing the temporary fixing composition between the first material to be bonded and the second material to be bonded, and firing the temporarily fixed two materials to bond the two materials.

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