Weight and / or layer thickness measurement apparatus and substrate processing system and method

By using a resonant frequency measurement system in the manufacturing process of semiconductor devices, the problem of difficulty in quickly and accurately measuring the thickness and weight of the substrate material layer in the prior art is solved, and an efficient and accurate production process is achieved, reducing defects and waste.

CN119737850APending Publication Date: 2025-04-01ASM IP HLDG BV
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Patent Information

Application Number
CN202411349144.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-29
Filing Date
2024-09-26
Publication Date
2025-04-01

AI Technical Summary

Technical Problem

In the manufacturing process of semiconductor device, prior art is difficult to measure the thickness and weight of the material layer on the substrate quickly and accurately, resulting in the potential production of a large number of defective products, increasing waste and cost.

Method used

A weight and/or layer thickness measurement system is used to determine the weight and/or layer thickness of the object by integrating a metering station in the substrate processing system to achieve in-situ or in-line measurement.

Benefits of technology

It realizes the rapid and precise determination of the thickness and weight of the material layer on the substrate during layer deposition and etching, reducing production defects and waste, and improving production efficiency and product quality.

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Abstract

A weight and / or layer thickness measurement system includes: (a) a support base for supporting an object; (b) an oscillator source applying an oscillation frequency to the support base; (c) a strain sensor measuring strain in the support base caused by the oscillation; and (d) a phase-locked loop module connected to the oscillator source and the strain sensor. The oscillation frequency applied to the support base is modified based on the phase difference information determined by the phase-locked loop module to locate the resonant frequency of the support base and the supported object. The resonant frequencies before and after processing are used for determining the weight and / or thickness of the upper layer of the object. The cluster-type substrate processing system may include weight and / or layer thickness measurement systems within the substrate handling chamber and / or in separate chambers or stations engaged with the substrate handling chamber, such as these types of systems.
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