A method, apparatus, and medium for analyzing the service life of internal copper wires of a flexible circuit board
By establishing a flexible circuit board model and fatigue analysis and calculating the fatigue life of copper wire, the problem of difficult prediction of copper wire fatigue failure risk in existing technologies is solved, and the production quality and design guidance of flexible circuit boards are improved.
Patent Information
- Application Number
- CN202411724142.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2044-11-28
AI Technical Summary
Existing technology does not have an effective method to analyze the service life of copper wires inside flexible circuit boards, resulting in unpredictable risks of copper wire fatigue failure, which affects the normal function of electronic equipment.
By establishing a flexible circuit board model, the tensile strength and elastic modulus of the copper wire are obtained, the stress fatigue curve is determined, and the load is applied under preset constraints. A cyclic working condition is established, and the fatigue life of the copper wire is calculated using fatigue analysis software.
Effectively analyze the fatigue life of copper wires inside flexible circuit boards, shorten the time to obtain stress fatigue curves, improve production quality and guide design improvements.