Wafer double-sided coating device and double-station wafer coating device
By designing a double-sided wafer coating device with flipable vehicles and double-sided targets, the problems of complex equipment and wafer contamination in the prior art are solved, and an efficient and reliable double-sided coating process is achieved.
CN119753600AActive Publication Date: 2025-04-04WUXI SHANGJI SEMICON TECH CO LTD
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Patent Information
- Application Number
- CN202510171192.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2045-02-17
AI Technical Summary
Technical Problem
In the prior art, the equipment configuration of double-sided coating of wafers is complex, which increases the layout cost and floor area of the equipment, and may lead to contamination of the wafers and affect the process effect.
Method used
A double-sided wafer coating device is designed, using a flipped vehicle and a double-sided target material. By flipping it once, the wafer can be quickly changed to achieve sequential coating on both front and back sides of the wafer.
Benefits of technology
It simplifies equipment layout, reduces cost and floor area, improves coating efficiency, reduces the risk of contamination of wafers, and ensures the reliability of wafer flip motion.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a wafer double-sided coating device and a double-station wafer coating device.The wafer double-sided coating device comprises a working cavity, a carrier and a target material, the carrier comprises a material receiving part, a magnetic attraction part, an overturning driving part and a moving mechanism, and the carrier can fix and overturn a wafer after receiving the wafer; the front and back surfaces of the wafer can be coated in sequence through the reversible carrier and the target material, the carrier magnetically attracts the material receiving piece through the magnetic attraction piece, the wafer can be fixed, the wafer can be conveniently positioned and overturned, the wafer is prevented from being damaged by pressing due to unstable pressure, and the reliability of the overturning movement of the wafer is ensured; the double-station wafer coating device comprises a working cavity, two carriers and a target material, the two carriers are arranged in the working cavity at intervals in the vertical direction, and the target material is arranged between the two carriers and provided with two target surfaces. The double-sided target material is arranged, and a group of carriers are respectively arranged facing the target material, so that double-sided coating of two groups of wafers can be simultaneously carried out in one working cavity, and the coating efficiency is further improved.
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