A Strategy for Estimating Junction Temperature of IGBTs in Motor Controllers

By calculating the average loss within one electrical cycle and establishing a thermal network model, the problems of large calculation and large loss parameters acquisition problems are solved, and more efficient and accurate IGBT junction temperature estimation and protection are achieved.

CN119756626APending Publication Date: 2025-04-04EWEA-TECH CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202411838337.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

The traditional IGBT junction temperature estimation method has a large amount of calculation and the workload of obtaining loss parameters has been large, which has resulted in insufficient protection or aggressiveness and inability to effectively protect the IGBT.

Method used

The method of calculating the average loss in one electrical cycle is used to measure the three-phase current and bus voltage, combine Vce, Rce, Vf, and Rf at different temperatures to calculate the conduction and switching losses, and establish a thermal network model to calculate the junction temperature rise, and finally obtain the IGBT junction temperature.

Benefits of technology

The workload of obtaining calculation and loss parameters is greatly reduced, the efficiency and accuracy of junction temperature estimation are improved, and the effective protection of IGBT is ensured.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention discloses an IGBT junction temperature estimation strategy for a motor controller, which measures and collects three-phase current and bus voltage, and calculates the effective value of phase current; according to V extracted at different temperatures, ce , R ce 、V f , R f , calculate the conduction loss by combining the calculated power factor angle and modulation ratio; obtain the switching loss at different temperatures according to the switching frequency and bus voltage; extract the IGBT thermal impedance curve, bring the loss into the established thermal network model to calculate the junction temperature rise, and add it to the basic junction temperature of the corresponding module to obtain the final IGBT junction temperature. The present invention adopts a method of calculating the average loss within one electrical cycle, and does not need to calculate the loss and junction temperature in each switching cycle.
Need to check novelty before this filing date? Find Prior Art