Display device

By using inkjet printing method to install ultraviolet curable materials on the bending area and the packaging layer in the manufacturing process of the flexible display device, the upper protective layer and the bending area protective layer are formed, and the problems of damage and high cost in the manufacturing process are solved, and the effect of simplifying the process and improving productivity is achieved.

CN119768012APending Publication Date: 2025-04-04SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202411967849.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2018-10-11
Filing Date
2019-10-09
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

In the process of manufacturing flexible display devices, damage to the display devices is prone to occur, and the existing processes are complex and the material costs are high, resulting in low productivity and output.

Method used

Using a display device design including a substrate, an organic light emitting element, an encapsulation layer and a bending area protective layer, an ultraviolet curable material is provided on the bending area and the encapsulation layer by inkjet printing to form an upper protective layer and a bending area protective layer to reduce damage, simplify the process and reduce material costs.

Benefits of technology

It effectively prevents damage to the display device in the manufacturing process, simplifies the manufacturing process, reduces material costs, and thus increases productivity and output.

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Abstract

A display device is provided. The display device includes: a substrate including a bending area at which the display device is bendable; an organic light emitting element disposed on the substrate; an encapsulation layer covering an upper surface and a side surface of the organic light emitting element; and a bending region protection layer covering the bending region of the substrate. The upper surface of the encapsulation layer includes a nanostructure defined by nano-sized protrusions and recesses of the upper surface of the encapsulation layer, and the bending region is disposed apart from the encapsulation layer along the substrate.
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