Conductive particles, method for producing same, and conductive material
By forming a plurality of protrusions on the conductive layer of the conductive particles and controlling their height deviation, the existing problems of high connection resistance and short circuit of the conductive particles are solved, and the effects of low connection resistance and excellent insulation are achieved.
Patent Information
- Application Number
- CN202380061972.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-08-25
- Filing Date
- 2023-08-07
- Publication Date
- 2025-04-04
AI Technical Summary
When existing conductive particles are used in electronic devices for electrode connection, the connection resistance is large and it is easy to cause short circuits in the insulating parts, which cannot meet the requirements of minimizing and precision of electronic devices.
By forming a plurality of protrusions on the conductive layer and controlling the height deviation of the protrusions between 0.01 and 0.25, the contact efficiency and balance between the conductive particles and the electrode are improved, thereby reducing the connection resistance and suppressing short circuits.
The low connection resistance, excellent insulation and high connection reliability of conductive particles are achieved, short circuits in the insulated parts are avoided, and the performance and reliability of electronic equipment are improved.