LED display screen, LED display module and preparation method thereof

Abstract

The invention provides an LED display screen, an LED display module and a preparation method of the LED display module. The LED display module comprises a PCB substrate, a plurality of LED lamp beads and a protective layer. The outer surface of the PCB substrate comprises a first surface and a second surface which are oppositely arranged, a plurality of hollow holes are formed in the PCB substrate, and each hollow hole penetrates through the first surface and the second surface; the plurality of LED lamp beads are arranged on the first surface of the PCB substrate at intervals; the protection layers are formed by coating the outer surface of the PCB substrate with an adhesive, the protection layer located on the first surface is distributed between every two adjacent LED lamp beads, the protection layer located on the first surface and the protection layer located on the second surface are both penetrated by the hollowed-out holes, and the hollowed-out holes are filled with the protection layers. The protective layer formed by curing the adhesive on the surface of the PCB substrate replaces a mask and a bottom shell in the prior art, the structure is simple, and a better display effect can be provided.

Description

Technical Field

[0001] The present invention relates to the technical field of LED display, and mainly to an LED display screen, an LED display module and a preparation method thereof. Background Art

[0002] The LED stage rental transparent screen consists of a display module and a box frame. The display module consists of a light board, a mask on the surface of the light board, and a bottom shell on the back of the light board. The current production and maintenance process of the display module is relatively cumbersome. The light board is fixed to the back shell by screws, glue is poured, and then the mask is fixed to the bottom shell by screws. During maintenance, it is necessary to remove the screws that fix the mask, remove the potting glue, and then remove the screws that fix the light board. The maintenance process is relatively troublesome.

[0003] Moreover, in the structure of the display module of the LED stage rental transparent screen, due to the deformation problem caused by the lack of strength and poor support of the hollow part of the bottom shell, the light board cannot be completely fitted to the bottom shell, resulting in a gap, which easily causes glue leakage during glue pouring and requires secondary rework, seriously affecting production efficiency. At the same time, the hollow part of the mask of the LED stage rental transparent screen cannot be fixed by screws or buckles, and it is easy to warp and block the light-emitting surface of the LED lamp beads, thereby affecting the display effect and viewing experience of the LED stage rental transparent screen. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide an LED display screen, an LED display module and a preparation method thereof.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] One aspect of the present invention provides an LED display module, comprising: a PCB substrate, the outer surface of the PCB substrate comprising a first surface and a second surface arranged opposite to each other, the PCB substrate being provided with a plurality of hollow holes, each of the hollow holes penetrating the first surface and the second surface; a plurality of LED lamp beads arranged at intervals on the first surface of the PCB substrate; a protective layer, the protective layer being formed by coating the outer surface of the PCB substrate with an adhesive, the protective layer located on the first surface being distributed between two adjacent LED lamp beads, wherein the protective layer located on the first surface and the protective layer located on the second surface are both penetrated by the hollow holes, and the protective layer is filled in the hollow holes.

[0007] According to an embodiment of the present invention, the protective layer includes a first sub-protective layer, a second sub-protective layer, a third sub-protective layer and a fourth sub-protective layer; the first sub-protective layer covers the first surface of the PCB substrate and is filled at the connection between the LED lamp bead and the PCB substrate, so as to cover the outside of the first surface; the second sub-protective layer covers the second surface of the PCB substrate and is covered at the outside of the second surface; the outer surface of the PCB substrate includes a peripheral side surface connected between the first surface and the second surface, the third sub-protective layer covers the outside of the peripheral side surface and is connected between the first protective layer and the second protective layer; the fourth sub-protective layer covers the hollow hole and is connected to the hollow hole connection of the first sub-protective layer and the second sub-protective layer.

[0008] According to an embodiment of the present invention, the fourth sub-protective layer is provided with a connection hole, the connection hole passes through the first sub-protective layer, the PCB substrate and the second sub-protective layer, and the connection hole is used for a connector to pass through.

[0009] According to an embodiment of the present invention, the connecting hole includes a first through portion and a second through portion arranged along the axial direction thereof, the first through portion and the second through portion are connected, and both the first through portion and the second through portion penetrate the PCB substrate along the thickness direction of the PCB substrate;

[0010] The first through-portion is used to match with the head of the connector, and the second through-portion is used to match with the connecting portion of the connector, wherein the thickness of the fourth sub-protective layer located at the second through-portion is in the range of 0.5 mm to 1 mm.

[0011] According to an embodiment of the present invention, the ratio of the thickness of the first sub-protection layer to the height of the LED lamp bead is in a range of 1 / 2 to 1 / 3.

[0012] According to an embodiment of the present invention, the thickness of the second sub-protection layer is in the range of 0.5 mm to 2 mm.

[0013] According to an embodiment of the present invention, the thickness of the third sub-protection layer is in the range of 0.5 mm to 1 mm.

[0014] According to an embodiment of the present invention, the hardness of the first sub-protective layer, the second sub-protective layer, the third sub-protective layer and the fourth sub-protective layer ranges from 40D to 80D.

[0015] According to an embodiment of the present invention, the optical density of the first sub-protection layer, the second sub-protection layer, the third sub-protection layer and the fourth sub-protection layer is 2.5-3.0.

[0016] According to an embodiment of the present invention, the LED display module further includes a driver IC, which is disposed on the second surface and electrically connected to the plurality of LED lamp beads, and the third sub-protective layer covers the outer surface of the driver IC.

[0017] According to an embodiment of the present invention, the adhesive includes packaging glue, and the packaging glue is matte black.

[0018] According to an embodiment of the present invention, the packaging glue includes one of epoxy glue, polyurethane glue and acrylate glue.

[0019] A second aspect of the present invention provides a method for preparing an LED display module, which is used to prepare the LED display module described in any of the above embodiments, and the preparation method comprises the following steps:

[0020] Soldering a plurality of LED lamp beads at intervals on a PCB substrate to form an LED lamp board, wherein the PCB substrate is provided with a plurality of hollow holes;

[0021] In a vacuum state, the adhesive is coated on the outer surface of the LED light board, and the adhesive is cured on the outer surface of the LED light board to form the protective layer.

[0022] According to an embodiment of the present invention, the adhesive is cured by one of room temperature curing, heating curing and ultraviolet curing.

[0023] According to an embodiment of the present invention, the adhesive is a matte black polyurethane system glue.

[0024] According to an embodiment of the present invention, curing the adhesive includes: applying ultraviolet light to the LED light board, and the curing wavelength range of the ultraviolet light is 340NM to 400NM.

[0025] The third aspect of the present invention provides an LED display screen, comprising an LED display module, a box frame and a connecting piece as described in any of the above embodiments, wherein the connecting piece is inserted into the connecting hole of the LED display module to fix the LED display module to the box frame.

[0026] Beneficial effects:

[0027] In the LED display module disclosed in the present application, a protective layer is formed by curing an adhesive on the surface of a PCB substrate, and the protective layer is used to replace the bottom shell and the mask of the LED display module in the prior art. Specifically, the protective layer located on the first surface can be used to cover and protect the LED lamp beads and the PCB substrate, thereby replacing the mask set on the first surface in the prior art, and the protective layer located on the second surface can be used to cover and protect the second surface of the PCB substrate, thereby replacing the bottom shell set on the second surface in the prior art. In this way, the bottom shell and the mask of the LED display module can be eliminated by setting a protective layer, thereby effectively reducing the problem of glue leakage caused by deformation of the hollow part of the bottom shell and the hollow part of the mask easily warping and blocking the light-emitting surface of the LED lamp beads, and effectively improving the display effect of the LED display screen. Moreover, the protective layer is filled in each hollow hole of the PCB substrate, and the position of the hollow hole can also be covered and protected. Furthermore, the protective layer covers the outer surface of the PCB substrate, which can prevent the PCB substrate from being damaged by the external environment, and can also serve as a structural support to enhance the overall strength of the LED display module. The provision of the protective layer also simplifies the module structure, thereby reducing production costs and assembly complexity. At the same time, since the protective layer covers the outer surface of the PCB substrate, it protects the PCB substrate and the LED lamp beads arranged on the first surface thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a top view of an LED display module in one embodiment of the present application;

[0029] Figure 2 yes Figure 1 A local enlarged view of point A in FIG.

[0030] Figure 3 yes Figure 1 Schematic diagram of the cross section at AA in FIG.

[0031] Figure 4 for Figure 3 A partial enlarged view of point B;

[0032] Figure 5 for Figure 3 A partial enlarged view of point C;

[0033] Figure 6 This is a flow chart of a method for preparing an LED display module in one embodiment of the present application;

[0034] Figure 7 This is a schematic diagram of an LED display screen in one embodiment of the present application;

[0035] The corresponding relationship between the reference numerals and the component names is as follows:

[0036] 100. LED display module;

[0037] 1. PCB substrate; 101. first surface; 102. second surface; 103. peripheral side surface;

[0038] 2. LED lamp beads;

[0039] 3. Protective layer; 301. Connecting hole; 3011. First shaft section hole; 3012. Second shaft section hole; 31. First sub-protective layer; 32. Second sub-protective layer; 33. Third sub-protective layer; 34. Fourth sub-protective layer;

[0040] 200, box frame;

[0041] 300. Connectors. DETAILED DESCRIPTION

[0042] The present invention provides an LED display screen, an LED display module and a method for manufacturing the same. To make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the scope of protection of the present invention.

[0043] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the prior art, the display module of the LED stage rental transparent screen consists of a light board, a mask on the surface of the light board, and a bottom shell on the back of the light board. The light board is fixed to the back shell by screws, glue is poured, and then the mask is fixed to the bottom shell by screws. During maintenance, the screws fixing the mask need to be removed, the potting glue is removed, and then the screws fixing the light board are removed, which makes the maintenance process more troublesome.

[0046] Moreover, in the structure of the display module of the LED stage rental transparent screen, due to the deformation problem caused by the lack of strength and poor support of the hollow part of the bottom shell, the light board cannot be completely fitted to the bottom shell, resulting in a gap, which easily causes glue leakage during glue pouring and requires secondary rework, seriously affecting production efficiency. At the same time, the hollow part of the mask of the LED stage rental transparent screen cannot be fixed by screws or buckles, and it is easy to warp and block the light-emitting surface of the LED lamp beads, thereby affecting the display effect and viewing experience of the LED stage rental transparent screen.

[0047] Therefore, it is necessary to design an LED display module that can solve the problems of mask warping and blocking the light-emitting surface, the inability of the light board bottom shell to fully fit resulting in glue leakage during glue pouring, and high maintenance efficiency.

[0048] Figure 1 is a top view of an LED display module in one embodiment of the present application; Figure 2 yes Figure 1 A local enlarged view of point A in FIG. Figure 3 yes Figure 1 Schematic diagram of the cross section at AA in FIG.

[0049] Combination Figure 1 , Figure 2 and Figure 3 It can be understood that an embodiment of one aspect of the present invention provides an LED display module 100 , including a PCB substrate 1 , a plurality of LED lamp beads 2 and a protective layer 3 .

[0050] The PCB substrate 1 includes a first surface 101 and a second surface 102 that are opposite to each other. A plurality of hollow holes are provided on the PCB substrate 1 , and each hollow hole passes through the first surface 101 and the second surface 102 .

[0051] The first surface 101 and the second surface 102 are disposed on opposite sides of the board body of the PCB substrate 1, the first surface 101 can be represented as the upper surface of the PCB substrate 1, and the second surface 102 can be represented as the lower surface of the PCB substrate 1. A hollow hole is provided through the PCB substrate 1, and specifically, the axial ends of the hollow hole penetrate the first surface 101 and the second surface 102 respectively.

[0052] A plurality of LED lamp beads 2 are arranged at intervals on the first surface 101 of the PCB substrate 1. The plurality of LED lamp beads 2 are arranged at intervals to maintain good lighting effect and viewing angle uniformity of the LED lamp beads 2. The plurality of LED lamp beads 2 and the PCB substrate 1 together constitute a light board of the LED display module 100.

[0053] The protective layer 3 is formed by coating the outer surface of the PCB substrate with an adhesive. It should be noted that an adhesive generally refers to a substance that can connect two or more homogeneous or heterogeneous materials together and has sufficient strength after curing. After the adhesive is coated on the outer surface of the PCB substrate, a protective layer connected to the outer surface of the PCB substrate can be formed.

[0054] The protective layer located on the first surface is distributed between two adjacent LED lamp beads, wherein the protective layer located on the first surface and the protective layer located on the second surface are both penetrated by hollow holes, and the protective layer is filled in each hollow hole.

[0055] Specifically, the protective layer 3 covering the outer surface of the PCB substrate 1 is formed by coating the outer surface of the PCB substrate 1 with an adhesive, wherein the protective layer 3 covers all surfaces of the PCB substrate 1, and the protective layer 3 can provide comprehensive protection for the PCB substrate 1. Moreover, the protective layer 3 located on the first surface 101 is also distributed between adjacent LED lamp beads 2, which not only provides sufficient structural strength, but also ensures a close fit between the LED lamp board and the protective layer 3, thereby reducing gaps.

[0056] The protective layer 3 is filled in the hollow hole. By filling the protective layer 3 on the inner surface of the hollow hole, the area of ​​the PCB substrate 1 with the hollow hole can be further protected, avoiding the problem of insufficient strength and easy damage of the PCB substrate 1 due to the setting of the hollow hole.

[0057] In the LED display module 100 disclosed in the present application, the protective layer 3 is formed by curing the adhesive on the surface of the PCB substrate 1, and the protective layer 3 is used to replace the bottom shell and the mask of the LED display module 100 in the prior art. The protective layer 3 can not only cover and protect the LED lamp beads 2 and the PCB substrate 1 to prevent them from being damaged by the external environment, such as moisture, dust and mechanical impact, but also can be used as a structural support to enhance the overall strength of the LED display module 100, simplify the module structure, and thus reduce the production cost and assembly complexity. At the same time, it can also avoid the problem of glue leakage due to deformation of the hollow part of the bottom shell and the problem of the hollow part of the mask being easily warped and blocking the light-emitting surface of the LED lamp beads 2.

[0058] Specifically, the protective layer 3 is formed by curing the adhesive on the entire outer surface of the PCB substrate 1, so that the protective layer 3 and the PCB substrate 1 have better adhesion performance, avoiding the problem of gaps caused by the inability to fully fit the PCB substrate 1 when it is fixed to the bottom shell. By providing a hollow hole on the PCB substrate 1, the hollow hole is filled with the protective layer 3, thereby also protecting the hollow hole on the PCB substrate.

[0059] In some embodiments, the protection layer includes a first subprotecting layer 31 , a second subprotecting layer 32 , a third subprotecting layer 33 and a fourth subprotecting layer 34 .

[0060] The first sub-protective layer 31 covers the first surface of the PCB substrate and fills the connection between the LED lamp bead and the PCB substrate to cover the outside of the first surface. The first sub-protective layer 31 can replace the mask in the prior art and protect the first surface of the PCB substrate by covering the first surface and thus playing the role of the mask covering the outside of the first surface.

[0061] The second sub-protective layer 32 covers the second surface of the PCB substrate, so as to cover the outside of the second surface. The second sub-protective layer 32 can replace the bottom shell in the prior art, and by covering the second surface, it plays the role of protecting the second surface of the PCB substrate as the bottom shell covers the outside of the second surface.

[0062] The outer surface of the PCB substrate includes a peripheral side surface connected between the first surface and the second surface, and the third sub-protective layer 33 covers the outer side of the peripheral side surface and is connected between the first protective layer and the second protective layer. Among them, the peripheral side surface is covered with the third sub-protective layer 33, which can protect the peripheral side surface of the PCB substrate. Moreover, the first sub-protective layer 31, the second sub-protective layer 32 and the third sub-protective layer 33 can jointly constitute a protective structure for each surface of the PCB substrate, effectively preventing it from being damaged by the external environment. At the same time, the overall structure of the LED display module can be simplified, and the risk of leaking glue due to deformation of the hollow part of the bottom shell and the risk of the hollow part of the mask being easily warped and blocking the light-emitting surface of the LED lamp beads can be effectively reduced.

[0063] The fourth sub-protective layer 34 covers the hollow hole and connects the hollow hole connection of the first sub-protective layer 31 and the second sub-protective layer 32. The fourth sub-protective layer 34 is correspondingly provided for the hollow hole of the PCB substrate, and the fourth sub-protective layer 34 can cover and protect the hole wall of the hollow hole. At the same time, the two sides of the fourth sub-protective layer 34 are respectively connected to the first sub-protective layer 31 and the second sub-protective layer 32, and a continuous protective layer can be formed on the PCB substrate, thereby avoiding the connection between different sides of the protective layer or the disconnection at the hollow hole to affect the structural strength and protection function of the PCB substrate.

[0064] In some embodiments, the fourth sub-protective layer 34 is provided with a connection hole, which passes through the first sub-protective layer 31, the PCB substrate and the second sub-protective layer 32, and the connection hole is used for a connector to pass through.

[0065] Specifically, the protective layer 3 located in the hollow hole is provided with a connecting hole 301, which passes through the first sub-protective layer 31, the PCB substrate and the second sub-protective layer 32. The connecting hole 301 is used for the connecting piece 300 to pass through, so that the LED display module 100 is fixed on the box frame 200 through the connecting piece 300.

[0066] Furthermore, the connection hole 301 can be provided to allow a connection member 300 such as a screw or a bolt to pass through.

[0067] In this way, even if the mask and the bottom shell structure are removed, the connection between the PCB substrate 1 and the fixed frame can be directly achieved through the connection holes 301 on the fourth sub-protective layer 34, which also improves the convenience of installation. Compared with the prior art, since the hollow part of the mask cannot be fixed by screws or buckles, and is easy to warp and block the light-emitting surface of the LED lamp bead 2, in this embodiment, through the setting of the connection holes and the hollow holes on the PCB substrate 1, the connection holes 301 on the protective layer 3 can still be used to fix the PCB substrate 1 after the mask and the bottom shell are removed, which not only simplifies the structure of the LED display module 100, but also avoids the influence of the light-emitting effect due to the warping of the mask, and improves the display effect and viewing experience of the LED display module 100.

[0068] In some other embodiments, the fourth sub-protective layer 34 may not have the connection holes, and the connection between the PCB substrate 1 and the fixed frame may be fixedly connected by other adhesives.

[0069] Figure 4 for Figure 3 A partial enlarged view of point B.

[0070] like Figure 4 As shown, in some embodiments, the connection hole 301 includes a first through portion 3011 and a second through portion 3012 that are connected, the first through portion 3011 and the second through portion 3012 are connected, and both the first through portion 3011 and the second through portion 3012 penetrate the PCB substrate along the thickness direction of the PCB substrate. The first through portion 3011 can be arranged on an end of the second through portion 3012 close to the first surface, and the central axes of the first through portion 3011 and the second through portion 3012 coincide with each other.

[0071] The first through-portion 3011 is used to match with the head of the connector 300 , and the second through-portion 3012 is used to match with the connecting portion of the connector 300 , wherein the thickness of the fourth sub-protective layer 34 located at the second through-portion 3012 is in the range of 0.5 mm to 1 mm.

[0072] Specifically, the connector 300 generally includes a head and a connecting portion. Taking a screw as an example, the connecting portion of the screw has a thread, and the head of the screw is arranged on one end of the connecting portion. Since the head of the connector 300 is larger than the connecting portion, the first through portion 3011 is used to adapt to the head of the connector 300, and the aperture of the first through portion 3011 will be slightly larger to accommodate the head of the connector 300 and allow it to rotate or position. The second through portion 3012 is used to adapt to the connecting portion of the connector 300, and this part of the aperture is usually matched with the diameter of the connecting portion of the connector 300 to ensure that the connector 300 can be firmly fixed in the hole. Among them, the segmented arrangement of the connecting hole 301 can better adapt to the shape and size of the connector 300, so that the connector 300 can be more firmly penetrated in the connecting hole 301.

[0073] Furthermore, since the fourth sub-protective layer 34 serves as the connection area of ​​the LED module, by setting the layer thickness range of the fourth sub-protective layer 34 between the second through-hole portions 3012 to be within the range of 0.5 mm to 1 mm, within this thickness range, the connection hole 301 has sufficient strength to provide a good support, ensuring that the protective layer 3 can effectively isolate interference from the external environment (such as moisture, dust, etc.) while filling the hollow hole, while providing physical protection, thereby enhancing the durability and service life of the LED display module 100.

[0074] It is understood that please refer to the attached Figure 4 As shown, W1 shows the diameter of the second through portion 3012, W2 shows the diameter of the hollow hole on the PCB substrate, and the difference between W2 and W1 divided by 2 is the thickness of the protective layer 3 located between the hollow hole and the second through portion 3012.

[0075] Figure 5 for Figure 3 A partial enlarged view of point C;

[0076] like Figure 5 As shown, in some embodiments, the ratio of the thickness of the first sub-protection layer 31 to the height of the LED lamp bead 2 is in the range of 1 / 2 to 1 / 3.

[0077] Please see attached Figure 5 As shown, H1 shows the height of the LED lamp bead 2, and H2 shows the thickness of the first sub-protective layer 31. The ratio of the thickness of the protective layer located on the first surface 101 to the height of the LED lamp bead 2 can be understood as the ratio of the numerical values ​​of H2 to H1.

[0078] The LED lamps are welded on the PCB substrate 1 at intervals, and the ratio of the thickness of the first sub-protective layer 31 to the height of the LED lamp beads 2 is in the range of 1 / 2 to 1 / 3, so that the thickness of the first sub-protective layer 31 can completely cover the connection between the LED lamp beads 2 and the PCB substrate 1, and by controlling the ratio range, the connection strength between the LED lamp beads 2 and the PCB substrate 1 can be improved. In this way, when the LED display module 100 of the present application uses the protective layer 3 to replace the mask in the prior art, the anti-collision performance of the PCB substrate 1 can be improved by controlling the ratio of the thickness of the first sub-protective layer 31 to the height of the LED lamp beads 2 to be in the range of 1 / 2 to 1 / 3, and the LED lamp beads 2 can still be well protected when the mask is removed, so that the overall LED display module 100 is both sturdy and durable and light and flexible.

[0079] It is understandable that the LED lamp bead 2 generates a certain amount of heat during operation. If the protective layer 3 is too thick, it may hinder the heat dissipation, causing the temperature of the LED lamp bead 2 to rise, affecting the stability and service life. In this embodiment, by controlling the thickness of the protective layer 3 located on the first surface 101 within the above range, it can not only provide good protection for the LED lamp bead 2, but also ensure that the heat of the lamp board can be smoothly transferred to the external environment through the protective layer 3.

[0080] In some embodiments, the thickness of the third sub-protection layer 33 is in the range of 0.5 mm to 1 mm. By controlling the thickness of the third sub-protection layer 33 in the range of 0.5 mm to 1 mm, the peripheral side of the PCB substrate can be effectively protected.

[0081] In some embodiments, the hardness of the first sub-protective layer 31, the second sub-protective layer 32, the third sub-protective layer 33 and the fourth sub-protective layer 34 ranges from 40D to 80D. In this way, the protective layer 3 formed after the adhesive is cured can make the LED display module 100 have good strength as a whole, thereby enhancing the anti-deformation ability of the LED display module 100. When subjected to a certain pressure or bending, the protective layer 3 within the above hardness can effectively maintain its shape, and can prevent damage to the surface of the LED lamp bead 2 or the protective layer 3 due to external forces during transportation, installation or use, and provide strength support for the setting of the protective layer 3 to replace the mask and the bottom shell. Moreover, the protective layer 3 with higher hardness has better wear resistance, can resist friction and scratches that may occur during use, and extend the service life of the LED display module 100.

[0082] In some embodiments, the LED display module 100 further includes a driver IC (not shown). The driver IC is disposed on the second surface 102 and is electrically connected to a plurality of LED lamp beads 2. The protection layer 3 on the second surface 102 covers the outer surface of the driver IC.

[0083] Among them, by arranging the driver IC on the second surface 102 of the LED display module 100 and electrically connecting with the plurality of LED lamp beads 2, the driver IC can efficiently control the functions of the LED lamp beads 2 such as switching and brightness adjustment. The second sub-protective layer 32 not only covers the second surface 102 of the PCB substrate 1, but also covers the outer surface of the driver IC. After the encapsulation glue is cured to form the protective layer 3, the driver IC and the PCB substrate 1 can be connected as one. In this way, not only the driver IC is effectively protected, but also the installation and production steps of assembling through the bottom shell and the mask are simplified, thereby improving production efficiency.

[0084] like Figure 5 As shown, in some specific embodiments, the thickness of the second sub-protective layer 32 ranges from 0.5 mm to 2 mm. By controlling the thickness of the protective layer 3 on the second surface 102, the driver IC is completely encapsulated so that the driver IC is completely wrapped by the protective layer 3. In this way, after the bottom shell is removed, the LED display module 100 can still achieve good structural strength by setting the protective layer 3.

[0085] like Figure 5 As shown, H3 represents the thickness of the protective layer 3 of the second surface 102, and the size of H3 satisfies 0.5 mm to 2 mm.

[0086] Furthermore, the LED display module 100 further includes a capacitor (not shown in the figure). The capacitor can be arranged on the second surface 102 of the PCB substrate 1, and the second sub-protection layer 32 completely encapsulates the capacitor.

[0087] In some embodiments, the adhesive may include encapsulation glue. The encapsulation glue is matte black. It should be noted that encapsulation glue refers to a type of electronic glue that can seal, encapsulate or pot some components (such as resistors, capacitors, circuit boards, etc. in the electronics industry). The setting of encapsulation glue can play the role of waterproofing, moisture-proofing, shock-proofing, dust-proofing, heat dissipation, and confidentiality for the PCB substrate.

[0088] The packaging glue includes one of epoxy glue, polyurethane glue and acrylate glue. The use of the above packaging glue types can make the cured protective layer 3 fit tightly on the PCB substrate 1, and at the same time can integrally connect the PCB substrate 1, the LED lamp beads 2 and the driver IC and other components to form a firm LED display module 100.

[0089] Specifically, the encapsulation glue can be any one of epoxy glue, polyurethane glue and acrylate glue. In some specific applications, glues of different systems can be modified and used separately. For example, polyurethane can be used to modify the epoxy glue matrix to obtain polyurethane-modified epoxy resin. The modified epoxy glue can achieve better results.

[0090] Among them, epoxy glue generally has good bonding strength, chemical corrosion resistance and electrical insulation performance. The protective layer 3 formed by curing the epoxy glue can provide a strong protective layer 3, effectively protecting components such as the LED lamp beads 2 and the driver IC from physical damage and the influence of the external environment.

[0091] Polyurethane glue has excellent elasticity, wear resistance and weather resistance. The protective layer 3 formed by curing the polyurethane glue can adapt to temperature changes, mechanical stress and other problems that the LED display module 100 may encounter during use, and maintain the integrity and stability of the protective layer 3.

[0092] Acrylate glue usually has the characteristics of fast curing and UV resistance. The protective layer 3 cured by epoxy glue can quickly form a matte black protective film on the PCB substrate 1, which does not affect the luminous effect of the LED lamp beads 2 and can effectively prevent UV damage to the components.

[0093] Preferably, the packaging adhesive is a polyurethane system packaging adhesive.

[0094] In some embodiments, the optical density of the first subprotecting layer 31 , the second subprotecting layer 32 , the third subprotecting layer 33 and the fourth subprotecting layer is 2.5-3.0.

[0095] Since the protective layer is used in the present application to replace the mask and the bottom shell in the prior art, in order to prevent the protective layer from affecting the display effect of the LED light board, by controlling the optical density of the first sub-protective layer 31, the second sub-protective layer 32, the third sub-protective layer 33 and the fourth sub-protective layer within the range of 2.5-3.0, in a light environment, the LED display module can be prevented from generating glare, and at the same time, the contrast of the LED display module can be made higher. Compared with the existing technical solution in which the mask and the bottom shell are set on the PCB substrate, the present application has a better display effect.

[0096] Figure 6 This is a flow chart of a method for preparing an LED display module in one embodiment of the present application.

[0097] Please see attached Figure 6 The second aspect of the present application provides a method for preparing an LED display module 100, which is used to prepare the LED display module 100 of any of the above embodiments. The preparation method comprises the following steps:

[0098] S1: soldering a plurality of LED lamp beads 2 on a PCB substrate 1 at intervals to form an LED lamp board, wherein a plurality of hollow holes are provided on the PCB substrate 1;

[0099] S2: In a vacuum state, an adhesive is applied to the outer surface of the lamp board, and the adhesive is cured on the outer surface of the lamp board to form a protective layer 3. In step S1, a plurality of hollow holes can be opened in advance on the PCB substrate 1 or a PCB substrate 1 with a plurality of hollow holes can be directly used. First, a plurality of LED lamp beads 2 are welded on the first surface 101 of the PCB substrate 1 at intervals to form an LED lamp board. Specifically, a driver IC and a capacitor can also be welded on the second surface 102 of the PCB substrate 1.

[0100] In step S2, an adhesive is applied to the outer surface of the light panel by a vacuum coating process, wherein the adhesive is a matte black polyurethane system glue.

[0101] After the encapsulation glue is coated on the surface of the LED light board, the encapsulation glue is cured.

[0102] Specifically, coating the outer surface of the lamp board with adhesive in a vacuum state can make the adhesive evenly cover various surfaces of the lamp board to form a reliable protective layer 3, and can also avoid the problem of bubbles or unevenness in the protective layer 3 after curing.

[0103] The adhesive curing method may include one of room temperature curing, heating curing and ultraviolet curing.

[0104] Preferably, the adhesive is cured by ultraviolet curing.

[0105] The specific steps of curing the adhesive include: applying ultraviolet light to the light board, and the curing wavelength range of the ultraviolet light is 340NM~400NM. Among them, ultraviolet light curing has a fast curing characteristic. After irradiating ultraviolet light, the adhesive will quickly cure and form, thereby greatly shortening the entire production cycle of the LED display module 100. Compared with traditional thermal curing or chemical curing methods, ultraviolet light curing can significantly improve efficiency in the production line. Moreover, ultraviolet light curing is conducive to uniform curing of various areas on various surfaces of the LED light board, thereby improving the appearance quality and structural stability of the LED display module 100.

[0106] In this embodiment, by controlling the wavelength range of ultraviolet light to 340nm to 400nm, it is beneficial to control the curing depth and speed, and can prevent over-curing or under-curing, thereby achieving the best curing effect and improving the stability and long-term reliability of the product.

[0107] The preparation method of the LED display module also includes: S3: opening a connection hole on the fourth sub-protective layer 34. Specifically, a mold can be provided, and a protrusion can be provided on the mold. The lamp board is placed in the mold, and the protrusion is correspondingly inserted into the hollow hole of the PCB substrate 1. Then, under a vacuum state, the encapsulation glue is injected into the mold. At this time, due to the vacuum state, the lamp board is suspended in the mold, and the encapsulation glue injected into the mold can be evenly and comprehensively coated on all surfaces of the lamp board, covering between two adjacent LED lamp beads 2, and covering the hollow hole. Due to the provision of the protrusion, the protective layer 3 located in the hollow hole can form a corresponding connection hole 301, and it also facilitates the positioning of the lamp board during the process of coating the encapsulation glue in the mold.

[0108] In some other embodiments, after the protective layer is cured in step S2 to obtain the protective layer, the protective layer 3 located in the hollow hole may be punched to form a connecting hole.

[0109] Figure 7 Schematic diagram of an LED display screen in one embodiment of the present application.

[0110] like Figure 7 As shown, an embodiment of the third aspect of the present application provides an LED display screen, comprising an LED display module 100, a box frame 200 and a connecting member 300 of any of the above-mentioned embodiments, wherein the connecting member 300 is passed through a connecting hole of the LED display module 100 to fix the LED display module 100 to the box frame 200.

[0111] In this embodiment, the LED display module 100 of any of the above embodiments is directly fixed on the box frame 200 through the connecting piece 300 to form an LED display screen, wherein the LED display module 100 is formed by curing the protective layer 3 formed by the adhesive on the surface of the PCB substrate 1 to replace the mask and the bottom shell in the prior art, which not only makes the LED display screen lighter, but also provides a higher contrast, avoids the problem that the mask may block the light-emitting surface of the LED lamp bead 2, and the overall display effect is better.

[0112] Specifically, since the adhesive can form a tightly fitting structure with the PCB substrate 1 after being cured on each surface of the PCB substrate 1, it can solve the problem that the bottom shell of the existing LED stage rental transparent screen is hollow and easily deformed, resulting in a gap when the light board and the bottom shell cannot be fully fitted, and solves the problem that the LED stage rental transparent screen is prone to glue leakage during glue pouring due to the setting of the bottom shell, which requires secondary rework and seriously affects production efficiency.

[0113] It is understandable that a plurality of LED lamp beads 2 are welded on the PCB substrate 1 to form an LED lamp board, and the adhesive directly covers and solidifies on each surface of the lamp board. Since the adhesive forms an integrated LED display module 100 with the lamp board after solidification, the overall strength and support can be improved. In addition, by providing a plurality of hollow holes on the PCB substrate 1, the adhesive is used to cover the hollow holes of the PCB substrate 1 to form a connecting hole 301, so that after the LED display module 100 is removed from the mask and the bottom shell, the connector 300 can still fix the LED display module 100 on the box frame 200 through the connecting hole 301, avoiding the problem of loosening or displacement of the module due to external force or vibration. In this way, the problem that the hollow part of the mask in the prior art cannot be fixed by screws or buckles and is easy to warp and block the light-emitting surface of the LED lamp beads 2 can be solved.

[0114] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of the present invention, and all these changes or substitutions should fall within the protection scope of the present invention.

Claims

1. An LED display module, characterized in that: include: A PCB substrate, wherein the outer surface of the PCB substrate comprises a first surface and a second surface arranged opposite to each other, and the PCB substrate is provided with a plurality of hollow holes, each of which penetrates the first surface and the second surface; A plurality of LED lamp beads are arranged at intervals on the first surface of the PCB substrate; A protective layer is formed by coating the outer surface of the PCB substrate with an adhesive, and the protective layer located on the first surface is distributed between two adjacent LED lamp beads, wherein the protective layer located on the first surface and the protective layer located on the second surface are both penetrated by the hollow holes, and the protective layer is filled in the hollow holes.

2. The LED display module according to claim 1, characterized in that: The protective layer includes a first sub-protective layer, a second sub-protective layer, a third sub-protective layer and a fourth sub-protective layer; The first sub-protection layer covers the first surface of the PCB substrate and fills the connection between the LED lamp bead and the PCB substrate, so as to cover the outside of the first surface; The second sub-protection layer covers the second surface of the PCB substrate to cover the outer side of the second surface; The outer surface of the PCB substrate includes a peripheral side surface connected between the first surface and the second surface, and the third sub-protective layer covers the outer side of the peripheral side surface and is connected between the first protective layer and the second protective layer; The fourth sub-protective layer covers the hollow hole and connects the hollow hole connection of the first sub-protective layer and the second sub-protective layer.

3. The LED display module according to claim 2, characterized in that: The fourth sub-protective layer is provided with a connection hole, the connection hole passes through the first sub-protective layer, the PCB substrate and the second sub-protective layer, and the connection hole is used for a connector to pass through.

4. The LED display module according to claim 3, characterized in that: The connecting hole comprises a first through portion and a second through portion arranged along the axial direction thereof, the first through portion and the second through portion are connected, and both the first through portion and the second through portion penetrate the PCB substrate along the thickness direction of the PCB substrate; The first through-portion is used to match with the head of the connector, and the second through-portion is used to match with the connecting portion of the connector, wherein the thickness of the fourth sub-protective layer located at the second through-portion is in the range of 0.5 mm to 1 mm.

5. The LED display module according to claim 2, characterized in that: The ratio of the thickness of the first sub-protection layer to the height of the LED lamp bead is in the range of 1 / 2 to 1 / 3; and / or The thickness of the second sub-protection layer is in the range of 0.5 mm to 2 mm; and / or The thickness of the third sub-protection layer is in the range of 0.5 mm to 1 mm; and / or The hardness of the first sub-protective layer, the second sub-protective layer, the third sub-protective layer and the fourth sub-protective layer is in the range of 40D to 80D; and / or The optical density of the first sub-protection layer, the second sub-protection layer, the third sub-protection layer and the fourth sub-protection layer is 2.5-3.0; and / or The LED display module further includes a driver IC, which is disposed on the second surface and is electrically connected to the plurality of LED lamp beads. The third sub-protective layer covers the outer surface of the driver IC.

6. The LED display module according to claim 1, characterized in that: The adhesive comprises packaging glue, and the packaging glue is matte black.

7. The LED display module according to claim 6, characterized in that: The packaging glue includes one of epoxy glue, polyurethane glue and acrylate glue.

8. A method for preparing an LED display module, for preparing the LED display module according to any one of claims 1 to 7, characterized in that: The preparation method comprises the following steps: Soldering a plurality of LED lamp beads at intervals on a PCB substrate to form an LED lamp board, wherein the PCB substrate is provided with a plurality of hollow holes; In a vacuum state, the adhesive is coated on the outer surface of the LED light board, and the adhesive is cured on the outer surface of the LED light board to form the protective layer.

9. The method for preparing an LED display module according to claim 8, characterized in that: The adhesive curing method includes one of room temperature curing, heating curing and ultraviolet curing; and / or The adhesive is a matte black polyurethane glue. and / or The adhesive curing includes: applying ultraviolet light to the LED light board, and the curing wavelength range of the ultraviolet light is 340NM to 400NM.

10. An LED display screen, characterized in that: It comprises the LED display module, box frame and connecting piece as claimed in any one of claims 1 to 7, wherein the connecting piece is passed through the connecting hole of the LED display module to fix the LED display module to the box frame.

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